US20160236314A1 - Polishing device and polishing method - Google Patents

Polishing device and polishing method Download PDF

Info

Publication number
US20160236314A1
US20160236314A1 US15/026,089 US201415026089A US2016236314A1 US 20160236314 A1 US20160236314 A1 US 20160236314A1 US 201415026089 A US201415026089 A US 201415026089A US 2016236314 A1 US2016236314 A1 US 2016236314A1
Authority
US
United States
Prior art keywords
workpiece
polishing
polishing member
acid
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/026,089
Other languages
English (en)
Inventor
Hitoshi Morinaga
Hiroshi Asano
Shingo Otsuki
Kazusei Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Assigned to FUJIMI INCORPORATED reassignment FUJIMI INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORINAGA, HITOSHI, TAMAI, KAZUSEI, ASANO, HIROSHI, OTSUKI, Shingo
Publication of US20160236314A1 publication Critical patent/US20160236314A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning

Definitions

  • the present invention relates to a polishing device and a polishing method.
  • Patent document 1 and patent document 2 each describe a polishing device that polishes a periphery of a workpiece by rotating the workpiece (object to be polished) in contact with a polishing member.
  • the polishing member contacts the periphery of the rotating workpiece.
  • the workpiece is limited to a workpiece having a truly round contour, such as a disk-shaped or cylindrical workpiece. This imposes limitations on the polishing of workpieces having contours with other shapes.
  • true round refers to the shape of a curve traced along points that are at an equal distance from a given point.
  • contour refers to the shape in a projected view on a plane orthogonal to a side surface to be polished of the workpiece.
  • the present invention is made in view of such circumstances, and its objective is to provide a polishing device and a polishing method that allow for polishing of workpieces having various contours.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the first movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the second movement mechanism moves at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of a portion to be polished of the workpiece.
  • the movement mechanism moves at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member.
  • the rotation mechanism rotates at least one of the workpiece and the polishing member.
  • the pressing mechanism presses at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the above polishing devices preferably include a motor that rotates the polishing member from below.
  • the above polishing devices preferably include a base that is rotated integrally with the polishing member when the polishing member is located on an upper surface of the base.
  • a polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member when polishing the workpiece.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member when polishing the workpiece, and moving at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes rotating at least one of the workpiece and the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member and rotating at least one of the workpiece and the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member and pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • another polishing method for polishing a workpiece with a polishing member that includes a polishing surface shaped in conformance with the shape of a portion to be polished of the workpiece includes moving at least one of the workpiece and the polishing member in a direction tangential to a radially outer circumferential surface of the polishing member, rotating at least one of the workpiece and the polishing member, and pressing at least one of the workpiece and the polishing member in a direction orthogonal to a rotation axis of the polishing member.
  • the polishing methods preferably include rotating the polishing member from below.
  • the polishing methods preferably include when the polishing member is located on an upper surface of a base, rotating the polishing member integrally with the base.
  • the polishing member includes a polishing surface that is shaped in conformance with the shape of the portion to be polished of the workpiece.
  • the portion to be polished of the workpiece has a non-planar shape, for example, a curved surface or a triangular shape, the workpiece can be polished.
  • the workpiece when at least one of the workpiece and the polishing member is moved in the direction tangential to the radially outer circumferential surface of the polishing member, the workpiece linearly moves relative to the polishing member.
  • the workpiece having a linear contour can be polished.
  • the workpiece and the polishing member when at least one of the workpiece and the polishing member is moved in the direction tangential to the radially outer circumferential surface of the polishing member and at least one of the workpiece and the polishing member is rotated in a direction orthogonal to the rotation axis of the polishing member, the workpiece and the polishing member can be shifted to any positional relationship. This maintains the contact of polishing member and the workpiece while following the contour shape of various workpieces. Thus, the workpieces having various contours can be polished.
  • a surface to be polished of the workpiece may be changed.
  • the entire periphery or a portion of each of the workpieces having various contours can be appropriately polished.
  • the polishing of the workpiece when at least one of the workpiece and the polishing member is pressed in a direction orthogonal to the rotation axis of the polishing member, the polishing of the workpiece can be advanced. Additionally, uniform contact (i.e., touch) of the workpiece and the polishing surface can be enhanced.
  • the present invention succeeds in polishing of workpieces having various contours.
  • FIG. 1 is a schematic plan view showing the structure of a polishing device according to one embodiment.
  • FIG. 2 is a schematic side view showing the structure of the polishing device of the embodiment.
  • FIG. 3 is a schematic plan view showing the structure of a polishing device according to a modified example of the embodiment.
  • FIG. 4 is a plan view showing one example of a workpiece that is polished using the polishing device of the modified example shown in FIG. 3 .
  • FIG. 5 is a partial side view showing a workpiece and a polishing member according to another modified example of the embodiment.
  • FIG. 6 is a partial side view showing a workpiece and a polishing member according to another modified example of the embodiment.
  • FIG. 7 is a partial side view showing a workpiece and a polishing member according to another modified example of the embodiment.
  • FIG. 8 is a partial side view showing a workpiece and a polishing member according to another modified example of the embodiment.
  • FIG. 9 is a partial side view showing a workpiece and a polishing member according to another modified example of the embodiment.
