WO2018059373A1 - 一种批处理键合装置及键合方法 - Google Patents

一种批处理键合装置及键合方法 Download PDF

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Publication number
WO2018059373A1
WO2018059373A1 PCT/CN2017/103330 CN2017103330W WO2018059373A1 WO 2018059373 A1 WO2018059373 A1 WO 2018059373A1 CN 2017103330 W CN2017103330 W CN 2017103330W WO 2018059373 A1 WO2018059373 A1 WO 2018059373A1
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Prior art keywords
chip
unit
supply unit
pick
picking
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PCT/CN2017/103330
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English (en)
French (fr)
Inventor
姜晓玉
夏海
陈飞彪
郭耸
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上海微电子装备（集团）股份有限公司
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Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Priority to SG11201902878VA priority Critical patent/SG11201902878VA/en
Priority to JP2019517337A priority patent/JP2019532511A/ja
Priority to US16/338,551 priority patent/US10763235B2/en
Priority to KR1020197011731A priority patent/KR20190052126A/ko
Publication of WO2018059373A1 publication Critical patent/WO2018059373A1/zh

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Definitions

  • the present invention relates to the field of chip bonding, and in particular to a batch bonding device and a bonding method.
  • Chip bonding is an interconnection form formed by connecting a chip to a carrier.
  • the bonding chip is generally placed on the separation table with the mark face up, and the chip is transferred to the substrate by the robot to grasp and flip.
  • the bonding process is completed in series, for a process with a long press-bonding time (about 30 seconds), since only one chip can be bonded at a time, the yield is very low, and it is difficult to meet the mass production demand.
  • the chip bonding is divided into two processes: the label on the chip is bonded face down to the substrate, and the mark on the chip is bonded to the substrate upward.
  • the device can only complete one mode of the chip key. The process of replacing the equipment is complicated, further reducing the yield of bonding.
  • the invention provides a batch processing bonding device and a bonding method to solve the problem that the existing chip bonding yield is low.
  • the present invention provides a batch processing bonding apparatus, comprising:
  • a chip supply unit for providing a chip to be bonded
  • a substrate supply unit for providing a substrate
  • a transfer unit configured to transfer the chip pick-up unit between the chip supply unit and the substrate supply unit, disposed above the chip supply unit, for picking up a chip from the chip supply unit, and The marking surface of the chip is flipped to the desired direction and uploaded to the transfer unit.
  • the pick-up unit includes a first pick-up assembly and a second pick-up assembly, the first pick-up assembly being disposed above the chip supply unit, including a first rotating member and disposed on the first a first pick-up head on the rotating member; the second pick-up assembly includes a second rotating member and a second pick-up head disposed on the second rotating member, the first pick-up head picking up from the chip supply unit Chips are handed over to the transfer unit or handed over to the second pick head.
  • the first rotating member rotates once at an angle of 90° or 180°.
  • the second pick-up assembly further includes a first alignment component for identifying the position of the chip on the second pick-up head.
  • the number of the second pick-up heads is one, and the second rotating member drives the second pick-up head in an alignment position corresponding to the first alignment member, and the first pick-up head A transition between the corresponding handover bit and the transfer bit corresponding to the transfer unit.
  • the number of the second pick-up heads is at least three, and the at least three second pick-up heads are evenly disposed on the second rotating member, and are circumferentially spaced apart, and the second rotating member is rotated.
  • three of the at least three second pick-up heads are respectively located at an alignment bit corresponding to the first alignment component, a handover bit corresponding to the first pickup head, and the transfer unit Corresponding transfer bit.
  • the angle at which the second rotating member rotates once is the same as the angle between the adjacent two second picking heads.
  • the batch processing bonding apparatus further comprises a fine adjustment unit, the fine adjustment unit includes a second alignment component and a fine adjustment hand, and the second alignment component scans a position of the chip on the transfer unit And the fine adjustment hand adjusts the position of the chip according to the scan result of the second alignment component.
  • the fine adjustment unit includes a second alignment component and a fine adjustment hand
  • the second alignment component scans a position of the chip on the transfer unit
  • the fine adjustment hand adjusts the position of the chip according to the scan result of the second alignment component.
  • the transfer unit comprises a guide rail and a stage mounted on the guide rail and slidable along the guide rail, and the mount is provided with a suction head for adsorbing a plurality of chips.
