SG10201501104QA - Universal process carrier for substrates - Google Patents
Universal process carrier for substratesInfo
- Publication number
- SG10201501104QA SG10201501104QA SG10201501104QA SG10201501104QA SG10201501104QA SG 10201501104Q A SG10201501104Q A SG 10201501104QA SG 10201501104Q A SG10201501104Q A SG 10201501104QA SG 10201501104Q A SG10201501104Q A SG 10201501104QA SG 10201501104Q A SG10201501104Q A SG 10201501104QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- process carrier
- universal process
- universal
- carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49998—Work holding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/179,777 US20150228517A1 (en) | 2014-02-13 | 2014-02-13 | Universal process carrier for substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201501104QA true SG10201501104QA (en) | 2015-09-29 |
Family
ID=53775558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201501104QA SG10201501104QA (en) | 2014-02-13 | 2015-02-12 | Universal process carrier for substrates |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150228517A1 (en) |
CN (2) | CN104851828A (en) |
SG (1) | SG10201501104QA (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015113956B4 (en) * | 2015-08-24 | 2024-03-07 | Meyer Burger (Germany) Gmbh | Substrate carrier |
WO2017180866A1 (en) * | 2016-04-15 | 2017-10-19 | Michaelis A John | Maintaining alignment while turning over a panel |
WO2020242611A1 (en) | 2019-05-24 | 2020-12-03 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
CN110379758B (en) * | 2019-07-05 | 2021-02-02 | 深超光电(深圳)有限公司 | Adsorption device, transfer system and transfer method |
US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6581278B2 (en) * | 2001-01-16 | 2003-06-24 | St Assembly Test Service Ltd. | Process and support carrier for flexible substrates |
US7402893B2 (en) * | 2003-11-21 | 2008-07-22 | Texas Instruments Incorporated | System and method for improved auto-boating |
JP4613367B2 (en) * | 2004-08-30 | 2011-01-19 | スパンション エルエルシー | Carrier structure for stacked semiconductor device, manufacturing method thereof, and manufacturing method of stacked semiconductor device |
CN202384308U (en) * | 2011-07-11 | 2012-08-15 | 诺发系统有限公司 | Carrier adapter used for semiconductor wafer disposition |
-
2014
- 2014-02-13 US US14/179,777 patent/US20150228517A1/en not_active Abandoned
-
2015
- 2015-02-12 SG SG10201501104QA patent/SG10201501104QA/en unknown
- 2015-02-12 CN CN201510083427.7A patent/CN104851828A/en active Pending
- 2015-02-12 CN CN201520102651.1U patent/CN204632730U/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN204632730U (en) | 2015-09-09 |
US20150228517A1 (en) | 2015-08-13 |
CN104851828A (en) | 2015-08-19 |
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