  • FIG. 10 is a schematic view showing a workpiece that is processed with a polishing device according to another modified example of the embodiment.
  • FIG. 11 is a schematic view showing a workpiece that is processed with a polishing device according to another modified example of the embodiment.
  • FIG. 12 is a schematic view showing the structure of a pressure application mechanism according to another modified example of the embodiment.
  • a polishing device, a polishing method, and a workpiece according to one embodiment of the present invention will now be described with reference to FIGS. 1 and 2 .
  • the polishing device includes a discoid polishing member 10 .
  • the polishing member 10 includes a radially outer circumferential surface that is used to polish an end of a workpiece K, which is a portion to be polished.
  • the workpiece K has a tetragonal contour, or a tetragonal projected shape on a plane orthogonal to a side surface to be polished of the workpiece K (shape of workpiece K shown in FIG. 1 ). More specifically, the corners of the tetragon are not right-angled but round. Instead, the corners of the tetragon may be right-angled.
  • the workpiece K includes an end KE the shape of which (shape of portion to be polished) is processed in advance to have a curved surface.
  • the end KE having the processed curved surface is polished with the polishing member 10 .
  • any optimal material for polishing the end KE may be used for the polishing member 10 .
  • any synthetic resin may be used.
  • a synthetic resin include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.).
  • a cloth, a non-woven fabric, a resin processed non-woven fabric, synthetic leather, or a composite thereof may be used.
  • the polishing surface of the polishing member 10 preferably has a Shore A hardness of 5 or greater.
  • a polishing member 10 having a shore A hardness of 5 or greater which is subject to hardness measurement, is left for 60 minutes or longer in a dry condition where the humidity is 20% to 60% under room temperature, the hardness of the polishing surface of the polishing member is then measured with a durometer (type A) that is compliance with JIS K6253, and the measured value is 5 or greater.
  • a durometer type A
  • JIS K6253 JIS K6253
  • the Shore A hardness of the polishing surface of the polishing member 10 is preferably 40 or greater, more preferably 70 to 95, and particularly preferably 70 to 85.
  • magnesium, aluminum, titanium, iron, nickel, cobalt copper, zinc, manganese, or an alloy of which the main component is any of these metals may be used.
  • the polishing member 10 may include abrasive grains.
  • the kind of the used abrasive grains is not particularly limited and may be metal oxide particles of silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, or chromium oxide; a carbide such as silicon carbide; a nitride; a boride; or a diamond.
  • any of ceramics and glass any of an oxide, nitride, boride, and carbide of silicon, aluminum, zirconium, calcium, and barium; or any of aluminum oxide, zirconium oxide, silicon oxide, silicon carbide, silicon nitride, and boron nitride may be used.
  • any material may be used for the workpiece K.
  • any synthetic resin may be used.
  • a synthetic resin include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.).
  • any of ceramics, glass, and fine ceramics any of ceramics, glass, and fine ceramics; any of an oxide, carbide, nitride, and boride of silicon, aluminum, zirconium, calcium, and barium may be used.
  • magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese, or an alloy of which the main component is any of these metals may be used.
  • the workpiece K may be used for any purpose.
  • the workpiece K may be used as a wheel, a shaft, a container, a casing (for example, case and housing), a frame, a ball, a wire, an ornament, or the like.
  • the polishing member 10 is fixed to the upper surface of a discoid base 20 in a removable manner.
  • the lower surface of the base 20 includes a center portion that is fixed to a rotation shaft of a first motor 21 .
  • the first motor 21 is driven to be rotated, the base 20 and the polishing member 10 rotate.
  • the first motor 21 is located below the polishing member 10 and the base 20 .
  • the polishing member 10 which is located on the upper surface of the base 20 , is rotated together with the base 20 from below. This obtains stable rotation of the polishing member 10 with a small axial run-out and allows for a process with higher accuracy.
  • the radially outer circumferential surface of the polishing member 10 includes a polishing surface 11 , which is a curved grooved surface that circumferentially extends.
  • the curvature of the polishing surface 11 is shaped in conformance with the shape of the end KE of the workpiece K (shape of portion to be polished). More specifically, the polishing surface 11 and the end KE have the same curvature.
  • ends KE of workpieces K may be simultaneously polished with the circumferential surface of the polishing member 10 .
  • the maximum diameter of the polishing member 10 increases the linear velocity of polishing member 10 at the outer circumference even when the rotation speed of the polishing member 10 is the same. This obtains the sufficient linear velocity for the polishing even when the rotation speed of the polishing member 10 is relatively decreased. Thus, for example, dispersion of the processing liquid, which will be described later, may be reduced.
  • the workpiece K is held by a fixing seat 32 in a removable manner.
  • the fixing seat 32 is fixed to a rotation shaft 31 of a second motor 30 .
  • the second motor 30 When the second motor 30 is driven, the workpiece K is rotated about the rotation shaft 31 (in arrow R direction or arrow L direction shown in FIG. 1 ).
  • the second motor 30 forms the rotation mechanism.
  • the second motor 30 is coupled to a motor movement mechanism 33 .
  • the motor movement mechanism 33 includes a mechanism that reciprocates the second motor 30 in directions orthogonal to a rotation axis of the polishing member 10 .
  • the directions orthogonal to the rotation axis of the polishing member 10 are referred to as the “arrow X directions” (shown in FIG. 2 ).
  • the motor movement mechanism 33 also includes a mechanism that reciprocates the second motor 30 in directions tangential to the radially outer circumferential surface of the polishing member 10 .
  • the directions tangential to the radially outer circumferential surface of the polishing member 10 are referred to as the “arrow Y directions” (shown in FIG. 1 ).
  • the second motor 30 When the second motor 30 is moved by the motor movement mechanism 33 , the second motor 30 , the rotation shaft 31 , the fixing seat 32 , and the workpiece K are integrally moved in the directions orthogonal to the rotation axis of the polishing member 10 and in the directions tangential to the radially outer circumferential surface of the polishing member 10 .