  • the present invention also provides a batch bonding method for use in a batch bonding apparatus as described above, comprising the steps of:
  • the pickup unit sequentially picks up the chip from the chip supply unit and rotates by 180° to the transfer unit, and the transfer unit transfers all the chips to the substrate supply unit. Bonding of all the chips on the substrate and at one time;
  • the steps S3 and S4 further comprise: the transmitting unit carries the chip to move above the fine adjustment unit, and the fine adjustment unit adjusts the position of each chip on the transmitting unit.
  • the step of picking up the chip from the chip supply unit and flipping in step S4 includes: the first picking component picks up the chip from the chip supply unit and then rotates 90° to hand over to the second picking component; The chip is uploaded to the transfer unit by the second pick-up assembly.
  • the step S4 further comprises identifying the position of the chip on the second pick-up component by using the first alignment component, and then aligning the chip with the transfer unit.
  • the batch bonding device and the bonding method provided by the invention have the following advantages:
  • the pick-up and precision adjustment of each chip is performed separately, but the transfer and bonding of the chip can be completed simultaneously by multiple chips, thereby greatly improving the yield to meet the mass production requirements;
  • the present invention selectively uses the second pick-up assembly in accordance with the requirements for the orientation of the marking surface on the chip during bonding, so that the device can be compatible with the marking side up and down bonding modes on the chip.
  • FIG. 1 is a schematic structural view of a batch processing bonding apparatus according to an embodiment of the present invention (required marking face down bonding);
  • FIG. 2 is a schematic structural view of a batch processing bonding apparatus according to an embodiment of the present invention (required marking face-up bonding);
  • FIG. 3 is a schematic structural view of a pick-up unit according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a fine adjustment unit according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural view of a substrate supply unit according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a transmitting unit according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a chip according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a second pick-up head according to an embodiment of the present invention.
  • FIG. 9 is a schematic flow chart showing the process of the first pick-up assembly and the second pick-up assembly when the mark is placed face up, in accordance with an embodiment of the present invention.
  • 10-chip supply unit 11-separation table, 12-carrier tray, 20-substrate supply unit, 21-bonding table, 22-carrier plate, 30-pickup unit, 31-first rotating member, 32- First pick-up head, 33-second rotating member, 34-second pick-up head, 35-first alignment member, 40-transfer unit, 41-rail, 42-stage, 50-fine unit, 51- Two alignment components, 52-fine hand, 60-chip, 61-marked face.
  • the batch bonding device provided by the present invention includes:
  • the chip supply unit 10 is configured to separate a single chip 60 to be bonded from the wafer and provide the chip 60 to be bonded to the pickup unit 30.
  • the chip supply unit 10 includes separation. a stage 11 and a carrier 12 mounted on the separation table 11, the carrier 12 is used to carry a chip 60, and the separation table 11 can drive the chip 60 to move on a horizontal plane;
  • a substrate supply unit 20 for providing a substrate including a bonding table 21 and a carrier 22 mounted on the bonding table 21, the carrier 22 for carrying a substrate, the bonding
  • the table 21 can drive the substrate to move on a horizontal plane;
  • a transfer unit 40 for transferring the chip 60 between the chip supply unit 10 and the substrate supply unit 20;
  • the pickup unit 30 is disposed above the chip supply unit 10 for picking up the chip 60 from the chip supply unit 10, and flipping the marking surface 61 of the chip 60 to a desired direction and uploading to the transfer unit 40 , as shown in Figure 7.
  • the picking and precision adjustment of each chip 60 is performed separately, but the transfer and bonding of the chip 60 can be completed simultaneously by the plurality of chips 60, thereby greatly improving the yield to meet the mass production requirements.
  • the present invention selectively uses the second pick-up assembly in accordance with the requirements for the orientation of the marking surface 61 on the chip 60 during bonding, enabling the device to be compatible with the marking surface 61 on the chip 60 in an upward and downward bonding manner.
