TW201529224A - Polishing apparatus and polishing method - Google Patents

Abstract

The purpose of the present invention is to provide a polishing device and a polishing method capable of polishing workpieces of various shapes. This polishing device is provided with: a motor moving mechanism (33) which moves the workpiece to be polished (K) in a direction tangential to the outer peripheral surface of a polishing member (10) in the radial direction, and moves the workpiece to be polished (K) in a direction orthogonal to the rotational axis of the polishing member (10); and a second motor (20) which rotates the workpiece to be polished (K).

Description

Grinding device and grinding method

The present invention relates to a polishing apparatus and a polishing method.

The polishing apparatus described in Patent Document 1 and Patent Document 2 is in contact with the polishing member by rotating the workpiece (the object to be polished), and polishing the periphery of the workpiece.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-188590

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-205549

However, in the above-described conventional polishing apparatus, the periphery of the rotating workpiece is brought into contact with the polishing member, and the workpiece to be polished is limited to a circular shape such as a disk shape or a cylindrical shape. It is difficult to grind a workpiece having other shapes.

Further, the above-mentioned "a perfect circular shape" refers to a shape drawn on a plane by a curve obtained by collecting points having the same distance from a certain point. Moreover, the above-mentioned "outer shape" means a shape of a projection of a surface orthogonal to the side surface to be polished in the workpiece to be polished.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a polishing apparatus and a polishing method capable of polishing a workpiece having various shapes.

A polishing apparatus that solves the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism for the workpiece to be polished or At least one of the polishing members moves in a tangential direction toward a radially outer peripheral surface of the polishing member.

Further, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a first moving mechanism; At least one of the workpiece or the polishing member is moved in a tangential direction to a radially outer surface of the polishing member; and the second moving mechanism is configured to at least one of the workpiece or the polishing member The direction moves in a direction orthogonal to the rotation axis of the polishing member.

Further, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and a rotating mechanism; At least one of the workpiece to be polished or the polishing member is rotated.

Moreover, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and a pressing mechanism; At least one of the workpiece to be polished or the polishing member is pressed in a direction orthogonal to a rotation axis of the polishing member.

Moreover, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism At least one of the workpiece or the polishing member moves in a tangential direction to a radially outer surface of the polishing member, and a rotation mechanism rotates at least one of the workpiece or the polishing member.

Moreover, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism At least one of the workpiece or the polishing member moves toward a tangential direction of a radially outer surface of the polishing member; and a pressing mechanism that at least one of the workpiece or the polishing member faces the polishing The rotation axis of the member is pushed in the direction orthogonal to the axis.

Moreover, another polishing apparatus for solving the above-described problems is an apparatus for polishing a workpiece to be polished, and includes: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism At least one of the workpiece to be polished or the polishing member moves toward a tangential direction of a radially outer peripheral surface of the polishing member; and a rotating mechanism causes the above At least one of the workpiece or the polishing member is rotated; and the pressing mechanism presses at least one of the workpiece or the polishing member in a direction orthogonal to a rotation axis of the polishing member.

Further, the polishing apparatus preferably includes a motor that rotates the polishing apparatus from below, or a machine tool table that rotates integrally with the polishing member in a state in which the polishing apparatus is placed on the upper surface.

Moreover, the polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and performing the workpiece to be polished. At the time of polishing, at least one of the workpiece to be polished or the polishing member is moved in a tangential direction to a radially outer peripheral surface of the polishing member.

Further, another polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and the workpiece to be polished At the time of polishing, at least one of the workpiece or the polishing member is moved in a tangential direction to a radially outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is oriented toward Movement in a direction orthogonal to the rotation axis of the polishing member.

Further, another polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished. Or at least one of the polishing members is rotated.

Moreover, another polishing method for solving the above problems is to grind the member In the method of grinding a workpiece, the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and at least one of the workpiece or the polishing member is directed toward the polishing member. The rotation axis is pushed in the direction orthogonal to the axis.

Further, another polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished. At least one of the object or the polishing member moves in a tangential direction of the radially outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is rotated.

Further, another polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished. At least one of the object or the polishing member moves in a tangential direction to a radial outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is pushed in a direction orthogonal to a rotation axis of the polishing member. Pressure.

Further, another polishing method for solving the above-described problems is a method of polishing a workpiece to be polished by a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished. At least one of the object or the polishing member moves toward a tangential direction of a radially outer peripheral surface of the polishing member, and rotates at least one of the workpiece or the polishing member; and the workpiece or the polishing member At least one of which faces orthogonal to the axis of rotation of the polishing member Push in the direction.

Further, in the above polishing method, it is preferable that the polishing member is rotated integrally with the machine tool table in a state where the polishing member is rotated from below or the polishing member is placed on the upper surface of the machine tool table.

Further, in the above apparatus or the above method, since the polishing member has a polishing surface having a shape along the shape of the portion to be polished of the workpiece, the shape of the portion to be polished of the workpiece to be polished, for example, a curved surface or a triangle, is Grinding can still be carried out in a shape different from the plane.

In the above apparatus or the above method, when at least one of the workpiece or the polishing member is moved in a tangential direction to a radially outer peripheral surface of the polishing member, the workpiece to be polished is linearly opposed to the polishing member. mobile. Therefore, the workpiece to be polished having a linear outer shape can be polished.

In the above apparatus or the method, at least one of the workpiece or the polishing member is moved in a tangential direction to a radially outer peripheral surface of the polishing member, and at least one of the workpiece and the polishing member are oriented toward each other When moving in a direction orthogonal to the rotation axis of the polishing member, the positional relationship between the workpiece and the polishing member can be arbitrarily changed. Therefore, it is possible to follow the outer shape of each of the workpieces to be polished, and to maintain the state of contact with the workpiece by the workpiece to be polished. Therefore, the workpiece to be polished having various shapes can be ground.