  • the motor movement mechanism 33 forms the first movement mechanism and the second movement mechanism.
  • the polishing device further includes a pressing mechanism 40 that presses the workpiece K in a direction orthogonal to the rotation axis of the polishing member 10 .
  • the pressing mechanism 40 presses the workpiece K against the polishing surface 11 of the polishing member 10 with pressure P.
  • the pressure P of the pressing mechanism 40 may be adjusted in any manner. For example, contact pressure of a portion that contacts the end KE of the workpiece K and the polishing surface 11 is measured with, for example, a load cell. Then, the pressure P is adjusted so that the contact pressure is constant at a predetermined value. Alternatively, the pressure P may be adjusted in accordance with the area of the contact portion (e.g., the pressure P is increased where the area of the contact portion is large and decreased where the area of the contact portion is small).
  • the contact pressure tends to be higher on a corner than on a flat portion.
  • appropriate polishing control may be performed in accordance with the shape of the workpiece K, for example, by shorting time for polishing a portion of the workpiece having high contact pressure, for example, a corner, and extending time for polishing a portion of the workpiece having high contact pressure, for example, a flat portion.
  • the process time may be adjusted together with the adjustment of the pressure P to perform constant polishing.
  • An appropriate drive source such as electric power, hydraulic pressure, air pressure, or gas pressure, may be used as the drive source of the motor movement mechanism 33 and the pressing mechanism 40 .
  • the motor movement mechanism 33 and the pressing mechanism 40 may be automatically driven by a controller including, for example, a CPU, a RAM, and a ROM or may be driven, for example, when the operator of the polishing device operates a switch.
  • a contact portion of the end KE and the polishing surface 11 is supplied with, for example, a processing liquid in an appropriate manner.
  • the processing liquid may be directly supplied to the contact portion of the end KE and the polishing surface 11 from the outer side.
  • a processing liquid supply mechanism such as a rotary joint may be arranged in a portion that connects the polishing member 10 (more specifically, base 20 to which polishing member 10 is fixed) and the first motor 21 .
  • the processing liquid supply mechanism supplies the processing liquid into the polishing member 10 , the processing liquid may be supplied from the polishing member 10 to the contact portion through a supply passage formed in the polishing member 10 .
  • the processing liquid When supplied from the inside of the polishing member 10 toward the contact portion, the processing liquid may be further efficiently supplied. Additionally, to efficiently use the processing liquid, it is further preferable that a cover be arranged around the polishing member 10 and that a collection device be provided to increase the efficiency for collecting the processing liquid.
  • An appropriate kind of the processing liquid may be used in accordance with the material of the workpiece K to be polished and the polishing member 10 .
  • a cutting liquid, grinding liquid, a lapping material, a polishing agent, or a chemical mechanical polishing liquid may be used.
  • the processing liquid may include abrasive grains.
  • the kind of the used abrasive grains is not particularly limited and may be metal oxide particles of silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, or chromium oxide; a carbide, such as silicon carbide; a nitride; a boride; or a diamond.
  • the amount of the abrasive grains contained in the processing liquid is preferably 1 mass percent or greater, and more preferably 2 mass percent or greater.
  • the amount of the abrasive grains contained in the processing liquid is also preferably 50 mass percent or less, and more preferably 40 mass percent or less.
  • the abrasive grains in the processing liquid have an average secondary particle diameter of preferably 0.1 ⁇ m or greater, and more preferably 0.3 ⁇ m or greater. As the average secondary particle diameter of the abrasive grains increases, the processing liquid improves the processing speed.
  • the average secondary particle diameter of the abrasive grains in the processing liquid is preferably 20 ⁇ m or less, and more preferably 5 ⁇ m or less. As the average secondary particle diameter of the abrasive grains decreases in the processing liquid, the surface of the workpiece K can be further uniformly polished.
  • the average secondary particle diameter of the abrasive grains is a volume average particle diameter that is measured with a laser diffraction/scattering particle size distribution measurement instrument, such as “LA-950” manufactured by HORIBA, Ltd.
  • the processing liquid may further include another component such as a pH adjuster, an etching agent, an oxidant, a water-soluble polymer, a copolymer and a salt and derivative thereof, an anticorrosive, a chelating agent, a dispersant aid, an antiseptic, or a fungicide.
  • a pH adjuster such as a pH adjuster, an etching agent, an oxidant, a water-soluble polymer, a copolymer and a salt and derivative thereof, an anticorrosive, a chelating agent, a dispersant aid, an antiseptic, or a fungicide.
  • a known acid, base, or a salt of them may be used as the pH adjuster.
  • an acid that can be used as the pH adjuster include an inorganic acid, such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, or phosphoric acid; and an organic acid, such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid
  • Examples of such a base that can be used as the pH adjuster include an amine, such as aliphatic amine or aromatic amine; an organic base, such as quaternary ammonium hydroxide; an alkali metal hydroxide, such as potassium hydroxide; an alkaline earth metal hydroxide; and ammonia.
  • an amine such as aliphatic amine or aromatic amine
  • an organic base such as quaternary ammonium hydroxide
  • an alkali metal hydroxide such as potassium hydroxide
  • an alkaline earth metal hydroxide such as ammonia.
  • a salt of the above acid such as an ammonium salt or an alkali metal salt, may be used as the pH adjuster.
  • a pH adjuster is used to adjust the pH value of the processing liquid to the optimal value, which differs in accordance with the kind of the workpiece K to be polished.
  • the etching agent examples include an inorganic acid, such as nitric acid, sulfuric acid, or phosphoric acid; an organic acid, such as acetic acid, citric acid, tartaric acid, or methanesulfonic acid; an inorganic alkali, such as potassium hydroxide or sodium hydroxide; and an organic alkali, such as ammonia, amine, or quaternary ammonium hydroxide.
  • an inorganic acid such as nitric acid, sulfuric acid, or phosphoric acid
  • an organic acid such as acetic acid, citric acid, tartaric acid, or methanesulfonic acid