  • the pickup unit 30 includes a first pick-up assembly and a second pick-up assembly, the first pick-up assembly being disposed above the chip supply unit 10, including the first rotating member 31 and the setting a first pick-up head 32 on the first rotating member 31;
  • the second pick-up assembly includes a second rotating member 33 and a second pick-up head 34 disposed on the second rotating member 33, the first The pickup head 32 picks up the chip 60 from the chip supply unit 10 and hands it over to the transfer unit 40 or to the second pick-up head 34. Specifically, when there is no need to flip, the first pick-up head 32 directly places the chip.
  • the second pick-up assembly further includes a first alignment component 35 for Identifying the position of the chip 60 on the second pick-up head 34, the first alignment member 35 is disposed below the second rotating member 33, after the first pick-up head 32 and the second pick-up head 34 are handed over.
  • the position of the chip 60 on the second pick-up head 34 is scanned by the first alignment member 35, and the position information is used to ensure that the second pick-up head 34 can transfer the chip 60 to the exact position of the transfer unit 40.
  • the number of the second pick-up heads 34 is one, and the second rotating member 33 drives the pair of the second pick-up heads 34 corresponding to the first alignment member 35.
  • a level (the second pick head 34 faces the first alignment member 35)
  • a transfer position corresponding to the first pick head 32 (the second pick head 34 faces the first pick head 32)
  • the transfer unit 40 The corresponding transfer position (the second pick-up head 34 is directed toward the transfer unit 40) is switched between the first rotating member 31 at an angle of 90° or 180°, which ensures the accuracy of the transfer and simplifies the device structure.
  • the number of the second pick-up heads 34 is plural (in this embodiment, four are taken as an example), and the four second pick-up heads 34 are evenly disposed on the second rotation.
  • the members 33 are distributed around a circumference, preferably evenly spaced, and when the second rotating member 33 is stopped, three of the second picking heads 34 are respectively located in alignment with the first alignment member 35.
  • the bit, the intersection bit corresponding to the first pickup head 32, and the transfer bit corresponding to the transfer unit 40 are respectively located in alignment with the first alignment member 35.
  • the bit, the intersection bit corresponding to the first pickup head 32, and the transfer bit corresponding to the transfer unit 40 In this way, each of the second pick-up heads 34 can perform different actions at different stations, further improving the bonding efficiency.
  • the angle at which the second rotating member 33 rotates once is the same as the angle between the adjacent two second picking heads 34.
  • the four second picking heads 34 are taken as an example, and the second rotating member 33 is rotated. The angle of one time is 90°.
  • the batch bonding device further includes a fine adjustment unit 50.
  • the fine adjustment unit 50 includes a second alignment component 51 and a fine adjustment hand 52.
  • the second alignment member 51 scans the position of the chip 60 on the transfer unit 40, and the fine adjustment hand 52 adjusts the position of the chip 60 according to the scan result of the second alignment member 51.
  • the transfer unit 40 includes a guide rail 41 and is mounted on the guide A stage 42 is mounted on the rail 41 along the guide rail 41.
  • the stage 42 is provided with a suction head (not shown), and the position layout of the chip 60 on the tip can be adjusted as needed.
  • the present invention also provides a batch bonding method applied to the batch bonding apparatus as described above, comprising the following steps:
  • S2 determining the direction of the marking surface 61 on the chip 60 required for bonding, that is, whether the marking surface 61 is required to be upwardly bonded or the marking surface 61 is required to be downwardly bonded;
  • the pickup unit 30 sequentially picks up the chip 60 from the chip supply unit 10, and sequentially rotates the plurality of chips 60 by 180° and transmits them to the same.
  • the transfer unit 40 until the number and layout of the chips 60 on the stage 42 in the transfer unit 40 meets the requirements, the transfer unit 40 transfers all the chips 60 to the substrate of the substrate supply unit 20 and completes all at once Bonding of the chip 60;
  • the pick-up unit picks up the chip 60 from the chip supply unit 10 and flips the step of: picking up the chip 60 from the chip supply unit 10 by using the first pick-up component, and then rotating 90° to hand over to the second pick-up component to realize flipping
  • the second pick-up assembly uploads the chip 60 to the transfer unit 40, that is, the second pick-up head 34 carries the chip 60 to the transfer unit 40 in sequence.
  • the transfer unit 40 transfers all of the chips 60 to the substrate of the substrate supply unit 20 and completes the bonding of all of the chips 60 at one time.
