TW201529224A - 硏磨裝置及硏磨方法 - Google Patents
硏磨裝置及硏磨方法 Download PDFInfo
- Publication number
- TW201529224A TW201529224A TW103134429A TW103134429A TW201529224A TW 201529224 A TW201529224 A TW 201529224A TW 103134429 A TW103134429 A TW 103134429A TW 103134429 A TW103134429 A TW 103134429A TW 201529224 A TW201529224 A TW 201529224A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- workpiece
- polished
- polishing member
- shape
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013209602 | 2013-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201529224A true TW201529224A (zh) | 2015-08-01 |
Family
ID=52778773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103134429A TW201529224A (zh) | 2013-10-04 | 2014-10-02 | 硏磨裝置及硏磨方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160236314A1 (de) |
EP (1) | EP3053703A4 (de) |
JP (2) | JPWO2015050186A1 (de) |
KR (1) | KR20160067106A (de) |
CN (1) | CN105658377A (de) |
TW (1) | TW201529224A (de) |
WO (1) | WO2015050186A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI685400B (zh) * | 2016-04-08 | 2020-02-21 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015174180A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東京精密 | 超音波面取り機 |
JP6398902B2 (ja) * | 2014-08-19 | 2018-10-03 | 信越化学工業株式会社 | インプリント・リソグラフィ用角形基板及びその製造方法 |
CN108436650A (zh) * | 2018-03-08 | 2018-08-24 | 北京铂阳顶荣光伏科技有限公司 | 磨边方法及装置 |
US11799150B2 (en) | 2020-07-17 | 2023-10-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling structure for hybrid-electric vehicle battery cell assemblies |
CN115365928A (zh) * | 2022-08-23 | 2022-11-22 | 北京航空航天大学宁波创新研究院 | 一种研磨方法及研磨机 |
CN117773697B (zh) * | 2024-02-23 | 2024-05-14 | 山东旭辉玻璃科技有限公司 | 一种用于农机玻璃的切割边角打磨设备 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1082418A (en) * | 1966-07-22 | 1967-09-06 | Toolmasters Ltd | Improvements relating to grinding wheels |
DE2646483A1 (de) * | 1975-10-15 | 1977-04-21 | Monsanto Co | Profilierrolle |
JPS5388291A (en) * | 1977-01-12 | 1978-08-03 | Fukuyama Tetsukoushiyo Kk | Machine for automatically pol shuing all circumference of plate glass |
JPS591548U (ja) * | 1982-06-29 | 1984-01-07 | 小出 ▲けん▼ | 倣い研磨用砥石装置 |
JPS60143646U (ja) * | 1984-03-02 | 1985-09-24 | 豊田工機株式会社 | 研削装置 |
JPS6165762A (ja) * | 1984-09-06 | 1986-04-04 | Nippon Sheet Glass Co Ltd | 板状体の端面研磨装置 |
JPS6165763A (ja) * | 1984-09-06 | 1986-04-04 | Nippon Sheet Glass Co Ltd | 板状体の端面研磨装置 |
JPH01170558U (de) * | 1988-05-24 | 1989-12-01 | ||
US5083401A (en) * | 1988-08-08 | 1992-01-28 | Mitsubishi Denki Kabushiki Kaisha | Method of polishing |
JPH04360772A (ja) * | 1991-06-05 | 1992-12-14 | Toto Ltd | 平板面取用砥石及び平板面取装置 |
JP2559650B2 (ja) * | 1991-11-27 | 1996-12-04 | 信越半導体株式会社 | ウエーハ面取部研磨装置 |
KR100277320B1 (ko) * | 1992-06-03 | 2001-01-15 | 가나이 쓰도무 | 온라인 롤 연삭 장치를 구비한 압연기와 압연 방법 및 회전 숫돌 |
JP3010572B2 (ja) * | 1994-09-29 | 2000-02-21 | 株式会社東京精密 | ウェーハエッジの加工装置 |
JPH1170471A (ja) * | 1997-07-03 | 1999-03-16 | Asahi Glass Co Ltd | ガラス面取り方法およびその装置 |
JPH11188590A (ja) | 1997-12-22 | 1999-07-13 | Speedfam Co Ltd | エッジポリッシング装置 |
JP2000176805A (ja) * | 1998-12-17 | 2000-06-27 | Mitsubishi Materials Silicon Corp | 半導体ウェーハの面取り装置 |
DE19914174A1 (de) * | 1999-03-29 | 2000-10-12 | Wernicke & Co Gmbh | Verfahren und Vorrichtung zum Formbearbeiten des Umfangsrandes von Brillengläsern |
JP2001038589A (ja) * | 1999-08-03 | 2001-02-13 | Speedfam Co Ltd | ワーク外周部用研磨装置 |
JP2001062686A (ja) * | 1999-08-25 | 2001-03-13 | Speedfam Co Ltd | インデックス式エッジポリッシャー |
JP2001205549A (ja) | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
WO2002005337A1 (fr) * | 2000-07-10 | 2002-01-17 | Shin-Etsu Handotai Co., Ltd. | Tranche a chanfreinage en miroir, tissu a polir pour chanfreinage en miroir, machine a polir pour chanfreinage en miroir et procede associe |
TWI352645B (en) * | 2004-05-28 | 2011-11-21 | Ebara Corp | Apparatus for inspecting and polishing substrate r |
JP2007088143A (ja) * | 2005-09-21 | 2007-04-05 | Elpida Memory Inc | エッジ研磨装置 |
ES2279719B1 (es) * | 2006-01-26 | 2008-07-16 | Timac Agro España, S.A. | Nuevo activador metabolico y nutricional para las plantas. |
CN101284365A (zh) * | 2007-04-13 | 2008-10-15 | 奇美电子股份有限公司 | 基板的旋转装置、磨边装置及磨边方法 |
US20080293329A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile |
WO2009116945A1 (en) * | 2008-03-20 | 2009-09-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and apparatus for communication of data packets between local networks |
US8585467B2 (en) * | 2008-10-31 | 2013-11-19 | Corning Incorporated | Linear pressure feed grinding with voice coil |
JP2010182813A (ja) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmpパッドコンディショナー |
CN201380419Y (zh) * | 2009-03-02 | 2010-01-13 | 湖北新火炬科技股份有限公司 | 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置 |
JP5352331B2 (ja) * | 2009-04-15 | 2013-11-27 | ダイトエレクトロン株式会社 | ウェーハの面取り加工方法 |
JPWO2010131610A1 (ja) * | 2009-05-15 | 2012-11-01 | 旭硝子株式会社 | ガラス端面研削用砥石の加工位置設定方法 |
CN101612717A (zh) * | 2009-07-17 | 2009-12-30 | 李留江 | 数控球轴承内圈沟道多功能磨床 |
US8892238B2 (en) * | 2009-10-06 | 2014-11-18 | Edward T. Sweet | Edge break details and processing |
JP5519256B2 (ja) * | 2009-12-03 | 2014-06-11 | 株式会社荏原製作所 | 裏面が研削された基板を研磨する方法および装置 |
US8747188B2 (en) * | 2011-02-24 | 2014-06-10 | Apple Inc. | Smart automation of robotic surface finishing |
US8986072B2 (en) * | 2011-05-26 | 2015-03-24 | Corning Incorporated | Methods of finishing an edge of a glass sheet |
EP2537634A1 (de) * | 2011-06-21 | 2012-12-26 | WENDT GmbH | Verfahren zum Schleifen der umlaufenden Kantenfläche einer Verglasung |
JP5898984B2 (ja) * | 2012-02-03 | 2016-04-06 | 中村留精密工業株式会社 | 硬質脆性板の側辺加工装置 |
-
2014
- 2014-10-02 JP JP2015540534A patent/JPWO2015050186A1/ja active Pending
- 2014-10-02 KR KR1020167008523A patent/KR20160067106A/ko not_active Application Discontinuation
- 2014-10-02 EP EP14851309.6A patent/EP3053703A4/de not_active Withdrawn
- 2014-10-02 WO PCT/JP2014/076360 patent/WO2015050186A1/ja active Application Filing
- 2014-10-02 CN CN201480054424.4A patent/CN105658377A/zh active Pending
- 2014-10-02 TW TW103134429A patent/TW201529224A/zh unknown
- 2014-10-02 US US15/026,089 patent/US20160236314A1/en not_active Abandoned
-
2017
- 2017-10-06 JP JP2017196150A patent/JP2018001406A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI685400B (zh) * | 2016-04-08 | 2020-02-21 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3053703A1 (de) | 2016-08-10 |
JPWO2015050186A1 (ja) | 2017-03-09 |
JP2018001406A (ja) | 2018-01-11 |
KR20160067106A (ko) | 2016-06-13 |
WO2015050186A1 (ja) | 2015-04-09 |
CN105658377A (zh) | 2016-06-08 |
EP3053703A4 (de) | 2017-07-26 |
US20160236314A1 (en) | 2016-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201529224A (zh) | 硏磨裝置及硏磨方法 | |
JP4730844B2 (ja) | 複数の半導体ウェハを同時に両面研磨する方法および半導体ウェハ | |
CN100369210C (zh) | 抛光方法 | |
TW200642796A (en) | Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same | |
JP6110736B2 (ja) | 仕上げ加工装置 | |
CN101740442A (zh) | 薄板状工件的搬送装置 | |
WO2015020082A1 (ja) | 研磨加工工具及び部材の加工方法 | |
WO2016108284A1 (ja) | 平坦加工方法および平坦加工装置 | |
JP6474861B2 (ja) | 研磨装置、研磨部材の加工又は修正用工具、研磨部材の加工又は修正方法、及び研磨部材の製造方法 | |
JP2009095952A (ja) | ウェハの製造方法 | |
JP5352216B2 (ja) | ウェハ周辺部研磨装置 | |
CN202861945U (zh) | 一种石材槽抛光机 | |
JP6270921B2 (ja) | ブレードのドレッシング機構を備えた切削装置 | |
JP2022047538A (ja) | 面取り研削方法及び面取り研削装置 | |
JP2013188814A (ja) | 研削方法 | |
JP5464386B2 (ja) | ドレッシング装置、およびこのドレッシング装置によりドレッシングされる加工工具を用いた製造装置 | |
JP2001150311A (ja) | 薄肉円盤の円周加工方法および加工装置 | |
JP2001310254A (ja) | 平面研磨装置 | |
KR20110112066A (ko) | 컨디셔너 교체형 연마장치 | |
JP2018199199A (ja) | 研磨方法 | |
JP2001009731A (ja) | メカノケミカル砥石 | |
KR20160116729A (ko) | 다이아몬드 연삭기의 드레싱장치 | |
JPS62120971A (ja) | 研磨機 | |
CN105575791A (zh) | 化学机械研磨制作工艺 | |
WO2015082963A1 (en) | Grinding implement for oscillating drive |