  • an inorganic alkali such as potassium hydroxide or sodium hydroxide
  • an organic alkali such as ammonia, amine, or quaternary ammonium hydroxide.
  • oxidant examples include hydrogen peroxide, peracetic acid, a percarbonate, urea peroxide, a perchlorate, a persulfate, an oxoacid, such as sulfuric acid, nitric acid, or phosphoric acid, and a salt of the oxoacid.
  • water-soluble polymer examples include a polycarboxylic acid, such as a polyacrylate; a polysulfonic acid, such as polyphosphonic acid or polystyrenesulfonic acid; a polysaccharide, such as xanthan gum or sodium alginate; a cellulose derivative such as hydroxyethyl cellulose or carboxymethyl cellulose; polyethylene glycol; polyvinyl alcohol; polyvinylpyrrolidone; sorbitan monooleate; an oxyalkylene-based polymer having one or more kinds of oxyalkylene unit; a non-ionic surfactant; and an anionic surfactant.
  • a polycarboxylic acid such as a polyacrylate
  • a polysulfonic acid such as polyphosphonic acid or polystyrenesulfonic acid
  • a polysaccharide such as xanthan gum or sodium alginate
  • a cellulose derivative such as hydroxyethyl cellulose or carboxymethyl cellulose
  • non-ionic surfactant examples include polyoxyethylene alkylether, polyoxyethylene alkylphenylether, sorbitan monooleate, and an oxyalkylene-based polymer having one or more kinds of oxyalkylene unit.
  • anionic surfactant examples include an alkylsulfonic acid-based compound, an alkylbenzenesulfonic acid-based compound, an alkylnaphthalenesulfonic acid-based compound, a methyltaurine acid-based compound, an alkyldiphenyletherdisulfonic acid-based compound, an ⁇ -olefinsulfonic acid-based compound, a naphthalenesulfonic acid condensate, and a sulfosuccinic acid diester-based compound.
  • anticorrosive examples include a monocyclic compound, a polycyclic compound having a condensed ring, and heterocyclic compound, such as an amine, a pyridine, a tetraphenylphosphonium salt, a benzotriazole, a triazole, a tetrazole, or benzoic acid.
  • the chelating agent examples include a carboxylic acid-based chelating agent, such as gluconic acid; an amine-based chelating agent, such as ethylenediamine, diethylenetriamine, or trimethyltetraamine; polyaminopolycarbon-based chelating agent, such as ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid, or diethylenetriaminepentaacetic acid; an organic phosphonic acid-based chelating agent, such as 2-aminoethylphosphonic acid, 1-hydroxyethyliden-1,1-diphosphonic acid, aminotri(methylenephosphonic acid), ethylenediaminetetrakis(methylenephosphonic acid), diethylenetriaminepenta(methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphospho
  • dispersant aid examples include a condensed phosphate, such as pyrophosphate or hexametaphosphate.
  • antiseptic examples include sodium hypochlorite.
  • fungicide examples include an oxazoline, such as oxazolidine-2,5-dione.
  • the end KE having a curved surface is polished.
  • the end KE may be polished, for example, through the following steps.
  • Step 1 The motor movement mechanism 33 moves the workpiece K toward the rotation center of the polishing member 10 in an arrow X direction, so that the end KE contacts the polishing surface 11 .
  • Step 2 While the pressing mechanism 40 is driven and the end KE and the polishing surface 11 are in contact, the motor movement mechanism 33 moves the workpiece K in the arrow Y directions. This shifts portions that contact the end KE and the polishing surface 11 . Consequently, the polishing of one side of the workpiece K progresses.
  • Step 3 When the polishing of one side of the workpiece K is finished, the pressing mechanism 40 is separated from the end KE. Then, as the motor movement mechanism 33 moves the workpiece K in an arrow X direction, the second motor 30 rotates the workpiece K. When the workpiece K is rotated while maintaining contact of the workpiece K and the polishing surface 11 , a side adjacent to the side that has been polished is opposed toward the polishing surface 11 . This switches the side that is polished.
  • step 2 and step 3 polishes the entire four sides of the workpiece K.
  • the polishing steps described above are one example.
  • the driving modes of the motor movement mechanism 33 and the pressing mechanism 40 may be changed taking into consideration, for example, the process time.
  • the present embodiment has the advantages described below.
  • the motor movement mechanism 33 moves the workpiece K in the directions (arrow Y directions) tangential to the radially outer circumferential surface of the polishing member 10 .
  • the workpiece K linearly moves relative to the polishing member 10 . This allows for polishing of the end KE of the tetragonal workpiece K having a linear side.
  • the second motor 30 rotates the workpiece K to change the surface (side) of the workpiece K that is polished.
  • the entire periphery of the workpiece K having a tetragonal contour can be polished.
  • the polishing device includes a polishing member 10 having a polishing surface 11 that is shaped in conformance with the shape of the end KE of the workpiece K to be polished.
  • a polishing member 10 having a polishing surface 11 that is shaped in conformance with the shape of the end KE of the workpiece K to be polished.
  • the polishing device is used to polish the workpiece K.
  • shape of end KE shape of end KE
  • the workpiece K is tetragonal
  • the periphery of the workpiece K can be polished.
  • the embodiment may be modified as follows.
  • the workpiece K is rotated to polish the entire periphery of the workpiece K. Instead, a portion of the periphery of the workpiece K, for example, only one, two, or three sides of the workpiece K may be polished.
  • step 3 the workpiece K is rotated as moving in an arrow X direction away from the rotation center of the polishing member 10 .
  • the workpiece K may be rotated.
  • the workpiece K may be moved in an arrow Y direction so that the side of the workpiece K that is next to be polished approaches the polishing surface 11 .
  • the side that is polished is switched in this manner, each side of the workpiece K may be polished.
  • the function for moving the workpiece K in the arrow X directions may be omitted from the motor movement mechanism 33 .
  • the motor movement mechanism 33 may only have the function for moving the workpiece K in the arrow Y directions, and the rotation mechanism (second motor 30 and the like) may be omitted. Even in this case, the motor movement mechanism 33 linearly moves the workpiece K relative to the polishing member 10 . Thus, one side of the end KE of the tetragonal workpiece K having linear sides can be polished.
  • the workpiece K is movable in the arrow X directions and the arrow Y directions. Additionally, a mechanism that moves the rotation center of the polishing member 10 may be provided. While the workpiece K is moved in the arrow X directions, the polishing member 10 may be moved in the arrow Y directions. Alternatively, while the workpiece K is moved in the arrow Y directions, the polishing member 10 may be moved in the arrow X directions.