  • the first pickup head 32 projects downward, and a chip 60 is picked up from the chip supply unit 10; the first pickup head 32 is raised and rotated 90° counterclockwise, The second pick-up head 34 hands over the chip 60; then the first pick-up head 32 is rotated 90° clockwise
  • the chip 60 is removed while the second pick-up head 34 is rotated to the first alignment member 35 for position scanning; the first pick-up head 32 rotates the second chip 60 to the intersection with the second pick-up head 34, waiting for the second pick-up
  • the head 34 picks up, while the second pick-up head 34 carries the first chip 60, accurately transfers the position information scanned by the first alignment member 35 to the transfer unit 40, and so on, thereby completing the supply of the chip 60 from the chip. Transfer of unit 10 to transfer unit 40.
  • both steps S3 and S4 further include: the transfer unit 40 carries the chip 60 to move over the fine adjustment unit 50, and the fine adjustment unit 50 is on the transfer unit 40 for each chip 60. Position adjustment.
  • step S3 the transmitting unit 40 simultaneously moves a plurality of the chips 60 to the top of the fine adjustment unit 50, and performs the position of each chip 60 on the transfer unit 40 by using the fine adjustment unit 50.
  • Adjustment specifically, the second alignment component 51 scans the chip 60 on the stage 42. After the second alignment component 51 scans the chip 60 and calculates it, the fine adjustment hand 52 is loaded one by one according to the scanning result of each chip 60.
  • the chip 60 on the stage 42 is removed and adjusted, and the stage 42 is also horizontally adjusted according to the scanning result so that the position and angle of the chip 60 on the stage 42 satisfy the requirements.
  • the step S4 further includes identifying the position of the chip 60 on the second pick-up component by using the first alignment component 35, and then aligning the chip 60 with the transfer unit 40, specifically, the flipped chip 60.
  • the first alignment component 35 scans the chip mark and calculates that the stage 42 is moved into position according to the alignment result, while the second pickup head 34 is flipped over with the chip 60 to complete the handover.
