TW201614760A - Heater apparatus for substrate processing and liquid processing arraratus for substrate comprising the same - Google Patents

Heater apparatus for substrate processing and liquid processing arraratus for substrate comprising the same

Info

Publication number
TW201614760A
TW201614760A TW104131640A TW104131640A TW201614760A TW 201614760 A TW201614760 A TW 201614760A TW 104131640 A TW104131640 A TW 104131640A TW 104131640 A TW104131640 A TW 104131640A TW 201614760 A TW201614760 A TW 201614760A
Authority
TW
Taiwan
Prior art keywords
substrate
processing
same
opposite surface
arraratus
Prior art date
Application number
TW104131640A
Other languages
English (en)
Other versions
TWI567857B (zh
Inventor
Kwang-Il Jung
Byeong-Su Lee
Joo-Hyung Ryu
Original Assignee
Zeus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140136939A external-priority patent/KR102046531B1/ko
Priority claimed from KR1020140136938A external-priority patent/KR102082151B1/ko
Application filed by Zeus Co Ltd filed Critical Zeus Co Ltd
Publication of TW201614760A publication Critical patent/TW201614760A/zh
Application granted granted Critical
Publication of TWI567857B publication Critical patent/TWI567857B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
TW104131640A 2014-10-10 2015-09-24 基板處理用加熱裝置及含有該加熱裝置的基板液處理裝置 TWI567857B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140136939A KR102046531B1 (ko) 2014-10-10 2014-10-10 기판 처리용 온도측정장치 및 이를 구비한 기판 액처리 장치
KR1020140136938A KR102082151B1 (ko) 2014-10-10 2014-10-10 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치

Publications (2)

Publication Number Publication Date
TW201614760A true TW201614760A (en) 2016-04-16
TWI567857B TWI567857B (zh) 2017-01-21

Family

ID=55653323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131640A TWI567857B (zh) 2014-10-10 2015-09-24 基板處理用加熱裝置及含有該加熱裝置的基板液處理裝置

Country Status (5)

Country Link
US (1) US20170221730A1 (zh)
JP (1) JP6343100B2 (zh)
CN (1) CN106575618A (zh)
TW (1) TWI567857B (zh)
WO (1) WO2016056748A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651791B (zh) * 2017-09-19 2019-02-21 台灣積體電路製造股份有限公司 烘烤模組的驗證測試方法及其系統

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11107708B2 (en) 2017-11-14 2021-08-31 Taiwan Semiconductor Manufacturing Company, Ltd. Heating platform, thermal treatment and manufacturing method
JP7096693B2 (ja) * 2018-04-13 2022-07-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
CN110854044B (zh) * 2019-11-20 2022-05-27 北京北方华创微电子装备有限公司 半导体设备及其加热装置
KR102406087B1 (ko) * 2020-03-23 2022-06-10 엘에스이 주식회사 회전 척에 내장된 광원을 이용한 기판 처리 장치
CN113471046B (zh) 2020-12-14 2023-06-20 北京屹唐半导体科技股份有限公司 具有等离子体处理系统和热处理系统的工件处理装置

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JP3130607B2 (ja) * 1991-11-15 2001-01-31 東京エレクトロン株式会社 処理装置
US6108490A (en) * 1996-07-11 2000-08-22 Cvc, Inc. Multizone illuminator for rapid thermal processing with improved spatial resolution
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
US20090081810A1 (en) * 2004-10-06 2009-03-26 Ebara Corporation Substrate processing apparatus and substrate processing method
TWI240333B (en) * 2004-12-07 2005-09-21 Chung Shan Inst Of Science Thermal treatment apparatus and tuning technology for thermal treatment process
JP2007019158A (ja) * 2005-07-06 2007-01-25 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4864396B2 (ja) * 2005-09-13 2012-02-01 株式会社東芝 半導体素子の製造方法、及び、半導体素子の製造装置
JP5282409B2 (ja) * 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
KR20120054636A (ko) * 2009-08-18 2012-05-30 도쿄엘렉트론가부시키가이샤 열처리장치
US20110185969A1 (en) * 2009-08-21 2011-08-04 Varian Semiconductor Equipment Associates, Inc. Dual heating for precise wafer temperature control
JP2011256427A (ja) * 2010-06-09 2011-12-22 Hitachi Zosen Corp 真空蒸着装置における蒸着材料の蒸発、昇華方法および真空蒸着用るつぼ装置
US20120015523A1 (en) * 2010-07-15 2012-01-19 Jerry Dustin Leonhard Systems and methods for etching silicon nitride
JP5964626B2 (ja) * 2012-03-22 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP6351948B2 (ja) * 2012-10-12 2018-07-04 ラム・リサーチ・アーゲーＬａｍ Ｒｅｓｅａｒｃｈ Ａｇ 円板状物品の液体処理装置およびかかる装置で用いる加熱システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651791B (zh) * 2017-09-19 2019-02-21 台灣積體電路製造股份有限公司 烘烤模組的驗證測試方法及其系統
US11222783B2 (en) 2017-09-19 2022-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Using cumulative heat amount data to qualify hot plate used for postexposure baking

Also Published As

Publication number Publication date
JP6343100B2 (ja) 2018-06-13
JP2017524269A (ja) 2017-08-24
TWI567857B (zh) 2017-01-21
WO2016056748A1 (ko) 2016-04-14
CN106575618A (zh) 2017-04-19
US20170221730A1 (en) 2017-08-03

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