TW201447487A - 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置以及觸控面板顯示裝置 - Google Patents

感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置以及觸控面板顯示裝置 Download PDF

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Publication number
TW201447487A
TW201447487A TW103120271A TW103120271A TW201447487A TW 201447487 A TW201447487 A TW 201447487A TW 103120271 A TW103120271 A TW 103120271A TW 103120271 A TW103120271 A TW 103120271A TW 201447487 A TW201447487 A TW 201447487A
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TW
Taiwan
Prior art keywords
group
resin composition
acid
photosensitive resin
component
Prior art date
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TW103120271A
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English (en)
Chinese (zh)
Inventor
Shigekazu Suzuki
Shie Yamashita
Daisuke Kashiwagi
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Fujifilm Corp
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Publication of TW201447487A publication Critical patent/TW201447487A/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Liquid Crystal (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
TW103120271A 2013-06-14 2014-06-12 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置以及觸控面板顯示裝置 TW201447487A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013125125 2013-06-14

Publications (1)

Publication Number Publication Date
TW201447487A true TW201447487A (zh) 2014-12-16

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TW103120271A TW201447487A (zh) 2013-06-14 2014-06-12 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、液晶顯示裝置、有機el顯示裝置以及觸控面板顯示裝置

Country Status (4)

Country Link
JP (1) JPWO2014199967A1 (fr)
CN (1) CN105190437A (fr)
TW (1) TW201447487A (fr)
WO (1) WO2014199967A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI644166B (zh) * 2018-02-07 2018-12-11 大陸商業成科技(成都)有限公司 影像擷取裝置及其製造方法
TWI671593B (zh) * 2016-12-07 2019-09-11 奇美實業股份有限公司 感光性樹脂組成物及其應用
TWI679239B (zh) * 2015-04-24 2019-12-11 日商Jsr股份有限公司 感放射線性樹脂組成物、紅外線遮蔽膜及其形成方法、固體攝像元件以及照度傳感器

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JP6778989B2 (ja) * 2015-03-31 2020-11-04 東京応化工業株式会社 化学増幅型ポジ型感光性樹脂組成物
JP7012424B2 (ja) * 2016-03-25 2022-02-14 東京応化工業株式会社 エネルギー感受性組成物、硬化物及び硬化物の製造方法
KR20190010561A (ko) * 2016-05-26 2019-01-30 제이에스알 가부시끼가이샤 감방사선성 조성물 및 패턴 형성 방법
WO2018037565A1 (fr) * 2016-08-26 2018-03-01 Jnc株式会社 Composition de résine époxyde et film de résine durci présentant un faible retrait pendant le durcissement et une excellente adhérence
CN107902642A (zh) * 2017-10-12 2018-04-13 兰州大学 一种用于细胞核成像和线粒体成像的石墨烯量子点的制备及应用研究
US11086220B2 (en) * 2017-10-31 2021-08-10 Rohm And Haas Electronic Materials Korea Ltd. Underlayer coating compositions for use with photoresists
EP3570076B1 (fr) * 2018-05-14 2022-05-11 Canon Kabushiki Kaisha Produit durci, et élément optique, élément optique diffractif, appareil optique et dispositif d'imagerie utilisant le produit durci
WO2020175560A1 (fr) * 2019-02-27 2020-09-03 日産化学株式会社 Composition de résine, film de résine et élément d'affichage à cristaux liquides
TW202132390A (zh) * 2019-12-17 2021-09-01 南韓商Lg化學股份有限公司 用於接著劑的化合物、接著劑樹脂、負型感光樹脂組成物、黑堤及顯示裝置
CN111518504B (zh) * 2020-03-27 2021-12-24 顺德职业技术学院 光通讯器件专用高折射高透明光路胶
JP2022131493A (ja) * 2021-02-26 2022-09-07 東京応化工業株式会社 金属酸化物膜形成性組成物、及びこれを用いた金属酸化物膜の製造方法

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JP4484479B2 (ja) * 2002-09-27 2010-06-16 大阪瓦斯株式会社 フルオレン誘導体及び光活性化合物
JP2005292613A (ja) * 2004-04-02 2005-10-20 Matsushita Electric Ind Co Ltd レジスト材料及びそれを用いたパターン形成方法
KR101618897B1 (ko) * 2010-01-20 2016-05-09 후지필름 가부시키가이샤 경화막의 제조 방법, 감광성 수지 조성물, 경화 막, 유기 el 표시 장치, 및 액정 표시 장치
JP5846622B2 (ja) * 2010-12-16 2016-01-20 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機el表示装置、及び、液晶表示装置
JP5566988B2 (ja) * 2011-04-27 2014-08-06 富士フイルム株式会社 樹脂組成物、硬化物の製造方法、樹脂パターン製造方法、硬化物及び光学部材
JP5744694B2 (ja) * 2011-10-06 2015-07-08 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化物の製造方法、樹脂パターン製造方法、硬化物及び光学部材
JP5616871B2 (ja) * 2011-10-12 2014-10-29 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化物の製造方法、樹脂パターン製造方法、硬化物及び光学部材
JP2014091790A (ja) * 2012-11-05 2014-05-19 Toyo Ink Sc Holdings Co Ltd 樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679239B (zh) * 2015-04-24 2019-12-11 日商Jsr股份有限公司 感放射線性樹脂組成物、紅外線遮蔽膜及其形成方法、固體攝像元件以及照度傳感器
TWI671593B (zh) * 2016-12-07 2019-09-11 奇美實業股份有限公司 感光性樹脂組成物及其應用
TWI644166B (zh) * 2018-02-07 2018-12-11 大陸商業成科技(成都)有限公司 影像擷取裝置及其製造方法

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CN105190437A (zh) 2015-12-23
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