  • the step of enabling the fine adjustment unit 50 to perform the precision adjustment can be omitted, saving time and energy while ensuring accuracy.
  • the present invention provides a batch bonding device and a bonding method, the device comprising a chip supply unit 10 for providing a chip 60 to be bonded; a substrate supply unit 20 for providing a substrate; and a transfer unit 40 For moving between the chip supply unit 10 and the substrate supply unit 20
  • the chip 60 is sent; a pickup unit 30 is disposed above the chip supply unit 10 for picking up the chip 60 from the chip supply unit 10, and flipping the marking surface 61 of the chip 60 to a desired direction and uploading To the transfer unit 40.
  • the pick-up and precision adjustment of each chip 60 is completed separately, but in the transfer process and the bonding process, the plurality of chips 60 can be simultaneously completed, which greatly increases the yield; the present invention marks the chip 60 according to the bonding.
  • the flipping mechanism and the steps are selectively employed to enable the device to be compatible with the marking surface 61 on the chip 60 in the upward and downward bonding manner.

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Abstract

一种批处理键合装置及键合方法，键合装置包括：芯片供应单元（10），用于提供待键合的芯片（60）；基底供应单元（20），用于提供基底；传送单元（40），用于在芯片供应单元（10）以及基底供应单元（20）之间移送芯片（60）；拾取单元（30），设置于芯片供应单元（10）上方，用于从芯片供应单元（10）拾取芯片（60），并将芯片（60）的标记面翻转至所需方向后上载至传送单元（40）。由此单独完成每个芯片的拾取，但传送过程和键合过程中，多个芯片可同时完成，大大增加了产率。

Description

一种批处理键合装置及键合方法 技术领域
本发明涉及芯片键合领域，特别涉及一种批处理键合装置及键合方法。
背景技术
芯片键合是将芯片与载片连接形成的一种互连形式。键合芯片一般以标记面朝上的方式放置在分离台上，采用机械手抓取和翻转的方式将芯片传输到基底上进行键合。键合流程串行完成时，对于下压接合时间较长(约为30秒)的工艺，由于一次只能接合一颗芯片，产率非常低，难以满足量产需求。另外，芯片键合分为芯片上的标记面朝下键合到基底上，以及芯片上的标记面朝上键合到基底上两种工艺，目前已知设备只能完成一种方式的芯片键合工艺，更换设备的过程复杂，进一步降低了键合的产率。
发明内容
本发明提供一种批处理键合装置及键合方法，以解决现有的芯片键合产率低的问题。
为解决上述技术问题，本发明提供一种批处理键合装置，包括：
芯片供应单元，用于提供待键合的芯片；
基底供应单元，用于提供基底；
传送单元，用于在所述芯片供应单元以及所述基底供应单元之间移送所述芯片拾取单元，设置于所述芯片供应单元上方，用于从所述芯片供应单元拾取芯片，并将所述芯片的标记面翻转至所需方向后上载至所述传送单元。
较佳地，所述拾取单元包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元上方，包括第一转动部件和设置于所述第一 转动部件上的第一拾取头；所述第二拾取组件包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取头从所述芯片供应单元上拾取芯片，并交接至所述传送单元或交接至所述第二拾取头。
较佳地，所述第一转动部件旋转一次的角度为90°或180°。