  • the workpiece K and the polishing member 10 may both be moved in the arrow X directions.
  • the workpiece K and the polishing member 10 may both be moved in the arrow Y directions.
  • FIG. 3 is a schematic view showing such a modified example.
  • the rotation center of the polishing member 10 which is driven to be rotated, includes a movement mechanism 50 that moves the polishing member.
  • the movement mechanism 50 functions as a first movement mechanism that moves the polishing member 10 in the directions (arrow Y directions shown in FIG. 3 ) tangential to the radially outer circumferential surface of the polishing member 10 and as a second movement mechanism that moves the polishing member 10 in the directions (arrow X directions in FIG. 3 ) orthogonal to the rotation axis of the polishing member 10 .
  • An appropriate mechanism may be used as the movement mechanism 50 .
  • a link mechanism or a mechanism similar to the motor movement mechanism 33 may be used.
  • the movement mechanism 50 shifts the polishing member 10 to any position relative to the workpiece K. This maintains the contact of the workpiece K and the polishing member 10 while following the contour shape of the workpiece K. More specifically, as indicated by the double-dashed lines in FIG. 3 , the polishing member 10 may be moved along the periphery (end KE) of the workpiece K. Thus, in such a modified example, the entire periphery of the workpiece K having the tetragonal contour can be polished. Additionally, in such a modified example, even when the polishing member 10 is relatively small in size, the entire periphery of the workpiece K can be polished compared to the above embodiment. Instead of the movement mechanism 50 of the modified example shown in FIG.
  • a movement mechanism that moves the polishing member 10 in the arrow Y directions shown in FIG. 3 may be arranged separately from a movement mechanism that moves the polishing member 10 in the arrow X directions shown in FIG. 3 .
  • a portion of the periphery of the workpiece K for example, only one, two, or three sides of the workpiece K, may be polished.
  • the polishing member 10 is arranged on the upper surface of the base 20 . Instead, the base 20 may be omitted, and the rotation shaft of the first motor 21 may be directly fixed to the center of the polishing member 10 .
  • the pressing mechanism 40 is driven to press the end KE against the polishing surface 11 .
  • the pressing mechanism 40 may be omitted as long as the end KE can be pressed against the polishing surface 11 when the motor movement mechanism 33 moves the second motor 30 in an arrow X direction.
  • the motor movement mechanism 33 reciprocates the second motor 30 in the directions (arrow X directions shown in FIG. 2 ) orthogonal to the rotation axis of the polishing member 10 and the directions (arrow Y directions shown in FIG. 1 ) tangential to the radially outer circumferential surface of the polishing member 10 .
  • a mechanism that moves the second motor 30 in the directions (arrow X directions shown in FIG. 2 ) orthogonal to the rotation axis of the polishing member 10 may be arranged separately from a mechanism that moves the second motor 30 in the directions (arrow Y directions shown in FIG. 1 ) tangential to the radially outer circumferential surface of the polishing member 10 .
  • the second motor 30 is moved to move the workpiece K. Instead, the workpiece K may be moved using a different means.
  • the end KE of the workpiece K is polished.
  • the portion to be polished is not limited to such an end and may be a different portion.
  • the end KE of the workpiece K to be polished may have a non-planar shape other than a curved surface.
  • the shape may be a triangle.
  • the shape may be a triangle with a round peak.
  • the end KE of the workpiece K to be polished may have the form of steps as shown in FIG. 7 or the form of steps with round corners as shown in FIG. 8 .
  • the end KE may be recessed inward in the workpiece K.
  • a curve surface may have a number of curvatures or partially have a straight portion.
  • the polishing surface 11 of the polishing member 10 when the polishing surface 11 of the polishing member 10 is shaped in conformance with the shape of the end KE of the workpiece K (shape of portion to be polished), the end KE can be polished.
  • the contour of the workpiece K may have any of a variety of shapes other than a tetragonal shape.
  • the shape may have a plurality of planar or curved surfaces or may be triangular or elliptical.
  • workpieces K having various contours can be polished.
  • the circumferential surface of a tubular workpiece K having a circular contour can be polished.
  • the polishing member 10 can be shifted to any position relative to the workpiece K.
  • the contour of the workpiece K is shaped to have a number of curvatures, the periphery of the workpiece K can be polished.
  • the workpiece K is moved in the arrow X directions to bring the end KE of the workpiece K into contact with the polishing surface 11 and also separate the end KE that has been polished from the polishing surface 11 .
  • the motor movement mechanism 33 which is capable of moving the workpiece K in the arrow X directions and the arrow Y directions, can shift the workpiece K to any position relative to the polishing member 10 . This maintains the contact of the workpiece K and the polishing member 10 while following the contour shape of the workpiece K.
  • the polishing device of the above embodiment includes the rotation mechanism that rotates the workpiece K.
  • the periphery of the workpiece K can be polished even when the workpiece K has a shape such as that shown in FIG. 4 , that is, the shape of the contour of the workpiece K have a number of curvatures.
  • feature (A) that includes movement of at least one of the workpiece K and the polishing member 10 in the directions (arrow Y directions) tangential to the radially outer circumferential surface of the polishing member 10
  • one side of the workpiece K can be polished.
  • feature (B) that includes movement of at least one of the workpiece K and the polishing member 10 in the directions (arrow X directions) orthogonal to the rotation axis of the polishing member 10 and movement of at least one of the workpiece K and the polishing member 10 in the directions (arrow Y directions) tangential to the radially outer circumferential surface of the polishing member 10 , the workpiece K and the polishing member 10 may be shifted to any positional relationship.
  • feature (C) When feature (C) is adopted that includes rotation of at least one of the workpiece K and the polishing member 10 , a surface to be polished of the workpiece K may be changed.
  • feature (D) When feature (D) is adopted that includes the pressing of at least one of the workpiece K and the polishing member 10 in the directions orthogonal to the rotation axis of the polishing member 10 , the polishing of the workpiece may be advanced, and the uniform contact (i.e., touch) of the workpiece and the polishing surface may be enhanced.