In the above apparatus or the above method, when at least one of the workpiece to be polished or the polishing member is rotated, the surface to be polished of the workpiece to be polished can be changed. Therefore, it is possible to appropriately grind a workpiece having various shapes For example, the whole part or a part of the periphery.

In the above apparatus or the above method, when at least one of the workpiece to be polished or the polishing member is pressed in a direction orthogonal to the rotation axis of the polishing member, the polishing process of the workpiece to be polished can be promoted, and the The uniformity of the contact state (ie, contact) between the workpiece and the polished surface.

In the above apparatus or the above method, when the polishing member is rotated from below or the polishing member is placed on the machine table, the polishing member can be rotated integrally with the machine table, and a stable stable polishing member such as chattering can be obtained. Rotation for more precise machining.

According to the present invention, the workpiece to be polished having various shapes can be ground.

10‧‧‧Abrased components

10U‧‧‧ (grinding member) top

11‧‧‧Grinding surface

20‧‧‧Machine Workbench

21‧‧‧1st motor

30‧‧‧2nd motor

31‧‧‧ shaft

32‧‧‧ fixed table

33‧‧‧Motor moving mechanism

40‧‧‧Pushing mechanism

50‧‧‧Mobile agencies

K‧‧‧Abrased workpiece

KE‧‧‧ (end of the workpiece)

KU‧‧‧ (grounded)

KD‧‧‧ (under the workpiece)

60‧‧‧ swinging mechanism

70‧‧‧Vibration mechanism

80‧‧‧Roller

81‧‧‧ shaft

82‧‧‧Actuator

Fig. 1 is a top view showing a schematic configuration of a polishing apparatus according to an embodiment.

Fig. 2 is a side view showing a schematic configuration of a polishing apparatus of the same embodiment.

Fig. 3 is a top view showing a schematic configuration of a polishing apparatus according to a modification of the embodiment.

Fig. 4 is a top view showing an example of a workpiece to be polished which is polished by using a polishing apparatus according to a modification of Fig. 3.

Fig. 5 is a partial side elevational view showing the workpiece to be polished and the polishing member according to another modification of the embodiment.

Fig. 6 is a partial side elevational view showing the workpiece to be polished and the polishing member according to another modification of the embodiment.

Fig. 7 is a partial side elevational view showing the workpiece to be polished and the polishing member according to another modification of the embodiment.

Fig. 8 is a partial side elevational view showing the workpiece to be polished and the polishing member according to another modification of the embodiment.

Fig. 9 is a partial side elevational view showing the workpiece to be polished and the polishing member according to another modification of the embodiment.

Fig. 10 is a schematic view showing a state of processing of a workpiece to be polished by a polishing apparatus according to another modification of the embodiment.

Fig. 11 is a schematic view showing a state of processing of a workpiece to be polished by a polishing apparatus according to another modification of the embodiment.

Fig. 12 is a schematic view showing a schematic configuration of a pressure applying mechanism according to another modification of the embodiment.

Hereinafter, an embodiment in which the polishing apparatus, the polishing method, and the workpiece to be polished according to the present invention are embodied will be described with reference to FIGS. 1 and 2 .

As shown in Fig. 1, the polishing apparatus includes a disk-shaped polishing member 10. The end portion of the portion to be polished of the workpiece K to be polished is polished using the radially outer peripheral surface of the polishing member 10.

The outer shape of the workpiece K to be polished, that is, the projection shape of the surface orthogonal to the side surface on which the workpiece K is polished (the first figure shows the shape of the workpiece K) has a square shape. In more detail, the corners of the quadrilateral Not a right angle but a rounded corner. However, for other shapes, the corners of the quadrilateral may be formed at right angles.

As shown in Fig. 2, the shape of the end portion KE of the workpiece K to be polished (the shape of the portion to be polished) is previously processed into a curved shape, and the end portion KE processed into the curved shape is polished by the polishing member 10.

The material of the polishing member 10 can be arbitrarily used as the material of the polishing material KE. For example, when a resin is used as the material of the polishing member 10, any synthetic resin can be used. For example, a thermosetting resin (phenolic resin, epoxy resin, urethane resin, polyimide, or the like) or a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyimide, polycarbonate, or the like) may be mentioned. Further, it may be a woven fabric, a non-woven fabric, a non-woven fabric, a synthetic leather, or a composite thereof. The hardness of the polishing surface of the polishing member 10 is preferably 5 or more Shore A hardness. The Shore A hardness of 5 or more is a rubber hardness tester based on JIS K6253 after the polishing member 10 having the polishing surface of the sample having the hardness is placed in a dry state of 20 to 60% humidity at room temperature for 60 minutes or more. The hardness of the polished surface measured by (Type A) is 5 or more. When the Shore A hardness is 5 or more, the surface of the workpiece K can be appropriately processed, and the polishing surface of the polishing member 10 can be prevented from being deformed by polishing for a short period of time.

Further, the Shore A hardness of the polishing surface of the polishing member 10 is preferably 40 or more, more preferably 70 to 95, and particularly preferably 70 to 85.

Further, when a metal is used as the material of the polishing member 10, magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese or an alloy containing these as a main component can be used.

Further, when a resin or a metal is used as the material of the polishing member 10, the polishing member 10 may have abrasive grains. The type of the abrasive grains to be used is not particularly limited, but metal oxide particles such as cerium oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, chromium oxide, or the like may be used. Carbides such as niobium carbide, other nitrides, borides, diamonds, and the like.

Further, when ceramic is used as the material of the polishing member 10, an oxide, a nitride, a boride, a carbide, or the like of ruthenium, aluminum, zirconium, calcium, barium or the like may be used in addition to a ceramic or glass. Aluminum, zirconia, yttria, tantalum carbide, tantalum nitride, boron nitride, and the like.

Any material can be used as the material of the workpiece K to be polished. For example, when a resin is used as the material of the workpiece K to be polished, any synthetic resin can be used. For example, a thermosetting resin (phenolic resin, epoxy resin, urethane resin, polyimide, or the like) or a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyimide, polycarbonate, or the like) may be mentioned.