较佳地，所述第二拾取组件还包括第一对准部件，用于识别所述第二拾取头上的芯片的位置。
较佳地，所述第二拾取头的数量为一个，所述第二转动部件驱动所述第二拾取头在与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位之间转换。
较佳地，所述第二拾取头的数量为至少三个，所述至少三个第二拾取头均匀设置于所述第二转动部件上，且绕圆周间隔分布，所述第二转动部件转动停止时，所述至少三个第二拾取头中的三个分别位于与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位。
较佳地，所述第二转动部件转动一次的角度与相邻两个第二拾取头之间的角度相同。
较佳地，所述批处理键合装置还包括精调单元，所述精调单元包括第二对准部件和精调手，所述第二对准部件扫描所述传送单元上的芯片的位置，所述精调手根据所述第二对准部件的扫描结果对所述芯片的位置进行调整。
较佳地，所述传送单元包括导轨和安装于所述导轨上并能沿所述导轨滑动的载台，所述载台上设有吸头，用于吸附多个芯片。
本发明还提供了一种批处理键合方法，应用于如上所述的批处理键合装置，包括如下步骤：
S1：将带有芯片的晶片上载至所述芯片供应单元，将基底上载至所述基 底供应单元；
S2：判断键合时要求的芯片上标记面的方向；
S3：若要求标记面朝下键合，则所述拾取单元依次从所述芯片供应单元拾取芯片旋转180°并传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合；
S4：若要求标记面朝上键合，则所述拾取单元从所述芯片供应单元拾取芯片并翻转，将翻转后的芯片依次传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合。
较佳地，步骤S3和S4均还包括：所述传送单元携载所述芯片移动至精调单元上方，所述精调单元对每个芯片在所述传送单元上的位置进行调整。
较佳地，步骤S4中所述拾取单元从所述芯片供应单元拾取芯片并翻转的步骤包括：第一拾取组件从所述芯片供应单元上拾取芯片后旋转90°交接给第二拾取组件；以及由所述第二拾取组件将所述芯片上载至所述传送单元。
较佳地，所述步骤S4还包括利用第一对准部件识别所述第二拾取组件上芯片的位置，之后将所述芯片与所述传送单元进行对准交接。
与现有技术相比，本发明提供的批处理键合装置及键合方法，具有如下优点：
1.本发明中，每个芯片的拾取和精度调整是单独完成的，但芯片的传送和键合，可多个芯片同时完成，从而大大提高了产率，以满足量产要求；
2.本发明根据键合时对芯片上标记面方向的要求，选择性使用第二拾取组件，使该装置能够兼容芯片上的标记面朝上和朝下两种键合方式。
附图说明
图1为本发明一具体实施方式中批处理键合装置的结构示意图(要求标记面朝下键合)；
图2为本发明一具体实施方式中批处理键合装置的结构示意图(要求标记面朝上键合)；
图3为本发明一具体实施方式中拾取单元的结构示意图；
图4为本发明一具体实施方式中精调单元的结构示意图；
图5为本发明一具体实施方式中基底供应单元的结构示意图；
图6为本发明一具体实施方式中传送单元的结构示意图；
图7为本发明一具体实施方式中芯片的结构示意图；
图8为本发明一具体实施方式中第二拾取头的结构示意图；
图9为本发明一具体实施方式中当要求标记面朝上键合时，第一拾取组件与第二拾取组件的交接流程示意图。
图中：10-芯片供应单元、11-分离台、12-载盘、20-基底供应单元、21-键合台、22-载板、30-拾取单元、31-第一转动部件、32-第一拾取头、33-第二转动部件、34-第二拾取头、35-第一对准部件、40-传送单元、41-导轨、42-载台、50-精调单元、51-第二对准部件、52-精调手、60-芯片、61-标记面。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本发明提供的批处理键合装置，如图1和图2所示，包括：
芯片供应单元10，用于从晶片中分离出单个待键合的芯片60，并提供待键合的芯片60给拾取单元30，请结合图3，所述芯片供应单元10包括分离 台11以及安装于所述分离台11上的载盘12，所述载盘12用于承载芯片60，所述分离台11可带动所述芯片60在水平面上移动；
基底供应单元20，用于提供基底，请重点参考图5，包括键合台21和安装于所述键合台21上的载板22，所述载板22用于承载基底，所述键合台21可带动所述基底在水平面上移动；
传送单元40，用于在所述芯片供应单元10以及所述基底供应单元20之间移送所述芯片60；
拾取单元30，设置于所述芯片供应单元10上方，用于从所述芯片供应单元10拾取芯片60，并将所述芯片60的标记面61翻转至所需方向后上载至所述传送单元40，如图7所示。
具体地，本发明中，每个芯片60的拾取和精度调整是单独完成的，但芯片60的传送和键合，可多个芯片60同时完成，从而大大提高了产率，以满足量产要求；本发明根据键合时对芯片60上标记面61方向的要求，选择性使用第二拾取组件，使该装置能够兼容芯片60上的标记面61朝上和朝下两种键合方式。
