EP3053703A1 - Poliervorrichtung und polierverfahren - Google Patents

Poliervorrichtung und polierverfahren Download PDF

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Publication number
EP3053703A1
EP3053703A1 EP14851309.6A EP14851309A EP3053703A1 EP 3053703 A1 EP3053703 A1 EP 3053703A1 EP 14851309 A EP14851309 A EP 14851309A EP 3053703 A1 EP3053703 A1 EP 3053703A1
Authority
EP
European Patent Office
Prior art keywords
polishing
workpiece
polishing member
polished
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14851309.6A
Other languages
English (en)
French (fr)
Other versions
EP3053703A4 (de
Inventor
Hitoshi Morinaga
Hiroshi Asano
Shingo OTSUKI
Kazusei Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP3053703A1 publication Critical patent/EP3053703A1/de
Publication of EP3053703A4 publication Critical patent/EP3053703A4/de
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning

Definitions

  • the present invention relates to a polishing device and a polishing method.
  • Patent document 1 and patent document 2 each describe a polishing device that polishes a periphery of a workpiece by rotating the workpiece (object to be polished) in contact with a polishing member.
  • the polishing member contacts the periphery of the rotating workpiece.
  • the workpiece is limited to a workpiece having a truly round contour, such as a disk-shaped or cylindrical workpiece. This imposes limitations on the polishing of workpieces having contours with other shapes.
  • true round refers to the shape of a curve traced along points that are at an equal distance from a given point.
  • contour refers to the shape in a projected view on a plane orthogonal to a side surface to be polished of the workpiece.
  • the present invention is made in view of such circumstances, and its objective is to provide a polishing device and a polishing method that allow for polishing of workpieces having various contours.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the first movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the second movement mechanism moves at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the above polishing devices preferably include a motor that rotates the polishing member from below.
  • the above polishing devices preferably include a base that is rotated integrally with the polishing member when the polishing member is located on an upper surface of the base.
  • a polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member when polishing the workpiece.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member when polishing the workpiece, and moving at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes rotating at least one of the workpiece and the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member and rotating at least one of the workpiece and the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member and pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member, rotating at least one of the workpiece and the polishing member, and pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing methods preferably include rotating the polishing member from below.
  • the polishing methods preferably include when the polishing member is located on an upper surface of a base, rotating the polishing member integrally with the base.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of the portion to be polished of the workpiece.
  • the portion to be polished of the workpiece has a non-planar shape, for example, a curved surface or a triangular shape, the workpiece can be polished.
  • the workpiece when at least one of the workpiece and the polishing member is moved in the direction tangential to the radially outer circumferential surface of the polishing member, the workpiece linearly moves relative to the polishing member.
  • the workpiece having a linear contour can be polished.
  • the workpiece and the polishing member when at least one of the workpiece and the polishing member is moved in the direction tangential to the radially outer circumferential surface of the polishing member and at least one of the workpiece and the polishing member is rotated in a direction orthogonal to the rotation axis of the polishing member, the workpiece and the polishing member can be shifted to any positional relationship. This maintains the contact of polishing member and the workpiece while following the contour shape of various workpieces. Thus, the workpieces having various contours can be polished.
  • a surface to be polished of the workpiece may be changed.
  • the entire periphery or a portion of each of the workpieces having various contours can be appropriately polished.
  • the polishing of the workpiece when at least one of the workpiece and the polishing member is pressed in a direction orthogonal to the rotation axis of the polishing member, the polishing of the workpiece can be advanced. Additionally, uniform contact (i.e., touch) of the workpiece and the polishing surface can be enhanced.
  • the present invention succeeds in polishing of workpieces having various contours.
  • a polishing device, a polishing method, and a workpiece according to one embodiment of the present invention will now be described with reference to Figs. 1 and 2 .
  • the polishing device includes a discoid polishing member 10.
  • the polishing member 10 includes a radially outer circumferential surface that is used to polish an end of a workpiece K, which is a portion to be polished.
  • the workpiece K has a tetragonal contour, or a tetragonal projected shape on a plane orthogonal to a side surface to be polished of the workpiece K (shape of workpiece K shown in Fig. 1 ). More specifically, the corners of the tetragon are not right-angled but round. Instead, the corners of the tetragon may be right-angled.
  • the workpiece K includes an end KE the shape of which (shape of portion to be polished) is processed in advance to have a curved surface.