  • Features (A) to (D) may be adopted in combination or solely in accordance with the shape of the workpiece K and the processing purpose. In such a case, the advantages may be obtained in accordance with the adopted features (A) to (D).
  • polishing marks may remain in the polished surface of the workpiece K in the rotation direction.
  • a reciprocation mechanism that reciprocates at least one of the polishing member 10 and the workpiece K in directions intersecting the rotation direction may be further included in addition to the above various mechanisms.
  • FIGS. 10 and 11 show two examples in which such a reciprocation mechanism is included in the polishing device of the above embodiment shown, for example, in FIG. 2 .
  • the modified example of the polishing device shown in FIG. 10 includes a pivot mechanism 60 that pivots the workpiece K in directions orthogonal to the rotation direction of the polishing member 10 .
  • An appropriate mechanism for example, a link mechanism, may be used as the pivot mechanism 60 .
  • the pivot mechanism 60 when the polishing member 10 is rotated to polish the end KE of the workpiece K, the pivot mechanism 60 is activated.
  • the activation of the pivot mechanism 60 pivots the workpiece K in directions (arrow RO directions shown in FIG. 10 ) orthogonal to the rotation direction of the polishing member 10 .
  • the pivotal motion of the workpiece K pivots the end KE of the workpiece K, which is being rotationally polished, along the curved surface of the polishing surface 11 .
  • Such pivoting of the end KE results in intersecting polishing marks of the end KE and reduces the polishing marks compared to those resulted from the polishing only by rotation. This limits the polishing marks caused by the rotational polishing.
  • the pivot directions of the workpiece K are not necessarily limited to the directions orthogonal to the rotation direction of the polishing member 10 .
  • the polishing marks intersect one another. This limits the polishing marks caused by the rotational polishing.
  • the polishing member 10 may pivot. Further, the workpiece K and the polishing member 10 may both pivot.
  • the modified example of the polishing device shown in FIG. 11 includes an oscillation mechanism 70 that slightly oscillates the workpiece K in directions orthogonal to the rotation direction of the polishing member 10 .
  • An appropriate mechanism for example, a mechanism using ultrasonic oscillations, may be used as the oscillation mechanism 70 .
  • the oscillation mechanism 70 when the polishing member 10 is rotated to polish the end KE of the workpiece K, the oscillation mechanism 70 is activated.
  • the activation of the oscillation mechanism 70 slightly oscillates the workpiece K in directions (arrow UD directions shown in FIG. 11 ) orthogonal to the rotation direction of the polishing member 10 .
  • the oscillation of the workpiece K slightly reciprocates the end KE of the workpiece K, which is being rotationally polished, in the arrow UD directions in contact with the curved surface of the polishing surface 11 .
  • Such reciprocation of the end KE results in intersecting polishing marks of the end KE and reduces the polishing marks compared to those formed when polishing only with rotation.
  • the polishing marks caused by the rotational polishing may be limited.
  • the oscillation directions of the workpiece K are not necessarily limited to the directions orthogonal to the rotation direction of the polishing member 10 .
  • the polishing marks intersect one another. This limits the polishing marks caused by the rotational polishing.
  • the polishing member 10 may oscillate. Further, the workpiece K and the polishing member 10 may both oscillate.
  • the reciprocation mechanism may be applied to the polishing device (e.g., polishing device shown, for example, in FIG. 3 ) in the modified examples of the embodiment. Also, in this case, polishing marks caused by the rotational polishing may be limited.
  • the end KE of the workpiece K is polished.
  • the pressed end KE is polished.
  • the upper and lower surfaces of the workpiece K that is, two surfaces of the workpiece K that are parallel to the planar orthogonal to the rotation axis of the polishing member 10 , do not receive much pressure when being polished and may fail to be sufficiently polished.
  • a pressure application mechanism that applies perpendicular pressure to the two surfaces of the workpiece K may be further included in addition to the above various mechanisms.
  • FIG. 12 schematically shows the structure of one example of such a pressure application mechanism.
  • the pressure application mechanism includes a roller 80 and an actuator 82 .
  • the roller 80 which is discoid, rotates about a rotation shaft 81 .
  • the roller 80 includes a circumferential surface that is in contact with a circumferential portion of an upper surface 10 U of the polishing member 10 . Rotation of the upper surface 10 U rotates the roller 80 .
  • the roller 80 and the upper surface 10 U only need to be in contact at least while polishing the workpiece K.
  • the roller 80 and the upper surface 10 U may be in constant contact with each other or in contact with each other only when polishing the workpiece K.
  • the actuator 82 includes an appropriate mechanism that presses the roller 80 against the upper surface 10 U and is of, for example, a motor-driven type or a hydraulic pressure-driven type. While polishing the workpiece K, the actuator 82 is activated to press the roller 80 against the upper surface 10 U (in arrow VT direction shown in FIG. 12 ).
  • the actuator 82 is used to press the roller 80 .
  • the actuator 82 may be omitted.
  • one surface of the polishing member 10 is pressed.
  • two surfaces may be pressed, for example, by sandwiching the two surfaces of the polishing member 10 .
  • distortion of the polishing member 10 may be limited compared to when one surface is pressed.
  • the roller 80 does not need to be configured to be rotational. In this case, the roller 80 may be changed to a simple weight.
  • 10 polishing member
  • 10 U upper surface (of polishing member)
  • 11 polishing surface
  • 20 base
  • 21 first motor
  • 30 second motor
  • 31 rotation shaft
  • 32 fixing seat
  • 33 motor movement mechanism
  • 40 pressing mechanism
  • 50 movement mechanism
  • K workpiece to be polished
  • KE end (of workpiece)
  • KU upper surface (of workpiece)
  • KD lower surface (of workpiece)
  • 60 pivot mechanism
  • 70 oscillation mechanism
  • 80 roller
  • 81 rotation shaft
  • 82 actuator.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
US15/026,089 2013-10-04 2014-10-02 Polishing device and polishing method Abandoned US20160236314A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013209602 2013-10-04
JP2013-209602 2013-10-04
PCT/JP2014/076360 WO2015050186A1 (ja) 2013-10-04 2014-10-02 研磨装置及び研磨方法

