KR20150082673A - 본딩 장치용 히터 및 그 냉각 방법 - Google Patents

본딩 장치용 히터 및 그 냉각 방법 Download PDF

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Publication number
KR20150082673A
KR20150082673A KR1020157017088A KR20157017088A KR20150082673A KR 20150082673 A KR20150082673 A KR 20150082673A KR 1020157017088 A KR1020157017088 A KR 1020157017088A KR 20157017088 A KR20157017088 A KR 20157017088A KR 20150082673 A KR20150082673 A KR 20150082673A
Authority
KR
South Korea
Prior art keywords
capillary
heater
cooling
bonding apparatus
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157017088A
Other languages
English (en)
Korean (ko)
Inventor
코헤이 세야마
야스히로 치다
오사무 카쿠타니
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20150082673A publication Critical patent/KR20150082673A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
KR1020157017088A 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법 Ceased KR20150082673A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法
JPJP-P-2012-161304 2012-07-20
PCT/JP2013/060908 WO2014013764A1 (ja) 2012-07-20 2013-04-11 ボンディング装置用ヒータ及びその冷却方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024142A Division KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Publications (1)

Publication Number Publication Date
KR20150082673A true KR20150082673A (ko) 2015-07-15

Family

ID=49948601

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157017088A Ceased KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
KR1020147024142A Active KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147024142A Active KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Country Status (7)

Country Link
US (1) US10350692B2 (enExample)
JP (1) JP5793473B2 (enExample)
KR (2) KR20150082673A (enExample)
CN (1) CN104520980B (enExample)
SG (1) SG11201500238RA (enExample)
TW (2) TW201535635A (enExample)
WO (1) WO2014013764A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
WO2017164385A1 (ja) * 2016-03-24 2017-09-28 株式会社新川 ボンディング装置
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
TWI834007B (zh) 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
WO2022144997A1 (ja) * 2020-12-28 2022-07-07 株式会社新川 実装ヘッド
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592363A (en) 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002016091A (ja) 2000-06-29 2002-01-18 Kyocera Corp 接触加熱装置
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
JP3801966B2 (ja) * 2002-07-31 2006-07-26 京セラ株式会社 加熱装置
JP2007180505A (ja) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
US20070131659A1 (en) 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
JP2007242724A (ja) * 2006-03-06 2007-09-20 Seiko Epson Corp マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
WO2010131317A1 (ja) * 2009-05-11 2010-11-18 トヨタ自動車株式会社 熱交換器、半導体装置、及び、これらの製造方法
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
US8633423B2 (en) * 2010-10-14 2014-01-21 Applied Materials, Inc. Methods and apparatus for controlling substrate temperature in a process chamber
US9434029B2 (en) * 2011-12-20 2016-09-06 Intel Corporation High performance transient uniform cooling solution for thermal compression bonding process

Also Published As

Publication number Publication date
WO2014013764A1 (ja) 2014-01-23
CN104520980A (zh) 2015-04-15
TW201405731A (zh) 2014-02-01
KR20140128380A (ko) 2014-11-05
SG11201500238RA (en) 2015-03-30
JP2014022629A (ja) 2014-02-03
KR101559741B1 (ko) 2015-10-13
US20150183040A1 (en) 2015-07-02
CN104520980B (zh) 2017-07-07
TW201535635A (zh) 2015-09-16
US10350692B2 (en) 2019-07-16
JP5793473B2 (ja) 2015-10-14
TWI489598B (zh) 2015-06-21

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