When ceramics are used as the material of the workpiece K to be polished, oxides, carbides, nitrides, and borides such as bismuth, aluminum, zirconium, calcium, and barium may be used in addition to ceramics, glass, or fine ceramics. Wait.

Further, when a metal is used as the material of the workpiece K to be polished, magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese or an alloy containing these as a main component can be used.

Moreover, the specific use of the workpiece K to be polished may be arbitrary. For example, a roller, a shaft, a container, a frame (case, outer casing, etc.), a frame (frame, etc.), a ball, a cable, an ornament, or the like can be used.

The polishing member 10 is detachably fixed to the upper surface of the disk-shaped machine table 20. A rotating shaft of the first motor 21 is fixed to the lower surface of the center portion of the machine table 20. When the first motor 21 is rotationally driven, the machine tool table 20 and the polishing member 10 rotate together. The first motor 21 is disposed under the polishing member 10 and the machine table 20, and the polishing member 10 disposed on the upper surface of the machine table 20 is rotated from below along with the machine table 20, thereby obtaining low vibration such as shaft vibration. By stabilizing the rotation of the polishing member 10, it is possible to perform processing with higher precision.

On the radially outer peripheral surface of the polishing member 10, a polishing surface 11 having a groove-like curved shape extending in the peripheral direction is provided. The curved surface of the polishing surface 11 is formed in a shape along the end portion KE of the workpiece K to be polished. That is, the curvature of the abrasive surface 11 is the same as the curvature of the end portion KE.

Further, when the diameter of the polishing member 10 is increased as much as possible within a range in which the polishing precision can be appropriately maintained, the end portion KE of the plurality of workpieces K to be polished can be simultaneously polished on the outer peripheral surface of the polishing member 10, so that productivity can be improved. Further, when the diameter of the polishing member 10 is increased as much as possible, even if the rotational speed of the polishing member 10 is the same, since a large linear velocity can be obtained at the periphery, sufficient polishing can be obtained even when the rotational speed of the polishing member 10 is relatively low during the polishing process. Line speed. Therefore, for example, scattering of the working fluid described later can be suppressed.

The workpiece K is detachably held on the fixing table 32. The fixing table 32 is fixed to the rotating shaft 31 of the second motor 30. By the driving of the second motor 30, the workpiece K is rotated about the rotation shaft 31 (the direction of the arrow R or the direction of the arrow L shown in the first drawing). Further, the second motor 30 constitutes the above-described rotating mechanism.

The second motor 30 is attached to the motor moving mechanism 33. The motor moving mechanism 33 includes a mechanism that reciprocates the second motor 30 in a direction orthogonal to the rotation axis of the polishing member 10 . In the following, the direction orthogonal to the rotation axis of the polishing member 10 is referred to as "arrow X direction" (illustrated in Fig. 2).

Further, the motor moving mechanism 33 also includes a mechanism that reciprocates the second motor 30 in the tangential direction of the radial outer peripheral surface of the polishing member 10. In addition, the tangential direction with respect to the radial peripheral surface of the polishing member 10 is hereinafter referred to as "arrow Y direction" (illustrated in the previous first drawing).

When the second motor 30 is moved by the motor moving mechanism 33, the second motor 30, the rotating shaft 31, the fixed table 32, and the workpiece K are integrally aligned in a direction orthogonal to the rotation axis of the polishing member 10 or the diameter of the polishing member 10. Move to the tangential direction of the outer surface. The motor moving mechanism 33 constitutes the first moving mechanism and the second moving mechanism.

Further, the polishing apparatus includes a pressing mechanism 40 that presses the workpiece K toward the direction orthogonal to the rotation axis of the polishing member 10 . The pressing mechanism 40 presses the workpiece K with the pressure P on the polishing surface 11 of the polishing member 10. The adjustment of the pressure P by the pressing mechanism 40 is arbitrarily performed. For example, the contact pressure between the end portion KE of the workpiece K and the contact portion of the polishing surface 11 is measured by a load sensor or the like. Then, the pressure P is adjusted so that the contact pressure becomes a predetermined value. Further, the pressure P may be adjusted in accordance with the area of the contact portion (for example, a portion where the area of the contact portion is wide is a high pressure P, and a portion where the area of the contact portion is narrow is a low pressure P or the like).

Further, the contact pressure is likely to be high as compared with the flat portion at the corner portion or the like. Therefore, the grinding of the portion of the workpiece K that has a high contact pressure such as a corner portion When the time is shortened, the polishing time of the portion of the workpiece K to be polished, such as a flat portion, is increased, and the polishing control may be performed in accordance with the shape of the workpiece K, and the pressure P as described above. The adjustment is made to adjust the processing time to perform a certain grinding.

As the power source of the motor moving mechanism 33 or the pressing mechanism 40, an appropriate power source such as electric power, hydraulic pressure, air pressure, or air pressure can be used. Further, the motor moving mechanism 33 or the pressing mechanism 40 is driven by an automatic drive by a control device such as a CPU, a RAM, and a ROM, or a switch operation of an operator who operates the polishing apparatus.

The end portion KE of the workpiece K is pressed against the polishing surface 11 by the movement of the second motor 30 by the motor moving mechanism 33 and the pressing of the workpiece K by the pressing mechanism 40. Further, the contact portion between the end portion KE and the polishing surface 11 is supplied with a working fluid or the like in an appropriate state. The above supply of the working fluid can be directly supplied from the outside to the contact portion of the end portion KE and the grinding surface 11. Alternatively, a machining liquid supply mechanism such as a coupling shaft is interposed between the polishing member 10 (more specifically, the machine tool table 20 to which the polishing member 10 is fixed) and the contact portion of the first motor 21. The machining liquid is supplied from the machining liquid supply mechanism to the inside of the polishing member 10, and the machining liquid supplied to the inside of the polishing member 10 is supplied to the contact portion through a supply passage formed inside the polishing member 10. The machining liquid can be further efficiently supplied by supplying the machining liquid from the inside of the polishing member 10 toward the contact portion as described above. Moreover, in order to use the working fluid efficiently, it is more preferable to provide a cover having a cover around the polishing member 10 and a recovery device for improving the recovery efficiency of the working fluid.

