TWI635557B - 批處理鍵合裝置及鍵合方法 - Google Patents

批處理鍵合裝置及鍵合方法 Download PDF

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TWI635557B
TWI635557B TW106133485A TW106133485A TWI635557B TW I635557 B TWI635557 B TW I635557B TW 106133485 A TW106133485 A TW 106133485A TW 106133485 A TW106133485 A TW 106133485A TW I635557 B TWI635557 B TW I635557B
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chip
unit
supply unit
pick
transfer
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TW201814805A (zh
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Xiao-yu JIANG
姜曉玉
Hai XIA
夏海
Fei-biao CHEN
陳飛彪
Song Guo
郭聳
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上海微電子裝備（集團）股份有限公司
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本發明有關於一種批處理鍵合裝置及鍵合方法，批處理鍵合裝置包括芯片供應單元，用於提供待鍵合的芯片；基底供應單元，用於提供基底；傳送單元，用於在芯片供應單元以及基底供應單元之間移送芯片；拾取單元，設置於芯片供應單元上方，用於從芯片供應單元拾取芯片，並將芯片的標記面翻轉至所需方向後上載至傳送單元。本發明中，單獨完成每個芯片的拾取，但傳送過程和鍵合過程中，多個芯片可同時完成，大大增加了產率；本發明根據鍵合時對芯片上標記面方向的要求，選擇性採取翻轉機構及翻轉步驟，使批處理鍵合裝置能夠兼容芯片上的標記面朝上和朝下兩種鍵合方式。

Description

批處理鍵合裝置及鍵合方法
本發明有關於芯片鍵合領域，特別是有關於一種批處理鍵合裝置及鍵合方法。
芯片鍵合是將芯片與載片連接形成的一種互連形式。鍵合芯片一般以標記面朝上的方式放置在分離臺上，採用機械手抓取和翻轉的方式將芯片傳輸到基底上進行鍵合。鍵合流程串行完成時，對於下壓接合時間較長（約為30秒）的製程，由於一次只能接合一顆芯片，產率非常低，難以滿足量產需求。另外，芯片鍵合分為芯片上的標記面朝下鍵合到基底上，以及芯片上的標記面朝上鍵合到基底上兩種製程，目前已知設備只能完成一種方式的芯片鍵合製程，更換設備的過程複雜，進一步降低了鍵合的產率。
本發明提供一種批處理鍵合裝置及鍵合方法，以解決習知的芯片鍵合產率低的問題。
為解決上述技術問題，本發明提供一種批處理鍵合裝置，包括：芯片供應單元，用於提供待鍵合的芯片；基底供應單元，用於提供基底；傳送單元，用於在芯片供應單元以及基底供應單元之間移送芯片拾取單元，設置於芯片供應單元上方，用於從芯片供應單元拾取芯片，並將芯片的標記面翻轉至所需方向後上載至傳送單元。
較佳地，拾取單元包括第一拾取組件和第二拾取組件，第一拾取組件設置於芯片供應單元上方，包括第一轉動部件和設置於第一轉動部件上的第一拾取頭；第二拾取組件包括第二轉動部件和設置於第二轉動部件上的第二拾取頭，第一拾取頭從芯片供應單元上拾取芯片，並交接至傳送單元或交接至第二拾取頭。
