JPH04360772A - Plate chamfering grinding-wheel and plate chamfering device - Google Patents

Abstract

PURPOSE:To perform semi-circular chamfering with plate thickness as a diameter easily even with the thickness dispersion of a plate by opening both ends of a groove-shape polishing part from both ends of a center circular arc part divergently toward the outer peripheral edge of the groove-shape polishing part. CONSTITUTION:A groove-shape polishing part 11 of constant thickness formed into semi-circular cross section is provided along the outer peripheral surface of a disk wheel 10. This groove-shape polishing part 11 is formed of a center circular arc part of an inferior arc with a constant radius, and both side inclined linear parts 11b, 11c extended from both ends of the center circular arc part 11a while being opened toward the outer peripheral edge of the groove-shape polishing part 11. The thickness dispersion of the chamfered part of a plate, and a fitting position error between a grinding wheel and the plate are absorbed by chamfering the end face of the plate using such a plate chamfering wheel, so that semi-circular chamfering with plate thickness as a diameter can be performed easily.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering grindstone and a flat plate chamfering device for chamfering the edges of flat plate materials such as natural stone, artificial stone, and ceramic counters.

0002

[Prior art] A flat natural stone formed into a predetermined shape,
The ceramic counter member is cut into predetermined dimensions using a cutting device, ground and polished to a predetermined thickness using a surface grinder, and then the front surface is chamfered.

FIG. 1 shows a grindstone used for chamfering the front surface.
1 and FIG. 12, a disc-shaped wheel 101
There is a grindstone E for flat chamfering, which has groove-shaped polishing portions 102 on the outer periphery of which semicircular diamond abrasive grains of a predetermined thickness are bound at a predetermined pitch in the circumferential direction.

The flat plate chamfering grindstone E is rotated and brought into contact with the end of a flat plate P (see FIGS. 13 and 14), which will be described later, to chamfer the end. After chamfering,
The edges are polished using a belt polisher to give them a glossy finish.

[0005]

[Problems to be Solved by the Invention] However, as shown in FIG.
has a perfect semicircular cross section with radius R.

Therefore, as shown in FIG. 13, when the thickness T of the flat plate P is thicker than the standard thickness, both ends of the flat plate P become larger than the width w of the groove-shaped polishing part 12, and the ends of the flat plate P remain as they are. When 103 is polished, stepped portions 104 and 105 are formed at both ends of the same end 103. Therefore,
When performing mirror finishing after chamfering, it is necessary to polish until the stepped portions 104 and 105 are removed, which takes time and makes it difficult to obtain a front surface that is close to a semicircle.

Furthermore, as shown in FIG. 14, even if the thickness T of the flat plate P is equal to the standard thickness, there is an error between the mounting position of the flat plate chamfering grindstone E and the mounting position of the flat plate P. If there is, if the end 103 of the flat plate P is polished as is,
A stepped portion 106 is formed at one end of the end portion 103 . Therefore, when mirror finishing is performed after chamfering, it is necessary to polish until the stepped portion 106 disappears, which takes time, and it is also difficult to obtain a front surface that is close to a semicircle.

The object of the present invention is to maintain the thickness of the flat plate even if the thickness of the flat plate varies slightly or even if there is an error between the mounting position of the flat plate chamfering grindstone and the mounting position of the flat plate. It is an object of the present invention to provide a grindstone for flat plate chamfering that can easily and efficiently chamfer a semicircular shape with a diameter, and a flat plate chamfering device equipped with the grindstone.

[0009]

[Means for Solving the Problems] The present invention provides a groove-like polishing portion having a semicircular cross section and a constant thickness along the outer peripheral surface of a disc-shaped wheel, and A flat chamfer characterized in that it is formed from a central circular arc portion of a sub-arc having a radius, and both inclined straight portions extending from both ends of the central circular arc portion while expanding toward the outer periphery of the groove-shaped polished portion. This relates to grindstones.

In the above configuration, a line connecting the radial center of the central circular arc portion and the outer peripheral edge of the groove-shaped polished portion, and a line connecting the boundary between the central circular arc portion and the straight portion and the radial center of the central circular arc portion It is preferable that the angle formed is 15° to 18°.

[0011] Further, the groove-shaped polishing portion is provided with a plurality of groove-shaped polishing portions having a constant width and constant thickness and having a plurality of semicircular cross sections at a predetermined circumferential pitch along the outer peripheral surface of the disc-shaped wheel. Each groove-shaped polished part is formed from a central circular arc part with a constant radius and sloped straight parts on both sides that expand and extend from both ends of the central circular arc part toward the outer periphery of the groove-shaped polished part. You may also do so.