The type of the above-mentioned working fluid may be in accordance with the workpiece K or the grinding member. The material of 10 is used appropriately. Specifically, a machining liquid for grinding or grinding, a polishing material, a polishing agent, a polishing liquid for chemical mechanical polishing, or the like can be used. The working fluid may also contain abrasive particles. The type of the abrasive grains to be used is not particularly limited, but metal oxide particles such as cerium oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, chromium oxide, or the like may be used. Carbides such as niobium carbide, other nitrides, borides, diamonds, and the like.

For example, the content of the abrasive grains in the working fluid is preferably 1% by mass or more, and more preferably 2% by mass or more. Further, the content of the abrasive grains in the working fluid is preferably 50% by mass or less, and more preferably 40% by mass or less.

The average secondary particle diameter of the abrasive grains in the working fluid is preferably 0.1 μm or more, and more preferably 0.3 μm or more. As the average secondary particle size of the abrasive grains in the working fluid becomes larger, the processing speed of the working fluid can be increased.

On the other hand, the average secondary particle diameter of the abrasive grains in the working fluid is preferably 20 μm or less, and more preferably 5 μm or less. As the average secondary particle diameter of the abrasive grains in the working fluid becomes smaller, the surface of the workpiece K can be more uniformly polished. Incidentally, the average secondary particle diameter of the abrasive grains is, for example, a volume average particle diameter measured by a laser diffraction/scattering particle size distribution measuring device such as "LA-950" manufactured by Horiba, Ltd., and the like.

The working fluid may further contain a pH adjuster, an etchant, an oxidizing agent, a water-soluble polymer, a copolymer or a salt thereof, a derivative, a rust preventive, a chelating agent, a dispersing aid, an anticorrosive agent, and an antifungal agent, as needed. Other ingredients.

As an example of the above pH adjusting agent, a conventional acid, a base, or These salts. Examples of the acid which can be used as the pH adjuster include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, and phosphoric acid, or formic acid, acetic acid, propionic acid, and butyric acid. , valeric acid, 2-methylbutyric acid, n-hexane, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexyl Acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, horse Acid, phthalic acid, malic acid, tartaric acid, citric acid, lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furandicarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofurancarboxylic acid, methoxy An organic acid such as acetic acid, methoxyphenylacetic acid or phenoxyacetic acid.

Examples of the base to be used as the pH adjuster include an amine such as an aliphatic amine or an aromatic amine, an organic alkali such as tetraammonium hydroxide, or an alkali metal hydroxide such as potassium hydroxide or an alkaline earth. Metal hydroxides, ammonium, etc.

Further, a salt such as an ammonium salt or an alkali metal salt of the above acid may be used as a pH adjuster in the substitution of the above acid or in combination with the above acid. Further, the above pH adjusting agent is used to adjust the pH of the working fluid to an optimum value depending on the type of the workpiece K to be polished.

Examples of the etchant include inorganic acids such as nitric acid, sulfuric acid, and phosphoric acid, organic acids such as acetic acid, citric acid, tartaric acid or methanesulfonic acid, inorganic bases such as potassium hydroxide and sodium hydroxide, and ammonia. An organic base such as a fourth-order ammonium hydroxide or the like.

Examples of the oxidizing agent include sulfur, hydrogen peroxide, percolate, urea peroxide, perchlorate, perchlorate, and the like. A carboxylic acid such as an acid, nitric acid, phosphoric acid or a salt thereof, or a salt thereof.

Examples of the water-soluble polymer, the copolymer, or a salt or a derivative thereof include an oxyalkylene polymer, a nonionic surfactant, an anionic surfactant, and the like, and a polycarboxylic acid such as an acrylate or a poly Polysaccharides such as phthalic acid, sulfonated polystyrene, xanthan gum, sodium alginate, cellulose derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose, polyethylene glycol, Polyvinyl alcohol, polyvinylpyrrolidone, sorbitan monostearate, single or plural oxyalkylene units. Examples of the nonionic surfactant include, for example, an oxyethylene polymer, and a polyoxyethylene alkyl ether, a polyoxyethylene alkylphenyl ether, a sorbitan monostearate, and a single One or more oxyalkylene units. Examples of the anionic surfactant and the like include an alkylsulfonic acid compound, an alkylbenzenesulfonic acid compound, an alkylnaphthalenesulfonic acid compound, a methylaminoethanesulfonic acid compound, and an alkyl diphenyl ether disulfonate. An acid compound, an α-olefin sulfonic acid compound, a naphthalenesulfonic acid condensate, a sulfosuccinate compound, or the like.

Examples of the anticorrosive agent include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acids, and the like, monocyclic compounds, and polycyclic compounds having a condensed ring. , heterocyclic compounds, and the like.

Examples of the chelating agent include a carboxylic acid-based chelating agent such as gluconic acid, an amine-based chelating agent such as ethylenediamine, diethylenetriamine or triethylenetetramine, ethylenediaminetetraacetic acid, and nitrilotriacetic acid. Polyaminopolycarboxylic acid chelating agent such as hydroxyethylethylenediaminetriacetic acid, triethylenetetramine hexaacetic acid or diethylenetriaminepentaacetic acid, 2-aminoethylphosphoric acid, 1-hydroxyethylidene -1,1-diphosphate, aminotri(methylenephosphoric acid), ethylenediaminetetrakis (methylenephosphorus) Acid), diethylenetriamine penta (methylene phosphate), ethane-1,1-diphosphate, ethane-1,1,2-triphosphate, methanesulfonic acid, 1-phosphorane- An organic phosphate-based chelating agent such as 2,3,4-tricarboxylic acid, a phenol derivative, or a 1,3-diketone.

