TW201350564A - 研磨用組成物 - Google Patents
研磨用組成物 Download PDFInfo
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- TW201350564A TW201350564A TW102108834A TW102108834A TW201350564A TW 201350564 A TW201350564 A TW 201350564A TW 102108834 A TW102108834 A TW 102108834A TW 102108834 A TW102108834 A TW 102108834A TW 201350564 A TW201350564 A TW 201350564A
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- Prior art keywords
- acid
- polishing
- polishing composition
- phase change
- compound
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims abstract description 191
- 239000000203 mixture Substances 0.000 title claims abstract description 114
- 239000000956 alloy Substances 0.000 claims abstract description 53
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 53
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 19
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims abstract description 16
- 150000002903 organophosphorus compounds Chemical class 0.000 claims abstract description 15
- 230000008859 change Effects 0.000 claims description 48
- 229910052902 vermiculite Inorganic materials 0.000 claims description 24
- 239000010455 vermiculite Substances 0.000 claims description 24
- 235000019354 vermiculite Nutrition 0.000 claims description 24
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- 150000007524 organic acids Chemical class 0.000 claims description 14
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 12
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004310 lactic acid Substances 0.000 claims description 5
- 235000014655 lactic acid Nutrition 0.000 claims description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 5
- 229960004889 salicylic acid Drugs 0.000 claims description 5
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 150000002763 monocarboxylic acids Chemical class 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract description 6
- -1 iron ion Chemical class 0.000 description 51
- 239000006061 abrasive grain Substances 0.000 description 37
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 26
- 239000007800 oxidant agent Substances 0.000 description 20
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 10
- 239000003112 inhibitor Substances 0.000 description 10
- 239000012782 phase change material Substances 0.000 description 9
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 239000011164 primary particle Substances 0.000 description 7
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 6
- FGKJLKRYENPLQH-UHFFFAOYSA-N isocaproic acid Chemical compound CC(C)CCC(O)=O FGKJLKRYENPLQH-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052714 tellurium Inorganic materials 0.000 description 6
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 150000002391 heterocyclic compounds Chemical group 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 150000007522 mineralic acids Chemical class 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- WLAMNBDJUVNPJU-UHFFFAOYSA-N 2-methylbutyric acid Chemical compound CCC(C)C(O)=O WLAMNBDJUVNPJU-UHFFFAOYSA-N 0.000 description 4
- OVBFMEVBMNZIBR-UHFFFAOYSA-N 2-methylvaleric acid Chemical compound CCCC(C)C(O)=O OVBFMEVBMNZIBR-UHFFFAOYSA-N 0.000 description 4
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 235000011054 acetic acid Nutrition 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 235000015165 citric acid Nutrition 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 4
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 4
- TWBYWOBDOCUKOW-UHFFFAOYSA-N isonicotinic acid Chemical compound OC(=O)C1=CC=NC=C1 TWBYWOBDOCUKOW-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000011163 secondary particle Substances 0.000 description 4
- 239000004471 Glycine Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 235000019260 propionic acid Nutrition 0.000 description 3
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229940005605 valeric acid Drugs 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- QQVDJLLNRSOCEL-UHFFFAOYSA-N (2-aminoethyl)phosphonic acid Chemical compound [NH3+]CCP(O)([O-])=O QQVDJLLNRSOCEL-UHFFFAOYSA-N 0.000 description 2
