TW201430038A - 用於電子裝置之成型及覆蓋成型組合物 - Google Patents
用於電子裝置之成型及覆蓋成型組合物 Download PDFInfo
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- TW201430038A TW201430038A TW102139848A TW102139848A TW201430038A TW 201430038 A TW201430038 A TW 201430038A TW 102139848 A TW102139848 A TW 102139848A TW 102139848 A TW102139848 A TW 102139848A TW 201430038 A TW201430038 A TW 201430038A
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Abstract
本發明係關於用於精細組件之成型及覆蓋成型組合物。更特定而言,本發明係關於用於低壓成型及覆蓋成型之組合物,使得該等組合物尤其適於電子裝置。該成型及覆蓋成型組合物適於特定而言在0.5巴至200巴下在70℃至240℃下之低壓注射成型方法。
Description
本發明係關於用於電子裝置之成型及覆蓋成型組合物。更特定而言,本發明係關於用於低壓成型及覆蓋成型之組合物,使得該等組合物尤其適於與電子裝置一起使用。
成型係藉由將塑膠或金屬材料液化至模具腔中並將材料冷卻及硬化為腔之組態產生成形物件的製造方法。在覆蓋成型中,可將先前成型部件再插入新模具以允許在前述成型部件周圍形成新成型層,且整合至新物件。覆蓋成型可在不使用任何黏著劑或底漆之情況下將兩個不同組件接合在一起。兩個不同組件之此組合允許產生具有人體工學舒適及安撫顯示(appeasing display)之堅固的結構產物。
典型注射成型需要於250℃或以上溫度下之壓力大於200巴,此乃因成型材料具有高黏度及高軟化溫度。儘管穩健組件適於利用較高壓力之注射成型,但精細組件不能耐受高壓及高溫。典型注射成型方法之替代方法係低壓注射成型。兩種方法實質上相同,只是低壓注射成型需要於70℃至240℃下0.5巴至200巴用於注射。
照明或電子裝置含有易碎組件,且因此,低壓注射成型優於傳統高壓注射成型。電子裝置包含諸如LED(發光二極體)、連接器、感測器、電容器、微開關、印刷電路板、電纜束、發射應答機及諸如此
類等組件。LED係消耗低能(例如,電壓小於5伏或電流小於20毫安)、但所發射光之亮度超過遠更大白熾燈之亮度的半導體二極體。LED(燈型或表面安裝裝置(SMD)型)通常包含由光學透明且熱穩定之材料囊封至裝置中用於適當佈線、安裝及運作的LED晶片。
存在各種LED成型及覆蓋成型材料。WO 2010138221闡述胺基甲酸酯、聚矽氧及丙烯酸系物質之兩部分液體成型系統。儘管性能對於兩部分液體系統係可接受的,但液體形式通常致使使用特別技術(例如灌封或澆注以製備聚矽氧體)以及延長固化時間(例如超過若干小時至數天),從而導致較低生產力。延長固化時間又可導致尤其對於較厚模具缺乏表面均勻性且在所得LED中轉化成低光學品質。
環氧樹脂亦廣泛用作成型及覆蓋成型組合物。然而,環氧樹脂往往呈現差的光穩定性,該差的光穩定性在於其在暴露於紫外(UV)光或升高熱條件(例如超過(>)110℃之溫度,持續>1000小時之時間)後隨時間變黃。變黃又導致自LED之光輸出隨時間減小。此外,固化經常在延長時段(例如3小時)內發生以使固化環氧樹脂之等份試樣內之殘餘應力最小化。「殘餘應力」係指在不施加外部負荷(例如施加力)或使熱梯度移位之情況下體材料中存在之張力或壓縮力。隨著LED材料內之殘餘應力增加,諸如尺寸變化或碎裂等不利效應往往在LED之壽命使用中發生。
聚醯胺由於其低黏度廣泛用於低壓注射成型中。聚醯胺儘管充分適用作成型及覆蓋成型材料,但其顏色通常為琥珀色,此對於光學應用係不合意的。