Examples of the dispersing aid include condensed phosphates such as pyrophosphate or hexametaphosphate.

Examples of the anticorrosive agent include sodium hypochlorite and the like.

Examples of the above-mentioned antifungal agent include oxazoline such as oxazolidine-2,5-dione.

Then, the rotation speed of the first motor 21 is adjusted together with the supply of the machining liquid or the like described above, thereby polishing the curved end portion KE. The polishing of the end portion KE can be carried out, for example, in the following sequence of steps.

Step 1: By the motor moving mechanism 33, the workpiece K is moved in the direction of the arrow X toward the center of rotation of the polishing member 10, whereby the end portion KE is brought into contact with the polishing surface 11.

Step 2: Next, the pressing mechanism 40 is driven while the end portion KE is in contact with the polishing surface 11, and the workpiece K is moved in the arrow Y direction by the motor moving mechanism 33, thereby changing the end portion KE and grinding The contact area of the face 11. Thereby, the grinding of one side of the workpiece K is continued.

Step 3: When the polishing of one side of the workpiece K is completed, the pressing mechanism 40 is separated from the end portion KE. Then, the workpiece K is moved in the direction of the arrow X by the motor moving mechanism 33, and the workpiece K is rotated by the second motor 30. In this manner, the state in which the workpiece K is in contact with the polishing surface 11 is maintained and the workpiece is ground. The object K is rotated so that the adjacent side of the side where the polishing is completed faces the polishing surface 11 side, and the polished side can be switched.

Further, steps 2 and 3 are repeated to polish all four sides of the workpiece K to be polished. In addition, the above-described polishing step is an example, and the driving state of the motor moving mechanism 33 or the pressing mechanism 40 can be appropriately changed in consideration of the processing time and the like.

According to the embodiment described above, the following effects can be obtained.

(1) The workpiece K is moved by the motor moving mechanism 33 in the tangential direction (arrow Y direction) of the radially outer peripheral surface of the polishing member 10. Therefore, the workpiece K can be moved in a straight line relative to the polishing member 10. Therefore, the end portion KE of the workpiece K having a quadrangular shape having a linear side can be polished.

(2) By rotating the workpiece K by the second motor 30, the surface (edge) on which the workpiece K is polished can be changed. Therefore, the outer periphery of the workpiece K having a quadrangular outer shape can be ground.

(3) When the workpiece K is polished, the workpiece K is pressed against the polishing member 10. Therefore, the polishing process of the workpiece K can be promoted. It is possible to promote the contact state of the workpiece K and the polishing surface 11, that is, the uniformity of the contact.

(4) The polishing apparatus includes the polishing member 10 having the polishing surface 11 in the shape of the end portion KE of the workpiece K to be polished. Therefore, even if the end portion KE of the workpiece K is a curved surface shape different from the planar shape, the end portion KE can be polished.

(5) The above grinding method is performed by grinding using a grinding device Grinding of work K. Therefore, the shape of the portion to be polished (the shape of the end portion KE) is a curved surface shape different from the planar shape, and even if it is a square-shaped workpiece K, the outer periphery can be polished.

Further, the above embodiment can be implemented by the following modifications.

‧When the workpiece K is rotated, the entire outer periphery of the workpiece K is polished, but a part of the periphery of the workpiece K may be replaced, for example, only one side of the workpiece K, or Grinding with only two sides, or only three sides.

‧ In the above step 3, the workpiece K is moved and rotated from the center of rotation of the polishing member 10 in the direction of the arrow X, but the workpiece KE may be polished instead of the end portion KE after polishing. After the object K moves in the arrow Y direction until it leaves the polishing surface 11, the same workpiece K is rotated. Further, the next workpiece to be polished of the workpiece K may be moved closer to the polishing surface 11 to move the workpiece K in the arrow Y direction. In this way, each side of the workpiece K can be polished separately even if the edge of the grinding is replaced. Further, in the case of this modification, the function of the motor moving mechanism 33 for moving the workpiece K in the arrow X direction can be omitted.

‧ Among the four sides of the workpiece K to be polished, if only one side is polished, the motor moving mechanism 33 only needs to have a function of moving the workpiece K in the arrow Y direction, and the rotation mechanism may be omitted. 2 motor 30, etc.). Even in this case, since the workpiece K can be moved linearly relative to the polishing member 10 by the motor moving mechanism 33, the end portion KE of the square-shaped workpiece K having the linear side can be polished. One side.

In the above embodiment, the workpiece K can be moved in the arrow X direction and the arrow Y direction. However, a mechanism for moving the rotation center of the polishing member 10 may be additionally provided. Further, the polishing member 10 may be moved in the arrow Y direction together with the movement of the workpiece K in the arrow X direction. Or the workpiece K is moved in the arrow Y direction, and the grinding member 10 is moved in the direction of the arrow X.

Alternatively, the workpiece K and the polishing member 10 may be moved together in the arrow X direction, or the workpiece K and the polishing member 10 may be moved together in the arrow Y direction.

In the above embodiment, the workpiece K to be polished may be moved, but the configuration of the movable polishing member 10 may be replaced. Fig. 3 is a schematic view showing a modification of the same.

As shown in Fig. 3, the square-shaped workpiece K is clamped to the polishing apparatus in an appropriate manner. A moving mechanism 50 that moves the same polishing member is provided at the center of rotation of the rotationally driven polishing member 10. The moving mechanism 50 has a function as a first moving mechanism that moves the polishing member 10 toward a tangential direction of the radially outer peripheral surface of the polishing member 10 (the arrow Y direction shown in FIG. 3), and causes the polishing member 10 to be moved. The function as the second moving mechanism that moves in a direction orthogonal to the rotation axis of the polishing member 10 (the arrow X direction shown in FIG. 3). The above moving mechanism 50 can employ an appropriate mechanism. For example, a link mechanism or a mechanism similar to the motor moving mechanism 33 described above can be employed.