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- XYHKNCXZYYTLRG-UHFFFAOYSA-N 1h-imidazole-2-carbaldehyde Chemical compound O=CC1=NC=CN1 XYHKNCXZYYTLRG-UHFFFAOYSA-N 0.000 description 2
- VUAXHMVRKOTJKP-UHFFFAOYSA-N 2,2-dimethylbutyric acid Chemical compound CCC(C)(C)C(O)=O VUAXHMVRKOTJKP-UHFFFAOYSA-N 0.000 description 2
- XFOASZQZPWEJAA-UHFFFAOYSA-N 2,3-dimethylbutyric acid Chemical compound CC(C)C(C)C(O)=O XFOASZQZPWEJAA-UHFFFAOYSA-N 0.000 description 2
- OXQGTIUCKGYOAA-UHFFFAOYSA-N 2-Ethylbutanoic acid Chemical compound CCC(CC)C(O)=O OXQGTIUCKGYOAA-UHFFFAOYSA-N 0.000 description 2
- BHNHHSOHWZKFOX-UHFFFAOYSA-N 2-methyl-1H-indole Chemical compound C1=CC=C2NC(C)=CC2=C1 BHNHHSOHWZKFOX-UHFFFAOYSA-N 0.000 description 2
- MLMQPDHYNJCQAO-UHFFFAOYSA-N 3,3-dimethylbutyric acid Chemical compound CC(C)(C)CC(O)=O MLMQPDHYNJCQAO-UHFFFAOYSA-N 0.000 description 2
- GWYFCOCPABKNJV-UHFFFAOYSA-M 3-Methylbutanoic acid Natural products CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ONYNOPPOVKYGRS-UHFFFAOYSA-N 6-methylindole Natural products CC1=CC=C2C=CNC2=C1 ONYNOPPOVKYGRS-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 2
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- FFDGPVCHZBVARC-UHFFFAOYSA-N N,N-dimethylglycine Chemical compound CN(C)CC(O)=O FFDGPVCHZBVARC-UHFFFAOYSA-N 0.000 description 2
- SEQKRHFRPICQDD-UHFFFAOYSA-N N-tris(hydroxymethyl)methylglycine Chemical compound OCC(CO)(CO)[NH2+]CC([O-])=O SEQKRHFRPICQDD-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 229940024606 amino acid Drugs 0.000 description 2
- 235000001014 amino acid Nutrition 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N anhydrous quinoline Natural products N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- GWYFCOCPABKNJV-UHFFFAOYSA-N beta-methyl-butyric acid Natural products CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 150000004770 chalcogenides Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical compound NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 description 2
- DDRJAANPRJIHGJ-UHFFFAOYSA-N creatinine Chemical compound CN1CC(=O)NC1=N DDRJAANPRJIHGJ-UHFFFAOYSA-N 0.000 description 2
- XVOYSCVBGLVSOL-UHFFFAOYSA-N cysteic acid Chemical compound OC(=O)C(N)CS(O)(=O)=O XVOYSCVBGLVSOL-UHFFFAOYSA-N 0.000 description 2
- 235000018417 cysteine Nutrition 0.000 description 2
- 229960002433 cysteine Drugs 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000000174 gluconic acid Substances 0.000 description 2
- 235000012208 gluconic acid Nutrition 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 2
- 229910052699 polonium Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- ZFRKQXVRDFCRJG-UHFFFAOYSA-N skatole Chemical compound C1=CC=C2C(C)=CNC2=C1 ZFRKQXVRDFCRJG-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKQKDCXVLPGWPO-UHFFFAOYSA-N sulfanylidenephosphane Chemical compound S=P OKQKDCXVLPGWPO-UHFFFAOYSA-N 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000004474 valine Substances 0.000 description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- NYPYHUZRZVSYKL-UHFFFAOYSA-N -3,5-Diiodotyrosine Natural products OC(=O)C(N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-UHFFFAOYSA-N 0.000 description 1
- FMCUPJKTGNBGEC-UHFFFAOYSA-N 1,2,4-triazol-4-amine Chemical compound NN1C=NN=C1 FMCUPJKTGNBGEC-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- SFRLSTJPMFGBDP-UHFFFAOYSA-N 1,2-diphosphonoethylphosphonic acid Chemical compound OP(O)(=O)CC(P(O)(O)=O)P(O)(O)=O SFRLSTJPMFGBDP-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 1
- HBOMLICNUCNMMY-KJFJCRTCSA-N 1-[(4s,5s)-4-azido-5-(hydroxymethyl)oxolan-2-yl]-5-methylpyrimidine-2,4-dione Chemical compound O=C1NC(=O)C(C)=CN1C1O[C@H](CO)[C@@H](N=[N+]=[N-])C1 HBOMLICNUCNMMY-KJFJCRTCSA-N 0.000 description 1
- MWZDIEIXRBWPLG-UHFFFAOYSA-N 1-methyl-1,2,4-triazole Chemical compound CN1C=NC=N1 MWZDIEIXRBWPLG-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- BLRHMMGNCXNXJL-UHFFFAOYSA-N 1-methylindole Chemical compound C1=CC=C2N(C)C=CC2=C1 BLRHMMGNCXNXJL-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- UFLWECJWSGWVHB-UHFFFAOYSA-N 1H-carbazole Chemical compound C1=CC=C2C3=CC=CCC3=NC2=C1 UFLWECJWSGWVHB-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- LJVQHXICFCZRJN-UHFFFAOYSA-N 1h-1,2,4-triazole-5-carboxylic acid Chemical compound OC(=O)C1=NC=NN1 LJVQHXICFCZRJN-UHFFFAOYSA-N 0.000 description 1
