JP2013125855A5 - - Google Patents

Download PDF

Info

Publication number
JP2013125855A5
JP2013125855A5 JP2011273631A JP2011273631A JP2013125855A5 JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5 JP 2011273631 A JP2011273631 A JP 2011273631A JP 2011273631 A JP2011273631 A JP 2011273631A JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5
Authority
JP
Japan
Prior art keywords
ceramic substrate
substrate according
dividing
electronic component
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011273631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013125855A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011273631A priority Critical patent/JP2013125855A/ja
Priority claimed from JP2011273631A external-priority patent/JP2013125855A/ja
Publication of JP2013125855A publication Critical patent/JP2013125855A/ja
Publication of JP2013125855A5 publication Critical patent/JP2013125855A5/ja
Pending legal-status Critical Current

Links

JP2011273631A 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 Pending JP2013125855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Publications (2)

Publication Number Publication Date
JP2013125855A JP2013125855A (ja) 2013-06-24
JP2013125855A5 true JP2013125855A5 (enExample) 2015-01-15

Family

ID=48776934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011273631A Pending JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Country Status (1)

Country Link
JP (1) JP2013125855A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149419A (ja) * 2015-02-11 2016-08-18 日本特殊陶業株式会社 多数個取り配線基板の製造方法
JP6517942B2 (ja) * 2016-04-22 2019-05-22 京セラ株式会社 多数個取り配線基板、配線基板および多数個取り配線基板の製造方法
DE102021105109A1 (de) * 2021-03-03 2022-09-08 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Metall-Keramik-Substrat
CN118435706A (zh) * 2021-12-22 2024-08-02 株式会社东芝 陶瓷划线电路基板、陶瓷电路基板、陶瓷划线电路基板的制造方法、陶瓷电路基板的制造方法以及半导体装置的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248683A (ja) * 1988-03-30 1989-10-04 Toshiba Corp 多面取り印刷配線基板
JPH032667U (enExample) * 1989-05-31 1991-01-11
CN102132635A (zh) * 2008-06-20 2011-07-20 日立金属株式会社 陶瓷集合基板及其制造方法，陶瓷基板和陶瓷电路基板

Similar Documents

Publication Publication Date Title
JP2015510219A5 (enExample)
WO2014137192A3 (ko) 금속 세선을 포함하는 투명 기판 및 그 제조 방법
JP2014036110A5 (enExample)
EP2709140A4 (en) METHOD FOR PRODUCING A LAMINATED SUBSTRATE WITH AN INSULATING LAYER ON A PART OF A SUBSTRATE
MY176541A (en) Mold release film and process for producing semiconductor package
JP2013247367A5 (enExample)
EP2991083A4 (en) METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN AND SUBSTRATE WITH ELECTRICALLY CONDUCTIVE PATTERN
JP2014235279A5 (enExample)
JP2014237545A5 (enExample)
PT3875248T (pt) Método para produzir uma estrutura tridimensional numa superfície de um substrato plano
EP2810540A4 (en) METHOD AND ARRANGEMENT FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN ON A SURFACE
JP2015216344A5 (enExample)
JP2013125855A5 (enExample)
EP2502747A3 (en) Inkjet head and method of manufacturing the same
WO2015038367A3 (en) Forming through wafer vias in glass
WO2013034312A8 (en) A process for the manufacture of a semiconductor device
JP2013232484A5 (enExample)
EP2631959A3 (en) Piezoelectric element and method for manufacturing the same
JP2016122704A5 (enExample)
JP2015014547A5 (enExample)
JP2013226688A5 (enExample)
SG10201805849SA (en) Methods of forming a substrate opening
FR3008718B1 (fr) Procede de fabrication d'une sous-couche metallique a base de platine sur un substrat metallique
JP2014188668A5 (ja) 基板の製造方法及びキャリア
JP2013098514A5 (enExample)