美國公開案第2011/0133245號教示用於LED囊封劑及覆蓋成型應用之氫化苯乙烯/丁二烯三嵌段聚合物組合物;然而,組合物之黏度對於低壓注射成型方法過高。
WO200954553A2教示,丙烯酸系嵌段共聚物具有罕見透明性、
低色度及穩定性,其可用於光學應用。頒予Kato之美國專利第6,894,114號進一步教示,丙烯酸系嵌段共聚物可用於成型物件;然而,該等材料限於傳統高壓注射成型方法。
更經常地,丙烯酸系嵌段共聚物與增黏劑組合作為壓敏材料。壓敏材料呈現「永久幹黏性(aggressive and permanent tack)」或於活化溫度下之黏性(可熱活化),且於環境溫度下具有小於3×10^6達因/cm2之模數值。頒予Everaerts等人之美國專利第6,734,256號教示使用丙烯酸系嵌段及大量增黏劑(>28.5%)以獲得熱熔融可處理黏著劑,例如壓敏黏著劑(PSA)或可熱活化之黏著劑組合物。此外,頒予Everaerts等人之美國專利第7,084,209號教示使用丙烯酸系嵌段共聚物與大量增黏劑用於壓敏黏著劑膠帶。
業內需要用於低壓注射成型之非黏性成型及覆蓋成型組合物,其具有快速通量及透明性,而不損害欲覆蓋成型之物件之精細電或電子組件。本發明滿足此需要。
本發明係關於適於作為低壓成型或覆蓋成型材料用於製備電子裝置以及所得成型及覆蓋成型裝置之組合物。
本發明之一個態樣係關於包含以下之覆蓋成型組合物:(1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且共聚物包含大於35wt%之[A]單體;及(2)增黏樹脂。覆蓋成型組合物具有於210℃下根據ASTM D3236量測之小於75,000cP之黏度及於25℃下大於1×10^7達因/cm2之模數。
本發明之另一態樣係關於包含電子組件及覆蓋成型組合物之製品。覆蓋成型組合物包含(1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且共聚物包含大於35wt%之[A]單體;(2)增黏樹脂;及(3)約0.05wt%至約5wt%
選自由苯并三唑、三嗪及二苯基酮組成之群之UV吸收劑。覆蓋成型組合物具有根據ASTM D6090量測之大於135℃之軟化點。
本發明之又一態樣係關於在電子組件上形成覆蓋成型件(overmold)之方法,該方法包含(a)製備包含以下之覆蓋成型組合物:[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且共聚物包含大於35wt%之[A]單體;增黏樹脂;及0.05wt%至約5wt%選自由苯并三唑、三嗪及二苯基酮組成之群之UV吸收劑;(b)於小於150巴之壓力下將該覆蓋成型組合物施加至該電子組件上;及(c)冷卻該覆蓋成型組合物。
本文所引用所有文件之全文皆以引用方式併入本文中。
除非另外說明,否則重量百分比(wt%)係基於組合物之總重量。
術語「成型」及「覆蓋成型」可互換使用以表示單一或多材料成型。
本發明係關於適於覆蓋成型精細組件、較佳電子組件、更佳需要高透明度之電子組件的組合物。
覆蓋成型組合物包含(1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且共聚物包含大於35wt%之[A]單體;及(2)增黏樹脂。本發明之覆蓋成型組合物呈現使其可用於電子組件之低壓成型的獨特特徵。諸如高透光率、低色度、UV穩定性及熱循環抗性等特徵使得成型及覆蓋成型組合物相當適於含有易碎組件之照明或電子裝置。
在一個實施例中,嵌段共聚物組份係以佔覆蓋成型組合物50重量%或以上之量存在。