The present invention also provides a flat plate chamfering device for the end face of a flat plate using the flat plate chamfering grindstone described above, which includes: a) a device for positioning the chamfered portion of the flat plate at a reference position; It is characterized by comprising: a plurality of flat plate chamfering grindstones disposed at positions on the relative surface side of the chamfering portion; and c) a device for relatively moving the flat plate and the plurality of flat plate chamfering grindstones in one direction. This relates to a flat plate chamfering device.

[0013] In the above device configuration, the plurality of flat plate chamfering grindstones may each have a different radius.

[0014]

[Function] In the present invention, both ends of the groove-shaped polishing part of the chamfering whetstone widen from both ends of the central circular arc part toward the outer periphery of the groove-shaped polishing part, so that the chamfer of the flat plate Polishing and chamfering can be performed by absorbing variations in the thickness of the flat plate and mounting position errors between the flat plate chamfering whetstone and the flat plate.

Furthermore, since the grindstone for chamfering a flat plate has a plurality of grindstones having different radial dimensions, the grindstone to be used can be selected depending on the thickness of the flat plate.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A flat plate chamfering grindstone according to the present invention and a flat plate chamfering device using the flat plate chamfering grindstone according to the present invention will be explained in detail below with reference to examples shown in the accompanying drawings.

(Whetstone A for chamfering a flat plate) First, the grindstone A for chamfering a flat plate will be explained with reference to FIGS. 1 to 4.

The grindstone of the present invention will be explained with reference to FIG.

As shown in FIG. 1, the flat plate chamfering grindstone A is
Substantially, it is formed by attaching a groove-like polishing section 11 having a constant thickness and a semicircular cross section along the outer circumferential surface of the disc-shaped rotating wheel 10.

In the above configuration, the rotating wheel 10 is preferably made of a material having sufficient mechanical strength, such as steel, and is provided with a mounting opening 12 in its center for mounting on a rotating shaft (not shown).

The groove-shaped polishing portion 11 is formed by bonding diamond grains to a synthetic resin, and has a semicircular cross section.

However, the groove-shaped polishing portion 11 according to the present invention is
Unlike the conventional groove-shaped polishing part 102, it is not completely semicircular, but as shown in FIG. It is formed from both side inclined straight parts 11b and 11c extending while expanding toward the outer peripheral edge 11d of the polishing part 11.

[0023] Furthermore, in the above configuration, the central arcuate portion 11
A line L1 that connects the radial center X of a and the outer peripheral edge of the groove-shaped polished portion 11, and a line L2 that connects the boundary Y between the central arc portion 11a and the straight portion 11b and the radial center of the central arc portion 11a.
The angle .alpha. formed with the .alpha.

Therefore, as shown in FIG.
1 groove width W of the conventional groove-shaped polishing part 102 (=2
R) can be made considerably larger.

As a result, even if the thickness T of the flat plate P is slightly thicker than the standard thickness due to manufacturing errors, as shown in FIG. As long as it is small, the error can be absorbed by the groove-like polishing portion 11, and therefore, the end portion 13 of the flat plate P can be easily and quickly polished into a circular shape without forming a step.

Furthermore, even if there is an error between the mounting position of the grindstone A for flat plate chamfering and the mounting position of the flat plate P,
As shown in FIG.
Can be easily and quickly polished into a circular shape without forming a step.

Although not shown, the groove-shaped polishing portion 1
1 along the entire circumference of the rotating wheel 10, groove-shaped polishing portions having a predetermined width may be formed along the outer circumferential surface at a predetermined circumferential pitch. In this case, it is suitable for a grindstone that requires a large amount of polishing, and the polishing debris of the flat plate is discharged from the predetermined spaced portions, allowing effective polishing.

(Structure of Flat Plate Chamfering Apparatus B) Next, the structure of the flat plate chamfering apparatus B will be explained with reference to FIGS. 5 to 10.

As shown in FIGS. 5 and 6, the flat plate chamfering device B includes a pedestal 20, a flat plate conveying cart 40, and a flat plate mounting section 50.
, a chamfered portion 60 and a flat plate removal portion 80.

(Frame 20) As shown in FIGS. 5 and 6, the mount 20 has a pair of vertically long frames 2 extending in parallel with a constant width.
1, 21, a plurality of horizontal frames 22, 23, etc.

A flat plate carrier 40 is placed on the vertically long frames 21, 21 so as to be movable in the longitudinal direction.

