JP2014022629A5 - - Google Patents

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Publication number
JP2014022629A5
JP2014022629A5 JP2012161304A JP2012161304A JP2014022629A5 JP 2014022629 A5 JP2014022629 A5 JP 2014022629A5 JP 2012161304 A JP2012161304 A JP 2012161304A JP 2012161304 A JP2012161304 A JP 2012161304A JP 2014022629 A5 JP2014022629 A5 JP 2014022629A5
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JP
Japan
Prior art keywords
capillary
heater
bonding apparatus
insulating material
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012161304A
Other languages
English (en)
Japanese (ja)
Other versions
JP5793473B2 (ja
JP2014022629A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012161304A external-priority patent/JP5793473B2/ja
Priority to JP2012161304A priority Critical patent/JP5793473B2/ja
Priority to TW104117385A priority patent/TW201535635A/zh
Priority to TW102106499A priority patent/TWI489598B/zh
Priority to KR1020147024142A priority patent/KR101559741B1/ko
Priority to CN201380014787.0A priority patent/CN104520980B/zh
Priority to KR1020157017088A priority patent/KR20150082673A/ko
Priority to PCT/JP2013/060908 priority patent/WO2014013764A1/ja
Priority to SG11201500238RA priority patent/SG11201500238RA/en
Publication of JP2014022629A publication Critical patent/JP2014022629A/ja
Publication of JP2014022629A5 publication Critical patent/JP2014022629A5/ja
Priority to US14/597,635 priority patent/US10350692B2/en
Publication of JP5793473B2 publication Critical patent/JP5793473B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012161304A 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法 Active JP5793473B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法
TW104117385A TW201535635A (zh) 2012-07-20 2013-02-25 接合裝置用加熱器及其冷卻方法
TW102106499A TWI489598B (zh) 2012-07-20 2013-02-25 A heater for a bonding device and a cooling method thereof
PCT/JP2013/060908 WO2014013764A1 (ja) 2012-07-20 2013-04-11 ボンディング装置用ヒータ及びその冷却方法
CN201380014787.0A CN104520980B (zh) 2012-07-20 2013-04-11 接合装置用加热器及其冷却方法
KR1020157017088A KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
KR1020147024142A KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
SG11201500238RA SG11201500238RA (en) 2012-07-20 2013-04-11 Heater for bonding apparatus and method of cooling the same
US14/597,635 US10350692B2 (en) 2012-07-20 2015-01-15 Heater for bonding apparatus and method of cooling the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015050779A Division JP2015109485A (ja) 2015-03-13 2015-03-13 ボンディング装置用ヒータ及びその冷却方法
JP2015127628A Division JP6149241B2 (ja) 2015-06-25 2015-06-25 ボンディング装置用ヒータ及びその冷却方法

Publications (3)

Publication Number Publication Date
JP2014022629A JP2014022629A (ja) 2014-02-03
JP2014022629A5 true JP2014022629A5 (enExample) 2014-10-23
JP5793473B2 JP5793473B2 (ja) 2015-10-14

Family

ID=49948601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012161304A Active JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法

Country Status (7)

Country Link
US (1) US10350692B2 (enExample)
JP (1) JP5793473B2 (enExample)
KR (2) KR101559741B1 (enExample)
CN (1) CN104520980B (enExample)
SG (1) SG11201500238RA (enExample)
TW (2) TW201535635A (enExample)
WO (1) WO2014013764A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
US11508688B2 (en) * 2016-03-24 2022-11-22 Shinkawa Ltd. Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
TWI834007B (zh) 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
US20240063170A1 (en) * 2020-12-28 2024-02-22 Shinkawa Ltd. Mounting head
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件

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US5592363A (en) 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
JP2002016091A (ja) 2000-06-29 2002-01-18 Kyocera Corp 接触加熱装置
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
JP3801966B2 (ja) * 2002-07-31 2006-07-26 京セラ株式会社 加熱装置
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
JP2007180505A (ja) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US20070131659A1 (en) 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
JP2007242724A (ja) * 2006-03-06 2007-09-20 Seiko Epson Corp マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器
JP2007329306A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置
CN102422413B (zh) * 2009-05-11 2014-07-30 丰田自动车株式会社 热交换器、半导体装置及它们的制造方法
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
US8633423B2 (en) * 2010-10-14 2014-01-21 Applied Materials, Inc. Methods and apparatus for controlling substrate temperature in a process chamber
US9434029B2 (en) * 2011-12-20 2016-09-06 Intel Corporation High performance transient uniform cooling solution for thermal compression bonding process

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