本文所用之丙烯酸系聚合物意欲包括彼等含有至少一個丙烯酸或甲基丙烯酸烷基酯單體之聚合物。可用於本發明實踐中之嵌段共聚物通常將為多嵌段聚合物,其中大於約35重量%之聚合物包含至少2個硬嵌段。有用嵌段共聚物之實例包括彼等具有式-A-B-A-及(-A-B-)n-Xm者。尤佳者係式-[A1]-[B]-[A2]-之嵌段共聚物。在上述代表性調配物中,A、A1及A2各自代表如藉由示差掃描量熱法(DSC)測定之玻璃轉變溫度(Tg)大於約30℃、較佳大於80℃、最佳大於110℃的聚合物嵌段,B代表如藉由DSC測定之Tg小於約20℃、較佳小於0℃、最佳小於-20℃的聚合物嵌段,且X代表多官能偶合劑,例如四氯化矽、二溴乙烷及亞磷酸叁(壬基苯基)酯。
丙烯酸系嵌段之Tg可藉由以20℃/分鐘之加熱速率利用5mg或更少試樣實施之示差掃描量熱法(DSC)測定。Tg計算為DSC熱容加熱曲線上對應於玻璃轉變之熱流變化之起點與終點之間的中點。使用DSC測定Tg已為業內所熟知,且由B.Cassel及M.P.DiVito闡述於「Use of DSC To Obtain Accurate Thermodynamic and Kinetic Data」,American Laboratory,1994年1月,第14-19頁及由B.Wunderlich闡述於Thermal Analysis,Academic Press公司,1990中。
適宜A1及A2聚合物嵌段包括衍生自丙烯酸或甲基丙烯酸烷基酯單體之聚合物或共聚物,例如甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丙基酯、甲基丙烯酸異丁基酯、丙烯酸異莰基酯、甲基丙烯酸異莰基酯、甲基丙烯酸異丁基酯、甲基丙烯酸第三丁基酯、甲基丙烯酸環己基酯及其組合。較佳A1及A2聚合物嵌段係甲基丙烯酸甲酯、甲基丙烯酸乙酯、丙烯酸異莰基酯、甲基丙烯酸異莰基酯、甲基丙烯酸環己基酯及其組合。
適宜B聚合物嵌段包括衍生自丙烯酸或甲基丙烯酸烷基酯單體之聚合物或共聚物,例如丙烯酸甲酯、基丙烯酸乙酯、丙烯酸正丙基
酯、丙烯酸異丁基酯、丙烯酸正丁基酯、丙烯酸正丙基酯、丙烯酸第二丁基酯、丙烯酸第三丁基酯、丙烯酸戊基酯、丙烯酸異戊基酯、丙烯酸正己基酯、丙烯酸2-乙基己基酯、丙烯酸月桂基酯、丙烯酸異辛基酯、甲基丙烯酸癸基酯及其組合。較佳B聚合物嵌段係丙烯酸正丁基酯、丙烯酸2-乙基己基酯、丙烯酸異辛基酯及其組合。
應瞭解,相同丙烯酸系單體可包括於硬嵌段及軟嵌段二者中,且一或多個其他可共聚單體可用於製備聚合物嵌段。可共聚單體包括(但不限於)丙烯酸、甲基丙烯酸、乙烯基酯、乙烯基醚、苯乙烯單體及丙烯醯胺及甲基丙烯醯胺。其他共單體可以佔每一嵌段高達約25%、較佳小於10%之量存在,前提係其在冷卻時不會干擾硬嵌段與軟嵌段之間清晰的相分離。
[A]單體係以佔聚合物大於約35重量%、較佳大於45重量%存在。
在尤佳實施例中,A1及A2係甲基丙烯酸甲酯且B係丙烯酸正丁基酯。適宜嵌段共聚物可以商標KURARITYTM自Kuraray購得。一種例示性嵌段共聚物係具有聚(甲基丙烯酸甲酯)末端嵌段及聚(丙烯酸正丁基酯)中間嵌段之LA4285三嵌段共聚物。可添加具有聚(甲基丙烯酸甲酯)末端嵌段及聚(丙烯酸正丁基酯)中間嵌段之其他嵌段共聚物(例如LA2250、LA2140e及LA2330三嵌段共聚物)以改良組合物之性質及處理條件。
丙烯酸系嵌段共聚物之分子量並無特別限制,但自至本發明光學組件之可成型性角度來看,關於苯乙烯之共聚物之重量平均分子量(如藉由凝膠滲透層析(GPC)量測所測定)較佳在10,000Da至500,000Da、更佳20,000Da至300,000Da之範圍內。
業內已知製備丙烯酸系嵌段共聚物之方法。用於本發明實踐中之嵌段共聚物可藉由如Japanese Kokai 11-302617中所述之陰離子聚
合、藉由如P.Mancinelli,Materiaux et Techniques,March-April 1990,第41-46頁所述之自由基聚合、藉由(例如)美國專利第5,679,762號中所述之多官能鏈轉移劑、藉由如EP 0 349 270 B1中所述之引發-轉移-終止劑聚合及/或藉由如共同待決共同受讓之美國申請案第10/045,881號中所述之自由基逆行沈澱製得。尤佳者係藉由陰離子聚合製得之丙烯酸系嵌段共聚物。
