SG11201902878VA - Batch bonding apparatus and bonding method - Google Patents

Batch bonding apparatus and bonding method

Info

Publication number
SG11201902878VA
SG11201902878VA SG11201902878VA SG11201902878VA SG11201902878VA SG 11201902878V A SG11201902878V A SG 11201902878VA SG 11201902878V A SG11201902878V A SG 11201902878VA SG 11201902878V A SG11201902878V A SG 11201902878VA SG 11201902878V A SG11201902878V A SG 11201902878VA
Authority
SG
Singapore
Prior art keywords
chip
supply unit
bonding
unit
batch
Prior art date
Application number
SG11201902878VA
Inventor
Xiaoyu Jiang
Hai Xia
Feibiao Chen
Song Guo
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201902878VA publication Critical patent/SG11201902878VA/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
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    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/8112—Aligning
    • H01L2224/81148—Aligning involving movement of a part of the bonding apparatus
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95121—Active alignment, i.e. by apparatus steering

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit () for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield. 12
SG11201902878VA 2016-09-30 2017-09-26 Batch bonding apparatus and bonding method SG11201902878VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610876747.2A CN107887293B (en) 2016-09-30 2016-09-30 Batch bonding device and method
PCT/CN2017/103330 WO2018059373A1 (en) 2016-09-30 2017-09-26 Batch bonding apparatus and bonding method

Publications (1)

Publication Number Publication Date
SG11201902878VA true SG11201902878VA (en) 2019-05-30

Family

ID=61763137

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201902878VA SG11201902878VA (en) 2016-09-30 2017-09-26 Batch bonding apparatus and bonding method

Country Status (7)

Country Link
US (1) US10763235B2 (en)
JP (1) JP2019532511A (en)
KR (1) KR20190052126A (en)
CN (1) CN107887293B (en)
SG (1) SG11201902878VA (en)
TW (1) TWI635557B (en)
WO (1) WO2018059373A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111383972A (en) * 2018-12-29 2020-07-07 上海微电子装备（集团）股份有限公司 Bonding device and bonding method
TW202119533A (en) * 2019-11-04 2021-05-16 台灣愛司帝科技股份有限公司 Chip carrying structure having chip-absorbing function
KR102316940B1 (en) * 2019-11-08 2021-10-25 세메스 주식회사 Die transfer module and die bonding apparatus having the same
KR102330659B1 (en) * 2019-11-08 2021-11-23 세메스 주식회사 Die transfer module and die bonding apparatus having the same
KR102386338B1 (en) * 2019-11-08 2022-04-13 세메스 주식회사 Die transfer module and die bonding apparatus having the same
KR102386337B1 (en) * 2019-11-08 2022-04-13 세메스 주식회사 Die transfer module and die bonding apparatus having the same
CN112967991B (en) * 2020-11-25 2022-10-21 重庆康佳光电技术研究院有限公司 Transfer device, system and method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330109A (en) 1998-05-20 1999-11-30 Nec Corp Device and method for packaging element
JP2001326251A (en) 2000-05-12 2001-11-22 Hitachi Ltd Apparatus for producing semiconductor
JP4190161B2 (en) 2001-05-08 2008-12-03 株式会社新川 Wafer ring supply and return device
DE10203601A1 (en) 2002-01-30 2003-08-14 Siemens Ag Chip removal device, chip removal system, placement system and method for removing chips from a wafer
US7179346B2 (en) * 2003-06-03 2007-02-20 Asm Assembly Automation Ltd. Semiconductor apparatus with multiple delivery devices for components
US7727800B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus
KR20130079031A (en) 2012-01-02 2013-07-10 삼성전자주식회사 Apparatus for mounting semiconductor chip
US20140341691A1 (en) * 2013-05-14 2014-11-20 Kui Kam Lam Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
CN104183527A (en) 2013-05-28 2014-12-03 北京中电科电子装备有限公司 Workpiece bonding system
KR20140146852A (en) * 2013-06-18 2014-12-29 삼성테크윈 주식회사 Flip-chip mounter and mounting mehtod using it
CN104051318B (en) * 2014-07-04 2017-02-01 格科微电子（上海）有限公司 Automatic packaging system and automatic packaging method of image sensor chip
SE538792C2 (en) * 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
US10743447B2 (en) * 2015-02-26 2020-08-11 Fuji Corporation Component mounting machine

Also Published As

Publication number Publication date
US20190385972A1 (en) 2019-12-19
WO2018059373A1 (en) 2018-04-05
TWI635557B (en) 2018-09-11
CN107887293B (en) 2020-06-16
US10763235B2 (en) 2020-09-01
KR20190052126A (en) 2019-05-15
TW201814805A (en) 2018-04-16
JP2019532511A (en) 2019-11-07
CN107887293A (en) 2018-04-06

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