SG11201706069WA - Lamp heating for process chamber - Google Patents

Lamp heating for process chamber

Info

Publication number
SG11201706069WA
SG11201706069WA SG11201706069WA SG11201706069WA SG11201706069WA SG 11201706069W A SG11201706069W A SG 11201706069WA SG 11201706069W A SG11201706069W A SG 11201706069WA SG 11201706069W A SG11201706069W A SG 11201706069WA SG 11201706069W A SG11201706069W A SG 11201706069WA
Authority
SG
Singapore
Prior art keywords
process chamber
lamp heating
lamp
heating
chamber
Prior art date
Application number
SG11201706069WA
Inventor
Mehmet Tugrul Samir
Schubert S Chu
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201706069WA publication Critical patent/SG11201706069WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
SG11201706069WA 2015-01-30 2016-01-04 Lamp heating for process chamber SG11201706069WA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562110440P 2015-01-30 2015-01-30
US201562141133P 2015-03-31 2015-03-31
PCT/US2016/012066 WO2016122835A1 (en) 2015-01-30 2016-01-04 Lamp heating for process chamber

Publications (1)

Publication Number Publication Date
SG11201706069WA true SG11201706069WA (en) 2017-08-30

Family

ID=56544155

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706069WA SG11201706069WA (en) 2015-01-30 2016-01-04 Lamp heating for process chamber

Country Status (6)

Country Link
US (1) US10356848B2 (en)
KR (2) KR20230173740A (en)
CN (1) CN107208966B (en)
SG (1) SG11201706069WA (en)
TW (1) TWI686869B (en)
WO (1) WO2016122835A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018017587A1 (en) 2016-07-22 2018-01-25 Applied Materials, Inc. Heating modulators to improve epi uniformity tuning
US11057963B2 (en) 2017-10-06 2021-07-06 Applied Materials, Inc. Lamp infrared radiation profile control by lamp filament design and positioning
CN109489363A (en) * 2018-12-24 2019-03-19 国兴(东莞)新能源科技有限公司 A kind of soft-package battery de-watering apparatus
US11107709B2 (en) 2019-01-30 2021-08-31 Applied Materials, Inc. Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
JP7098677B2 (en) 2020-03-25 2022-07-11 株式会社Kokusai Electric Manufacturing methods and programs for substrate processing equipment and semiconductor equipment
CN113124649B (en) * 2021-03-31 2022-09-23 北京印刷学院 Control method and device for microwave transmitting array in microwave drying system
US20220322492A1 (en) * 2021-04-06 2022-10-06 Applied Materials, Inc. Epitaxial deposition chamber
US20230341186A1 (en) * 2022-04-26 2023-10-26 Applied Materials, Inc. Air shrouds with integrated heat exchanger

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1669005A (en) * 1927-04-28 1928-05-08 Hustadt Paul Heating element for tempering machines
US6121579A (en) * 1996-02-28 2000-09-19 Tokyo Electron Limited Heating apparatus, and processing apparatus
US6771895B2 (en) * 1999-01-06 2004-08-03 Mattson Technology, Inc. Heating device for heating semiconductor wafers in thermal processing chambers
WO2001082348A1 (en) * 2000-04-20 2001-11-01 Tokyo Electron Limited Thermal processing system
JP2003059853A (en) * 2001-08-08 2003-02-28 Tokyo Electron Ltd Lamp heater and heat treatment apparatus
JP4294445B2 (en) * 2003-11-07 2009-07-15 パナソニック株式会社 Infrared bulb, heating device, and method of manufacturing infrared bulb
US7045746B2 (en) * 2003-11-12 2006-05-16 Mattson Technology, Inc. Shadow-free shutter arrangement and method
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
US7262390B2 (en) * 2005-05-23 2007-08-28 Chung Shan Institute Of Science And Technology, Armaments Bureau, M.N.D. Apparatus and adjusting technology for uniform thermal processing
US7398693B2 (en) * 2006-03-30 2008-07-15 Applied Materials, Inc. Adaptive control method for rapid thermal processing of a substrate
JP4893474B2 (en) * 2007-05-29 2012-03-07 ウシオ電機株式会社 Filament lamp and light irradiation type heat treatment equipment
JP2010016225A (en) * 2008-07-04 2010-01-21 Tokyo Electron Ltd Thermal control mechanism and semiconductor manufacturing device using the same
KR101031226B1 (en) * 2009-08-21 2011-04-29 에이피시스템 주식회사 Heater block of rapid thermal processing apparatus
JP2014503117A (en) * 2010-12-29 2014-02-06 スリーエム イノベイティブ プロパティズ カンパニー Remote phosphor LED device with broadband output and controllable color
CN103502508B (en) * 2010-12-30 2016-04-27 维易科仪器公司 Use the wafer processing of loader expansion
WO2013047975A1 (en) * 2011-09-26 2013-04-04 Posco Led Company Ltd. Optical semiconductor-based lighting apparatus
US9905444B2 (en) * 2012-04-25 2018-02-27 Applied Materials, Inc. Optics for controlling light transmitted through a conical quartz dome
TWI722978B (en) * 2013-04-16 2021-04-01 美商應用材料股份有限公司 Lamp heater for atomic layer deposition
KR101458963B1 (en) * 2014-02-18 2014-11-12 민정은 Heater for papid heat treatment apparatus

Also Published As

Publication number Publication date
KR20170109599A (en) 2017-09-29
WO2016122835A1 (en) 2016-08-04
US20160227606A1 (en) 2016-08-04
CN107208966A (en) 2017-09-26
CN107208966B (en) 2020-01-03
US10356848B2 (en) 2019-07-16
TW201639037A (en) 2016-11-01
KR20230173740A (en) 2023-12-27
TWI686869B (en) 2020-03-01

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