  • the end KE having the processed curved surface is polished with the polishing member 10.
  • any optimal material for polishing the end KE may be used for the polishing member 10.
  • a resin is used as the material of the polishing member 10
  • any synthetic resin may be used.
  • a synthetic resin include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.).
  • a cloth, a non-woven fabric, a resin processed non-woven fabric, synthetic leather, or a composite thereof may be used.
  • the polishing surface of the polishing member 10 preferably has a Shore A hardness of 5 or greater.
  • a polishing member 10 having a shore A hardness of 5 or greater which is subject to hardness measurement, is left for 60 minutes or longer in a dry condition where the humidity is 20% to 60% under room temperature, the hardness of the polishing surface of the polishing member is then measured with a durometer (type A) that is compliance with JIS K6253, and the measured value is 5 or greater.
  • a durometer type A
  • JIS K6253 JIS K6253
  • the Shore A hardness of the polishing surface of the polishing member 10 is preferably 40 or greater, more preferably 70 to 95, and particularly preferably 70 to 85.
  • magnesium, aluminum, titanium, iron, nickel, cobalt copper, zinc, manganese, or an alloy of which the main component is any of these metals may be used.
  • the polishing member 10 may include abrasive grains.
  • the kind of the used abrasive grains is not particularly limited and may be metal oxide particles of silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, or chromium oxide; a carbide such as silicon carbide; a nitride; a boride; or a diamond.
  • any of ceramics and glass any of ceramics and glass; any of an oxide, nitride, boride, and carbide of silicon, aluminum, zirconium, calcium, and barium; or any of aluminum oxide, zirconium oxide, silicon oxide, silicon carbide, silicon nitride, and boron nitride may be used.
  • any material may be used for the workpiece K.
  • any synthetic resin may be used.
  • a synthetic resin include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.).
  • any of ceramics, glass, and fine ceramics any of ceramics, glass, and fine ceramics; any of an oxide, carbide, nitride, and boride of silicon, aluminum, zirconium, calcium, and barium may be used.
  • magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese, or an alloy of which the main component is any of these metals may be used.
  • the workpiece K may be used for any purpose.
  • the workpiece K may be used as a wheel, a shaft, a container, a casing (for example, case and housing), a frame, a ball, a wire, an ornament, or the like.
  • the polishing member 10 is fixed to the upper surface of a discoid base 20 in a removable manner.
  • the lower surface of the base 20 includes a center portion that is fixed to a rotation shaft of a first motor 21.
  • the first motor 21 is driven to be rotated, the base 20 and the polishing member 10 rotate.
  • the first motor 21 is located below the polishing member 10 and the base 20.
  • the polishing member 10, which is located on the upper surface of the base 20, is rotated together with the base 20 from below. This obtains stable rotation of the polishing member 10 with a small axial run-out and allows for a process with higher accuracy.
  • the radially outer circumferential surface of the polishing member 10 includes a polishing surface 11, which is a curved grooved surface that circumferentially extends.
  • the curvature of the polishing surface 11 is shaped in conformance with the shape of the end KE of the workpiece K (shape of portion to be polished). More specifically, the polishing surface 11 and the end KE have the same curvature.
  • ends KE of workpieces K may be simultaneously polished with the circumferential surface of the polishing member 10. This improves the productivity. Additionally, the maximum diameter of the polishing member 10 increases the linear velocity of polishing member 10 at the outer circumference even when the rotation speed of the polishing member 10 is the same. This obtains the sufficient linear velocity for the polishing even when the rotation speed of the polishing member 10 is relatively decreased. Thus, for example, dispersion of the processing liquid, which will be described later, may be reduced.
  • the workpiece K is held by a fixing seat 32 in a removable manner.
  • the fixing seat 32 is fixed to a rotation shaft 31 of a second motor 30.
  • the second motor 30 When the second motor 30 is driven, the workpiece K is rotated about the rotation shaft 31 (in arrow R direction or arrow L direction shown in Fig. 1 ).
  • the second motor 30 forms the rotation mechanism.
  • the second motor 30 is coupled to a motor movement mechanism 33.
  • the motor movement mechanism 33 includes a mechanism that reciprocates the second motor 30 in directions orthogonal to a rotation axis of the polishing member 10.
  • the directions orthogonal to the rotation axis of the polishing member 10 are referred to as the "arrow X directions" (shown in Fig. 2 ).
