TW201501861A - 化學機械抛光裝置 - Google Patents

化學機械抛光裝置 Download PDF

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Publication number
TW201501861A
TW201501861A TW103102591A TW103102591A TW201501861A TW 201501861 A TW201501861 A TW 201501861A TW 103102591 A TW103102591 A TW 103102591A TW 103102591 A TW103102591 A TW 103102591A TW 201501861 A TW201501861 A TW 201501861A
Authority
TW
Taiwan
Prior art keywords
pressure
air
polished
pressure chamber
cylinder
Prior art date
Application number
TW103102591A
Other languages
English (en)
Chinese (zh)
Inventor
Tokinori Terada
Original Assignee
Leap Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leap Co Ltd filed Critical Leap Co Ltd
Publication of TW201501861A publication Critical patent/TW201501861A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103102591A 2013-02-19 2014-01-24 化學機械抛光裝置 TW201501861A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/000917 WO2014128754A1 (ja) 2013-02-19 2013-02-19 Ｃｍｐ装置及びｃｍｐ方法

Publications (1)

Publication Number Publication Date
TW201501861A true TW201501861A (zh) 2015-01-16

Family

ID=50396574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102591A TW201501861A (zh) 2013-02-19 2014-01-24 化學機械抛光裝置

Country Status (6)

Country Link
US (1) US20160001418A1 (ja)
JP (1) JP5432421B1 (ja)
KR (1) KR20150121029A (ja)
CN (1) CN105009257A (ja)
TW (1) TW201501861A (ja)
WO (1) WO2014128754A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10124855B2 (en) 2016-11-14 2018-11-13 Lee Chi Enterprises Company Ltd. Disc brake caliper of bicycle

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108028312B (zh) * 2015-09-15 2021-03-26 日本碍子株式会社 复合基板的制造方法
US11077536B2 (en) * 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
CN112440203B (zh) * 2019-09-03 2022-04-05 芯恩（青岛）集成电路有限公司 一种晶圆研磨系统和晶圆研磨方法
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
CN113547445B (zh) * 2020-04-03 2023-03-24 重庆超硅半导体有限公司 一种抛光头中心压力精确监测方法
WO2023101842A1 (en) * 2021-11-30 2023-06-08 Corning Incorporated Localized polishing fixture and processes of using the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757464B2 (ja) * 1988-01-29 1995-06-21 住友金属鉱山株式会社 基板上の薄膜の研磨方法
JPH0727061Y2 (ja) * 1992-09-29 1995-06-21 嘉市郎 芦北 エアーリフター
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08162432A (ja) * 1994-11-30 1996-06-21 Ricoh Co Ltd 半導体基板の研磨方法及び研磨装置並びに研磨されたウエハ
JP3850924B2 (ja) * 1996-02-15 2006-11-29 財団法人国際科学振興財団 化学機械研磨装置及び化学機械研磨方法
JPH10329012A (ja) * 1997-03-21 1998-12-15 Canon Inc 研磨装置および研磨方法
JP3076291B2 (ja) * 1997-12-02 2000-08-14 日本電気株式会社 研磨装置
JP2968784B1 (ja) * 1998-06-19 1999-11-02 日本電気株式会社 研磨方法およびそれに用いる装置
JP2000024914A (ja) * 1998-07-03 2000-01-25 Hitachi Ltd 半導体ウエハの研磨装置
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US20020037649A1 (en) * 1999-12-15 2002-03-28 Matsushita Electric Industrial Co., Ltd. Method for carrying out planarization processing
JP2002141313A (ja) * 2000-08-22 2002-05-17 Nikon Corp Ｃｍｐ装置及び半導体デバイスの製造方法
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
JP2004319730A (ja) * 2003-04-16 2004-11-11 Nikon Corp 加工装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
JP2008044063A (ja) * 2006-08-14 2008-02-28 Nikon Corp 研磨装置
KR101004435B1 (ko) * 2008-11-28 2010-12-28 세메스 주식회사 기판 연마 장치 및 이를 이용한 기판 연마 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10124855B2 (en) 2016-11-14 2018-11-13 Lee Chi Enterprises Company Ltd. Disc brake caliper of bicycle

Also Published As

Publication number Publication date
KR20150121029A (ko) 2015-10-28
WO2014128754A1 (ja) 2014-08-28
JPWO2014128754A1 (ja) 2017-02-02
CN105009257A (zh) 2015-10-28
US20160001418A1 (en) 2016-01-07
JP5432421B1 (ja) 2014-03-05

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