In the polishing mechanism of this modification, since the moving mechanism 50 can be used, Since the position of the polishing member 10 with respect to the workpiece K to be polished is arbitrarily changed, the shape of the workpiece K can be maintained and the state of contact between the workpiece K and the polishing member 10 can be maintained. That is, as shown in Fig. 3 by a two-dot chain line, the polishing member 10 can be moved along the periphery (end portion KE) of the workpiece K to be polished. Therefore, even in the above modification, the entire outer periphery of the workpiece K having a quadrangular outer shape can be polished. Further, in the case of the above modification, the outer periphery of the workpiece K can be polished even if the size of the polishing member 10 is small as compared with the above embodiment. Incidentally, instead of the deformation of FIG. 3, a moving mechanism for moving the polishing member 10 in the direction of the arrow Y shown in FIG. 3 and a moving mechanism for moving the polishing member 10 in the direction of the arrow X shown in FIG. 3 may be separately provided. The moving mechanism 50 of the example. Further, in the modification of Fig. 3, a part of the periphery of the workpiece K may be polished, for example, only one side of the workpiece K, or only two sides, or only three sides.

‧ Although the polishing member 10 is provided on the upper surface of the machine tool table 20, the machine tool table 20 may be omitted, and the rotation shaft of the first motor 21 may be directly fixed to the center of the polishing member 10.

‧ Although the end portion KE is pressed against the polishing surface 11 by the driving of the pressing mechanism 40, the second motor 30 may be moved in the direction of the arrow X by the motor moving mechanism 33 as long as the end portion KE can be thereby The pressing mechanism 40 can be omitted by pressing against the polishing surface 11.

‧In the motor moving mechanism 33, the second motor 30 is oriented in a direction orthogonal to the rotation axis of the polishing member 10 (the direction of the arrow X shown in FIG. 2) and a tangential direction of the radially outer surface of the polishing member 10 (previously 1st Although the arrow Y direction shown in the figure is reciprocating, it is also possible to provide a mechanism for moving in a direction orthogonal to the rotation axis of the polishing member 10 of the second motor 30 (the arrow X direction shown in FIG. 2), and The second motor 30 moves toward the tangential direction of the radially outer peripheral surface of the polishing member 10 (the arrow Y direction shown in the first drawing).

‧ Although the second motor 30 is moved to move the workpiece K, the workpiece K may be moved in other manners.

‧ Although the polishing of the end portion KE of the workpiece K is performed, the portion to be polished is not limited to such an end portion, and may be another portion.

‧ The shape of the end portion KE of the workpiece K to be polished may be a non-planar shape other than the curved surface. For example, the triangle shown in Fig. 5 or the hexagonal shape shown in Fig. 6 is substantially triangular and the top is circular. Further, the shape of the end portion KE of the workpiece K to be polished may be a stepped shape as shown in Fig. 7, or a substantially stepped corner portion may have a circular shape as shown in Fig. 8. Alternatively, as shown in Fig. 9, the end portion KE may have a curved shape that is recessed toward the inner side of the workpiece K to be polished. It is also possible to have a curved surface composed of a plurality of curvatures or a curved surface having a straight portion. In the above-described modification, the polishing surface 11 of the polishing member 10 can be polished along the shape of the end portion KE of the workpiece K (the shape of the portion to be polished).

‧ The shape of the workpiece K to be polished may be any shape other than a square. For example, a shape formed by a complex plane or a curved surface may be a triangle or an ellipse. Incidentally, in the above-described embodiment and its modifications, the workpiece K having various outer shapes can be polished, and for example, the peripheral surface of the cylindrical workpiece K having a circular outer shape can be polished.

Further, in the modification shown in the third embodiment, since the position of the polishing member 10 with respect to the workpiece K can be arbitrarily changed, as shown in Fig. 4, even if the workpiece K is made of a plurality of curvatures. The shape of the shape can still be polished on the periphery.

Further, in the above-described embodiment, the end portion KE of the workpiece K to be polished is in contact with the polishing surface 11, or the end portion KE after the polishing is separated from the polishing surface 11, the workpiece K can be polished in the direction of the arrow X. The movement. Here, according to the motor moving mechanism 33, since the workpiece K can be moved in the arrow X direction and the arrow Y direction, the position of the workpiece K with respect to the polishing member 10 can be arbitrarily changed. Therefore, it is possible to follow the outer shape of the workpiece K and maintain the contact state of the workpiece K with the polishing member 10. Further, the polishing apparatus of the above embodiment includes a rotation mechanism that rotates the workpiece K to be polished. Therefore, in the above-described embodiment, the combination of the movement of the workpiece K in the arrow X direction and the arrow Y direction and the rotation of the workpiece K may be the workpiece K as shown in Fig. 4 previously. That is, even if the outer shape of the workpiece K to be polished is formed into a shape of the outer shape of the workpiece K by a plurality of curvatures, the outer periphery can be polished.

‧ As a feature (A), when at least one of the workpiece K or the polishing member 10 is moved in the tangential direction (arrow Y direction) of the radially outer surface of the polishing member 10, the workpiece K can be polished. Grinding of the sides. Further, as the feature (B), at least one of the workpiece K or the polishing member 10 is moved in a direction orthogonal to the rotation axis of the polishing member 10 (arrow X direction), and the workpiece K is ground or ground. When at least one of the grinding members 10 moves in the tangential direction (arrow Y direction) of the radially outer peripheral surface of the polishing member 10, the positional relationship between the workpiece K and the polishing member 10 can be arbitrarily changed. Moreover, as the feature (C), when at least one of the workpiece K or the polishing member 10 is rotated, the surface to be polished by the workpiece K can be changed. Further, as the feature (D), when at least one of the workpiece K or the polishing member 10 is pressed in a direction orthogonal to the rotation axis of the polishing member 10, the polishing process of the workpiece to be polished can be promoted, and The uniformity of the contact state (ie, contact) of the workpiece and the polishing surface is promoted. Therefore, the features (A) to (D) can be appropriately combined according to the shape and processing purpose of the workpiece K, or can be used alone. In this case, the corresponding features (A) to (( D) effect.

