SG10201601073TA - Process fluid circulation type processing system - Google Patents

Process fluid circulation type processing system

Info

Publication number
SG10201601073TA
SG10201601073TA SG10201601073TA SG10201601073TA SG10201601073TA SG 10201601073T A SG10201601073T A SG 10201601073TA SG 10201601073T A SG10201601073T A SG 10201601073TA SG 10201601073T A SG10201601073T A SG 10201601073TA SG 10201601073T A SG10201601073T A SG 10201601073TA
Authority
SG
Singapore
Prior art keywords
processing system
process fluid
fluid circulation
circulation type
type processing
Prior art date
Application number
SG10201601073TA
Inventor
Uchida Masayoshi
Yoshida Miki
Arai Satoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201601073TA publication Critical patent/SG10201601073TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
SG10201601073TA 2015-03-10 2016-02-15 Process fluid circulation type processing system SG10201601073TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015046664A JP2016165771A (en) 2015-03-10 2015-03-10 Processing liquid circulation type processing system

Publications (1)

Publication Number Publication Date
SG10201601073TA true SG10201601073TA (en) 2016-10-28

Family

ID=56886385

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601073TA SG10201601073TA (en) 2015-03-10 2016-02-15 Process fluid circulation type processing system

Country Status (4)

Country Link
US (1) US20160263627A1 (en)
JP (1) JP2016165771A (en)
SG (1) SG10201601073TA (en)
TW (1) TW201641441A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887722B2 (en) * 2016-10-25 2021-06-16 株式会社ディスコ Wafer processing method and cutting equipment
JP7015638B2 (en) * 2017-02-23 2022-02-03 株式会社ディスコ Machining liquid supply device
JP7034543B2 (en) * 2017-10-13 2022-03-14 株式会社ディスコ Tool cutting equipment
JP7337442B2 (en) * 2019-02-19 2023-09-04 株式会社ディスコ Machining fluid circulation system
CN112318196A (en) * 2020-10-30 2021-02-05 郑斋彬 Auxiliary mechanism based on coolant liquid recycling for numerical control machine tool

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722442A (en) * 1994-01-07 1998-03-03 Startec Ventures, Inc. On-site generation of ultra-high-purity buffered-HF for semiconductor processing
JP2900788B2 (en) * 1994-03-22 1999-06-02 信越半導体株式会社 Single wafer processing equipment
TWI271555B (en) * 2005-06-13 2007-01-21 Basf Ag Slurry composition for polishing color filter
JP4908097B2 (en) * 2006-07-28 2012-04-04 株式会社ディスコ Cutting equipment
JP5086123B2 (en) * 2008-02-15 2012-11-28 株式会社ディスコ Processing waste liquid treatment equipment
JP2009260020A (en) * 2008-04-16 2009-11-05 Kurita Water Ind Ltd Cleaning water for electronic material, method of cleaning electronic material, and system for supplying water containing dissolved gas
JP5461918B2 (en) * 2009-08-19 2014-04-02 株式会社ディスコ Processing waste liquid treatment equipment
US8883701B2 (en) * 2010-07-09 2014-11-11 Air Products And Chemicals, Inc. Method for wafer dicing and composition useful thereof
JP6227895B2 (en) * 2013-05-24 2017-11-08 株式会社荏原製作所 Substrate processing equipment

Also Published As

Publication number Publication date
US20160263627A1 (en) 2016-09-15
JP2016165771A (en) 2016-09-15
TW201641441A (en) 2016-12-01

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