較佳地，第一轉動部件旋轉一次的角度為90°或180°。
較佳地，第二拾取組件更包括第一對準部件，用於識別第二拾取頭上的芯片的位置。
較佳地，第二拾取頭的數量為一個，第二轉動部件驅動第二拾取頭在與第一對準部件對應的對準位、與第一拾取頭對應的交接位、以及與傳送單元對應的傳送位之間轉換。
較佳地，第二拾取頭的數量為至少三個，至少三個第二拾取頭均勻設置於第二轉動部件上，且繞圓周間隔分佈，第二轉動部件轉動停止時，至少三個第二拾取頭中的三個分別位於與第一對準部件對應的對準位、與第一拾取頭對應的交接位、以及與傳送單元對應的傳送位。
較佳地，第二轉動部件轉動一次的角度與相鄰兩個第二拾取頭之間的角度相同。
較佳地，批處理鍵合裝置更包括精調單元，精調單元包括第二對準部件和精調手，第二對準部件掃描傳送單元上的芯片的位置，精調手根據第二對準部件的掃描結果對芯片的位置進行調整。
較佳地，傳送單元包括導軌和安裝於導軌上並能沿導軌滑動的載台，載台上設有吸頭，用於吸附多個芯片。
本發明更提供了一種批處理鍵合方法，應用於如上所述的批處理鍵合裝置，包括如下步驟：S1：將帶有芯片的晶片上載至芯片供應單元，將基底上載至基底供應單元；S2：判斷鍵合時要求的芯片上標記面的方向；S3：若要求標記面朝下鍵合，則拾取單元依次從芯片供應單元拾取芯片旋轉180°並傳遞至傳送單元，傳送單元將所有芯片移送至基底供應單元的基底上並一次性完成所有芯片的鍵合；S4：若要求標記面朝上鍵合，則拾取單元從芯片供應單元拾取芯片並翻轉，將翻轉後的芯片依次傳遞至傳送單元，傳送單元將所有芯片移送至基底供應單元的基底上並一次性完成所有芯片的鍵合。
較佳地，步驟S3和S4均更包括：傳送單元攜載芯片移動至精調單元上方，精調單元對每個芯片在傳送單元上的位置進行調整。
較佳地，步驟S4中拾取單元從芯片供應單元拾取芯片並翻轉的步驟包括：第一拾取組件從芯片供應單元上拾取芯片後旋轉90°交接給第二拾取組件；以及由第二拾取組件將芯片上載至傳送單元。
較佳地，步驟S4更包括利用第一對準部件識別第二拾取組件上芯片的位置，之後將芯片與傳送單元進行對準交接。
與習知技術相比，本發明提供的批處理鍵合裝置及鍵合方法，具有如下優點：
1.本發明中，每個芯片的拾取和精度調整是單獨完成的，但芯片的傳送和鍵合，可多個芯片同時完成，從而大大提高了產率，以滿足量產要求；
2.本發明根據鍵合時對芯片上標記面方向的要求，選擇性使用第二拾取組件，使批處理鍵合裝置能夠兼容芯片上的標記面朝上和朝下兩種鍵合方式。
為使本發明的上述目的、特徵和優點能夠更加明顯易懂，下面結合圖式對本發明的實施方式做詳細的說明。需說明的是，本發明圖式均採用簡化的形式且均使用非精准的比例，僅用以方便、明晰地輔助說明本發明實施例的目的。
本發明提供的批處理鍵合裝置，如第1圖和第2圖所示，包括：芯片供應單元10，用於從晶片中分離出單個待鍵合的芯片60，並提供待鍵合的芯片60給拾取單元30，請結合第3圖，芯片供應單元10包括分離台11以及安裝於分離台11上的載盤12，載盤12用於承載芯片60，分離台11可帶動芯片60在水平面上移動；基底供應單元20，用於提供基底，請重點參考第5圖，包括鍵合台21和安裝於鍵合台21上的載板22，載板22用於承載基底，鍵合台21可帶動基底在水平面上移動；傳送單元40，用於在芯片供應單元10以及基底供應單元20之間移送芯片60；拾取單元30，設置於芯片供應單元10上方，用於從芯片供應單元10拾取芯片60，並將芯片60的標記面61翻轉至所需方向後上載至傳送單元40，如第7圖所示。
具體地，本發明中，每個芯片60的拾取和精度調整是單獨完成的，但芯片60的傳送和鍵合，可多個芯片60同時完成，從而大大提高了產率，以滿足量產要求；本發明根據鍵合時對芯片60上標記面61方向的要求，選擇性使用第二拾取組件，使批處理鍵合裝置能夠兼容芯片60上的標記面61朝上和朝下兩種鍵合方式。