覆蓋成型組合物進一步包含增黏樹脂。增黏樹脂係以基於總組合物至少約10wt%、較佳至少約15%且更佳至少約20wt%存在。
典型增黏劑具有如藉由ASTM方法E28測定之約70℃至約150℃之環球軟化點。
有用之增黏樹脂可包括任何相容樹脂或其混合物,例如天然及經改質松香,包括(例如)脂松香、木松香、妥爾油(tall oil)松香、蒸餾松香、氫化松香、二聚化松香、樹脂酸鹽及聚合松香;天然及經改質松香之甘油及異戊四醇酯,包括(例如)灰色木松香之甘油酯、氫化松香之甘油酯、聚合松香之甘油酯、氫化松香之異戊四醇酯及松香之酚系改質之異戊四醇酯;天然萜之共聚物及三元聚合物,包括(例如)苯乙烯/萜及α甲基苯乙烯/萜;多萜樹脂,其具有如藉由ASTM方法E28-58T測定之約70℃至150℃之軟化點;酚系改質之萜樹脂及其氫化衍生物,包括(例如)由在酸性介質中濃縮二環萜及酚產生之樹脂產物;具有約70℃至135℃之環球軟化點之脂族石油烴樹脂;芳族石油烴樹脂及其氫化衍生物;及脂環族石油烴樹脂及其氫化衍生物。
在一個實施例中,增黏劑係合成烴樹脂。包括脂族或環脂族烴、芳族烴、芳族改質之脂族或環脂族烴及其混合物。非限制性實例包括脂族烯烴衍生之樹脂。
衍生自C9芳族/脂族烯烴之芳族烴樹脂亦有用,其可自Sartomer及Cray Valley以相同商品名Norsolene購得及自TK芳族烴樹脂之
Rutgers系列購得。
甲基苯乙烯(例如來自Eastman Chemical之Kristalex 3085及3100)、來自Arizona Chemical之Sylvares SA 100亦在本發明中用作增黏劑。
一些覆蓋成型組合物可能需要兩種或更多種所述增黏樹脂之混合物。
本發明覆蓋成型組合物中之例示性增黏樹脂包括α-甲基苯乙烯、松香酯、歧化及/或氫化松香酯、苯乙烯化萜、萜酚、脂族改質之芳族樹脂及其混合物。
在另一實施例中,覆蓋成型組合物進一步包含低分子量末端嵌段增黏劑。低分子量欲表示平均分子量範圍小於20,000Da。末端嵌段增黏劑係彼等增強硬的A嵌段相而非軟的B嵌段相者。適宜末端嵌段增黏劑包括基於丙烯酸酯之末端嵌段增黏樹脂。一種尤佳末端嵌段增黏樹脂係分子量小於20,000Da之聚(甲基丙烯酸甲酯)樹脂。
覆蓋成型組合物可進一步包含約0.05wt%至約5wt%之UV吸收劑。UV吸收劑係苯并三唑、三嗪、二苯基酮、氰基丙烯酸酯、草醯苯胺及諸如此類。該等UV吸收劑之實例包括Tinuvin 328、Tinuvin 329、Tinuvin 384-2、Tinuvin 400、Tinuvin 479、Tinuvin 900、Tinuvin 928、Tinuvin 1130及以Tinuvin及Chimassorb商品名來自BASF及以BLS商品名來自Mayzo之其他UV吸收劑。
在一個較佳實施例中,苯并三唑係具有以下結構之羥基苯基苯并三唑:
其中R1、R2、R4=H、具有C1-C20之脂族、環脂族或芳族,且
其中R3並非H。在一個較佳實施例中,R3係具有C1-C20之脂族、環脂族或芳族。
包含上述UV吸收劑之覆蓋成型組合物隨時間具有長期UV穩定性及高透明度。在一些實施例中,即使在UV老化至少3000小時後,根據ASTM G154量測之UV穩定性及色度(b值)亦小於8、較佳小於5。
在另一實施例中,覆蓋成型組合物進一步包含約0.05wt%至約5wt%之受阻胺光穩定劑。例示性受阻胺光穩定劑係可自BASF購得之Tinuvin 152、Tinuvin 292、Tinuvin 622、Tinuvin 770及Tinuvin 783及可自Mayzo購得之BLS 1944及BLS 123。
