TW201535635A - 接合裝置用加熱器及其冷卻方法 - Google Patents

接合裝置用加熱器及其冷卻方法 Download PDF

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Publication number
TW201535635A
TW201535635A TW104117385A TW104117385A TW201535635A TW 201535635 A TW201535635 A TW 201535635A TW 104117385 A TW104117385 A TW 104117385A TW 104117385 A TW104117385 A TW 104117385A TW 201535635 A TW201535635 A TW 201535635A
Authority
TW
Taiwan
Prior art keywords
capillary
heater
cooling
insulating material
heat insulating
Prior art date
Application number
TW104117385A
Other languages
English (en)
Chinese (zh)
Inventor
瀬山耕平
千田恭弘
角谷修
Original Assignee
新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新川股份有限公司 filed Critical 新川股份有限公司
Publication of TW201535635A publication Critical patent/TW201535635A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Resistance Heating (AREA)
TW104117385A 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法 TW201535635A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Publications (1)

Publication Number Publication Date
TW201535635A true TW201535635A (zh) 2015-09-16

Family

ID=49948601

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104117385A TW201535635A (zh) 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法
TW102106499A TWI489598B (zh) 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102106499A TWI489598B (zh) 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof

Country Status (7)

Country Link
US (1) US10350692B2 (enExample)
JP (1) JP5793473B2 (enExample)
KR (2) KR101559741B1 (enExample)
CN (1) CN104520980B (enExample)
SG (1) SG11201500238RA (enExample)
TW (2) TW201535635A (enExample)
WO (1) WO2014013764A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
US11508688B2 (en) * 2016-03-24 2022-11-22 Shinkawa Ltd. Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
TWI834007B (zh) 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
US20240063170A1 (en) * 2020-12-28 2024-02-22 Shinkawa Ltd. Mounting head

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US5592363A (en) 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
JP2002016091A (ja) 2000-06-29 2002-01-18 Kyocera Corp 接触加熱装置
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
JP3801966B2 (ja) * 2002-07-31 2006-07-26 京セラ株式会社 加熱装置
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
JP2007180505A (ja) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US20070131659A1 (en) 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
JP2007242724A (ja) * 2006-03-06 2007-09-20 Seiko Epson Corp マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
CN102422413B (zh) * 2009-05-11 2014-07-30 丰田自动车株式会社 热交换器、半导体装置及它们的制造方法
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
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US9434029B2 (en) * 2011-12-20 2016-09-06 Intel Corporation High performance transient uniform cooling solution for thermal compression bonding process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

Also Published As

Publication number Publication date
WO2014013764A1 (ja) 2014-01-23
CN104520980B (zh) 2017-07-07
KR20140128380A (ko) 2014-11-05
US20150183040A1 (en) 2015-07-02
US10350692B2 (en) 2019-07-16
JP5793473B2 (ja) 2015-10-14
KR20150082673A (ko) 2015-07-15
TWI489598B (zh) 2015-06-21
KR101559741B1 (ko) 2015-10-13
TW201405731A (zh) 2014-02-01
JP2014022629A (ja) 2014-02-03
CN104520980A (zh) 2015-04-15
SG11201500238RA (en) 2015-03-30

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