較佳地，請重點參考第3圖，拾取單元30包括第一拾取組件和第二拾取組件，第一拾取組件設置於芯片供應單元10上方，包括第一轉動部件31和設置於第一轉動部件31上的第一拾取頭32；第二拾取組件包括第二轉動部件33和設置於第二轉動部件33上的第二拾取頭34，第一拾取頭32從芯片供應單元10上拾取芯片60，並交接至傳送單元40或交接至第二拾取頭34，具體地，不需翻轉時，第一拾取頭32直接將芯片60交接至傳送單元40；若需翻轉，則第一拾取頭32將芯片60交接至第二拾取頭34進行翻轉，再通過第二拾取頭34將翻轉後的芯片60傳遞至傳送單元40。較佳地，第二拾取組件更包括第一對準部件35，用於識別第二拾取頭34上的芯片60的位置，第一對準部件35設置於第二轉動部件33的下方，在第一拾取頭32與第二拾取頭34交接完成後，利用第一對準部件35掃描芯片60在第二拾取頭34上的位置，利用該位置信息確保第二拾取頭34可將芯片60傳遞至傳送單元40的準確位置。
較佳地，請繼續參考第3圖，第二拾取頭34的數量為一個，第二轉動部件33驅動第二拾取頭34在與第一對準部件35對應的對準位（第二拾取頭34朝向第一對準部件35）、與第一拾取頭32對應的交接位（第二拾取頭34朝向第一拾取頭32）、以及與傳送單元40對應的傳送位（第二拾取頭34朝向傳送單元40）之間轉換，交接時，第一轉動部件31旋轉一次的角度為90°或180°，確保交接精度的同時，簡化裝置結構。
較佳地，請重點參考第8圖，第二拾取頭34的數量為多個（本實施例以4個為例），4個第二拾取頭34均勻設置於第二轉動部件33上，且繞一個圓周間隔分佈，優選均勻間隔分佈，第二轉動部件33轉動停止時，其中三個第二拾取頭34分別位於與第一對準部件35對應的對準位、與第一拾取頭32對應的交接位、以及與傳送單元40對應的傳送位。這樣，每個第二拾取頭34可在不同的工位處做不同的動作，進一步提高鍵合效率。本實施例中，第二轉動部件33轉動一次的角度與相鄰兩個第二拾取頭34之間的角度相同，同樣以四個第二拾取頭34為例，第二轉動部件33轉動一次的角度為90°。
較佳地，請重點參考第1圖和第2圖，批處理鍵合裝置更包括精調單元50，結合第4圖，精調單元50包括第二對準部件51和精調手52，第二對準部件51掃描傳送單元40上的芯片60的位置，精調手52根據第二對準部件51的掃描結果對芯片60的位置進行調整。
較佳地，請重點參考第6圖，傳送單元40包括導軌41和安裝於導軌41上並能沿導軌41滑動的載台42，載台42上設有吸頭（未圖示），芯片60在吸頭上的位置佈局可按需調整。
請重點參考第1圖和第2圖，本發明更提供了一種批處理鍵合方法，應用於如上的批處理鍵合裝置，包括如下步驟：
S1：將帶有芯片60的晶片上載至芯片供應單元10，此時芯片60的標記面61均朝上；將基底上載至基底供應單元20。
S2：判斷鍵合時要求的芯片60上標記面61的方向，即要求標記面61朝上鍵合還是要求標記面61朝下鍵合。
S3：若要求標記面61朝下鍵合，如第1圖所示，則拾取單元30依次從芯片供應單元10拾取芯片60，並將多個芯片60依次旋轉180°並傳遞至傳送單元40，直至傳送單元40中載台42上的芯片60數量與佈局滿足要求，傳送單元40將所有芯片60移送至基底供應單元20的基底上並一次性完成所有芯片60的鍵合。
S4：若要求標記面61朝上鍵合，如第2圖所示，則第一拾取頭32從芯片供應單元10拾取芯片60，交接至第二拾取頭34實現翻轉，該步驟中拾取單元從芯片供應單元10拾取芯片60並翻轉步驟為：利用第一拾取組件從芯片供應單元10上拾取芯片60後旋轉90°交接給第二拾取組件，實現翻轉，第二拾取組件將芯片60上載至傳送單元40，即第二拾取頭34承載芯片60依次傳遞至傳送單元40。傳送單元40將所有芯片60移送至基底供應單元20的基底上並一次性完成所有芯片60的鍵合。