抗氧化劑或穩定劑亦可以高達約3重量%之量、更通常以約0.5重量%之量包括於本文所述之覆蓋成型組合物中。本文中有用之穩定劑或抗氧化劑係受阻酚或受阻酚與次要抗氧化劑(例如硫基二丙酸二硬脂基酯(「DSTDP」)或硫基二丙酸二月桂基酯(「DLTDP」)之組合。代表性的抗氧化劑包括:1,3,5-三甲基2,4,6-叁(3,5-二-第三丁基-4-羥基苄基)苯;四-3(3,5-二-第三丁基-4-羥基苯基)丙酸季戊四醇基酯;異戊四醇四(3-月桂基硫基二丙酸酯);正十八烷基-3,5-二-第三丁基-4-羥基酚)-丙酸酯;4,4'-亞甲基雙(2,6-第三丁基酚);4,4'-硫基雙(6-第三丁基-鄰-甲酚);2,6-二-第三丁基酚;6-(4-羥基苯氧基)-2,4-雙(正-辛基-4-硫基)-1,3,5-三嗪;3,5-二-第三丁基-4-羥基-苄基-膦酸二-正-十八烷基酯;3,5-二-第三丁基-4-羥基-苯甲酸2-(正-辛基硫基)乙基酯;及山梨醇六[3-(3,5-二-第三丁基-4-羥基苯基)-丙酸酯]。較佳者係IRGAFOS 168(可自BASF購得之次要抗氧化劑)及IRGANOX 1010(可自BASF購得之受阻酚主要抗氧化劑)。其他抗氧化劑包括ETHANOX 330(來自Albermarle之受阻酚);SANTOVAR A(來自Monsanto之2,5二-第三戊基氫醌);及NAUGARD P(來自Chemtura之叁(對-壬基苯基)亞磷酸酯)。
亦可添加通常用於覆蓋成型組合物中以滿足不同性質並滿足具體應用要求之其他添加劑。該等添加劑包括(例如)蠟、增塑劑、填充劑、顏料、流動調節劑、染料、脫模劑或抗靜電劑,端視目的而定,其可以微量或較大量納入黏著劑調配物中。
對於精細電子組件施加大的壓力可損害組件。本發明覆蓋成型組合物於210℃下具有如藉由ASTM D3236量測之低於75,000cP之黏度。在另一實施例中,覆蓋成型組合物於210℃下具有低於50,000cP之黏度。由於210℃下之低黏度,本發明覆蓋成型組合物可用於低壓成型方法中。
用以產生包含本發明之精細電子組件之物件的成型方法之實例包括熔融擠出、熔融注射成型及溶液澆注。
將覆蓋成型材料熔融並注射至具有電子組件之密封模具或中空部件中。在冷卻覆蓋成型組合物後,自具有覆蓋成型組合物之模具移出電子組件。電子組件包括連接器、感測器、電容器、微開關、LED、印刷電路板、電纜束及發射應答機。較高壓力及高溫並不適於電子組件。低壓覆蓋成型係於0.5巴至200巴下在70℃至240℃下實施。本發明覆蓋成型組合物可較佳於小於200巴下於240℃下、更佳於小於150巴、120巴、60巴下於210℃下經歷低壓覆蓋成型。此外,用於低壓覆蓋成型之覆蓋成型組合物具有高熱穩定性。事實上,覆蓋成型組合物具有大於約135℃、較佳大於約140℃之軟化點。
在一個實施例中,覆蓋成型組合物充分適於包含光學組件之電子組件。覆蓋成型組合物具有根據ASTM D1003較佳大於85%、更佳大於90%之高透光率。根據BYK Spectro-guide及如由Hunter Lab所述之Hunter L,A,b,Color Scale量測之此初始色度(b值)小於6、較佳小於4。覆蓋成型組合物即使在老化後亦維持其光學透明性及色度達至少3000小時。
儘管在本發明覆蓋成型組合物中利用特定量之增黏劑,覆蓋成型組合物於室溫下亦不具有黏性。即使使用大於10wt%及大於20wt%之增黏樹脂量,覆蓋成型組合物之模數亦大於1×10^7達因/cm2,且未觀察到手指黏性。
彼等熟習此項技術者應瞭解,可在不背離本發明精神及範疇下對本發明實施多種修改及改變。本文所述之具體實施例僅以實例方式提供,且本發明僅受限於各項隨附申請專利範圍以及該等申請專利範圍所授權之等效物之全部範疇。
實例
覆蓋成型混合物可由彼等熟習此項技術者經由能夠處理嵌段共聚物之雙螺桿擠出機或其他混合或擠出設備產生。對於本文列舉之覆蓋成型實例,利用Brabender(冷弓刀混合器)。所有組份皆位於Brabender中且於180℃下混合直至均質為止。端視混合器中之滯留時間而定,試樣之初始色度可變。藉由使滯留時間最小化(例如藉由在210℃範圍內之溫度下使用擠出器)達成最佳色度。
於210℃下利用布魯克菲爾德黏度計(Brookfield viscometer)及具有27號心軸之Thermosel加熱室量測黏度。