  • the motor movement mechanism 33 also includes a mechanism that reciprocates the second motor 30 in directions tangential to the radially outer circumferential surface of the polishing member 10.
  • the directions tangential to the radially outer circumferential surface of the polishing member 10 are referred to as the "arrow Y directions" (shown in Fig. 1 ).
  • the second motor 30 When the second motor 30 is moved by the motor movement mechanism 33, the second motor 30, the rotation shaft 31, the fixing seat 32, and the workpiece K are integrally moved in the directions orthogonal to the rotation axis of the polishing member 10 and in the directions tangential to the radially outer circumferential surface of the polishing member 10.
  • the motor movement mechanism 33 forms the first movement mechanism and the second movement mechanism.
  • the polishing device further includes a pressing mechanism 40 that presses the workpiece K in a direction orthogonal to the rotation axis of the polishing member 10.
  • the pressing mechanism 40 presses the workpiece K against the polishing surface 11 of the polishing member 10 with pressure P.
  • the pressure P of the pressing mechanism 40 may be adjusted in any manner. For example, contact pressure of a portion that contacts the end KE of the workpiece K and the polishing surface 11 is measured with, for example, a load cell. Then, the pressure P is adjusted so that the contact pressure is constant at a predetermined value. Alternatively, the pressure P may be adjusted in accordance with the area of the contact portion (e.g., the pressure P is increased where the area of the contact portion is large and decreased where the area of the contact portion is small).
  • the contact pressure tends to be higher on a corner than on a flat portion.
  • appropriate polishing control may be performed in accordance with the shape of the workpiece K, for example, by shorting time for polishing a portion of the workpiece having high contact pressure, for example, a corner, and extending time for polishing a portion of the workpiece having high contact pressure, for example, a flat portion.
  • the process time may be adjusted together with the adjustment of the pressure P to perform constant polishing.
  • An appropriate drive source such as electric power, hydraulic pressure, air pressure, or gas pressure, may be used as the drive source of the motor movement mechanism 33 and the pressing mechanism 40.
  • the motor movement mechanism 33 and the pressing mechanism 40 may be automatically driven by a controller including, for example, a CPU, a RAM, and a ROM or may be driven, for example, when the operator of the polishing device operates a switch.
  • a contact portion of the end KE and the polishing surface 11 is supplied with, for example, a processing liquid in an appropriate manner.
  • the processing liquid may be directly supplied to the contact portion of the end KE and the polishing surface 11 from the outer side.
  • a processing liquid supply mechanism such as a rotary joint may be arranged in a portion that connects the polishing member 10 (more specifically, base 20 to which polishing member 10 is fixed) and the first motor 21.
  • the processing liquid supply mechanism supplies the processing liquid into the polishing member 10
  • the processing liquid may be supplied from the polishing member 10 to the contact portion through a supply passage formed in the polishing member 10.
  • the processing liquid may be further efficiently supplied.
  • a cover be arranged around the polishing member 10 and that a collection device be provided to increase the efficiency for collecting the processing liquid.
  • the processing liquid may include abrasive grains.
  • the kind of the used abrasive grains is not particularly limited and may be metal oxide particles of silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, or chromium oxide; a carbide, such as silicon carbide; a nitride; a boride; or a diamond.
  • the amount of the abrasive grains contained in the processing liquid is preferably 1 mass percent or greater, and more preferably 2 mass percent or greater.
  • the amount of the abrasive grains contained in the processing liquid is also preferably 50 mass percent or less, and more preferably 40 mass percent or less.
  • the abrasive grains in the processing liquid have an average secondary particle diameter of preferably 0.1 ⁇ m or greater, and more preferably 0.3 ⁇ m or greater. As the average secondary particle diameter of the abrasive grains increases, the processing liquid improves the processing speed.
  • the average secondary particle diameter of the abrasive grains in the processing liquid is preferably 20 ⁇ m or less, and more preferably 5 ⁇ m or less. As the average secondary particle diameter of the abrasive grains decreases in the processing liquid, the surface of the workpiece K can be further uniformly polished.
  • the average secondary particle diameter of the abrasive grains is a volume average particle diameter that is measured with a laser diffraction/scattering particle size distribution measurement instrument, such as "LA-950" manufactured by HORIBA, Ltd.
  • the processing liquid may further include another component such as a pH adjuster, an etching agent, an oxidant, a water-soluble polymer, a copolymer and a salt and derivative thereof, an anticorrosive, a chelating agent, a dispersant aid, an antiseptic, or a fungicide.