‧ When the same workpiece K is rotated by the polishing workpiece K or the polishing member 10, the polished surface of the workpiece K may have a polishing trace remaining in the rotation direction. Therefore, in order to suppress the polishing marks as described above, in addition to the various mechanisms described above, a reciprocating mechanism that reciprocates at least one of the polishing member 10 and the workpiece K to reciprocate in a direction intersecting the rotation direction may be further provided. Two examples of the case where such a reciprocating mechanism is provided in the polishing apparatus of the above-described embodiment shown in Fig. 2 and the like are shown in Figs. 10 and 11 .

FIG. 10 shows that the polishing apparatus according to the modification includes the swing mechanism 60, and the workpiece K is swung in a direction orthogonal to the rotation direction of the polishing member 10. The swing mechanism 60 is, for example, a link mechanism or the like, and an appropriate mechanism can be employed.

In this modification, when the rotary polishing member 10 performs polishing of the end portion KE of the workpiece K, the swing mechanism 60 is operated. By the operation of the swing mechanism 60, the workpiece K is swung in a direction orthogonal to the rotation direction of the polishing member 10 (the direction of the arrow RO shown in FIG. 10). Thereby, the end portion KE of the workpiece K to be polished during the rotational polishing is swung along the curved surface of the polishing surface 11 by the oscillating motion of the workpiece K. By the swing of the end portion KE as described above, the polishing marks of the end portion KE are crossed, and the polishing marks become smaller as compared with the polishing with only the rotation. Therefore, the polishing trace due to the rotational polishing can be suppressed.

In addition, the swinging direction of the workpiece K with respect to the rotation direction of the polishing member 10 is not limited to the orthogonal direction, and the grinding trace is crossed so as to oscillate in a direction intersecting at least in the rotation direction of the polishing member 10. , it can suppress the grinding marks generated by the rotary grinding. Further, it is also possible to swing the grinding member 10 instead of swinging the workpiece K. Further, the workpiece K and the polishing member 10 may be swung together.

11 shows that the polishing apparatus according to the modification includes the vibration mechanism 70, and the workpiece K is generated to generate small vibration in a direction orthogonal to the rotation direction of the polishing member 10. The vibration mechanism 70 is, for example, a mechanism that uses ultrasonic vibration, and an appropriate mechanism can be employed.

In this modification, when the rotary polishing member 10 performs polishing of the end portion KE of the workpiece K, the vibration mechanism 70 is operated. By the operation of the vibration mechanism 70, the workpiece K is slightly vibrated in a direction orthogonal to the rotation direction of the polishing member 10 (the arrow UD direction shown in FIG. 11). And, by this, the vibration of the workpiece K is rotated and rotated. The end portion KE of the workpiece K to be polished during the grinding is in a state of being in contact with the curved surface of the polishing surface 11 to cause a small reciprocating motion in the direction of the arrow UD. Thereby, the rounding motion of the end portion KE causes the polishing marks of the end portion KE to be cross-shaped, and the polishing marks become smaller as compared with the polishing only for the rotation. Therefore, this modification can also suppress the polishing marks caused by the rotational polishing.

In addition, the vibration direction of the workpiece K to be rotated with respect to the rotation direction of the polishing member 10 is not limited to the orthogonal direction, and as long as it vibrates in at least the intersecting direction with respect to the rotation direction of the polishing member 10, since the polishing trace is It is cross-shaped, so it is possible to suppress the polishing marks caused by the rotary polishing. Further, the polishing member 10 can be vibrated instead of the workpiece K to be polished. Further, the workpiece K and the polishing member 10 can be vibrated together.

Incidentally, the above-described reciprocating mechanism can be similarly applied to the polishing apparatus according to the modification of the above-described embodiment (for example, the polishing apparatus shown in the third drawing or the like), and in this case, the polishing trace due to the rotational polishing can be similarly suppressed.

‧ In the above-described embodiment, the workpiece K is pushed in the direction orthogonal to the rotation axis of the polishing member 10 (the direction of the arrow X shown in Fig. 2 and the like) with respect to the polishing surface 11 The pressure is thereby performed to polish the end portion KE of the workpiece K to be polished. At this time, the upper surface and the lower surface of the workpiece K to be polished by the end portion KE thus pressed, that is, the both surfaces of the workpiece K that are parallel to the plane orthogonal to the rotation axis of the polishing member 10 are At the time of polishing, a large amount of pressure was not applied and there was a possibility that the polishing process was not sufficiently performed. Therefore, in addition to the various mechanisms described above, a pressure applying mechanism may be further provided, and the workpiece K to be polished may be provided. Vertical pressure.

Fig. 12 is a view showing a schematic configuration of an example of the pressure applying mechanism. As shown in Fig. 12, the pressure applying mechanism is constituted by a roller 80, an actuator 82, and the like. The roller 80 has a disk shape and rotates around the rotation shaft 81. Further, the outer peripheral surface of the roller 80 is located on the upper surface 10U of the polishing member 10 in the vicinity of the periphery thereof, so that the roller 80 also rotates in accordance with the rotation of the upper surface 10U. Further, the roller 80 and the upper surface 10U may be in contact with each other at least during the polishing of the workpiece K. Therefore, the roller 80 and the upper surface 10U can often abut or only abut in the grinding of the workpiece K.

The actuator 82 is a mechanism for pressing the roller 80 against the upper surface 10U, and may be constituted by an appropriate mechanism such as an electric type or a hydraulic type. In the polishing of the workpiece K, the roller 80 is pressed to the upper surface by the operation of the actuator 82 (the arrow 12 shows the direction of the arrow VT).