Furthermore, sprocket wheels 25, 25, 26, 26 are arranged at both ends of the vertically long frames 21, 21.
.

Further, on one end side of the pedestal 20, a transport vehicle traveling motor 29 consisting of a geared motor or the like is disposed, and the output shaft of the motor 29 has a sprocket wheel 2.
A sprocket wheel 30 is attached which communicates with the sprocket wheel 6 via an endless chain 28.

With this configuration, the flat plate carrier 40 can be moved in the longitudinal direction on the pedestal 20 by driving the carrier traveling motor 29.

As shown in FIGS. 5 and 6, the frame 20 is
Furthermore, a conveyance guide bar 31 extending in the longitudinal direction and a stopper 32 for the flat plate conveyance cart 40 are provided at the center thereof.

(Flat Plate Transport Car 40) Next, the configuration of the flat plate transport car 40 will be explained. As shown in FIGS. On the other hand, the mounting plate 41 of the truck 40 has a flat plate support plate 42 attached to its upper surface to support the flat plate P in a slippery state.

On the upper surface of one side of the flat plate support plate 42, a flat plate P is attached to positioning stops 51, 51, which will be described later.
A width adjustment guide 43 for positioning the width adjustment guide 43 at a polishing position on the flat plate carrier 40 in cooperation with the width adjustment guide 43 and push screws 44, 44' for moving the width adjustment guide 43 are provided.

Further, near the center of the lower surface of the flat plate support plate 42, in order to move the flat plate conveying cart 40 smoothly in the longitudinal direction, there is a slide that slidably holds both sides of the above-mentioned conveying guide bar 31. Movable members 46, 46' are fixed at both ends in the longitudinal direction.

(Flat plate attachment part 50) The flat plate attachment part 50 is formed on the right side of the pedestal 20 in FIGS. 5 and 6. A pair of positioning stoppers 51 and 51' are arranged on the frame 20 at positions spaced apart from each other in the longitudinal direction. As shown in FIG. 7, these positioning stoppers 51 and 51' have reference gauge receivers 51a and 51a'.
is provided.

As shown in FIG. 7, the position adjustment of the flat plate P in the width direction is performed by using the reference gauge receivers 51a, 51a' of the positioning stoppers 51, 51' and the width adjusting guide 43 on the flat plate conveying carriage 40 described above. This is done accurately by adjusting the amount of movement in the width direction, that is, in the direction across the pedestal 10.

Further, a proximity switch 53 for detecting the backward limit is attached to the flat plate mounting portion 50 to accurately stop the flat plate conveying vehicle 40 at the backward stop position.

(Chamfer 60) As shown in FIGS. 5, 6 and 8, the chamfer 60 consists of a plurality of polishing devices 61, 62, 63, 64 installed on one side of the center of the pedestal 10. formed from.

These polishing devices 61, 62, 63, 64
are the rough finishing whetstone 61a and the first finishing whetstone 6, respectively.
2a, second finishing whetstone 63a, third finishing whetstone 64a
and grindstone drive motors 61b, 62b, 63b, 64b that rotate these grindstones 61a, 62a, 63a, 64a.
It consists of.

[0044] Among the above-mentioned whetstone group, the rough finishing whetstone 61a
is for rough finishing one side edge of the flat plate P, and also the first finishing whetstone 62a, the second finishing whetstone 63a,
The third finishing whetstones 64a have different radii R in order to vary the thickness of the flat plate P and the semicircular shape of one side edge of the flat plate P from the viewpoint of design. For example, the first finishing whetstone 62a
The radius of the second finishing whetstone 63a is 10 mm, and the radius of the third finishing whetstone 64a is 9 mm.
．． It can be 5 mm.

Further, as shown in FIGS. 8, 9 and 10, the chamfered portion 60 is formed by the polishing devices 61, 62, 63 described above
, 64, respectively, are provided with moving mechanisms 61c, 62c, 63c, and 64c for independently moving them in the width direction of the pedestal 20, that is, in the direction across the pedestal 10.

As shown in FIGS. 6 and 8, a polishing device support frame 65 is installed at a position away from one side edge of the pedestal 20.
A plurality of movable stands 66 are placed on the upper plate 65a of the support frame 65 so as to be movable toward and away from the gantry 20. At one end of this movable table 66, there are polishing devices 61, 62, 63 having the above-described structure.
, 64 are connected and supported, respectively.