较佳地，请重点参考图3，所述拾取单元30包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元10上方，包括第一转动部件31和设置于所述第一转动部件31上的第一拾取头32；所述第二拾取组件包括第二转动部件33和设置于所述第二转动部件33上的第二拾取头34，所述第一拾取头32从所述芯片供应单元10上拾取芯片60，并交接至所述传送单元40或交接至所述第二拾取头34，具体地，不需翻转时，第一拾取头32直接将芯片60交接至传送单元40；若需翻转，则第一拾取头32将芯片60交接至第二拾取头34进行翻转，再通过第二拾取头34将翻转后的芯片60传递至传送单元40。较佳地，所述第二拾取组件还包括第一对准部件35，用于 识别所述第二拾取头34上的芯片60的位置，所述第一对准部件35设置于所述第二转动部件33的下方，在第一拾取头32与第二拾取头34交接完成后，利用所述第一对准部件35扫描芯片60在所述第二拾取头34上的位置，利用该位置信息确保第二拾取头34可将芯片60传递至传送单元40的准确位置。
较佳地，请继续参考图3，所述第二拾取头34的数量为一个，所述第二转动部件33驱动所述第二拾取头34在与所述第一对准部件35对应的对准位(第二拾取头34朝向第一对准部件35)、与所述第一拾取头32对应的交接位(第二拾取头34朝向第一拾取头32)、以及与所述传送单元40对应的传送位(第二拾取头34朝向传送单元40)之间转换，交接时，所述第一转动部件31旋转一次的角度为90°或180°，确保交接精度的同时，简化装置结构。
较佳地，请重点参考图8，所述第二拾取头34的数量为多个(本实施例以4个为例)，4个所述第二拾取头34均匀设置于所述第二转动部件33上，且绕一个圆周间隔分布，优选均匀间隔分布，所述第二转动部件33转动停止时，其中三个第二拾取头34分别位于与所述第一对准部件35对应的对准位、与所述第一拾取头32对应的交接位、以及与所述传送单元40对应的传送位。这样，每个第二拾取头34可在不同的工位处做不同的动作，进一步提高键合效率。本实施例中，所述第二转动部件33转动一次的角度与相邻两个第二拾取头34之间的角度相同，同样以四个第二拾取头34为例，第二转动部件33转动一次的角度为90°。
较佳地，请重点参考图1和图2，所述批处理键合装置还包括精调单元50，结合图4，所述精调单元50包括第二对准部件51和精调手52，所述第二对准部件51扫描所述传送单元40上的芯片60的位置，所述精调手52根据所述第二对准部件51的扫描结果对所述芯片60的位置进行调整。
较佳地，请重点参考图6，所述传送单元40包括导轨41和安装于所述导 轨41上并能沿所述导轨41滑动的载台42，所述载台42上设有吸头(未图示)，芯片60在所述吸头上的位置布局可按需调整。
请重点参考图1和图2，本发明还提供了一种批处理键合方法，应用于如上所述的批处理键合装置，包括如下步骤：
S1：将带有芯片60的晶片上载至所述芯片供应单元10，此时所述芯片60的标记面61均朝上；将基底上载至所述基底供应单元20；
S2：判断键合时要求的芯片60上标记面61的方向，即要求标记面61朝上键合还是要求标记面61朝下键合；
S3：若要求标记面61朝下键合，如图1所示，则所述拾取单元30依次从所述芯片供应单元10拾取芯片60，并将多个芯片60依次旋转180°并传递至所述传送单元40，直至所述传送单元40中载台42上的芯片60数量与布局满足要求，所述传送单元40将所有芯片60移送至所述基底供应单元20的基底上并一次性完成所有芯片60的键合；
S4：若要求标记面61朝上键合，如图2所示，则所述第一拾取头32从所述芯片供应单元10拾取芯片60，交接至所述第二拾取头34实现翻转，该步骤中所述拾取单元从所述芯片供应单元10拾取芯片60并翻转步骤为：利用第一拾取组件从所述芯片供应单元10上拾取芯片60后旋转90°交接给第二拾取组件，实现翻转，所述第二拾取组件将所述芯片60上载至所述传送单元40，即第二拾取头34承载芯片60依次传递至所述传送单元40。所述传送单元40将所有芯片60移送至所述基底供应单元20的基底上并一次性完成所有芯片60的键合。
请参考图9，当要求标记面61朝下键合时，第一拾取头32向下伸出，从芯片供应单元10拾取一个芯片60；第一拾取头32上升并逆时针旋转90°，与所述第二拾取头34交接该芯片60；然后第一拾取头32顺时针旋转90°拾 取下一个芯片60，同时第二拾取头34旋转至第一对准部件35进行位置扫描；第一拾取头32将第二个芯片60旋转至与第二拾取头34交接处，等待第二拾取头34来拾取，同时第二拾取头34带着第一个芯片60，按照第一对准部件35扫描的位置信息，精确交接至传送单元40上，依此类推，从而完成芯片60从芯片供应单元10到传送单元40的移送。
较佳地，步骤S3和S4均还包括：所述传送单元40携载所述芯片60移动至精调单元50上方，所述精调单元50对每个芯片60在所述传送单元40上的位置进行调整。
具体地，步骤S3中，所述传送单元40将多个所述芯片60同时移动至所述精调单元50上方，利用精调单元50对每个芯片60在所述传送单元40上的位置进行调整，具体地，第二对准部件51扫描载台42上的芯片60，待第二对准部件51扫描完芯片60并计算后，精调手52根据每个芯片60的扫描结果逐个将载台42上的芯片60取下，调整，同时载台42亦根据扫描结果水平调整，使载台42上的芯片60的位置、角度满足要求。