- KOPFEFZSAMLEHK-UHFFFAOYSA-N 1h-pyrazole-5-carboxylic acid Chemical compound OC(=O)C=1C=CNN=1 KOPFEFZSAMLEHK-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 1
- AYPSHJCKSDNETA-UHFFFAOYSA-N 2-chloro-1h-benzimidazole Chemical compound C1=CC=C2NC(Cl)=NC2=C1 AYPSHJCKSDNETA-UHFFFAOYSA-N 0.000 description 1
- RVHOBHMAPRVOLO-UHFFFAOYSA-N 2-ethylbutanedioic acid Chemical compound CCC(C(O)=O)CC(O)=O RVHOBHMAPRVOLO-UHFFFAOYSA-N 0.000 description 1
- LDZYRENCLPUXAX-UHFFFAOYSA-N 2-methyl-1h-benzimidazole Chemical compound C1=CC=C2NC(C)=NC2=C1 LDZYRENCLPUXAX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- CVKMFSAVYPAZTQ-UHFFFAOYSA-N 2-methylhexanoic acid Chemical compound CCCCC(C)C(O)=O CVKMFSAVYPAZTQ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- HTAVZCVYBKYBBM-UHFFFAOYSA-N 3,5-diheptyl-1,2,4-triazol-4-amine Chemical compound CCCCCCCC1=NN=C(CCCCCCC)N1N HTAVZCVYBKYBBM-UHFFFAOYSA-N 0.000 description 1
- NYPYHUZRZVSYKL-ZETCQYMHSA-N 3,5-diiodo-L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-ZETCQYMHSA-N 0.000 description 1
- MIIKMZAVLKMOFM-UHFFFAOYSA-N 3,5-dimethyl-1,2,4-triazol-4-amine Chemical compound CC1=NN=C(C)N1N MIIKMZAVLKMOFM-UHFFFAOYSA-N 0.000 description 1
- QQHNFZBYCQMAOD-UHFFFAOYSA-N 3,5-dipropyl-1,2,4-triazol-4-amine Chemical compound CCCC1=NN=C(CCC)N1N QQHNFZBYCQMAOD-UHFFFAOYSA-N 0.000 description 1
- BRMWTNUJHUMWMS-UHFFFAOYSA-N 3-Methylhistidine Natural products CN1C=NC(CC(N)C(O)=O)=C1 BRMWTNUJHUMWMS-UHFFFAOYSA-N 0.000 description 1
- ZOPIBCDDKMAEII-UHFFFAOYSA-N 4-(1,2,4-triazol-1-yl)phenol Chemical compound C1=CC(O)=CC=C1N1N=CN=C1 ZOPIBCDDKMAEII-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- DFYGYTNMHPUJBY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane-1-thiol Chemical compound SCCCC(C(OC)(OC)OC)CCCCCCCC DFYGYTNMHPUJBY-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- MVPKIPGHRNIOPT-UHFFFAOYSA-N 5,6-dimethyl-2h-benzotriazole Chemical compound C1=C(C)C(C)=CC2=NNN=C21 MVPKIPGHRNIOPT-UHFFFAOYSA-N 0.000 description 1
- LJUQGASMPRMWIW-UHFFFAOYSA-N 5,6-dimethylbenzimidazole Chemical compound C1=C(C)C(C)=CC2=C1NC=N2 LJUQGASMPRMWIW-UHFFFAOYSA-N 0.000 description 1
- QGLMSZQOJZAPSZ-UHFFFAOYSA-N 5-benzyl-1h-1,2,4-triazol-3-amine Chemical compound NC1=NNC(CC=2C=CC=CC=2)=N1 QGLMSZQOJZAPSZ-UHFFFAOYSA-N 0.000 description 1
- XXAMCWVPBITOGA-UHFFFAOYSA-N 5-bromo-3-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NNC(Br)=N1 XXAMCWVPBITOGA-UHFFFAOYSA-N 0.000 description 1
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 1
- UHOFPBXQUTZOKZ-UHFFFAOYSA-N 5-methyl-1,2,4-triazole-3,4-diamine Chemical compound CC1=NN=C(N)N1N UHOFPBXQUTZOKZ-UHFFFAOYSA-N 0.000 description 1
- FJRZOOICEHBAED-UHFFFAOYSA-N 5-methyl-1h-1,2,4-triazol-3-amine Chemical compound CC1=NNC(N)=N1 FJRZOOICEHBAED-UHFFFAOYSA-N 0.000 description 1
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 description 1
- YPKBCLZFIYBSHK-UHFFFAOYSA-N 5-methylindole Chemical compound CC1=CC=C2NC=CC2=C1 YPKBCLZFIYBSHK-UHFFFAOYSA-N 0.000 description 1
- KUEFXPHXHHANKS-UHFFFAOYSA-N 5-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NC=NN1 KUEFXPHXHHANKS-UHFFFAOYSA-N 0.000 description 1
- AOCDQWRMYHJTMY-UHFFFAOYSA-N 5-nitro-2h-benzotriazole Chemical compound C1=C([N+](=O)[O-])C=CC2=NNN=C21 AOCDQWRMYHJTMY-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- ZMAXXOYJWZZQBK-UHFFFAOYSA-N 5334-40-7 Chemical compound OC(=O)C1=NNC=C1[N+]([O-])=O ZMAXXOYJWZZQBK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KGWPHCDTOLQQEP-UHFFFAOYSA-N 7-methylindole Chemical compound CC1=CC=CC2=C1NC=C2 KGWPHCDTOLQQEP-UHFFFAOYSA-N 0.000 description 1
- NWXBAYMTKHBJRG-UHFFFAOYSA-N 8H-carbazol-4-amine Chemical compound C1C=CC=C2C=3C(=CC=CC=3N=C12)N NWXBAYMTKHBJRG-UHFFFAOYSA-N 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- DCXYFEDJOCDNAF-UHFFFAOYSA-N Asparagine Natural products OC(=O)C(N)CC(N)=O DCXYFEDJOCDNAF-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YPWSLBHSMIKTPR-UHFFFAOYSA-N Cystathionine Natural products OC(=O)C(N)CCSSCC(N)C(O)=O YPWSLBHSMIKTPR-UHFFFAOYSA-N 0.000 description 1
- ILRYLPWNYFXEMH-UHFFFAOYSA-N D-cystathionine Natural products OC(=O)C(N)CCSCC(N)C(O)=O ILRYLPWNYFXEMH-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- XUIIKFGFIJCVMT-GFCCVEGCSA-N D-thyroxine Chemical compound IC1=CC(C[C@@H](N)C(O)=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 XUIIKFGFIJCVMT-GFCCVEGCSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- AHLPHDHHMVZTML-BYPYZUCNSA-N L-Ornithine Chemical compound NCCC[C@H](N)C(O)=O AHLPHDHHMVZTML-BYPYZUCNSA-N 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- DCXYFEDJOCDNAF-REOHCLBHSA-N L-asparagine Chemical compound OC(=O)[C@@H](N)CC(N)=O DCXYFEDJOCDNAF-REOHCLBHSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- RHGKLRLOHDJJDR-BYPYZUCNSA-N L-citrulline Chemical compound NC(=O)NCCC[C@H]([NH3+])C([O-])=O RHGKLRLOHDJJDR-BYPYZUCNSA-N 0.000 description 1
- ILRYLPWNYFXEMH-WHFBIAKZSA-N L-cystathionine Chemical compound [O-]C(=O)[C@@H]([NH3+])CCSC[C@H]([NH3+])C([O-])=O ILRYLPWNYFXEMH-WHFBIAKZSA-N 0.000 description 1
- LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
- GGLZPLKKBSSKCX-YFKPBYRVSA-N L-ethionine Chemical compound CCSCC[C@H](N)C(O)=O GGLZPLKKBSSKCX-YFKPBYRVSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 description 1
- DWPCPZJAHOETAG-IMJSIDKUSA-N L-lanthionine Chemical compound OC(=O)[C@@H](N)CSC[C@H](N)C(O)=O DWPCPZJAHOETAG-IMJSIDKUSA-N 0.000 description 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- JDHILDINMRGULE-LURJTMIESA-N N(pros)-methyl-L-histidine Chemical compound CN1C=NC=C1C[C@H](N)C(O)=O JDHILDINMRGULE-LURJTMIESA-N 0.000 description 1
- FHQDWPCFSJMNCT-UHFFFAOYSA-N N(tele)-methylhistamine Chemical compound CN1C=NC(CCN)=C1 FHQDWPCFSJMNCT-UHFFFAOYSA-N 0.000 description 1
- RHGKLRLOHDJJDR-UHFFFAOYSA-N Ndelta-carbamoyl-DL-ornithine Natural products OC(=O)C(N)CCCNC(N)=O RHGKLRLOHDJJDR-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- AHLPHDHHMVZTML-UHFFFAOYSA-N Orn-delta-NH2 Natural products NCCCC(N)C(O)=O AHLPHDHHMVZTML-UHFFFAOYSA-N 0.000 description 1
- UTJLXEIPEHZYQJ-UHFFFAOYSA-N Ornithine Natural products OC(=O)C(C)CCCN UTJLXEIPEHZYQJ-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Natural products C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 108010077895 Sarcosine Proteins 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UZMAPBJVXOGOFT-UHFFFAOYSA-N Syringetin Natural products COC1=C(O)C(OC)=CC(C2=C(C(=O)C3=C(O)C=C(O)C=C3O2)O)=C1 UZMAPBJVXOGOFT-UHFFFAOYSA-N 0.000 description 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 description 1
- 239000004473 Threonine Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007997 Tricine buffer Substances 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- KGNGTSCIQCLKEH-UHFFFAOYSA-N Vicine Natural products N1C(N)=NC(=O)C(OC2C(C(O)C(O)C(CO)O2)O)=C1N KGNGTSCIQCLKEH-UHFFFAOYSA-N 0.000 description 1
- KGNGTSCIQCLKEH-SYCVNHKBSA-N Vicine Chemical compound N1C(N)=NC(=O)C(O[C@H]2[C@@H]([C@@H](O)[C@H](O)[C@@H](CO)O2)O)=C1N KGNGTSCIQCLKEH-SYCVNHKBSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 235000009582 asparagine Nutrition 0.000 description 1
- 229960001230 asparagine Drugs 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- XSCHRSMBECNVNS-UHFFFAOYSA-N benzopyrazine Natural products N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 1
- JCXKHYLLVKZPKE-UHFFFAOYSA-N benzotriazol-1-amine Chemical compound C1=CC=C2N(N)N=NC2=C1 JCXKHYLLVKZPKE-UHFFFAOYSA-N 0.000 description 1
- BJFLSHMHTPAZHO-UHFFFAOYSA-N benzotriazole Chemical compound [CH]1C=CC=C2N=NN=C21 BJFLSHMHTPAZHO-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- KYPIPCWVZKRJDD-UHFFFAOYSA-N benzotriazole-1-carboxylic acid Chemical compound C1=CC=C2N(C(=O)O)N=NC2=C1 KYPIPCWVZKRJDD-UHFFFAOYSA-N 0.000 description 1
- 238000003339 best practice Methods 0.000 description 1
- 229940000635 beta-alanine Drugs 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- JODNECOOAJMIKX-UHFFFAOYSA-N butane-1,2,3-tricarboxylic acid Chemical compound OC(=O)C(C)C(C(O)=O)CC(O)=O JODNECOOAJMIKX-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229960002173 citrulline Drugs 0.000 description 1
- 235000013477 citrulline Nutrition 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229960003624 creatine Drugs 0.000 description 1
- 239000006046 creatine Substances 0.000 description 1
- 229940109239 creatinine Drugs 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 1
- 150000001945 cysteines Chemical class 0.000 description 1
- 229960003067 cystine Drugs 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- KCFYHBSOLOXZIF-UHFFFAOYSA-N dihydrochrysin Natural products COC1=C(O)C(OC)=CC(C2OC3=CC(O)=CC(O)=C3C(=O)C2)=C1 KCFYHBSOLOXZIF-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 108700003601 dimethylglycine Proteins 0.000 description 1
- VURFVHCLMJOLKN-UHFFFAOYSA-N diphosphane Chemical compound PP VURFVHCLMJOLKN-UHFFFAOYSA-N 0.000 description 1
- PMMYEEVYMWASQN-UHFFFAOYSA-N dl-hydroxyproline Natural products OC1C[NH2+]C(C([O-])=O)C1 PMMYEEVYMWASQN-UHFFFAOYSA-N 0.000 description 1
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- YSMODUONRAFBET-UHNVWZDZSA-N erythro-5-hydroxy-L-lysine Chemical compound NC[C@H](O)CC[C@H](N)C(O)=O YSMODUONRAFBET-UHNVWZDZSA-N 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 description 1
- 229960002743 glutamine Drugs 0.000 description 1
- 229960002449 glycine Drugs 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- GTTBQSNGUYHPNK-UHFFFAOYSA-N hydroxymethylphosphonic acid Chemical compound OCP(O)(O)=O GTTBQSNGUYHPNK-UHFFFAOYSA-N 0.000 description 1
- 229960002591 hydroxyproline Drugs 0.000 description 1
- 230000003100 immobilizing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229940045996 isethionic acid Drugs 0.000 description 1
- AWJUIBRHMBBTKR-UHFFFAOYSA-N iso-quinoline Natural products C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 1
- 229960000310 isoleucine Drugs 0.000 description 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 description 1
- 238000002356 laser light scattering Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- DWPCPZJAHOETAG-UHFFFAOYSA-N meso-lanthionine Natural products OC(=O)C(N)CSCC(N)C(O)=O DWPCPZJAHOETAG-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- 229960004452 methionine Drugs 0.000 description 1
- QMPFMODFBNEYJH-UHFFFAOYSA-N methyl 1h-1,2,4-triazole-5-carboxylate Chemical compound COC(=O)C1=NC=NN1 QMPFMODFBNEYJH-UHFFFAOYSA-N 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229940078490 n,n-dimethylglycine Drugs 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229960003104 ornithine Drugs 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229960003080 taurine Drugs 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229940034208 thyroxine Drugs 0.000 description 1
- XUIIKFGFIJCVMT-UHFFFAOYSA-N thyroxine-binding globulin Natural products IC1=CC(CC([NH3+])C([O-])=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 XUIIKFGFIJCVMT-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- DYWSVUBJGFTOQC-UHFFFAOYSA-N xi-2-Ethylheptanoic acid Chemical compound CCCCCC(CC)C(O)=O DYWSVUBJGFTOQC-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本發明之研磨用組成物為使用於研磨具有相變合金之研磨對象物之用途。研磨用組成物,其特徵為含有研磨粒及脆性膜形成劑,而前述脆性膜形成劑為選自於飽和單羧酸及有機磷化合物之至少1種以上。
Description
本發明為有關適合於研磨具有相變合金之研磨對象物之研磨用組成物。
PRAM(相變隨機存取記憶體)裝置(已知亦作為雙向記憶體裝置或PCRAM裝置)中,用於電子記憶用途在絕緣性非晶質相與傳導性結晶性相之間,係利用著能電性切換之相變材料(PCM)。適合於此等用途之典型相變材料,係以週期表之各種的VIB族(硫屬化物(chalcogenide),例如Te或Po)及VB族(例如Sb)元素,與In、Ge、Ga、Sn或Ag等之1種或複數種之金屬元素之組合而被利用著。特別適合的相變材料為鍺(Ge)-銻(Sb)-碲(Te)合金(GST合金)。此等材料為依附於(depend on)加熱/冷卻速度、溫度、及時間,而可使物理狀態可逆性地變化。其他適合的合金為包含銻化銦(InSb)。PRAM裝置中的記憶資訊會依不同物理之相或狀態之傳導特性,使損失成為最小地予以保存。
作為研磨半導體基材(例如,積體電路)之含有金屬之表面之方法,已知有化學機械研磨(CMP)。在CMP所使用的研磨用組成物,典型為含有研磨粒、氧化劑、錯化劑,並有效地利用蝕刻來進行研磨。
如此般的CMP,可利用於用來製作使用相變材料的記憶裝置。然而,不似由單一成分諸如銅(Cu)或鎢(W)所成的以往的金屬層,被研磨之相變材料係將硫(S)、鈰(Ce)、鍺(Ge)、銻(Sb)、碲(Te)、銀(Ag)、銦(In)、錫(Sn)、鎵(Ga)等,以結晶相及非結晶質相為可逆性進行相變化之特定比例混合而成,大多的相變材料(例如,GST)之物理性質,相較於PCM晶片中所利用的其他材料為「軟質」之點等,由於與以往的金屬層材料之特性不同,故難以將現今用來研磨含有金屬之表面之研磨用組成物直接予以適用。
如此般狀況之中,對於適合研磨具有相變合金之研磨對象物之研磨用組成物,已進行各種之檢討。例如,專利文獻1中,係揭示一種以含有研磨粒及氮化物且具有相變合金之研磨對象物的研磨為目的之研磨用組成物。又,專利文獻2中,係揭示一種以含有研磨粒、及鐵離子或鐵螯合錯合物且具有相變合金之研磨對象物的研磨為目的之研磨用組成物。但,僅以此等發明時,作為以研磨具有相變合金之研磨對象物為目的之研磨用組成物而言為不充分,乃期待進一步的改良。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2009-016821號公報
[專利文獻2]日本特開2009-016829號公報
在此,本發明之目的,係以提供一種在研磨具有相變合金之研磨對象物之用途為可適合使用的研磨用組成物。
特別是提供,一種不依附於如氧化劑及錯化劑而能夠得到高研磨速度的研磨用組成物,其中前述氧化劑及錯化劑為用來研磨以往含有金屬之表面的典型研磨用組成物中所含有者。
本發明團隊在經過精心探討後,結果發現到一種研磨用組成物,其係藉由包含研磨粒及特定脆性膜形成劑,對於具有相變合金之研磨對象物可得到高研磨速度。
即,本發明之要旨為如同下述。
<1>一種研磨用組成物,其係使用於研磨具有相變合金之研磨對象物之用途之研磨用組成物,其特徵為包含研磨粒及脆性膜形成劑,前述脆性膜形成劑為選自於飽和單羧酸及有機磷化合物之至少1種以上。
<2>如上述<1>之研磨用組成物,其中研磨粒為膠體矽石。
<3>如上述<2>之研磨用組成物,其中膠體矽石為使有機酸固定化的膠體矽石。
<4>如上述<1>之研磨用組成物,其中脆性膜形成劑為選自於飽和單羧酸之至少1種以上。
<5>如上述<4>之研磨用組成物,其中飽和單羧酸為選自於乙酸、乙醇酸、乳酸及水楊酸之至少1種以上。
<6>如上述<1>之研磨用組成物,其中脆性膜形成劑為選自於有機磷化合物之至少1種以上。
<7>如上述<6>之研磨用組成物,其中有機磷酸為選自於膦酸、烷基膦酸、HEDP及次膦酸之至少1種以上。
<8>一種研磨用組成物,其係使用於研磨具有相變合金之研磨對象物之用途之研磨用組成物,其特徵為包含脆性膜形成劑。
<9>如上述<1>~<8>中任一項之研磨用組成物,其係使用於研磨具有GST作為相變合金之研磨對象物之用途。
<10>一種研磨方法,其特徵係使用上述<1>~<8>中任一項之研磨用組成物來研磨具有相變合金之研磨對象物之表面。
<11>一種基板之製造方法,其特徵係具有使用上述<1>~<8>中任一項之研磨用組成物來研磨具有相變合金之研磨對象物之表面之步驟。
藉由本發明,可提供一種研磨用組成物,其係能適合使用於研磨具有相變合金之研磨對象物之用途。特別是提供一種有效提昇研磨速度的研磨用組成物。
以下為說明本發明之一實施形態。
本實施形態之研磨用組成物為包含研磨粒與特定脆性膜形成劑。
此研磨用組成物為使用於研磨具有相變合金之研磨對象物之用途。相變合金,在PRAM(相變隨機存取記憶體)裝置(已知亦作為雙向記憶體裝置或PCRAM裝置)中,用於電子記憶用途在絕緣性非晶質相與傳導性結晶性相之間,係利用著能電性切換之材料。作為適合於此等用途之相變合金,係以週期表之各種的VIB族(硫屬化物,例如Te或Po)及VB族(例如Sb)元素,與In、Ge、Ga、Sn或Ag等之1種或複數種之金屬元素之組合而被利用著。特別適合的相變材料為鍺(Ge)-銻(Sb)-碲(Te)合金(GST合金)。
研磨用組成物可含有研磨粒。研磨粒可為無機粒子、有機粒子、及有機無機複合粒子中之任一種。作為無機粒子的具體例,例如可列舉出由矽石、氧化鋁、氧化鈰、氧
化鈦等之金屬氧化物所構成之粒子,以及氮化矽粒子、碳化矽粒子及氮化硼粒子。作為有機粒子的具體例,例如可列舉出聚甲基丙烯酸甲酯(PMMA)粒子。當中較佳為矽石粒子,特佳為膠體矽石。
研磨粒可經表面改質。一般的膠體矽石,由於在酸性條件下動電勢之值接近於零,所以在酸性條件下,矽石粒子彼此不會相互呈電相斥而容易凝聚。相對於此,即使在酸性條件下動電勢亦具有相對較大的正或負值之經表面改質之研磨粒,在酸性條件下亦可彼此強力相斥而良好地分散,其結果可提昇研磨用組成物的保存穩定性。此般經表面改質之研磨粒,例如可將鋁、鈦或鋯等之金屬或此等的氧化物與研磨粒混合,使摻雜於研磨粒的表面而得。
或是,研磨用組成物中之經表面改質之研磨粒,亦可為將有機酸固定化之矽石。當中較佳可使用將有機酸固定化之膠體矽石。有機酸對膠體矽石之固定化,是藉由將有機酸的官能基化學鍵結於膠體矽石的表面來進行。僅使膠體矽石與有機酸共存者,乃無法達成有機酸對膠體矽石之固定化。將有機酸的一種之磺酸固定化於膠體矽石者,例如可藉由“Sulfonic acid-functionalized silica through quantitative oxidation of thiol groups”,Chem.Commun.246-247(2003)所記載之方法來進行。具體而言,可在將3-巰丙基三甲氧矽烷等之具有硫醇基之矽烷偶合劑偶合於膠體矽石後,以過氧化氫將硫醇基氧化而得到磺酸固定化於表面之膠體矽石。或是,將羧酸固定化於膠體矽石者,例如可藉由
“Novel Silane Coupling Agents Containing a Photolabile 2-Nitrobenzyl Ester for Introduction of a Carboxy Group on the Surface of Silica Gel”,Chemistry Letters,3,228-229(2000)所記載之方法來進行。具體而言,可將含有光反應性的2-硝基苄酯之矽烷偶合劑偶合於膠體矽石後,進行光照射而得到羧酸固定化於表面之膠體矽石。
研磨用組成物中,研磨粒之含有量較佳為0.1質量%以上,又較佳為0.5質量%以上,更佳為1質量%以上。隨著研磨粒的含有量增多,具有可提昇藉由研磨用組成物之研磨對象物之除去速度之優點。
研磨用組成物中,研磨粒之含有量較佳為20質量%以下,又較佳為15質量%以下,更佳為10質量%以下。隨著研磨粒的含有量減少,可抑制研磨用組成物的材料成本。
研磨粒的平均一次粒徑,較佳為5nm以上,又較佳為7nm以上,更佳為10nm以上。隨著研磨粒的平均一次粒徑增大,有利於提昇藉由研磨用組成物之研磨對象物之除去速度。尚,研磨粒的平均一次粒徑之值,例如可根據由BET法所測定之研磨粒的比表面積來計算。
研磨粒的平均一次粒徑,較佳為100nm以下,尤佳為90nm以下,更佳為80nm以下。隨著研磨粒的平均一次粒徑減少,藉由使用研磨用組成物來研磨研磨對象物,可容易得到表面缺陷少之研磨面。
研磨粒的平均二次粒徑,較佳為150nm以下,又較
佳為120nm以下,更佳為100nm以下。研磨粒的平均二次粒徑之值,例如可藉由雷射光散射法來測定。
研磨粒之以平均一次粒徑之值除上平均二次粒徑之值所得之研磨粒的平均結合度(degree of association),較佳為1.2以上,又較佳為1.5以上。隨著研磨粒的平均結合度增大,具有可提昇藉由研磨用組成物之研磨對象物之除去速度之優點。
研磨粒的平均結合度,較佳為4以下,又較佳為3以下,更佳為2以下。隨著研磨粒的平均結合度降低,藉由使用研磨用組成物來研磨研磨對象物,可容易得到表面缺陷少之研磨面。
研磨用組成物為包含選自於飽和單羧酸及有機磷酸之至少1種以上的脆性膜形成劑。用來研磨以往含有金屬之表面的典型研磨用組成物,係藉由該研磨用組成物中所包含的氧化劑來使研磨對象之金屬氧化,以形成金屬氧化物,進而再藉由以錯化劑來使金屬氧化物溶解,而進行研磨。相較於此係認為本發明之研磨用組成物為,該研磨用組成物中所包含的上述脆性膜形成劑會與相變合金表面進行錯合化,而形成不溶性的脆性膜,藉由將該脆性膜以研磨粒進行機械性研磨,因而可得到高研磨速度。
當作為脆性膜形成劑為使用飽和單羧酸時,列舉例如乙酸、乳酸、丙酸、丁酸、乙醇酸、葡萄糖酸、水楊酸、
異菸鹼酸、異丁酸、戊酸、異戊酸、三甲基乙酸、2-甲基丁酸(hydroangelic acid)、己酸、2-甲基戊酸、4-甲基戊酸、2,3-二甲基丁酸、2-乙基丁酸、2,2-二甲基丁酸、3,3-二甲基丁酸、庚酸、辛酸、壬酸、癸酸。飽和單羧酸之碳數較佳為2~6,又較佳為2~4。作為碳數為2~6的飽和單羧酸,就容易與相變合金表面錯合化並形成不溶性的脆性膜,其結果方面可得到所謂的高研磨速度之觀點而言,較佳為含有選自於由乙酸、乳酸、丙酸、丁酸、乙醇酸、葡萄糖酸、水楊酸、異菸鹼酸、異丁酸、戊酸、異戊酸、三甲基乙酸、2-甲基丁酸、己酸、2-甲基戊酸、4-甲基戊酸、2,3-二甲基丁酸、2-乙基丁酸、2,2-二甲基丁酸及3,3-二甲基丁酸所成之群之至少1種以上的化合物。上述飽和單羧酸亦可為鹽。又,上述飽和單羧酸可單獨使用1種,亦可組合2種以上使用。
研磨用組成物中,飽和單羧酸之含有量之上限較佳為10質量%,又較佳為8質量%,更佳為5質量%。隨著飽和單羧酸之含有量減少,由於可降低製造成本,故宜。
研磨用組成物中,飽和單羧酸之含有量之下限較佳為0.001質量%,又較佳為0.01質量%,更佳為0.1質量%。隨著飽和單羧酸之含有量增加,由於研磨速度會變高,故宜。
當作為脆性膜形成劑為使用有機磷化合物時,該有機磷化合物係指為包含碳(C)-磷(P)鍵結之有機化合物,列舉例如膦、膦氧化物(phosphine oxide)、膦硫化
物(phosphine sulfide)、二膦(diphosphane)等之3價磷之酸及鹵化物、鏻鹽、膦酸、次膦酸及此等之衍生物。就容易與相變合金表面錯合化並形成不溶性的脆性膜,其結果方面可得到所謂的高研磨速度之觀點而言,較佳為次膦酸及膦酸,更具體而言,較佳為含有選自於2-胺基乙基膦酸、1-羥基亞乙基-1,1-二膦酸、胺基三(亞甲基膦酸)、乙二胺四(亞甲基膦酸)、二伸乙三胺五(亞甲基膦酸)、乙烷-1,1,-二膦酸、乙烷-1,1,2-三膦酸、乙烷-1-羥基-1,1-二膦酸、乙烷-1-羥基-1,1,2-三膦酸、乙烷-1,2-二羧基-1,2-二膦酸、甲烷羥基膦酸、2-膦醯基丁烷-1,2-二羧酸、1-膦醯基丁烷-2,3,4-三羧酸、α-甲基膦醯基琥珀酸、苯基膦酸、次膦酸所成之群之至少1種以上的化合物。上述有機磷化合物亦可為鹽。又,上述有機磷化合物可單獨使用1種,亦可組合2種以上使用。
研磨用組成物中,有機磷化合物之含有量之上限較佳為10質量%,又較佳為8質量%,更佳為5質量%。隨著有機磷化合物之含有量減少,由於可降低製造成本,故宜。
研磨用組成物中,有機磷化合物之含有量之下限較佳為0.001質量%,又較佳為0.01質量%,更佳為0.1質量%。隨著有機磷化合物之含有量增加,由於研磨速度會變高,故宜。
研磨用組成物之pH之上限未特別特限定,但較佳為
12,又較佳為10。隨著pH變低,研磨用組成物之操作性會提昇。
研磨用組成物之pH之下限,亦未特別特限定,但較佳為1,又較佳為3。當pH越高時,越可提昇研磨用組成物中研磨粒之分散性。
為了將研磨用組成物之pH調整成所希望之值,因應所需而使用的pH調整劑可任意為酸或鹼,又,亦可為任意的無機或有機之化合物。
研磨用組成物中可進而含有氧化劑。氧化劑為具有將研磨對象物之表面氧化之作用,當研磨用組成物中添加有氧化劑時,藉由研磨用組成物之研磨速度具有提昇之效果。然而,當研磨對象物為具有相變合金,若使用用來研磨以往含有金屬之表面的典型研磨用組成物來進行研磨時,會引起過度研磨。此可考量為相變合金之特性與以往半導體中所使用的金屬(例如,Cu)之特性不同之故,當研磨對象物為具有相變合金時,氧化劑之含有量較佳為低者。
研磨用組成物中,氧化劑之含有量之上限,較佳為10質量%,又較佳為5質量%。隨著氧化劑之含有量減少,不易因氧化劑而產生相變合金之過剩氧化,可抑制過度研磨。
研磨用組成物中,氧化劑之含有量之下限,較佳為
0.1質量%,又較佳為0.3質量%。隨著氧化劑之含有量增加,有助於研磨速度之提昇。
可使用的氧化劑,例如有過氧化物。作為過氧化物之具體例,列舉例如過氧化氫、過乙酸、過碳酸鹽、過氧化尿素及過氯酸,以及過硫酸鈉、過硫酸鉀及過硫酸銨等之過硫酸鹽。之中就研磨速度之觀點而言,較佳為過硫酸鹽及過氧化氫;就在水溶液中的穩定性及環境負荷之觀點而言,特佳為過氧化氫。
研磨用組成物中可進而含有錯化劑。研磨用組成物中所包含的錯化劑,係具有將相變合金的表面化學性蝕刻之作用,而具有提昇藉由研磨用組成物之研磨速度之功用。然而,當研磨對象物為具有相變合金,若使用用來研磨以往含有金屬之表面的典型研磨用組成物來進行研磨時,會引起過剩蝕刻,該結果會引起過度研磨。此可考量為相變合金之特性與以往半導體中所使用的金屬(例如,Cu)之特性不同之故,當研磨對象物為具有相變合金時,錯化劑之含有量較佳為低者。
研磨用組成物中,錯化劑之含有量之上限,較佳為10質量%,又較佳為1質量%。隨著錯化劑之含有量減少,不易因錯化劑而產生對於相變合金之過剩蝕刻。該結果可抑制過剩研磨。
研磨用組成物中,錯化劑之含有量之下限,較佳為
0.01質量%,又較佳為0.1質量%。隨著錯化劑之含有量增加,對於相變合金之蝕刻效果會增加。該結果,有助於藉由研磨用組成物之研磨速度之提昇。
可使用的錯化劑,有例如無機酸、有機酸、及胺基酸。作為無機酸之具體例,列舉例如硫酸、硝酸、硼酸、碳酸、次亞磷酸、亞磷酸及磷酸。作為有機酸的具體例,例如可列舉出甲酸、乙酸、丙酸、丁酸、戊酸、2-甲基丁酸、n-己酸、3,3-二甲基丁酸、2-乙基丁酸、4-甲基戊酸、n-庚酸、2-甲基己酸、n-辛酸、2-乙基庚酸、苯甲酸、乙醇酸、柳酸、甘油酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、馬來酸、鄰苯二甲酸、蘋果酸、酒石酸、檸檬酸及乳酸。亦可使用甲烷磺酸、乙烷磺酸及2-羥乙磺酸(isethionic acid)等之有機硫酸。此外,亦可使用無機酸或有機酸的鹼金屬鹽等之鹽,來取代無機酸或有機酸、或是與無機酸或有機酸組合使用。作為胺基酸的具體例,例如可列舉出甘胺酸、α-丙胺酸、β-丙胺酸、N-甲基甘胺酸、N,N-二甲基甘胺酸、2-胺基丁酸、正纈胺酸、纈胺酸、白胺酸、正白胺酸、異白胺酸、苯基丙胺酸、脯胺酸、肌胺酸、鳥胺酸、離胺酸、牛磺酸、絲胺酸、蘇胺酸、類絲胺酸、酪胺酸、蠶豆苷(vicine)、麥黃酮(tricine)、3,5-二碘-酪胺酸、β-(3,4-二羥苯基)-甘胺酸、甲狀腺素、4-羥基-脯胺酸、半胱胺酸、甲硫胺酸、乙硫胺酸、羊毛硫胺酸、胱硫醚、胱胺酸、氧化半胱胺酸(cysteic acid)、天門冬胺酸、麩胺酸、S-(羧
甲基)-半胱胺酸、4-胺基丁酸、天門冬胺、麩胺、偶氮絲胺酸、精胺酸、刀豆氨酸、瓜氨酸、δ-羥基-離胺酸、肌酸、組胺酸、1-甲基-組胺酸、3-甲基-組胺酸、及色胺酸。之中作為錯化劑,就提昇研磨之觀點而言較佳為甘胺酸、丙胺酸、蘋果酸、酒石酸、檸檬酸、乙醇酸、2-羥乙磺酸或是此等之鹽。
研磨用組成物中可進而含有金屬防蝕劑。當將金屬防蝕劑添加於研磨用組成物時,使用研磨用組成物進行研磨後之相變合金,具有不易產生碟狀凹陷(dishing)等表面缺陷之效果。此外,該金屬防蝕劑,當研磨用組成物中為包含氧化劑及/或錯化劑時,可緩和因氧化劑所造成的相變合金表面之氧化,且與金屬離子(其係因氧化劑所造成的相變合金表面之金屬之氧化所產生者)反應,而發揮生成不溶性的錯合物之功用。其結果可抑制因錯化劑所造成的對相變合金之蝕刻,並可抑制過度研磨。
可使用的金屬防蝕劑之種類未特別特限定,但較佳為雜環化合物。雜環化合物中的雜環之節數未特別限定。又,雜環化合物可為單環化合物,亦可為具有縮合環之多環化合物。
作為金屬防蝕劑之雜環化合物之具體例,列舉例如吡咯化合物、吡唑化合物、咪唑化合物、三唑化合物、四唑化合物、吡啶化合物、吡嗪化合物、噠嗪化合物、4-氮茚
化合物、吲哚嗪化合物、吲哚化合物、異吲哚化合物、吲唑化合物、嘌呤化合物、喹嗪化合物、喹啉化合物、異喹啉化合物、萘啶化合物、酞嗪化合物、喹喔啉化合物、喹唑啉化合物、噌啉化合物、蝶啶化合物、噻唑化合物、異噻唑化合物、噁唑化合物、異噁唑化合物及呋呫化合物等之含氮雜環化合物。作為吡唑化合物的具體例,例如可列舉出1H-吡唑、4-硝基-3-吡唑羧酸及3,5-吡唑羧酸。作為咪唑化合物的具體例,例如可列舉出咪唑、1-甲基咪唑、2-甲基咪唑、4-甲基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-異丙基咪唑、苯並咪唑、5,6-二甲基苯並咪唑、2-胺基苯並咪唑、2-氯苯並咪唑及2-甲基苯並咪唑。作為三唑的具體例,例如可列舉出1,2,3-三唑、1,2,4-三唑、1-甲基-1,2,4-三唑、甲基-1H-1,2,4-三唑-3-羧酸酯、1,2,4-三唑-3-羧酸、1,2,4-三唑-3-羧酸甲酯、3-胺基-1H-1,2,4-三唑、3-胺基-5-苄基-4H-1,2,4-三唑、3-胺基-5-甲基-4H-1,2,4-三唑、3-硝基-1,2,4-三唑、3-溴-5-硝基-1,2,4-三唑、4-(1,2,4-三唑-1-基)酚、4-胺基-1,2,4-三唑、4-胺基-3,5-二丙基-4H-1,2,4-三唑、4-胺基-3,5-二甲基-4H-1,2,4-三唑、4-胺基-3,5-二庚基-4H-1,2,4-三唑、5-甲基-1,2,4-三唑-3,4-二胺、1-羥基苯並三唑、1-胺基苯並三唑、1-羧基苯並三唑、5-氯-1H-苯並三唑、5-硝基-1H-苯並三唑、5-羧基-1H-苯並三唑、5,6-二甲基-1H-苯並三唑、1-(1",2'-二羧乙基)苯並三唑。作為四唑化合物的具體例,例如可列舉出1H-四唑、5-甲基四唑、5-胺基四
唑、及5-苯基四唑。作為吲哚化合物的具體例,例如可列舉出1H-吲哚、1-甲基-1H-吲哚、2-甲基-1H-吲哚、3-甲基-1H-吲哚、4-甲基-1H-吲哚、5-甲基-1H-吲哚、6-甲基-1H-吲哚、及7-甲基-1H-吲哚。作為吲唑化合物的具體例,例如可列舉出1H-吲唑及5-胺基-1H-吲唑。此等雜環化合物,由於對相變合金之化學或物理吸附力高,所以可將更堅固的保護膜形成於相變合金表面。因此,可抑制在使用研磨用組成物進行研磨後之相變合金的過剩蝕刻。其結果可抑制過剩研磨。
研磨用組成物中,金屬防蝕劑之含有量之上限,較佳為10質量%,又較佳為5質量%,更佳為1質量%。隨著金屬防蝕劑之含有量減少,藉由研磨用組成物之研磨速度具有提昇之效果。
研磨用組成物中,金屬防蝕劑之含有量之下限,較佳為0.001質量%,又較佳為0.01質量%,更佳為0.1質量%。隨著金屬防蝕劑之含有量增加,可抑制在使用研磨用組成物進行研磨後之相變合金的過剩蝕刻。其結果可抑制過剩研磨。
本發明之其他實施形態為提供一種研磨方法,其係使用本發明之研磨用組成物用來研磨具有相變合金之研磨對象物之表面。作為可在本研磨方法中使用之墊片(pads),可使用不織布、發泡聚胺基甲酸酯(PU)、多孔質氟樹脂等,並無特別限制。此外,可在研磨墊片上施以溝槽加工以使研磨用組成物容易停留在研磨墊片上。
研磨具有相變合金之研磨對象物的研磨墊片,該研磨墊片之硬度之下限,以蕭氏硬度D計較佳為50。當墊片的蕭氏硬度D愈高時,墊片的機械性作用愈大,可提升研磨速度。此外,本發明實施形態之研磨用組成物係具有,即使為未含有研磨粒,亦可得到所謂的高研磨速度之優點。由如此般之觀點而言,蕭氏硬度D之又較佳的下限為60。
研磨具有相變合金之研磨對象物的研磨墊片,該研磨墊片之硬度之上限,以蕭氏硬度D計較佳為99。當墊片的蕭氏硬度D愈低時,愈不易使研磨對象物形成損傷。由如此般之觀點而言,蕭氏硬度D之更佳的上限為95。當墊片硬度未滿50時,墊片之機械性作用會變小,研磨速度會降低。尚,蕭氏硬度D,就定義上不會有100以上之值。墊片的蕭氏硬度D,可藉由蕭氏硬度D測定儀來測定。
蕭氏硬度D為50以上之研磨墊片,可由發泡體所形成,或是由布、不織布等之非發泡體所形成;作為研磨墊片之材質,可使用聚胺基甲酸酯、丙烯酸、聚酯、丙烯酸-酯共聚物、聚四氟乙烯、聚丙烯、聚乙烯、聚4-甲基戊烯、纖維素、纖維素酯、尼龍及醯胺等之聚醯胺、聚醯亞胺、聚醯亞胺醯胺、聚矽氧烷共聚物、環氧乙烷化合物、酚樹脂、聚苯乙烯、聚碳酸酯、環氧樹脂等之樹脂。
藉由本實施形態,可得到下列作用及效果。
用來研磨以往含有金屬之表面的典型研磨用組成物,
係藉由該研磨用組成物中所包含的氧化劑來使研磨對象之金屬氧化,以形成金屬氧化物,進而再藉由以錯化劑來使金屬氧化物溶解,而進行研磨。相較於此係認為本實施形態之研磨用組成物,該研磨用組成物中所包含的脆性膜形成劑會與相變合金表面進行錯合化,而形成不溶性膜,並以研磨粒機械性研磨該不溶性膜。其結果可提昇研磨速度。
前述實施形態亦可變更如下。
‧前述實施形態之研磨用組成物,因應所需可進而含有界面活性劑或水溶性高分子、防腐劑般之一般所公知的添加劑。
‧前述實施形態之研磨用組成物,可為單液型或是以雙液型為首之多液型。
‧前述實施形態之研磨用組成物,可藉由以水來稀釋研磨用組成物之原液而調製出。
接著說明本發明之實施例及比較例。
藉由將各成分以成為如表1中所記載之組成之方式予以混合,而調整出實施例1~14及比較例1~21之研磨用組成物。表1中的“脆性膜形成劑”欄之“種類”欄中,實施例時為表示選自各研磨用組成物中所包含的飽和單羧酸及有機磷化合物之脆性膜形成劑之種類;比較例時為表示選自該飽和單羧酸及有機磷化合物之脆性膜形成劑以外
的添加劑之種類,或是表示各研磨用組成物中所包含的由錯化劑、防蝕劑(其係用來研磨以往含有金屬之表面的典型研磨用組成物中所含有者)所選定的添加劑之種類。又,“含有量(質量%)”欄中為表示各研磨用組成物中該脆性膜形成劑或脆性膜形成劑以外的添加劑之含有量。同欄當中以“-”表示者,為未含有該脆性膜形成劑或脆性膜形成劑以外的添加劑之意。表1的“pH”欄中為表示各研磨用組成物中的pH。又,表1中的研磨粒為使用具有約60nm之平均二次粒徑(平均一次粒徑30nm)的膠體矽石,並於“研磨粒”欄中表示含有量。又,pH為添加無機酸或無機鹼,以調整成指定之值。尚,雖然表1中未表示出來,但各研磨用組成物中為添加有如2.1質量%般的過氧化氫來作為氧化劑。
使用實施例1~14及比較例1~21之各研磨用組成物,並以表2所示之條件來研磨含有GST合金(Ge、Sb及Te的質量%比為2:2:5)之無圖型晶圓(blanket wafer)。關於以表2所示條件進行一定時間研磨時之研磨速度,係依據直流四探針法所進行的薄片電阻(sheet resistance)的測定中,由所求取的研磨前後的無圖型晶圓之厚度差,除以研磨時間來算出研磨速度。該結果為表示於表1中“評估”欄之“研磨速度”欄。
如表1中所示般,相較於使用未符合本發明條件之比較例1~21之研磨用組成物,使用實施例1~14之研磨用組成物時,在研磨速度確認得到顯著優異之功效。
Claims (11)
- 一種研磨用組成物,其係使用於研磨具有相變合金之研磨對象物之用途之研磨用組成物,其特徵為包含研磨粒及脆性膜形成劑,前述脆性膜形成劑為選自於飽和單羧酸及有機磷化合物之至少1種以上。
- 如請求項1之研磨用組成物,其中前述研磨粒為膠體矽石。
- 如請求項2之研磨用組成物,其中前述膠體矽石為使有機酸固定化的膠體矽石。
- 如請求項1之研磨用組成物,其中前述脆性膜形成劑為選自於飽和單羧酸之至少1種以上。
- 如請求項4之研磨用組成物,其中前述飽和單羧酸為選自於乙酸、乙醇酸、乳酸及水楊酸之至少1種以上。
- 如請求項1之研磨用組成物,其中前述脆性膜形成劑為選自於有機磷化合物之至少1種以上。
- 如請求項6之研磨用組成物,其中前述有機磷酸為選自於膦酸、烷基膦酸、HEDP及次膦酸之至少1種以上。
- 一種研磨用組成物,其係使用於研磨具有相變合金之研磨對象物之用途之研磨用組成物,其特徵為包含脆性膜形成劑。
- 如請求項1~8中任一項之研磨用組成物,其中前述相變合金為GST。
- 一種研磨方法,其特徵係使用請求項1~8中任一項之研磨用組成物來研磨具有相變合金之研磨對象物之表面。
- 一種基板之製造方法,其特徵係具有使用請求項1~8中任一項之研磨用組成物來研磨具有相變合金之研磨對象物之表面之步驟。
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Country Status (5)
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US (1) | US9631121B2 (zh) |
JP (1) | JP2013247341A (zh) |
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WO2015140850A1 (ja) * | 2014-03-20 | 2015-09-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
WO2016052408A1 (ja) * | 2014-09-30 | 2016-04-07 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP6100231B2 (ja) * | 2014-12-15 | 2017-03-22 | 株式会社藤商事 | 弾球遊技機 |
JP7133401B2 (ja) * | 2017-09-26 | 2022-09-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 |
CN110656334B (zh) * | 2019-11-06 | 2021-12-07 | 深圳市鑫鸿达清洗技术有限公司 | 一种不含磷元素和氮元素的环境友好型铝材化学抛光液 |
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JP2000349052A (ja) * | 1999-06-04 | 2000-12-15 | Seimi Chem Co Ltd | Mn2O3粒子を含有する半導体用研磨剤 |
US6527817B1 (en) | 1999-11-15 | 2003-03-04 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
US6293848B1 (en) | 1999-11-15 | 2001-09-25 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
JP2002198331A (ja) * | 2000-12-26 | 2002-07-12 | Jsr Corp | 研磨方法 |
JP4231632B2 (ja) | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
JP2003303792A (ja) * | 2002-04-10 | 2003-10-24 | Nippon Shokubai Co Ltd | 化学機械研磨用水系分散体と研磨方法 |
DE602006004624D1 (de) * | 2005-02-23 | 2009-02-26 | Jsr Corp | Chemisch-mechanisches Polierverfahren |
WO2006105020A1 (en) * | 2005-03-25 | 2006-10-05 | Dupont Air Products Nanomaterials Llc | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
JP4792802B2 (ja) * | 2005-04-26 | 2011-10-12 | 住友電気工業株式会社 | Iii族窒化物結晶の表面処理方法 |
US7897061B2 (en) | 2006-02-01 | 2011-03-01 | Cabot Microelectronics Corporation | Compositions and methods for CMP of phase change alloys |
JP2007299979A (ja) * | 2006-05-01 | 2007-11-15 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶の表面処理方法およびiii族窒化物結晶基板 |
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US20100190339A1 (en) | 2007-07-26 | 2010-07-29 | Zhan Chen | Compositions and methods for chemical-mechanical polishing of phase change materials |
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JP5760317B2 (ja) | 2010-02-05 | 2015-08-05 | 日立化成株式会社 | Cmp研磨液及びこのcmp研磨液を用いた研磨方法 |
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- 2013-03-12 US US14/403,497 patent/US9631121B2/en active Active
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- 2013-03-13 TW TW102108840A patent/TW201402732A/zh unknown
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Also Published As
Publication number | Publication date |
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TWI557218B (zh) | 2016-11-11 |
WO2013179721A1 (ja) | 2013-12-05 |
KR102052015B1 (ko) | 2019-12-04 |
US20150152290A1 (en) | 2015-06-04 |
TW201404873A (zh) | 2014-02-01 |
WO2013179716A1 (ja) | 2013-12-05 |
TW201402732A (zh) | 2014-01-16 |
TW201350565A (zh) | 2013-12-16 |
US9631121B2 (en) | 2017-04-25 |
WO2013179717A1 (ja) | 2013-12-05 |
WO2013179719A1 (ja) | 2013-12-05 |
JP2013247341A (ja) | 2013-12-09 |
WO2013179720A1 (ja) | 2013-12-05 |
TW201402798A (zh) | 2014-01-16 |
KR20150020320A (ko) | 2015-02-25 |
WO2013179718A1 (ja) | 2013-12-05 |
TW201404874A (zh) | 2014-02-01 |
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