Further, as shown in FIGS. 9 and 10, a screw rod 68 with a handle 67 is rotatably attached to the upper plate 65a, and one end of the screw rod 68 is connected to a screw block 69 of the moving table 66. They are screwed together. The upper plate 65a also includes a pair of guide rods 70 for guiding the movement of the moving table 66 described above, and a clamp handle 71 for applying a clamping force to the guide rods 70 to fix the moving table 66. are doing.

Further, the chamfering portion 60 is provided with a vinyl curtain 72 for preventing splashing water to prevent water sprayed onto the polished surface of the flat plate P from scattering to the outside during chamfer polishing. That is, the curtain 72 is suspended toward the upper surface of the pedestal 20 from the tip of an L-shaped arm 73 whose base end is fixed to the side surface of the vertical frame 21 of the pedestal 20 .

(Flat plate removal section 80) Flat plate removal section 8
0 is formed on the left side of the pedestal 20, as shown in FIG. The flat plate mounting portion 50 is provided with a flat plate conveying cart 40.
A proximity switch 81 for detecting the forward limit is installed to accurately stop the motor at the forward stop position.

(Operation of Flat Plate Chamfering Apparatus B) Next, a chamfering operation by the flat plate chamfering apparatus B having the above configuration will be explained.

(1) First, when the flat plate conveying truck 40 is moved backward, the proximity switch 53 for detecting the backward limit is activated, and the truck 40 is accurately stopped at the flat plate mounting position.

(2) Place the flat plate P on the flat plate support plate 42 of the flat plate conveying cart 40.

(3) Positioning stoppers 51, 51'
The reference gauge 52 is placed on the reference gauge receivers 51a and 51a'.

(4) Move the flat plate P so that it is in contact with 51, 51', turn the set screws 44, 44' to move the width adjustment guide 43, and move the flat plate P to the flat plate support plate 42.
Position it by sliding it on the top and pressing it against the reference gauge 52.

(5) After the above positioning is completed, remove the reference gauge 52.

(6) Clamp the upper surface of the flat plate P and the lower surface of the flat plate support plate 42 with a manual clamp (not shown) at a position that will not interfere with the grindstone during chamfering.

(7) The flat plate carrier 40 is moved forward to move the flat plate P to the chamfered portion 60.

(8) While the flat plate carrier 40 is moving, first, the side surface of the flat plate P is ground into a semicircular shape using the rough finishing grindstone 61a.

(9) If the thickness of the flat plate P is thicker than the standard, perform final polishing and chamfering using the first finishing whetstone 62a. At this time, the second and third finishing whetstones 63a and 64a
are moved backward so that the grindstones 63a and 64a do not hit the flat plate P.

When the thickness of the flat plate P is the standard thickness, the first,
Two finishing whetstones 62a and 63a are used.

If the thickness of the flat plate P is thinner than the standard, polishing and chamfering is performed using the first, second, and third finishing grindstones 62a, 63a, and 64a.

Note that all the grindstones 61a, 62a, 63a
, 64a are continuously rotating.

(10) After passing through the chamfered portion (60), the flat plate transport vehicle 40 moves forward to the flat plate removing portion 80, and the forward limit detection proximity switch 81 is activated to stop the forward movement.

(11) Operate the manual clamp described above to release the clamp between the flat plate P and the flat plate support plate 42.

(12) The flat plate P after chamfering is removed from the flat plate transport vehicle 40 and moved to the next step.

(13) Turn the push screws 44, 44' to move the width adjustment guide 43 back to its original position.

(14) Thereafter, return to step (1) above to prepare for the next chamfering operation.

[0068] In this embodiment, by using the above-mentioned grindstone group, for example, the thickness of the flat plate P can be reduced to 20±
Chamfering is possible even if the deviation is within a range of 2mm.

Furthermore, each polishing device 61, 62, 63, 64
The back and forth movement of the plate P is carried out by manual operation of the handle, but before chamfering, another known means is used to automatically measure the thickness of the flat plate P and use a grindstone according to the thickness. may be selected.

[0070]

[Effects] With the configuration described above, the present invention has the following effects.

(1) A groove-shaped polishing portion with a constant thickness and a semicircular cross section is provided along the outer peripheral surface of the disc-shaped wheel,
The groove-shaped polished part is formed from a central circular arc part with a constant radius and sloped straight parts on both sides that expand and extend from both ends of the central circular arc part toward the outer periphery of the groove-shaped polished part. Therefore, even if the thickness of the flat plate varies, semicircular chamfering with the thickness of the flat plate as the diameter can be easily performed, and the final polishing work after chamfering can be completed in a short time.

(2) Since the groove-shaped polishing portion is formed along the outer peripheral surface of the disc-shaped wheel, having a predetermined width and having a predetermined circumferential pitch, when polishing many flat plates, Can be polished efficiently.