步骤S4中还包括利用第一对准部件35识别所述第二拾取组件上芯片60的位置，之后将所述芯片60与所述传送单元40进行对准交接，具体地，翻转后的芯片60移动至第一对准部件35处，第一对准部件35扫描芯片标记并计算，载台42根据对准结果运动到位，同时第二拾取头34带芯片60翻转与载台42完成交接，在该过程中，由于第一对准部件35已经对位置精度进行了调整，因此，启用精调单元50进行精度调整的步骤可以省略，在确保精度的前提下，节约了时间和能源。
综上所述，本发明提供的批处理键合装置及键合方法，该装置包括芯片供应单元10，用于提供待键合的芯片60；基底供应单元20，用于提供基底；传送单元40，用于在所述芯片供应单元10以及所述基底供应单元20之间移 送所述芯片60；拾取单元30，设置于所述芯片供应单元10上方，用于从所述芯片供应单元10拾取芯片60，并将所述芯片60的标记面61翻转至所需方向后上载至所述传送单元40。本发明中，单独完成每个芯片60的拾取和精度调整，但传送过程和键合过程中，多个芯片60可同时完成，大大增加了产率；本发明根据键合时对芯片60上标记面61方向的要求，选择性采取翻转机构及步骤，使该装置能够兼容芯片60上的标记面61朝上和朝下两种键合方式。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (13)

  1. 一种批处理键合装置，其特征在于，包括：
    芯片供应单元，用于提供待键合的芯片；
    基底供应单元，用于提供基底；
    传送单元，用于在所述芯片供应单元以及所述基底供应单元之间移送所述芯片；
    拾取单元，设置于所述芯片供应单元上方，用于从所述芯片供应单元拾取芯片，并将所述芯片的标记面翻转至所需方向后上载至所述传送单元。
  2. 如权利要求1所述的批处理键合装置，其特征在于，所述拾取单元包括第一拾取组件和第二拾取组件，所述第一拾取组件设置于所述芯片供应单元上方，包括第一转动部件和设置于所述第一转动部件上的第一拾取头；所述第二拾取组件包括第二转动部件和设置于所述第二转动部件上的第二拾取头，所述第一拾取头从所述芯片供应单元上拾取芯片，并交接至所述传送单元或交接至所述第二拾取头。
  3. 如权利要求2所述的批处理键合装置，其特征在于，所述第一转动部件旋转一次的角度为90°或180°。
  4. 如权利要求2所述的批处理键合装置，其特征在于，所述第二拾取组件还包括第一对准部件，用于识别所述第二拾取头上的芯片的位置。
  5. 如权利要求4所述的批处理键合装置，其特征在于，所述第二拾取头的数量为一个，所述第二转动部件驱动所述第二拾取头在与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位之间转换。
  6. 如权利要求4所述的批处理键合装置，其特征在于，所述第二拾取头 的数量为至少三个，所述至少三个第二拾取头均匀设置于所述第二转动部件上，且绕圆周间隔分布，所述第二转动部件转动停止时，所述至少三个第二拾取头中的三个分别位于与所述第一对准部件对应的对准位、与所述第一拾取头对应的交接位、以及与所述传送单元对应的传送位。
  7. 如权利要求6所述的批处理键合装置，其特征在于，所述第二转动部件转动一次的角度与相邻两个第二拾取头之间的角度相同。
  8. 如权利要求1所述的批处理键合装置，其特征在于，所述批处理键合装置还包括精调单元，所述精调单元包括第二对准部件和精调手，所述第二对准部件扫描所述传送单元上的芯片的位置，所述精调手根据所述第二对准部件的扫描结果对所述芯片的位置进行调整。
  9. 如权利要求1所述的批处理键合装置，其特征在于，所述传送单元包括导轨和安装于所述导轨上并能沿所述导轨滑动的载台，所述载台上设有吸头，用于吸附多个芯片。
  10. 一种批处理键合方法，应用于如权利要求1所述的批处理键合装置，其特征在于，包括如下步骤：
    S1：将带有芯片的晶片上载至所述芯片供应单元，将基底上载至所述基底供应单元；
    S2：判断键合时要求的芯片上标记面的方向；
    S3：若要求标记面朝下键合，则所述拾取单元依次从所述芯片供应单元拾取芯片旋转180°并传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合；
    S4：若要求标记面朝上键合，则所述拾取单元从所述芯片供应单元拾取芯片并翻转，将翻转后的芯片依次传递至所述传送单元，所述传送单元将所有芯片移送至所述基底供应单元的基底上并一次性完成所有芯片的键合。
  11. 如权利要求10所述批处理键合方法，其特征在于，步骤S3和S4均还包括：所述传送单元携载所述芯片移动至精调单元上方，所述精调单元对每个芯片在所述传送单元上的位置进行调整。
  12. 如权利要求10所述批处理键合方法，其特征在于，步骤S4中所述拾取单元从所述芯片供应单元拾取芯片并翻转的步骤包括：第一拾取组件从所述芯片供应单元上拾取芯片后旋转90°交接给第二拾取组件；以及由所述第二拾取组件将所述芯片上载至所述传送单元。
  13. 如权利要求12所述批处理键合方法，其特征在于，所述步骤S4还包括利用第一对准部件识别所述第二拾取组件上芯片的位置，之后将所述芯片与所述传送单元进行对准交接。
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