  • a pH adjuster such as a pH adjuster, an etching agent, an oxidant, a water-soluble polymer, a copolymer and a salt and derivative thereof, an anticorrosive, a chelating agent, a dispersant aid, an antiseptic, or a fungicide.
  • a known acid, base, or a salt of them may be used as the pH adjuster.
  • an acid that can be used as the pH adjuster include an inorganic acid, such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, or phosphoric acid; and an organic acid, such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid
  • Examples of such a base that can be used as the pH adjuster include an amine, such as aliphatic amine or aromatic amine; an organic base, such as quaternary ammonium hydroxide; an alkali metal hydroxide, such as potassium hydroxide; an alkaline earth metal hydroxide; and ammonia.
  • an amine such as aliphatic amine or aromatic amine
  • an organic base such as quaternary ammonium hydroxide
  • an alkali metal hydroxide such as potassium hydroxide
  • an alkaline earth metal hydroxide such as ammonia.
  • a salt of the above acid such as an ammonium salt or an alkali metal salt, may be used as the pH adjuster.
  • a pH adjuster is used to adjust the pH value of the processing liquid to the optimal value, which differs in accordance with the kind of the workpiece K to be polished.
  • the etching agent examples include an inorganic acid, such as nitric acid, sulfuric acid, or phosphoric acid; an organic acid, such as acetic acid, citric acid, tartaric acid, or methanesulfonic acid; an inorganic alkali, such as potassium hydroxide or sodium hydroxide; and an organic alkali, such as ammonia, amine, or quaternary ammonium hydroxide.
  • an inorganic acid such as nitric acid, sulfuric acid, or phosphoric acid
  • an organic acid such as acetic acid, citric acid, tartaric acid, or methanesulfonic acid
  • an inorganic alkali such as potassium hydroxide or sodium hydroxide
  • an organic alkali such as ammonia, amine, or quaternary ammonium hydroxide.
  • oxidant examples include hydrogen peroxide, peracetic acid, a percarbonate, urea peroxide, a perchlorate, a persulfate, an oxoacid, such as sulfuric acid, nitric acid, or phosphoric acid, and a salt of the oxoacid.
  • water-soluble polymer examples include a polycarboxylic acid, such as a polyacrylate; a polysulfonic acid, such as polyphosphonic acid or polystyrenesulfonic acid; a polysaccharide, such as xanthan gum or sodium alginate; a cellulose derivative such as hydroxyethyl cellulose or carboxymethyl cellulose; polyethylene glycol; polyvinyl alcohol; polyvinylpyrrolidone; sorbitan monooleate; an oxyalkylene-based polymer having one or more kinds of oxyalkylene unit; a non-ionic surfactant; and an anionic surfactant.
  • a polycarboxylic acid such as a polyacrylate
  • a polysulfonic acid such as polyphosphonic acid or polystyrenesulfonic acid
  • a polysaccharide such as xanthan gum or sodium alginate
  • a cellulose derivative such as hydroxyethyl cellulose or carboxymethyl cellulose
  • non-ionic surfactant examples include polyoxyethylene alkylether, polyoxyethylene alkylphenylether, sorbitan monooleate, and an oxyalkylene-based polymer having one or more kinds of oxyalkylene unit.
  • anionic surfactant examples include an alkylsulfonic acid-based compound, an alkylbenzenesulfonic acid-based compound, an alkylnaphthalenesulfonic acid-based compound, a methyltaurine acid-based compound, an alkyldiphenyletherdisulfonic acid-based compound, an ⁇ -olefinsulfonic acid-based compound, a naphthalenesulfonic acid condensate, and a sulfosuccinic acid diester-based compound.
  • anticorrosive examples include a monocyclic compound, a polycyclic compound having a condensed ring, and heterocyclic compound, such as an amine, a pyridine, a tetraphenylphosphonium salt, a benzotriazole, a triazole, a tetrazole, or benzoic acid.
  • the chelating agent examples include a carboxylic acid-based chelating agent, such as gluconic acid; an amine-based chelating agent, such as ethylenediamine, diethylenetriamine, or trimethyltetraamine; polyaminopolycarbon-based chelating agent, such as ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid, or diethylenetriaminepentaacetic acid; an organic phosphonic acid-based chelating agent, such as 2-aminoethylphosphonic acid, 1-hydroxyethyliden-1,1-diphosphonic acid, aminotri(methylenephosphonic acid), ethylenediaminetetrakis(methylenephosphonic acid), diethylenetriaminepenta(methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphospho
  • dispersant aid examples include a condensed phosphate, such as pyrophosphate or hexametaphosphate.
  • antiseptic examples include sodium hypochlorite.
  • fungicide examples include an oxazoline, such as oxazolidine-2,5-dione.
  • the end KE having a curved surface is polished.
  • the end KE may be polished, for example, through the following steps.
  • step 2 and step 3 polishes the entire four sides of the workpiece K.
  • the polishing steps described above are one example.
  • the driving modes of the motor movement mechanism 33 and the pressing mechanism 40 may be changed taking into consideration, for example, the process time.
  • the present embodiment has the advantages described below.
  • the embodiment may be modified as follows.
  • the workpiece K and the polishing member 10 may both be moved in the arrow X directions.
  • the workpiece K and the polishing member 10 may both be moved in the arrow Y directions.
  • the rotation center of the polishing member 10, which is driven to be rotated, includes a movement mechanism 50 that moves the polishing member.
  • the movement mechanism 50 functions as a first movement mechanism that moves the polishing member 10 in the directions (arrow Y directions shown in Fig. 3 ) tangential to the radially outer circumferential surface of the polishing member 10 and as a second movement mechanism that moves the polishing member 10 in the directions (arrow X directions in Fig. 3 ) orthogonal to the rotation axis of the polishing member 10.
  • An appropriate mechanism may be used as the movement mechanism 50.
  • a link mechanism or a mechanism similar to the motor movement mechanism 33 may be used.
  • the movement mechanism 50 shifts the polishing member 10 to any position relative to the workpiece K. This maintains the contact of the workpiece K and the polishing member 10 while following the contour shape of the workpiece K. More specifically, as indicated by the double-dashed lines in Fig. 3 , the polishing member 10 may be moved along the periphery (end KE) of the workpiece K. Thus, in such a modified example, the entire periphery of the workpiece K having the tetragonal contour can be polished. Additionally, in such a modified example, even when the polishing member 10 is relatively small in size, the entire periphery of the workpiece K can be polished compared to the above embodiment.
  • a movement mechanism that moves the polishing member 10 in the arrow Y directions shown in Fig. 3 may be arranged separately from a movement mechanism that moves the polishing member 10 in the arrow X directions shown in Fig. 3 .
  • a portion of the periphery of the workpiece K for example, only one, two, or three sides of the workpiece K, may be polished.
  • the polishing member 10 is arranged on the upper surface of the base 20. Instead, the base 20 may be omitted, and the rotation shaft of the first motor 21 may be directly fixed to the center of the polishing member 10.
  • the polishing member 10 can be shifted to any position relative to the workpiece K.
  • the contour of the workpiece K is shaped to have a number of curvatures, the periphery of the workpiece K can be polished.
  • the workpiece K is moved in the arrow X directions to bring the end KE of the workpiece K into contact with the polishing surface 11 and also separate the end KE that has been polished from the polishing surface 11.
  • the motor movement mechanism 33 which is capable of moving the workpiece K in the arrow X directions and the arrow Y directions, can shift the workpiece K to any position relative to the polishing member 10. This maintains the contact of the workpiece K and the polishing member 10 while following the contour shape of the workpiece K.
  • the polishing device of the above embodiment includes the rotation mechanism that rotates the workpiece K.
  • the periphery of the workpiece K can be polished even when the workpiece K has a shape such as that shown in Fig. 4 , that is, the shape of the contour of the workpiece K have a number of curvatures.
  • the modified example of the polishing device shown in Fig. 10 includes a pivot mechanism 60 that pivots the workpiece K in directions orthogonal to the rotation direction of the polishing member 10.
  • An appropriate mechanism for example, a link mechanism, may be used as the pivot mechanism 60.
  • the pivot mechanism 60 when the polishing member 10 is rotated to polish the end KE of the workpiece K, the pivot mechanism 60 is activated.
  • the activation of the pivot mechanism 60 pivots the workpiece K in directions (arrow RO directions shown in Fig. 10 ) orthogonal to the rotation direction of the polishing member 10.
  • the pivotal motion of the workpiece K pivots the end KE of the workpiece K, which is being rotationally polished, along the curved surface of the polishing surface 11.
  • Such pivoting of the end KE results in intersecting polishing marks of the end KE and reduces the polishing marks compared to those resulted from the polishing only by rotation. This limits the polishing marks caused by the rotational polishing.
  • the pivot directions of the workpiece K are not necessarily limited to the directions orthogonal to the rotation direction of the polishing member 10.
  • the polishing marks intersect one another. This limits the polishing marks caused by the rotational polishing.
  • the polishing member 10 may pivot. Further, the workpiece K and the polishing member 10 may both pivot.
  • the modified example of the polishing device shown in Fig. 11 includes an oscillation mechanism 70 that slightly oscillates the workpiece K in directions orthogonal to the rotation direction of the polishing member 10.
  • An appropriate mechanism for example, a mechanism using ultrasonic oscillations, may be used as the oscillation mechanism 70.
  • the oscillation mechanism 70 when the polishing member 10 is rotated to polish the end KE of the workpiece K, the oscillation mechanism 70 is activated.
  • the activation of the oscillation mechanism 70 slightly oscillates the workpiece K in directions (arrow UD directions shown in Fig. 11 ) orthogonal to the rotation direction of the polishing member 10.
  • the oscillation of the workpiece K slightly reciprocates the end KE of the workpiece K, which is being rotationally polished, in the arrow UD directions in contact with the curved surface of the polishing surface 11.
  • Such reciprocation of the end KE results in intersecting polishing marks of the end KE and reduces the polishing marks compared to those formed when polishing only with rotation.
  • the polishing marks caused by the rotational polishing may be limited.
  • the oscillation directions of the workpiece K are not necessarily limited to the directions orthogonal to the rotation direction of the polishing member 10.
  • the polishing marks intersect one another. This limits the polishing marks caused by the rotational polishing.
  • the polishing member 10 may oscillate. Further, the workpiece K and the polishing member 10 may both oscillate.
  • the reciprocation mechanism may be applied to the polishing device (e.g., polishing device shown, for example, in Fig. 3 ) in the modified examples of the embodiment. Also, in this case, polishing marks caused by the rotational polishing may be limited.
  • Fig. 12 schematically shows the structure of one example of such a pressure application mechanism.
  • the pressure application mechanism includes a roller 80 and an actuator 82.
  • the roller 80 which is discoid, rotates about a rotation shaft 81.
  • the roller 80 includes a circumferential surface that is in contact with a circumferential portion of an upper surface 10U of the polishing member 10. Rotation of the upper surface 10U rotates the roller 80.
  • the roller 80 and the upper surface 10U only need to be in contact at least while polishing the workpiece K.
  • the roller 80 and the upper surface 10U may be in constant contact with each other or in contact with each other only when polishing the workpiece K.
  • the actuator 82 includes an appropriate mechanism that presses the roller 80 against the upper surface 10U and is of, for example, a motor-driven type or a hydraulic pressure-driven type. While polishing the workpiece K, the actuator 82 is activated to press the roller 80 against the upper surface 10U (in arrow VT direction shown in Fig. 12 ).
  • the actuator 82 is used to press the roller 80.
  • the actuator 82 may be omitted.
  • one surface of the polishing member 10 is pressed. Instead, two surfaces may be pressed, for example, by sandwiching the two surfaces of the polishing member 10. When the two surfaces are pressed in this manner, distortion of the polishing member 10 may be limited compared to when one surface is pressed.
  • the roller 80 does not need to be configured to be rotational. In this case, the roller 80 may be changed to a simple weight.
EP14851309.6A 2013-10-04 2014-10-02 Poliervorrichtung und polierverfahren Withdrawn EP3053703A4 (de)

Applications Claiming Priority (2)

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JP2013209602 2013-10-04
PCT/JP2014/076360 WO2015050186A1 (ja) 2013-10-04 2014-10-02 研磨装置及び研磨方法

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EP (1) EP3053703A4 (de)
JP (2) JPWO2015050186A1 (de)
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CN (1) CN105658377A (de)
TW (1) TW201529224A (de)
WO (1) WO2015050186A1 (de)

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JP2018001406A (ja) 2018-01-11
CN105658377A (zh) 2016-06-08
EP3053703A4 (de) 2017-07-26
JPWO2015050186A1 (ja) 2017-03-09
US20160236314A1 (en) 2016-08-18
KR20160067106A (ko) 2016-06-13
TW201529224A (zh) 2015-08-01
WO2015050186A1 (ja) 2015-04-09

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