請參考第9圖，當要求標記面61朝下鍵合時，第一拾取頭32向下伸出，從芯片供應單元10拾取一個芯片60；第一拾取頭32上升並逆時針旋轉90°，與第二拾取頭34交接該芯片60；然後第一拾取頭32順時針旋轉90°拾取下一個芯片60，同時第二拾取頭34旋轉至第一對準部件35進行位置掃描；第一拾取頭32將第二個芯片60旋轉至與第二拾取頭34交接處，等待第二拾取頭34來拾取，同時第二拾取頭34帶著第一個芯片60，按照第一對準部件35掃描的位置信息，精確交接至傳送單元40上，依此類推，從而完成芯片60從芯片供應單元10到傳送單元40的移送。
較佳地，步驟S3和S4均更包括：傳送單元40攜載芯片60移動至精調單元50上方，精調單元50對每個芯片60在傳送單元40上的位置進行調整。
具體地，步驟S3中，傳送單元40將多個芯片60同時移動至精調單元50上方，利用精調單元50對每個芯片60在傳送單元40上的位置進行調整，具體地，第二對準部件51掃描載台42上的芯片60，待第二對準部件51掃描完芯片60並計算後，精調手52根據每個芯片60的掃描結果逐個將載台42上的芯片60取下，調整，同時載台42亦根據掃描結果水平調整，使載台42上的芯片60的位置、角度滿足要求。
步驟S4中更包括利用第一對準部件35識別第二拾取組件上芯片60的位置，之後將芯片60與傳送單元40進行對準交接，具體地，翻轉後的芯片60移動至第一對準部件35處，第一對準部件35掃描芯片標記並計算，載台42根據對準結果運動到位，同時第二拾取頭34帶芯片60翻轉與載台42完成交接，在該過程中，由於第一對準部件35已經對位置精度進行了調整，因此，啟用精調單元50進行精度調整的步驟可以省略，在確保精度的前提下，節約了時間和能源。
綜上，本發明提供的批處理鍵合裝置及鍵合方法，批處理鍵合裝置包括芯片供應單元10，用於提供待鍵合的芯片60；基底供應單元20，用於提供基底；傳送單元40，用於在芯片供應單元10以及基底供應單元20之間移送芯片60；拾取單元30，設置於芯片供應單元10上方，用於從芯片供應單元10拾取芯片60，並將芯片60的標記面61翻轉至所需方向後上載至傳送單元40。本發明中，單獨完成每個芯片60的拾取和精度調整，但傳送過程和鍵合過程中，多個芯片60可同時完成，大大增加了產率；本發明根據鍵合時對芯片60上標記面61方向的要求，選擇性採取翻轉機構及步驟，使批處理鍵合裝置能夠兼容芯片60上的標記面61朝上和朝下兩種鍵合方式。
顯然，本領域的具通常知識者可以對發明進行各種改動和變型而不脫離本發明的精神和範圍。這樣，倘若本發明的這些修改和變型屬於本發明申請專利範圍及其等同技術的範圍之內，則本發明也意圖包括這些改動和變型在內。
10‧‧‧芯片供應單元
11‧‧‧分離台
12‧‧‧載盤
20‧‧‧基底供應單元
21‧‧‧鍵合台
22‧‧‧載板
30‧‧‧拾取單元
31‧‧‧第一轉動部件
32‧‧‧第一拾取頭
33‧‧‧第二轉動部件
34‧‧‧第二拾取頭
35‧‧‧第一對準部件
40‧‧‧傳送單元
41‧‧‧導軌
42‧‧‧載台
50‧‧‧精調單元
51‧‧‧第二對準部件
52‧‧‧精調手
60‧‧‧芯片
61‧‧‧標記面
第1圖為本發明一具體實施方式中批處理鍵合裝置的結構示意圖（要求標記面朝下鍵合）。 第2圖為本發明一具體實施方式中批處理鍵合裝置的結構示意圖（要求標記面朝上鍵合）。 第3圖為本發明一具體實施方式中拾取單元的結構示意圖。 第4圖為本發明一具體實施方式中精調單元的結構示意圖。 第5圖為本發明一具體實施方式中基底供應單元的結構示意圖。 第6圖為本發明一具體實施方式中傳送單元的結構示意圖。 第7圖為本發明一具體實施方式中芯片的結構示意圖。 第8圖為本發明一具體實施方式中第二拾取頭的結構示意圖。 第9圖為本發明一具體實施方式中當要求標記面朝上鍵合時，第一拾取組件與第二拾取組件的交接流程示意圖。

Claims (11)

  1. 一種批處理鍵合裝置，其包括：芯片供應單元，用於提供待鍵合的芯片；基底供應單元，用於提供基底；傳送單元，用於在該芯片供應單元以及該基底供應單元之間移送該芯片；以及拾取單元，設置於該芯片供應單元上方，用於從該芯片供應單元拾取該芯片，並將該芯片的標記面翻轉至所需方向後上載至該傳送單元；其中，該拾取單元包括第一拾取組件和第二拾取組件，該第一拾取組件設置於該芯片供應單元上方，包括第一轉動部件和設置於該第一轉動部件上的第一拾取頭；該第二拾取組件包括第二轉動部件和設置於該第二轉動部件上的第二拾取頭，該第一拾取頭從該芯片供應單元上拾取該芯片，並交接至該傳送單元或交接至該第二拾取頭，該第二拾取組件更包括第一對準部件，用於識別該第二拾取頭上的該芯片的位置。
  2. 如申請專利範圍第1項所述之批處理鍵合裝置，其中該第一轉動部件旋轉一次的角度為90°或180°。
  3. 如申請專利範圍第1項所述之批處理鍵合裝置，其中該第二拾取頭的數量為一個，該第二轉動部件驅動該第二拾取頭在與該第一對準部件對應的對準位、與該第一拾取頭對應的交接位、以及與該傳送單元對應的傳送位之間轉換。
  4. 如申請專利範圍第1項所述之批處理鍵合裝置，其中該第二拾取頭的數量為至少三個，至少三個該第二拾取頭均勻設置於該第二轉動部件上，且繞圓周間隔分佈，該第二轉動部件轉動停止時，至少三個該第二拾取頭中的三個分別位於與該第一對準部件對應的對準位、與該第一拾取頭對應的交接位、以及與該傳送單元對應的傳送位。
  5. 如申請專利範圍第4項所述之批處理鍵合裝置，其中該第二轉動部件轉動一次的角度與相鄰兩個該第二拾取頭之間的角度相同。
  6. 如申請專利範圍第1項所述之批處理鍵合裝置，其中該批處理鍵合裝置更包括精調單元，該精調單元包括第二對準部件和精調手，該第二對準部件掃描該傳送單元上的該芯片的位置，該精調手根據該第二對準部件的掃描結果對該芯片的位置進行調整。
  7. 如申請專利範圍第1項所述之批處理鍵合裝置，其中該傳送單元包括導軌和安裝於該導軌上並能沿該導軌滑動的載台，該載台上設有吸頭，用於吸附多個該芯片。
  8. 一種批處理鍵合方法，應用於如申請專利範圍第1項所述之批處理鍵合裝置，其包括如下步驟：S1：將帶有該芯片的晶片上載至該芯片供應單元，將該基底上載至該基底供應單元；S2：判斷鍵合時要求的該芯片上標記面的方向；S3：若要求標記面朝下鍵合，則該拾取單元依次從該芯片供應單元拾取該芯片旋轉180°並傳遞至該傳送單元，該傳送單元將所有該芯片移送至該基底供應單元的該基底上並一次性完成所有該芯片的鍵合；以及S4：若要求標記面朝上鍵合，則該拾取單元從該芯片供應單元拾取該芯片並翻轉，將翻轉後的該芯片依次傳遞至該傳送單元，該傳送單元將所有該芯片移送至該基底供應單元的該基底上並一次性完成所有該芯片的鍵合。
  9. 如申請專利範圍第8項所述之批處理鍵合方法，其中該步驟S3和S4均更包括：該傳送單元攜載該芯片移動至精調單元上方，該精調單元對每個該芯片在該傳送單元上的位置進行調整。
  10. 如申請專利範圍第8項所述之批處理鍵合方法，其中該步驟S4中該拾取單元從該芯片供應單元拾取該芯片並翻轉的步驟包括：第一拾取組件從該芯片供應單元上拾取該芯片後旋轉90°交接給第二拾取組件；以及由該第二拾取組件將該芯片上載至該傳送單元。
  11. 如申請專利範圍第10項所述之批處理鍵合方法，其中該步驟S4更包括利用第一對準部件識別該第二拾取組件上該芯片的位置，之後將該芯片與該傳送單元進行對準交接。
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