SG11201909992QA - Device and method for bonding substrates - Google Patents

Device and method for bonding substrates

Info

Publication number
SG11201909992QA
SG11201909992QA SG11201909992QA SG11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA SG 11201909992Q A SG11201909992Q A SG 11201909992QA
Authority
SG
Singapore
Prior art keywords
substrate
chuck
bonding
bonding substrates
plate
Prior art date
Application number
Inventor
Dominik Zinner
Thomas Wagenleitner
Jürgen Markus Süss
Thomas Plach
Jürgen Mallinger
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201909992QA publication Critical patent/SG11201909992QA/en

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    • H01L21/185—Joining of semiconductor bodies for junction formation
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Device and method for bonding substrates The present invention relates to a method for bonding a first substrate 5 (4o) to a second substrate (4u) on mutually facing contact surfaces (4k) of the substrates (4o, 4u), wherein the first substrate (4o) is mounted on a first chuck (1o) and the second substrate (4u) is mounted on a second chuck (1u), and wherein a plate (17u) is arranged between the second substrate (4u) and the second chuck (1u), wherein the second substrate 10 (4u) with the plate (4u) is deformed with respect to the second chuck (1u) before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate. 15 Figure 1.
SG11201909992Q 2017-09-21 2017-09-21 Device and method for bonding substrates SG11201909992QA (en)

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