JP5793473B2 - ボンディング装置用ヒータ及びその冷却方法 - Google Patents

ボンディング装置用ヒータ及びその冷却方法 Download PDF

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Publication number
JP5793473B2
JP5793473B2 JP2012161304A JP2012161304A JP5793473B2 JP 5793473 B2 JP5793473 B2 JP 5793473B2 JP 2012161304 A JP2012161304 A JP 2012161304A JP 2012161304 A JP2012161304 A JP 2012161304A JP 5793473 B2 JP5793473 B2 JP 5793473B2
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JP
Japan
Prior art keywords
capillary
insulating material
heat insulating
slits
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012161304A
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English (en)
Japanese (ja)
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JP2014022629A5 (enExample
JP2014022629A (ja
Inventor
耕平 瀬山
耕平 瀬山
恭弘 千田
恭弘 千田
角谷　修
修 角谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2012161304A priority Critical patent/JP5793473B2/ja
Priority to TW102106499A priority patent/TWI489598B/zh
Priority to TW104117385A priority patent/TW201535635A/zh
Priority to KR1020147024142A priority patent/KR101559741B1/ko
Priority to PCT/JP2013/060908 priority patent/WO2014013764A1/ja
Priority to CN201380014787.0A priority patent/CN104520980B/zh
Priority to KR1020157017088A priority patent/KR20150082673A/ko
Priority to SG11201500238RA priority patent/SG11201500238RA/en
Publication of JP2014022629A publication Critical patent/JP2014022629A/ja
Publication of JP2014022629A5 publication Critical patent/JP2014022629A5/ja
Priority to US14/597,635 priority patent/US10350692B2/en
Application granted granted Critical
Publication of JP5793473B2 publication Critical patent/JP5793473B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Resistance Heating (AREA)
JP2012161304A 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法 Active JP5793473B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法
TW104117385A TW201535635A (zh) 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法
TW102106499A TWI489598B (zh) 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof
PCT/JP2013/060908 WO2014013764A1 (ja) 2012-07-20 2013-04-11 ボンディング装置用ヒータ及びその冷却方法
CN201380014787.0A CN104520980B (zh) 2012-07-20 2013-04-11 接合装置用加热器及其冷却方法
KR1020157017088A KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
KR1020147024142A KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
SG11201500238RA SG11201500238RA (en) 2012-07-20 2013-04-11 Heater for bonding apparatus and method of cooling the same
US14/597,635 US10350692B2 (en) 2012-07-20 2015-01-15 Heater for bonding apparatus and method of cooling the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015050779A Division JP2015109485A (ja) 2015-03-13 2015-03-13 ボンディング装置用ヒータ及びその冷却方法
JP2015127628A Division JP6149241B2 (ja) 2015-06-25 2015-06-25 ボンディング装置用ヒータ及びその冷却方法

Publications (3)

Publication Number Publication Date
JP2014022629A JP2014022629A (ja) 2014-02-03
JP2014022629A5 JP2014022629A5 (enExample) 2014-10-23
JP5793473B2 true JP5793473B2 (ja) 2015-10-14

Family

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JP2012161304A Active JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Country Status (7)

Country Link
US (1) US10350692B2 (enExample)
JP (1) JP5793473B2 (enExample)
KR (2) KR101559741B1 (enExample)
CN (1) CN104520980B (enExample)
SG (1) SG11201500238RA (enExample)
TW (2) TW201535635A (enExample)
WO (1) WO2014013764A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
US11508688B2 (en) * 2016-03-24 2022-11-22 Shinkawa Ltd. Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
TWI834007B (zh) 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
US20240063170A1 (en) * 2020-12-28 2024-02-22 Shinkawa Ltd. Mounting head
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

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US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
JP2002016091A (ja) 2000-06-29 2002-01-18 Kyocera Corp 接触加熱装置
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
JP3801966B2 (ja) * 2002-07-31 2006-07-26 京セラ株式会社 加熱装置
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
JP2007180505A (ja) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US20070131659A1 (en) 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
JP2007242724A (ja) * 2006-03-06 2007-09-20 Seiko Epson Corp マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
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Also Published As

Publication number Publication date
WO2014013764A1 (ja) 2014-01-23
CN104520980B (zh) 2017-07-07
KR20140128380A (ko) 2014-11-05
US20150183040A1 (en) 2015-07-02
US10350692B2 (en) 2019-07-16
KR20150082673A (ko) 2015-07-15
TWI489598B (zh) 2015-06-21
KR101559741B1 (ko) 2015-10-13
TW201405731A (zh) 2014-02-01
JP2014022629A (ja) 2014-02-03
CN104520980A (zh) 2015-04-15
SG11201500238RA (en) 2015-03-30
TW201535635A (zh) 2015-09-16

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