利用Mettler Toledo FP83HT下降點儀器量測軟化點。以1.7℃/min(約3℉/min)之速度加熱試樣。
於環境溫度23℃至25℃下藉由手指接觸量測黏性。若覆蓋成型材料黏手指,則將其視為「是」。
利用Rheometric Scientific RDA-III控制應變流變儀以10弧度/秒之頻率及具有2mm空隙之平行板(8mm)實施流變性量測。報告於25℃下之儲存模數(G')。
為量測透光率、b值及UV老化測試,利用銅模板及Carver實驗室壓機使覆蓋成型組合物形成2mm厚之斑塊。於200℃下在Kapton®膜
之間壓製試樣以使因水份或空氣泡引起之表面上之缺陷或聚矽氧污染最小化。
於550nm下量測2mm厚之成型試樣之透光率。經由Perkin Elmer Lambda 35 UV/Vis分光光度計在狹縫為2nm且掃描速度為240nm/min下量測透光率。使用Labsphere RSA-PE-20反射率球附件。透光率值與覆蓋成型組合物之透明性/透明度直接相關。
利用BYK Spectro-guide量測色度。根據CIE L*a*b色度量表報告b值。負的b值指示存在藍色,而正的b值指示存在黃色。值愈接近零,指示色度愈少。
在QUV加速風化測試器中使用UVA-340燈泡(0.68W/m2之典型輻照度,Q-Lab)實施UV老化。UV老化20週(約3360小時)後量測透光率及色度結果。
具有大於40% MMA及增黏劑之嵌段共聚物之實例示於表1中。
*甲基丙烯酸甲酯-丙烯酸正丁基酯-甲基丙烯酸甲酯嵌段共聚物預計實例1及2之初始透光率及初始b值實質上類似於實例3及4。
儘管組合物中具有大於30wt%之增黏劑,但覆蓋成型實例1-4並不具有黏性,具有於210℃下小於75,000cP之黏度,具有大於10^7之模數值,具有大於135℃之軟化點、高透光率/透明度及低色度(b值)。
向覆蓋成型組合物中添加UV吸收劑羥基苯基苯并三唑及受阻胺光穩定劑產生即使在加速UV老化20週後亦高之透光率/透明度及低之色度(b值)。
表2列舉比較實例。如上文所述製備試樣,且以與表1中所述相同之方式實施測試。
比較實例1利用MMA含量小於35wt%之嵌段共聚物。所得覆蓋成型組合物於室溫下具有黏性,且於25℃下具有高黏度及低模數。添加比較實例1B中之增黏劑降低黏度;然而,其於室溫下仍具有黏性。
比較實例2之高黏度並不適於低壓注射成型。
比較實例3具有低於135℃之軟化溫度。低於135℃之軟化溫度具有低尺寸穩定性。較佳地,本發明覆蓋成型組合物於135℃或以上溫度下具有軟化溫度,同時於210℃下具有低黏度。
比較實例4對應於EP 2 345 698之實例3,且比較實例5對應於WO 2009/054553之實例5。兩個試樣均不具有黏性,具有高模數及高軟化溫度,然而,黏度對於低壓注射成型過高。
並非所有UV吸收劑皆適於本發明。添加比較實例6中之Tinuvin 1577產生降低初始透光率之覆蓋成型組合物。UV老化此試樣20週產生2mm厚之試樣之濁度以及增加色度。該等試樣可不適於光學裝置。
Claims (24)
- 一種覆蓋成型組合物,其包含:1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且該共聚物包含大於35wt%之該[A]單體;2)增黏樹脂;且其中該組合物於210℃下根據ASTM D3236量測具有小於75,000cP的黏度;其中於25℃下該組合物之模數係大於1×10^7達因/cm2;且其中該wt%係基於該組合物之總重量。
- 如請求項1之覆蓋成型組合物,其中該[A]單體係選自由以下組成之群:甲基丙烯酸乙酯、丙烯酸異莰基酯、甲基丙烯酸異莰基酯、甲基丙烯酸環己基酯、(甲基)丙烯酸甲酯及其混合物。
- 如請求項1之覆蓋成型組合物,其中該[B]單體係選自由以下組成之群:丙烯酸正丁基酯、丙烯酸2-乙基己基酯、丙烯酸異辛基酯及其混合物。