When the roller 80 is pressed to the upper surface 10U, the pressing force F of the polishing surface 11 of the polishing member 10 is applied to the upper surface KU of the workpiece K to be polished. Further, when the upper KU pressing force F is given as described above, the lower surface KD of the workpiece K is pressed against the polishing surface 11 of the polishing member 10 which is in contact with the lower surface KD, and as a result, the lower KD of the workpiece K to be polished is obtained. It also gives the same pressing force F as the upper KU of the workpiece K to be polished. By the application of the pressing force F of the upper surface KU of the workpiece K to be polished and the lower KD, the upper surface KE can be polished, and the upper surface KU and the lower surface KD can be simultaneously polished. Incidentally, in the modification shown in Fig. 12, the one surface (the upper surface U) of the polishing member 10 is pressed by the pressure applying mechanism, whereby the workpiece K is polished. The face KU and the lower KD give the pushing force F. Therefore, the number of the pressure applying mechanisms can be reduced as compared with the case where the pressure applying mechanism is provided on both surfaces of the polishing member 10.

Further, in the modification shown in Fig. 12, the roller 80 is pressed by the actuator 82. However, if the roller 80 has sufficient mass and only a sufficient pressing force F is given by the weight of the roller 80, The actuator 82 can be omitted. Further, in the same modification, although one surface of the polishing member 10 is pressed, for example, both surfaces of the polishing member 10 may be sandwiched to press both surfaces thereof. When the both surfaces are pressed as described above, the deflection of the polishing member 10 can be suppressed, for example, compared with the case where one side is pressed. When the polishing member 10 is fixed to rotate the workpiece K by the polishing, the roller 80 is not required to be rotatable. In this case, for example, the weight of the roller 80 or the like may be simply changed.

10‧‧‧Abrased components

11‧‧‧Grinding surface

20‧‧‧Machine Workbench

21‧‧‧1st motor

30‧‧‧2nd motor

31‧‧‧ shaft

32‧‧‧ fixed table

33‧‧‧Motor moving mechanism

40‧‧‧ Pushing members

K‧‧‧Abrased workpiece

KE‧‧‧End of the workpiece being ground

P‧‧‧ pressure

Claims (18)

A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and a moving mechanism for polishing the workpiece to be polished At least one of the object or the polishing member moves toward a tangential direction of a radially outer peripheral surface of the polishing member. A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a first moving mechanism that polishes the material to be polished At least one of the workpiece or the polishing member moves in a tangential direction to a radial outer peripheral surface of the polishing member; and the second moving mechanism moves at least one of the workpiece or the polishing member toward the polishing The axis of rotation of the member moves in a direction orthogonal to the axis. A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and a rotating mechanism for polishing the workpiece to be polished At least one of the object or the polishing member rotates. A polishing apparatus comprising: a polishing member; a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a pressing mechanism for polishing the material to be polished At least one of the workpiece or the polishing member is pressed in a direction orthogonal to a rotation axis of the polishing member. A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism for polishing the workpiece Or at least one of the polishing members moves in a tangential direction toward a radially outer peripheral surface of the polishing member; and a rotation mechanism rotates at least one of the workpiece or the polishing member. A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism for polishing the workpiece Or at least one of the polishing members moves in a tangential direction toward a radially outer peripheral surface of the polishing member; and a pressing mechanism that directs at least one of the workpiece or the polishing member toward a rotation axis of the polishing member Push in the direction of the cross. A polishing apparatus comprising: a polishing member having a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished; and a moving mechanism for polishing the workpiece Or at least one of the polishing members moves in a tangential direction toward a radially outer peripheral surface of the polishing member; a rotation mechanism rotates at least one of the workpiece or the polishing member; and a pressing mechanism that polishes the polishing member At least one of the workpiece or the polishing member is pressed in a direction orthogonal to a rotation axis of the polishing member. The polishing apparatus according to any one of claims 1 to 7, further comprising a motor that rotates the polishing member from below. The polishing apparatus according to any one of the first to seventh aspects of the present invention, wherein the polishing apparatus includes a machine tool table that rotates integrally with the polishing member in a state in which the polishing member is placed on the upper surface. A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and the workpiece is polished. At the time of polishing, at least one of the workpiece to be polished or the polishing member is moved in a tangential direction to a radially outer peripheral surface of the polishing member. A grinding method for grinding a workpiece by using an abrasive member The method of the present invention is characterized in that the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece to be polished, and the polishing workpiece or the polishing is performed during polishing of the workpiece to be polished. At least one of the members moves in a tangential direction of the radially outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member moves in a direction orthogonal to a rotation axis of the polishing member. A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and the workpiece to be polished or the above At least one of the polishing members rotates. A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and the workpiece to be polished or the above At least one of the polishing members is pressed in a direction orthogonal to the rotation axis of the polishing member. A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface along a shape of a shape of a portion to be polished of the workpiece to be polished, At least one of the workpiece or the polishing member is moved in a tangential direction to a radial outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is rotated. A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and the workpiece is polished Or at least one of the polishing members is moved in a tangential direction to a radial outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is pressed in a direction orthogonal to a rotation axis of the polishing member. . A polishing method for polishing a workpiece by a polishing member, wherein the polishing member has a polishing surface having a shape along a shape of a portion to be polished of the workpiece, and the workpiece is polished Or moving at least one of the polishing members toward a tangential direction of a radially outer peripheral surface of the polishing member; rotating at least one of the workpiece or the polishing member; and at least one of the workpiece or the polishing member One of them is pressed in a direction orthogonal to the rotation axis of the polishing member. The polishing method according to any one of the items 10 to 16, wherein the polishing member is rotated from below. The polishing method according to any one of claims 10 to 16, wherein the polishing member is integrally rotated together with the machine tool table in a state in which the polishing member is placed on a machine tool table.