(3) Formation of a line connecting the radial center of the central circular arc portion and the outer peripheral edge of the groove-like polished portion, and a line connecting the boundary between the central circular arc portion and the straight portion and the radial center of the central circular arc portion. The corner is 1
Since the angle is 5° to 18°, polishing can be performed into a semicircular shape having the thickness of the flat plate as a diameter without forming a stepped portion.

(4) A device for positioning a chamfered portion of a flat plate at a reference position, a plurality of grindstones for chamfering a flat plate disposed at positions relative to the chamfered portion of a flat plate, and a flat plate and the plurality of flat plate surfaces. In a flat plate chamfering device equipped with a device that moves the flat plate relatively to the grindstone in one direction, by using the grindstone having the above configuration as the flat plate chamfering whetstone, the flat plate can be moved relatively to the grindstone. Just by moving it, semicircular chamfering can be efficiently performed.

(5) Since the plurality of grindstones for flat plate chamfering each have a different radius of the grooved polishing part, efficient polishing can be achieved by selecting the grindstone to be used according to the thickness of the flat plate. .

[Brief explanation of drawings]

FIG. 1 is a sectional view of a grindstone for chamfering a flat plate according to the present invention.

FIG. 2 is an enlarged explanatory view of the main parts of the same grindstone.

FIG. 3 is an explanatory diagram of the polishing state of the same grindstone.

FIG. 4 is an explanatory diagram of the polishing state of the same grindstone.

FIG. 5 is a front view of the flat plate chamfering device.

FIG. 6 is a plan view of the flat plate chamfering device.

FIG. 7 is a sectional view taken along line II in FIG. 6;

FIG. 8 is a sectional view taken along line II-II in FIG. 6;

FIG. 9 is a sectional view taken along line III-III in FIG. 8;

FIG. 10 is a cross-sectional view taken along line IV-IV in FIG. 8;

FIG. 11 is a sectional view of a conventional grindstone for chamfering a flat plate.

FIG. 12 is an enlarged explanatory view of the main parts of the same grindstone.

FIG. 13 is an explanatory diagram of the polishing state of the same grindstone.

FIG. 14 is an explanatory diagram of the polishing state of the same grindstone.

[Explanation of symbols]

A. Grindstone for flat plate chamfering B Flat plate chamfering device 10 Rotating wheel 11 Groove polishing part 11a Central arc part 11b Straight section 11c Straight section 20 Mount 40 Flat plate carrier 50 Flat plate mounting part 60 Chamfered part 80　Flat plate removal part

Claims (5)

[Claims] [Claim 1] Along the outer peripheral surface of a disc-shaped wheel,
A groove-shaped polishing part with a constant thickness and a semicircular cross section is provided, and the groove-shaped polishing part is connected to the central circular arc part of the inferior arc having a constant radius, and from both ends of the central circular arc part to the outside of the groove-shaped polishing part. A whetstone for chamfering a flat plate, characterized in that it is formed from inclined straight parts on both sides that expand and extend toward the periphery. [Claim 2] Along the outer peripheral surface of the disc-shaped wheel,
At a predetermined circumferential pitch, a plurality of groove-shaped polished parts each having a constant width and a constant thickness and having a semicircular cross section are provided, and each groove-shaped polished part is connected to the central arc part of the inferior arc having a constant radius, and the same center. A grindstone for chamfering a flat plate, characterized in that it is formed from both sides of an arcuate part and sloped straight parts extending from both ends of the groove-like polishing part while expanding toward the outer periphery of the groove-like polishing part. [Claim 3] An angle formed by a line connecting the radial center of the central circular arc portion and the outer peripheral edge of the groove-like polished portion, and a line connecting the boundary between the central circular arc portion and the straight portion and the radial center of the central circular arc portion. But 15
The flat plate chamfering grindstone according to claim 1 or 2, characterized in that the angle is between 18[deg.] and 18[deg.]. 4. A flat plate chamfering device for flat plate end faces using the flat plate chamfering grindstone according to claim 1, 2 or 3,
a) a device for positioning the chamfered portion of a flat plate at a reference position; b)
) a plurality of flat plate chamfering grindstones disposed at positions on opposite sides of the chamfered portions of the flat plate; and c) a device for relatively moving the flat plate and the plurality of flat plate chamfering grindstones in one direction. A flat plate chamfering device characterized by: 5. The flat plate chamfering device according to claim 4, wherein the plurality of flat plate chamfering grindstones each have a different radius.