Publications (1)

Publication Number Publication Date
US20160236314A1 true US20160236314A1 (en) 2016-08-18

Family

ID=52778773

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/026,089 Abandoned US20160236314A1 (en) 2013-10-04 2014-10-02 Polishing device and polishing method

Country Status (7)

Country Link
US (1) US20160236314A1 (de)
EP (1) EP3053703A4 (de)
JP (2) JPWO2015050186A1 (de)
KR (1) KR20160067106A (de)
CN (1) CN105658377A (de)
TW (1) TW201529224A (de)
WO (1) WO2015050186A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11799150B2 (en) 2020-07-17 2023-10-24 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling structure for hybrid-electric vehicle battery cell assemblies

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015174180A (ja) * 2014-03-14 2015-10-05 株式会社東京精密 超音波面取り機
JP6398902B2 (ja) * 2014-08-19 2018-10-03 信越化学工業株式会社 インプリント・リソグラフィ用角形基板及びその製造方法
JP6568006B2 (ja) * 2016-04-08 2019-08-28 株式会社荏原製作所 研磨装置および研磨方法
CN108436650A (zh) * 2018-03-08 2018-08-24 北京铂阳顶荣光伏科技有限公司 磨边方法及装置
CN115365928A (zh) * 2022-08-23 2022-11-22 北京航空航天大学宁波创新研究院 一种研磨方法及研磨机
CN117773697B (zh) * 2024-02-23 2024-05-14 山东旭辉玻璃科技有限公司 一种用于农机玻璃的切割边角打磨设备

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667443A (en) * 1984-09-06 1987-05-26 Kaoru Sakurai End face grinding apparatus
US5083401A (en) * 1988-08-08 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Method of polishing
US5658189A (en) * 1994-09-29 1997-08-19 Tokyo Seimitsu Co., Ltd. Grinding apparatus for wafer edge
US20010029153A1 (en) * 1992-06-03 2001-10-11 Hitachi Ltd. Rolling mill equipped with on-line roll grinding system and grinding wheel
US6579155B1 (en) * 1999-03-29 2003-06-17 Wernicke & Co. Gmbh Method and apparatus for form machining the peripheral edge of spectacle lenses
US20030153251A1 (en) * 2000-07-10 2003-08-14 Kazutoshi Mizushima Mirror chamfered wafer, mirror chamfering polishing cloth, and mirror chamfering polishing machine and method
US20080274670A1 (en) * 2004-05-28 2008-11-06 Ebara Corporation Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20100112910A1 (en) * 2008-10-31 2010-05-06 James William Brown Linear pressure feed grinding with voice coil
US20110013641A1 (en) * 2008-03-20 2011-01-20 Telefonaktiebolaget Lm Ericsson (Publ) Method and Apparatus for Communication of Data Packets between Local Networks
US20110081828A1 (en) * 2009-10-06 2011-04-07 Apple Inc. Edge break details and processing
US20110136411A1 (en) * 2009-12-03 2011-06-09 Masayuki Nakanishi Method and apparatus for polishing a substrate having a grinded back surface
US20120010078A1 (en) * 2006-01-26 2012-01-12 Inabonos, S.A. Metabolic and nutritional activator for plants
US20120100785A1 (en) * 2009-04-15 2012-04-26 Shin-Etsu Handotai Co., Ltd. Method for chamfering wafer
US20120220194A1 (en) * 2011-02-24 2012-08-30 Apple Inc. Smart automation of robotic surface finishing
US20120302139A1 (en) * 2011-05-26 2012-11-29 Darcangelo Charles M Methods of finishing an edge of a glass sheet

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082418A (en) * 1966-07-22 1967-09-06 Toolmasters Ltd Improvements relating to grinding wheels
DE2646483A1 (de) * 1975-10-15 1977-04-21 Monsanto Co Profilierrolle
JPS5388291A (en) * 1977-01-12 1978-08-03 Fukuyama Tetsukoushiyo Kk Machine for automatically pol shuing all circumference of plate glass
JPS591548U (ja) * 1982-06-29 1984-01-07 小出　▲けん▼ 倣い研磨用砥石装置
JPS60143646U (ja) * 1984-03-02 1985-09-24 豊田工機株式会社 研削装置
JPS6165763A (ja) * 1984-09-06 1986-04-04 Nippon Sheet Glass Co Ltd 板状体の端面研磨装置
JPH01170558U (de) * 1988-05-24 1989-12-01
JPH04360772A (ja) * 1991-06-05 1992-12-14 Toto Ltd 平板面取用砥石及び平板面取装置
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
JPH1170471A (ja) * 1997-07-03 1999-03-16 Asahi Glass Co Ltd ガラス面取り方法およびその装置
JPH11188590A (ja) 1997-12-22 1999-07-13 Speedfam Co Ltd エッジポリッシング装置
JP2000176805A (ja) * 1998-12-17 2000-06-27 Mitsubishi Materials Silicon Corp 半導体ウェーハの面取り装置
JP2001038589A (ja) * 1999-08-03 2001-02-13 Speedfam Co Ltd ワーク外周部用研磨装置
JP2001062686A (ja) * 1999-08-25 2001-03-13 Speedfam Co Ltd インデックス式エッジポリッシャー
JP2001205549A (ja) 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
JP2007088143A (ja) * 2005-09-21 2007-04-05 Elpida Memory Inc エッジ研磨装置
CN101284365A (zh) * 2007-04-13 2008-10-15 奇美电子股份有限公司 基板的旋转装置、磨边装置及磨边方法
JP2010182813A (ja) * 2009-02-04 2010-08-19 Noritake Super Abrasive Co Ltd Ｃｍｐパッドコンディショナー
CN201380419Y (zh) * 2009-03-02 2010-01-13 湖北新火炬科技股份有限公司 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置
JPWO2010131610A1 (ja) * 2009-05-15 2012-11-01 旭硝子株式会社 ガラス端面研削用砥石の加工位置設定方法
CN101612717A (zh) * 2009-07-17 2009-12-30 李留江 数控球轴承内圈沟道多功能磨床
EP2537634A1 (de) * 2011-06-21 2012-12-26 WENDT GmbH Verfahren zum Schleifen der umlaufenden Kantenfläche einer Verglasung
JP5898984B2 (ja) * 2012-02-03 2016-04-06 中村留精密工業株式会社 硬質脆性板の側辺加工装置