- 如請求項1之覆蓋成型組合物,其中該[A]單體係(甲基)丙烯酸甲酯且該[B]單體係丙烯酸正丁基酯。
- 如請求項1之覆蓋成型組合物,其中該增黏樹脂係選自由以下組成之群:α-甲基苯乙烯、松香酯、氫化及/或歧化松香酯、苯乙烯化萜、萜酚、脂族改質之芳族樹脂及其混合物。
- 如請求項1之覆蓋成型組合物,其進一步包含具有小於約20,000Da之平均分子量之末端嵌段增黏樹脂。
- 如請求項6之覆蓋成型組合物,其中該末端嵌段增黏樹脂係聚甲基丙烯酸甲酯。
- 如請求項1之覆蓋成型組合物,其進一步包含約0.05wt%至約5wt%之選自由苯并三唑、三嗪及二苯基酮組成之群之UV吸收劑。
- 如請求項1之覆蓋成型組合物,其中該UV穩定劑係該苯并三唑。
- 如請求項9之覆蓋成型組合物,其中該苯并三唑係羥基苯基苯并三唑。
- 如請求項1之覆蓋成型組合物,其進一步包含約0.05wt%至約5wt%之受阻胺光穩定劑。
- 如請求項1之覆蓋成型組合物,其進一步包含抗氧化劑、黏度調節劑、著色劑、填充劑、消泡劑、增塑劑、脫模劑或抗靜電劑。
- 一種包含電子組件及覆蓋成型組合物之物件,其中該覆蓋成型組合物包含:1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且該共聚物包含大於35wt%之該[A]單體;2)增黏樹脂;3)約0.05wt%至約5wt%之選自由苯并三唑、三嗪及二苯基酮組成之群之UV吸收劑;且其中該wt%係基於該組合物之總重量計;且其中根據ASTM D6090量測,該組合物之軟化點係大於135℃。
- 如請求項13之物件,其中該[A]單體係(甲基)丙烯酸甲酯且該[B]單體係丙烯酸正丁基酯。
- 如請求項13之物件,其中該UV穩定劑係苯并三唑。
- 如請求項15之物件,其中該苯并三唑係羥基苯基苯并三唑。
- 如請求項13之物件,其進一步包含約0.05wt%至約5wt%之受阻胺光穩定劑。
- 如請求項13之物件,其係光學裝置、含有LED之裝置或光導。
- 如請求項13之物件,其中該覆蓋成型組合物包裹該電子組件。
- 如請求項13之物件,其中該組合物於550nm下具有大於85%之透光率,該透光率係根據ASTM D1003在狹縫為2nm且掃描速度為240nm/min下量測。
- 如請求項13之物件,其中該覆蓋成型組合物在使用UVA-340燈泡之QUV室中暴露於UV光3000小時後,針對2mm厚度,根據ASTM G154具有小於8之色度(b值)。
- 一種在電子組件上形成覆蓋成型件之方法,該方法包含以下步驟:(a)製備包含以下組分之覆蓋成型組合物:1)[A]-[B]-[A]共聚物,其中[A]係Tg大於約30℃之硬嵌段單體且[B]係Tg小於約20℃之軟嵌段單體,且該共聚物包含大於35wt%之該[A]單體;2)增黏樹脂;3)約0.05wt%至約5wt%之選自由苯并三唑、三嗪及二苯基酮組成之群之UV吸收劑;且其中該wt%係基於該組合物之總重量計;(b)於小於150巴之壓力下將該覆蓋成型組合物施加於該電子組件上;及(c)冷卻該覆蓋成型組合物。
- 如請求項22之方法,其中該覆蓋成型組合物係以小於120巴之壓力施加。
- 如請求項23之方法,其中該覆蓋成型組合物係以小於60巴之壓力施加。
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DE102021130980A1 (de) * | 2021-11-25 | 2023-05-25 | Westfälische Hochschule Gelsenkirchen, Bocholt, Recklinghausen, Körperschaft des öffentlichen Rechts | Flexible Haftklebstoffe mit verbesserten Eigenschaften |
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