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667443A (en) * 1984-09-06 1987-05-26 Kaoru Sakurai End face grinding apparatus
US5083401A (en) * 1988-08-08 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Method of polishing
US20010029153A1 (en) * 1992-06-03 2001-10-11 Hitachi Ltd. Rolling mill equipped with on-line roll grinding system and grinding wheel
US5658189A (en) * 1994-09-29 1997-08-19 Tokyo Seimitsu Co., Ltd. Grinding apparatus for wafer edge
US6579155B1 (en) * 1999-03-29 2003-06-17 Wernicke & Co. Gmbh Method and apparatus for form machining the peripheral edge of spectacle lenses
US20030153251A1 (en) * 2000-07-10 2003-08-14 Kazutoshi Mizushima Mirror chamfered wafer, mirror chamfering polishing cloth, and mirror chamfering polishing machine and method
US20080274670A1 (en) * 2004-05-28 2008-11-06 Ebara Corporation Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus
US20120010078A1 (en) * 2006-01-26 2012-01-12 Inabonos, S.A. Metabolic and nutritional activator for plants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20110013641A1 (en) * 2008-03-20 2011-01-20 Telefonaktiebolaget Lm Ericsson (Publ) Method and Apparatus for Communication of Data Packets between Local Networks
US20100112910A1 (en) * 2008-10-31 2010-05-06 James William Brown Linear pressure feed grinding with voice coil
US20120100785A1 (en) * 2009-04-15 2012-04-26 Shin-Etsu Handotai Co., Ltd. Method for chamfering wafer
US20110081828A1 (en) * 2009-10-06 2011-04-07 Apple Inc. Edge break details and processing
US20110136411A1 (en) * 2009-12-03 2011-06-09 Masayuki Nakanishi Method and apparatus for polishing a substrate having a grinded back surface
US20120220194A1 (en) * 2011-02-24 2012-08-30 Apple Inc. Smart automation of robotic surface finishing
US20120302139A1 (en) * 2011-05-26 2012-11-29 Darcangelo Charles M Methods of finishing an edge of a glass sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11799150B2 (en) 2020-07-17 2023-10-24 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling structure for hybrid-electric vehicle battery cell assemblies

Also Published As

Publication number Publication date
EP3053703A1 (de) 2016-08-10
JPWO2015050186A1 (ja) 2017-03-09
JP2018001406A (ja) 2018-01-11
KR20160067106A (ko) 2016-06-13
WO2015050186A1 (ja) 2015-04-09
CN105658377A (zh) 2016-06-08
EP3053703A4 (de) 2017-07-26
TW201529224A (zh) 2015-08-01

Similar Documents

Publication Publication Date Title
US20160236314A1 (en) Polishing device and polishing method
US9962804B2 (en) Polishing apparatus, method for controlling the same, and method for outputting a dressing condition
US20060258268A1 (en) Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
JP2007210074A (ja) 研削装置および研磨装置、並びに研削方法および研磨方法
WO2016108284A1 (ja) 平坦加工方法および平坦加工装置
JP2007054896A (ja) 研削方法及び研削装置
JP6474861B2 (ja) 研磨装置、研磨部材の加工又は修正用工具、研磨部材の加工又は修正方法、及び研磨部材の製造方法
JP6145548B1 (ja) 面取り研削方法及び面取り研削装置
JP2008194771A (ja) レンズ球面研削方法及び装置
JP2009078326A (ja) ウェーハ面取り装置、及びウェーハ面取り方法
JP6369649B1 (ja) フィルムラップ加工装置
JP2022047538A (ja) 面取り研削方法及び面取り研削装置
JPH08276356A (ja) セラミックスの加工方法及び加工装置
JP7005120B2 (ja) 面取り基板の製造方法及びそれに用いられる面取り装置
JP2009066724A (ja) レンズの球面研削方法及び装置
TWM400382U (en) Ultrasonic chemical mechanical polishing mechanism
JP4106043B2 (ja) 平面研削方法およびその装置
JPH05170B2 (de)
JP5464337B2 (ja) センタレス研削方法及び同装置
JP2001239458A (ja) 基板の化学機械研磨装置
JP2024511275A (ja) 半導体材料で作られた円筒状ロッドからディスクを製造する方法
JP2005288551A (ja) 加工工具及び該加工工具を使用する加工方法
JP2001009731A (ja) メカノケミカル砥石
JPH0725026B2 (ja) セラミック基板の研磨方法
WO2015082963A1 (en) Grinding implement for oscillating drive

Legal Events

Date Code Title Description
AS Assignment

Owner name: FUJIMI INCORPORATED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MORINAGA, HITOSHI;ASANO, HIROSHI;OTSUKI, SHINGO;AND OTHERS;SIGNING DATES FROM 20160325 TO 20160411;REEL/FRAME:038442/0594

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION