TW201326376A - 研磨用組成物 - Google Patents
研磨用組成物 Download PDFInfo
- Publication number
- TW201326376A TW201326376A TW101135840A TW101135840A TW201326376A TW 201326376 A TW201326376 A TW 201326376A TW 101135840 A TW101135840 A TW 101135840A TW 101135840 A TW101135840 A TW 101135840A TW 201326376 A TW201326376 A TW 201326376A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- acid
- polishing composition
- phase change
- change alloy
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 195
- 239000000203 mixture Substances 0.000 title claims abstract description 124
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 77
- 239000000956 alloy Substances 0.000 claims abstract description 77
- 230000008859 change Effects 0.000 claims abstract description 73
- -1 ammonium ions Chemical class 0.000 claims abstract description 58
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 25
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 25
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 20
- 150000007524 organic acids Chemical class 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 9
- 150000003863 ammonium salts Chemical class 0.000 claims description 8
- 150000007522 mineralic acids Chemical class 0.000 claims description 8
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 7
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 229910000929 Ru alloy Inorganic materials 0.000 claims 1
- WMOJAWPGEQWAMM-UHFFFAOYSA-N [Ir].[Ru].[Ru] Chemical compound [Ir].[Ru].[Ru] WMOJAWPGEQWAMM-UHFFFAOYSA-N 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000006061 abrasive grain Substances 0.000 abstract 1
- 239000008119 colloidal silica Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 26
- 239000007800 oxidant agent Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
- 230000007797 corrosion Effects 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 239000003112 inhibitor Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 239000012782 phase change material Substances 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 238000000227 grinding Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910052732 germanium Inorganic materials 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 239000011164 primary particle Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000003082 abrasive agent Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 230000002776 aggregation Effects 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 description 6
- 239000008139 complexing agent Substances 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 229910052714 tellurium Inorganic materials 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 150000002391 heterocyclic compounds Chemical class 0.000 description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 235000015165 citric acid Nutrition 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 4
- 239000011163 secondary particle Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 3
- PZOUSPYUWWUPPK-UHFFFAOYSA-N 4-methyl-1h-indole Chemical compound CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000001630 malic acid Substances 0.000 description 3
- 235000011090 malic acid Nutrition 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- BHNHHSOHWZKFOX-UHFFFAOYSA-N 2-methyl-1H-indole Chemical compound C1=CC=C2NC(C)=CC2=C1 BHNHHSOHWZKFOX-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- ONYNOPPOVKYGRS-UHFFFAOYSA-N 6-methylindole Natural products CC1=CC=C2C=CNC2=C1 ONYNOPPOVKYGRS-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 2
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- FFDGPVCHZBVARC-UHFFFAOYSA-N N,N-dimethylglycine Chemical compound CN(C)CC(O)=O FFDGPVCHZBVARC-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- QWCKQJZIFLGMSD-UHFFFAOYSA-N alpha-aminobutyric acid Chemical compound CCC(N)C(O)=O QWCKQJZIFLGMSD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229940024606 amino acid Drugs 0.000 description 2
- 235000001014 amino acid Nutrition 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 150000004770 chalcogenides Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical compound NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 description 2
- DDRJAANPRJIHGJ-UHFFFAOYSA-N creatinine Chemical compound CN1CC(=O)NC1=N DDRJAANPRJIHGJ-UHFFFAOYSA-N 0.000 description 2
- 235000018417 cysteine Nutrition 0.000 description 2
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 229940071870 hydroiodic acid Drugs 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229940045996 isethionic acid Drugs 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-N isocaproic acid Chemical compound CC(C)CCC(O)=O FGKJLKRYENPLQH-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229910052699 polonium Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 2
- ZFRKQXVRDFCRJG-UHFFFAOYSA-N skatole Chemical compound C1=CC=C2C(C)=CNC2=C1 ZFRKQXVRDFCRJG-UHFFFAOYSA-N 0.000 description 2
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004474 valine Substances 0.000 description 2
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 description 1
- AGNGYMCLFWQVGX-AGFFZDDWSA-N (e)-1-[(2s)-2-amino-2-carboxyethoxy]-2-diazonioethenolate Chemical compound OC(=O)[C@@H](N)CO\C([O-])=C\[N+]#N AGNGYMCLFWQVGX-AGFFZDDWSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- NYPYHUZRZVSYKL-UHFFFAOYSA-N -3,5-Diiodotyrosine Natural products OC(=O)C(N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-UHFFFAOYSA-N 0.000 description 1
- FMCUPJKTGNBGEC-UHFFFAOYSA-N 1,2,4-triazol-4-amine Chemical compound NN1C=NN=C1 FMCUPJKTGNBGEC-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 1
- LUTLAXLNPLZCOF-UHFFFAOYSA-N 1-Methylhistidine Natural products OC(=O)C(N)(C)CC1=NC=CN1 LUTLAXLNPLZCOF-UHFFFAOYSA-N 0.000 description 1
- HBOMLICNUCNMMY-KJFJCRTCSA-N 1-[(4s,5s)-4-azido-5-(hydroxymethyl)oxolan-2-yl]-5-methylpyrimidine-2,4-dione Chemical compound O=C1NC(=O)C(C)=CN1C1O[C@H](CO)[C@@H](N=[N+]=[N-])C1 HBOMLICNUCNMMY-KJFJCRTCSA-N 0.000 description 1
- MWZDIEIXRBWPLG-UHFFFAOYSA-N 1-methyl-1,2,4-triazole Chemical compound CN1C=NC=N1 MWZDIEIXRBWPLG-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- BLRHMMGNCXNXJL-UHFFFAOYSA-N 1-methylindole Chemical compound C1=CC=C2N(C)C=CC2=C1 BLRHMMGNCXNXJL-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- UFLWECJWSGWVHB-UHFFFAOYSA-N 1H-carbazole Chemical compound C1=CC=C2C3=CC=CCC3=NC2=C1 UFLWECJWSGWVHB-UHFFFAOYSA-N 0.000 description 1
- ZCBIFHNDZBSCEP-UHFFFAOYSA-N 1H-indol-5-amine Chemical compound NC1=CC=C2NC=CC2=C1 ZCBIFHNDZBSCEP-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- LJVQHXICFCZRJN-UHFFFAOYSA-N 1h-1,2,4-triazole-5-carboxylic acid Chemical compound OC(=O)C1=NC=NN1 LJVQHXICFCZRJN-UHFFFAOYSA-N 0.000 description 1
- KOPFEFZSAMLEHK-UHFFFAOYSA-N 1h-pyrazole-5-carboxylic acid Chemical compound OC(=O)C=1C=CNN=1 KOPFEFZSAMLEHK-UHFFFAOYSA-N 0.000 description 1
- CPAGZVLINCPJEH-UHFFFAOYSA-N 2-(1-methyl-1h-imidazol-5-yl)ethan-1-amine Chemical compound CN1C=NC=C1CCN CPAGZVLINCPJEH-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- OXQGTIUCKGYOAA-UHFFFAOYSA-N 2-Ethylbutanoic acid Chemical compound CCC(CC)C(O)=O OXQGTIUCKGYOAA-UHFFFAOYSA-N 0.000 description 1
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 1
- GLVYLTSKTCWWJR-UHFFFAOYSA-N 2-carbonoperoxoylbenzoic acid Chemical compound OOC(=O)C1=CC=CC=C1C(O)=O GLVYLTSKTCWWJR-UHFFFAOYSA-N 0.000 description 1
- AYPSHJCKSDNETA-UHFFFAOYSA-N 2-chloro-1h-benzimidazole Chemical compound C1=CC=C2NC(Cl)=NC2=C1 AYPSHJCKSDNETA-UHFFFAOYSA-N 0.000 description 1
- LDZYRENCLPUXAX-UHFFFAOYSA-N 2-methyl-1h-benzimidazole Chemical compound C1=CC=C2NC(C)=NC2=C1 LDZYRENCLPUXAX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- WLAMNBDJUVNPJU-UHFFFAOYSA-N 2-methylbutyric acid Chemical compound CCC(C)C(O)=O WLAMNBDJUVNPJU-UHFFFAOYSA-N 0.000 description 1
- CVKMFSAVYPAZTQ-UHFFFAOYSA-N 2-methylhexanoic acid Chemical compound CCCCC(C)C(O)=O CVKMFSAVYPAZTQ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- MLMQPDHYNJCQAO-UHFFFAOYSA-N 3,3-dimethylbutyric acid Chemical compound CC(C)(C)CC(O)=O MLMQPDHYNJCQAO-UHFFFAOYSA-N 0.000 description 1
- HTAVZCVYBKYBBM-UHFFFAOYSA-N 3,5-diheptyl-1,2,4-triazol-4-amine Chemical compound CCCCCCCC1=NN=C(CCCCCCC)N1N HTAVZCVYBKYBBM-UHFFFAOYSA-N 0.000 description 1
- NYPYHUZRZVSYKL-ZETCQYMHSA-N 3,5-diiodo-L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-ZETCQYMHSA-N 0.000 description 1
- MIIKMZAVLKMOFM-UHFFFAOYSA-N 3,5-dimethyl-1,2,4-triazol-4-amine Chemical compound CC1=NN=C(C)N1N MIIKMZAVLKMOFM-UHFFFAOYSA-N 0.000 description 1
- QQHNFZBYCQMAOD-UHFFFAOYSA-N 3,5-dipropyl-1,2,4-triazol-4-amine Chemical compound CCCC1=NN=C(CCC)N1N QQHNFZBYCQMAOD-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- YNJSNEKCXVFDKW-UHFFFAOYSA-N 3-(5-amino-1h-indol-3-yl)-2-azaniumylpropanoate Chemical compound C1=C(N)C=C2C(CC(N)C(O)=O)=CNC2=C1 YNJSNEKCXVFDKW-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- LOTVQXNRIAEYCG-UHFFFAOYSA-N 3-hydroxy-2-(hydroxymethyl)-2-[hydroxymethyl(methyl)amino]propanoic acid Chemical compound OCN(C)C(CO)(CO)C(O)=O LOTVQXNRIAEYCG-UHFFFAOYSA-N 0.000 description 1
- ZOPIBCDDKMAEII-UHFFFAOYSA-N 4-(1,2,4-triazol-1-yl)phenol Chemical compound C1=CC(O)=CC=C1N1N=CN=C1 ZOPIBCDDKMAEII-UHFFFAOYSA-N 0.000 description 1
- DFYGYTNMHPUJBY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane-1-thiol Chemical compound SCCCC(C(OC)(OC)OC)CCCCCCCC DFYGYTNMHPUJBY-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- MVPKIPGHRNIOPT-UHFFFAOYSA-N 5,6-dimethyl-2h-benzotriazole Chemical compound C1=C(C)C(C)=CC2=NNN=C21 MVPKIPGHRNIOPT-UHFFFAOYSA-N 0.000 description 1
- LJUQGASMPRMWIW-UHFFFAOYSA-N 5,6-dimethylbenzimidazole Chemical compound C1=C(C)C(C)=CC2=C1NC=N2 LJUQGASMPRMWIW-UHFFFAOYSA-N 0.000 description 1
- QGLMSZQOJZAPSZ-UHFFFAOYSA-N 5-benzyl-1h-1,2,4-triazol-3-amine Chemical compound NC1=NNC(CC=2C=CC=CC=2)=N1 QGLMSZQOJZAPSZ-UHFFFAOYSA-N 0.000 description 1
- XXAMCWVPBITOGA-UHFFFAOYSA-N 5-bromo-3-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NNC(Br)=N1 XXAMCWVPBITOGA-UHFFFAOYSA-N 0.000 description 1
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 1
- UHOFPBXQUTZOKZ-UHFFFAOYSA-N 5-methyl-1,2,4-triazole-3,4-diamine Chemical compound CC1=NN=C(N)N1N UHOFPBXQUTZOKZ-UHFFFAOYSA-N 0.000 description 1
- FJRZOOICEHBAED-UHFFFAOYSA-N 5-methyl-1h-1,2,4-triazol-3-amine Chemical compound CC1=NNC(N)=N1 FJRZOOICEHBAED-UHFFFAOYSA-N 0.000 description 1
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 description 1
- YPKBCLZFIYBSHK-UHFFFAOYSA-N 5-methylindole Chemical compound CC1=CC=C2NC=CC2=C1 YPKBCLZFIYBSHK-UHFFFAOYSA-N 0.000 description 1
- KUEFXPHXHHANKS-UHFFFAOYSA-N 5-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NC=NN1 KUEFXPHXHHANKS-UHFFFAOYSA-N 0.000 description 1
- AOCDQWRMYHJTMY-UHFFFAOYSA-N 5-nitro-2h-benzotriazole Chemical compound C1=C([N+](=O)[O-])C=CC2=NNN=C21 AOCDQWRMYHJTMY-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- ZMAXXOYJWZZQBK-UHFFFAOYSA-N 5334-40-7 Chemical compound OC(=O)C1=NNC=C1[N+]([O-])=O ZMAXXOYJWZZQBK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KGWPHCDTOLQQEP-UHFFFAOYSA-N 7-methylindole Chemical compound CC1=CC=CC2=C1NC=C2 KGWPHCDTOLQQEP-UHFFFAOYSA-N 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- 108010011485 Aspartame Proteins 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- KDFWBTSKTAIPEK-UHFFFAOYSA-H C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].[Bi+3].[In+3].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-] Chemical compound C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].[Bi+3].[In+3].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-].C(C=1C(C(=O)[O-])=CC=CC1)(=O)[O-] KDFWBTSKTAIPEK-UHFFFAOYSA-H 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- GXIWMALOYDSQMW-UHFFFAOYSA-N ClCl(=O)=O Chemical compound ClCl(=O)=O GXIWMALOYDSQMW-UHFFFAOYSA-N 0.000 description 1
- YPWSLBHSMIKTPR-UHFFFAOYSA-N Cystathionine Natural products OC(=O)C(N)CCSSCC(N)C(O)=O YPWSLBHSMIKTPR-UHFFFAOYSA-N 0.000 description 1
- ILRYLPWNYFXEMH-UHFFFAOYSA-N D-cystathionine Natural products OC(=O)C(N)CCSCC(N)C(O)=O ILRYLPWNYFXEMH-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- XUIIKFGFIJCVMT-GFCCVEGCSA-N D-thyroxine Chemical compound IC1=CC(C[C@@H](N)C(O)=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 XUIIKFGFIJCVMT-GFCCVEGCSA-N 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical class [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 1
- AHLPHDHHMVZTML-BYPYZUCNSA-N L-Ornithine Chemical compound NCCC[C@H](N)C(O)=O AHLPHDHHMVZTML-BYPYZUCNSA-N 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- RHGKLRLOHDJJDR-BYPYZUCNSA-N L-citrulline Chemical compound NC(=O)NCCC[C@H]([NH3+])C([O-])=O RHGKLRLOHDJJDR-BYPYZUCNSA-N 0.000 description 1
- ILRYLPWNYFXEMH-WHFBIAKZSA-N L-cystathionine Chemical compound [O-]C(=O)[C@@H]([NH3+])CCSC[C@H]([NH3+])C([O-])=O ILRYLPWNYFXEMH-WHFBIAKZSA-N 0.000 description 1
- LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
- GGLZPLKKBSSKCX-YFKPBYRVSA-N L-ethionine Chemical compound CCSCC[C@H](N)C(O)=O GGLZPLKKBSSKCX-YFKPBYRVSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 description 1
- DWPCPZJAHOETAG-IMJSIDKUSA-N L-lanthionine Chemical compound OC(=O)[C@@H](N)CSC[C@H](N)C(O)=O DWPCPZJAHOETAG-IMJSIDKUSA-N 0.000 description 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- BRMWTNUJHUMWMS-LURJTMIESA-N N(tele)-methyl-L-histidine Chemical compound CN1C=NC(C[C@H](N)C(O)=O)=C1 BRMWTNUJHUMWMS-LURJTMIESA-N 0.000 description 1
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 description 1
- RHGKLRLOHDJJDR-UHFFFAOYSA-N Ndelta-carbamoyl-DL-ornithine Natural products OC(=O)C(N)CCCNC(N)=O RHGKLRLOHDJJDR-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- AHLPHDHHMVZTML-UHFFFAOYSA-N Orn-delta-NH2 Natural products NCCCC(N)C(O)=O AHLPHDHHMVZTML-UHFFFAOYSA-N 0.000 description 1
- UTJLXEIPEHZYQJ-UHFFFAOYSA-N Ornithine Natural products OC(=O)C(C)CCCN UTJLXEIPEHZYQJ-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Natural products C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 108010077895 Sarcosine Proteins 0.000 description 1
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 description 1
- 239000004473 Threonine Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- SEQKRHFRPICQDD-UHFFFAOYSA-N Tricine Natural products OCC(CO)(CO)[NH2+]CC([O-])=O SEQKRHFRPICQDD-UHFFFAOYSA-N 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- SMWDFEZZVXVKRB-UHFFFAOYSA-N anhydrous quinoline Natural products N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 229960003121 arginine Drugs 0.000 description 1
- IAOZJIPTCAWIRG-QWRGUYRKSA-N aspartame Chemical compound OC(=O)C[C@H](N)C(=O)N[C@H](C(=O)OC)CC1=CC=CC=C1 IAOZJIPTCAWIRG-QWRGUYRKSA-N 0.000 description 1
- 239000000605 aspartame Substances 0.000 description 1
- 229960003438 aspartame Drugs 0.000 description 1
- 235000010357 aspartame Nutrition 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- 229950011321 azaserine Drugs 0.000 description 1
- ZJRXSAYFZMGQFP-UHFFFAOYSA-N barium peroxide Chemical compound [Ba+2].[O-][O-] ZJRXSAYFZMGQFP-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- XSCHRSMBECNVNS-UHFFFAOYSA-N benzopyrazine Natural products N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 1
- JCXKHYLLVKZPKE-UHFFFAOYSA-N benzotriazol-1-amine Chemical compound C1=CC=C2N(N)N=NC2=C1 JCXKHYLLVKZPKE-UHFFFAOYSA-N 0.000 description 1
- BJFLSHMHTPAZHO-UHFFFAOYSA-N benzotriazole Chemical compound [CH]1C=CC=C2N=NN=C21 BJFLSHMHTPAZHO-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- KYPIPCWVZKRJDD-UHFFFAOYSA-N benzotriazole-1-carboxylic acid Chemical compound C1=CC=C2N(C(=O)O)N=NC2=C1 KYPIPCWVZKRJDD-UHFFFAOYSA-N 0.000 description 1
- 229940000635 beta-alanine Drugs 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- GBFLZEXEOZUWRN-UHFFFAOYSA-N carbocisteine Chemical compound OC(=O)C(N)CSCC(O)=O GBFLZEXEOZUWRN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229960002173 citrulline Drugs 0.000 description 1
- 235000013477 citrulline Nutrition 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229960003624 creatine Drugs 0.000 description 1
- 239000006046 creatine Substances 0.000 description 1
- 229940109239 creatinine Drugs 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 229960002433 cysteine Drugs 0.000 description 1
- 229960003067 cystine Drugs 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- CEJLBZWIKQJOAT-UHFFFAOYSA-N dichloroisocyanuric acid Chemical compound ClN1C(=O)NC(=O)N(Cl)C1=O CEJLBZWIKQJOAT-UHFFFAOYSA-N 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 108700003601 dimethylglycine Proteins 0.000 description 1
- PMMYEEVYMWASQN-UHFFFAOYSA-N dl-hydroxyproline Natural products OC1C[NH2+]C(C([O-])=O)C1 PMMYEEVYMWASQN-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- YSMODUONRAFBET-UHNVWZDZSA-N erythro-5-hydroxy-L-lysine Chemical compound NC[C@H](O)CC[C@H](N)C(O)=O YSMODUONRAFBET-UHNVWZDZSA-N 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 description 1
- 229960002743 glutamine Drugs 0.000 description 1
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- RKKOMEIYHHASIN-UHFFFAOYSA-N hydroperoxyboronic acid Chemical compound OOB(O)O RKKOMEIYHHASIN-UHFFFAOYSA-N 0.000 description 1
- 229960002591 hydroxyproline Drugs 0.000 description 1
- CUILPNURFADTPE-UHFFFAOYSA-N hypobromous acid Chemical compound BrO CUILPNURFADTPE-UHFFFAOYSA-N 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- GEOVEUCEIQCBKH-UHFFFAOYSA-N hypoiodous acid Chemical compound IO GEOVEUCEIQCBKH-UHFFFAOYSA-N 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- AWJUIBRHMBBTKR-UHFFFAOYSA-N iso-quinoline Natural products C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 description 1
- 229960000310 isoleucine Drugs 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000002356 laser light scattering Methods 0.000 description 1
- 229960003646 lysine Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- DWPCPZJAHOETAG-UHFFFAOYSA-N meso-lanthionine Natural products OC(=O)C(N)CSCC(N)C(O)=O DWPCPZJAHOETAG-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- 229960004452 methionine Drugs 0.000 description 1
- QMPFMODFBNEYJH-UHFFFAOYSA-N methyl 1h-1,2,4-triazole-5-carboxylate Chemical compound COC(=O)C1=NC=NN1 QMPFMODFBNEYJH-UHFFFAOYSA-N 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229940078490 n,n-dimethylglycine Drugs 0.000 description 1
- 229940074355 nitric acid Drugs 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229960003104 ornithine Drugs 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- 229960005190 phenylalanine Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229940032330 sulfuric acid Drugs 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229960003080 taurine Drugs 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229940034208 thyroxine Drugs 0.000 description 1
- XUIIKFGFIJCVMT-UHFFFAOYSA-N thyroxine-binding globulin Natural products IC1=CC(CC([NH3+])C([O-])=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 XUIIKFGFIJCVMT-UHFFFAOYSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229960004295 valine Drugs 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- DYWSVUBJGFTOQC-UHFFFAOYSA-N xi-2-Ethylheptanoic acid Chemical compound CCCCCC(CC)C(O)=O DYWSVUBJGFTOQC-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本發明之研磨用組成物，為使用在對具有相變合金之研磨對象物進行研磨的用途之研磨用組成物，其特徵係含有銨離子(NH4+)。研磨用組成物，可進一步含有膠體二氧化矽等之研磨料。
Description
本發明係關於適合於具有相變合金之研磨對象物的研磨之研磨用組成物。
PRAM(相變隨機存取記憶體)裝置(亦作為雙向記憶體裝置或PCRAM裝置而為人所知)中，係應用有可用於電子記憶用途中而在絕緣性非晶質相與傳導性結晶相之間進行電切換之相變材料(PCM)。適用於該用途之典型的相變材料的例子，可列舉出週期表的VIB族(硫屬化物，例如Te或Po)及VB族(例如Sb)元素，與In、Ge、Ga、Sn、或Ag等之1種或複數種金屬元素之組合。特別有用之相變材料，為鍺(Ge)-銻(Sb)-碲(Te)合金(GST合金)。此等材料的物理狀態，係與加熱/冷卻速度、溫度、及時間相依而能夠可逆地變化。其他有用之相變合金的例子，係包含亞銻酸銦(InSb)。PRAM裝置中的記憶資訊，係藉由不同之物理相或狀態的傳導特性，以損失最小的方式來保存。
對半導體基材(例如積體電路)之含有金屬的表面進行研磨之方法，為人所知者有化學機械研磨(CMP：Chemical-mechanical Planarization)。CMP中所使用之研磨用組成物，典型而言，可含有研磨料、氧化劑及錯合劑並有效地應用蝕刻來研磨。
CMP，能夠用以製作出使用相變材料之記憶裝置而應
用。然而，與由銅(Cu)或鎢(W)般的單一成分所構成之先前的金屬層不同，相變材料係以能夠使硫(S)、鈰(Ce)、鍺(Ge)、銻(Sb)、碲(Te)、銀(Ag)、銦(In)、錫(Sn)、鎵(Ga)等之複數種元素在結晶相及非晶質相之間可逆地變化之特定比率來混合。因此，較多之相變材料(例如GST)的物理性質，與PCM晶片中所應用之其他材料相比為軟質等，係與以往之金屬層材料的物理性質不同。因而難以將現行用以對含有金屬的表面進行研磨之研磨用組成物，直接應用在相變材料的研磨用途中。
此般狀況中，對於適合於具有相變合金之研磨對象物的研磨之研磨用組成物，乃進行各種探討。例如專利文獻1中，係揭示一種以含有研磨料及氮化物且具有相變合金之研磨對象物的研磨為目的之研磨用組成物。此外，專利文獻2中，係揭示一種以含有研磨料、及鐵離子或鐵螯合錯合物且具有相變合金之研磨對象物的研磨為目的之研磨用組成物。然而，此等文獻中所揭示之研磨用組成物，仍不具備有作為具有相變合金之研磨對象物的研磨用途之充分的性能，乃期待進一步的改良。
[專利文獻1]日本特開2009-016821號公報
[專利文獻2]日本特開2009-016829號公報
因此，本發明之目的在於提供一種可適合地使用在對具有相變合金之研磨對象物進行研磨的用途之研磨用組成物。尤其提供一種不與用以對含有金屬的表面進行研磨時所使用之先前典型的研磨用組成物中所含有之氧化劑及錯合劑相依，而能夠提升相變合金的研磨速度之研磨用組成物。
本發明者們在經過精心探討後，結果發現到藉由含有銨離子之研磨用組成物，相對於具有相變合金之研磨對象物可得到高研磨速度。
亦即，為了達成上述目的，本發明之一項型態中，係提供一種研磨用組成物，其係使用在對具有GST合金等的相變合金之研磨對象物進行研磨的用途之研磨用組成物，其係含有銨離子(NH4 +)。
一項實施形態中，前述銨離子係作為氫氧化銨而添加。
其他實施形態中，前述銨離子係作為選自有機酸的銨鹽及無機酸的銨鹽之1種以上的銨鹽而添加。
研磨用組成物可進一步含有研磨料。
前述研磨料較佳為膠體二氧化矽。
本發明之其他型態中，係提供一種研磨方法，其係使用上述型態之研磨用組成物，對具有相變合金之研磨對象
物的表面進行研磨。
本發明之另外型態中，係提供一種相變裝置的製造方法，其係包含：使用上述型態之研磨用組成物，對具有相變合金之研磨對象物的表面進行研磨之步驟。
根據本發明，係提供一種可適合地使用在對具有相變合金之研磨對象物進行研磨的用途之研磨用組成物，尤其提供一種可提升相變合金的研磨速度之研磨用組成物。
以下係說明本發明之一實施形態。
本發明之研磨用組成物，係使用在對具有相變合金之研磨對象物進行研磨的用途，進一步說明，係使用在藉由對具有相變合金之研磨對象物的表面進行研磨而製造相變裝置之用途。相變合金，在PRAM(相變隨機存取記憶體)裝置(亦作為雙向記憶體裝置或PCRAM裝置而為人所知)中，係應用作為可用於電子記憶用途中而在絕緣性非晶質相與傳導性結晶相之間進行電切換之材料。適用於該用途之相變合金的例子，可列舉出週期表的VIB族(硫屬化物，例如Te或Po)及VB族(例如Sb)元素，與In、Ge、Ga、Sn、或Ag等之1種或複數種金屬元素之組合。特別有用之相變材料，為鍺(Ge)-銻(Sb)-碲(Te)合金(GST合金)。
本實施形態之研磨用組成物，係含有銨離子。為用以對含有金屬的表面進行研磨時所使用之先前典型的研磨用組成物之情形時，係藉由同樣於研磨用組成物中所含有之錯合劑的作用，將藉由該研磨用組成物中所含有之氧化劑的作用使研磨對象的金屬氧化所產生之金屬氧化物予以溶解而進行金屬的研磨。相對於此，使用本實施形態之研磨用組成物來研磨相變合金時，該研磨用組成物中所含有之銨離子錯合形成於相變合金的表面並鍵結，而在相變合金的表面上形成不溶性的脆性膜。由於該脆性膜可藉由機械研磨作用容易地去除，所以可藉由本實施形態之研磨用組成物，以高研磨速度來研磨相變合金。
銨離子，可作為氨水(氫氧化銨)而添加於研磨用組成物，或是將作為氣體的氨添加於研磨用組成物並溶解，此外，亦可作為由酸與氨所構成之鹽來添加。
當使用由酸與氨所構成之鹽作為銨離子源時，酸的種類並無特別限定。惟較佳係使用在研磨用組成物中容易使銨離子解離之鹽。與氨一同形成滿足此條件之鹽之酸，無機酸，可列舉出鹽酸、硝酸、磷酸、硫酸、硼酸等；有機酸，可列舉出甲酸、乙酸、丙酸等之脂肪酸；苯甲酸、鄰苯二甲酸等之芳香族羧酸；檸檬酸、草酸、酒石酸、蘋果酸、馬來酸、富馬酸、琥珀酸、有機磺酸、有機膦酸等。銨鹽可單獨使用1種或組合2種以上使用。不論為何，係以在研磨用組成物中盡可能不形成鹽而能夠存在作為銨離子者為佳。
研磨用組成物中之銨離子的含量的上限，以氨水換算較佳為5mol/L，尤佳為3mol/L，更佳為1mol/L。隨著銨離子的含量減少，可降低研磨用組成物的製造成本，並且安全性提高，所以可提升研磨用組成物的處理容易度。
研磨用組成物中之銨離子的含量的下限，以氨水換算較佳為0.001mol/L，尤佳為0.01mol/L，更佳為0.1mol/L。隨著銨離子的含量增多，可提升研磨用組成物研磨相變合金之研磨速度。
研磨用組成物的pH之上限並無特別限定，較佳為12，尤佳為10。隨著pH變小，可提升研磨用組成物的處理容易度。
研磨用組成物的pH之下限亦無特別限定，較佳為1，尤佳為3。pH愈高，將研磨料添加於研磨用組成物時愈可提升研磨用組成物中之研磨料的分散性。
將研磨用組成物的pH調整為期望的值時，可使用pH調整劑。所使用之pH調整劑，可為酸或鹼，此外亦可為無機及有機化合物中的任一種。
研磨用組成物可含有研磨料。研磨料可為無機粒子、有機粒子、及有機無機複合粒子中的任一種。無機粒子的具體例，例如可列舉出由二氧化矽、氧化鋁、氧化鈰、氧
化鈦等之金屬氧化物所構成之粒子，以及氮化矽粒子、碳化矽粒子及氮化硼粒子。有機粒子的具體例，例如可列舉出聚甲基丙烯酸甲酯(PMMA)粒子。當中較佳為二氧化矽粒子，特佳為膠體二氧化矽。
研磨料可經表面改質。一般的膠體二氧化矽，由於在酸性條件下動電勢之值接近於零，所以在酸性條件下，二氧化矽粒子彼此不會相互呈電相斥而容易凝聚。相對於此，即使在酸性條件下動電勢亦具有相對較大的正或負值之經表面改質之研磨料，在酸性條件下亦可彼此強力相斥而良好地分散，其結果可提升研磨用組成物的保存穩定性。此般經表面改質之研磨料，例如可將鋁、鈦或鋯等之金屬或此等的氧化物與研磨料混合以摻雜於研磨料的表面而得。
或者是，研磨用組成物中之經表面改質之研磨料，可為有機酸經固定之二氧化矽。當中較佳為有機酸經固定之膠體二氧化矽。有機酸對膠體二氧化矽之固定，是藉由將有機酸的官能基化學鍵結於膠體二氧化矽的表面來進行。僅使膠體二氧化矽與有機酸共存者，乃無法達成有機酸對膠體二氧化矽之固定。將有機酸的一種之磺酸固定於膠體二氧化矽者，例如可藉由“Sulfonic acid-functionalized silica through quantitative oxidation of thiol groups”,Chem.Commu.246-247(2003)所記載之方法來進行。具體而言，可在將3-巰丙基三甲氧矽烷等之具有硫醇基之矽烷偶合劑偶合於膠體二氧化矽後，以過氧化氫將硫醇基氧
化而得到磺酸固定於表面之膠體二氧化矽。或者是，將羧酸固定於膠體二氧化矽者，例如可藉由“Novel Silane Coupling Agents Containing a Photolabile 2-Nitrobenzyl Ester for Introduction of a Carboxy Group on the Surface of Silica Gel”,Chemistry Letters,3,228-229(2000)所記載之方法來進行。具體而言，可將含有光反應性的2-硝基苄酯之矽烷偶合劑偶合於膠體二氧化矽後，進行光照射而得到羧酸固定於表面之膠體二氧化矽。
研磨用組成物中之研磨料的含量，較佳為0.1質量%以上，尤佳為0.5質量%以上，更佳為1質量%以上。隨著研磨料的含量增多，乃具有可提升研磨用組成物研磨相變合金之速度之優點。
此外，研磨用組成物中之研磨料的含量，較佳為20質量%以下，尤佳為15質量%以下，更佳為10質量%以下。隨著研磨料的含量減少，可抑制研磨用組成物的材料成本，並且不易引起研磨料的凝聚。此外，藉由使用研磨用組成物來研磨相變合金，可容易得到表面缺陷少之研磨面。
研磨料的平均一次粒徑，較佳為5nm以上，尤佳為7nm以上，更佳為10nm以上。隨著研磨料的平均一次粒徑增大，乃有利於提升研磨用組成物研磨相變合金之速度。研磨料的平均一次粒徑之值，例如可根據由BET法所測定之研磨料的比表面積來計算。
此外，研磨料的平均一次粒徑，較佳為100nm以
下，尤佳為90nm以下，更佳為80nm以下。隨著研磨料的平均一次粒徑減少，可藉由使用研磨用組成物來研磨相變合金而容易得到表面缺陷少之研磨面。
研磨料的平均二次粒徑，較佳為150nm以下，尤佳為120nm以下，更佳為100nm以下。研磨料的平均二次粒徑之值，例如可藉由雷射光散射法來測定。
研磨料之以平均一次粒徑之值除上平均二次粒徑之值所得之研磨料的平均聚集度，較佳為1.2以上，尤佳為1.5以上。隨著研磨料的平均聚集度增大，乃具有可提升研磨用組成物研磨相變合金之速度之優點。
此外，研磨料的平均聚集度，較佳為4以下，尤佳為3以下，更佳為2以下。隨著研磨料的平均聚集度降低，藉由使用研磨用組成物來研磨相變合金，可容易得到表面缺陷少之研磨面。
研磨用組成物可含有氧化劑。氧化劑係具有將研磨對象物的表面氧化之作用，並可視為具有有助於使研磨用組成物中所含有之銨離子與相變合金表面錯合形成而形成不溶性的脆性膜之效果。其結果為，當將氧化劑添加於研磨用組成物時，乃具有提升研磨用組成物研磨相變合金之速度之效果。然而，當使用用以對含有金屬的表面進行研磨所使用之先前典型的研磨用組成物來研磨相變合金時，相變合金容易被過度研磨。此可考量為相變合金的特性與銅
般之一般半導體裝置中所使用之金屬材料的特性不同之故。
研磨用組成物中之氧化劑的含量之上限，較佳為10質量%，尤佳為5質量%。隨著氧化劑的含量減少，不易引起氧化劑對相變合金所造成的過剩氧化，而抑制相變合金的過剩研磨。
研磨用組成物中之氧化劑的含量之下限，較佳為0.1質量%，尤佳為0.3質量%。隨著氧化劑的含量增多，有助於提升相變合金的研磨速度。
能夠使用之氧化劑，例如有過氧化物。過氧化物的具體例，例如可列舉出過氧化氫、過氧化鋇、過乙酸、過碳酸鹽、過氧化脲、過甲酸、過苯甲酸、過鄰苯二甲酸、過氧二硫酸、過氧磷酸、過氧硫酸、過氧硼酸及過氫氯酸、以及過硫酸鈉、過硫酸鉀及過硫酸銨等之過硫酸鹽。此外，亦可使用有機氧化劑、臭氧水、銀(II)鹽、鐵(III)鹽、過錳酸、鉻酸、重鉻酸、次氯酸、次溴酸、次碘酸、氫氯酸、亞氯酸、氫溴酸、氫碘酸、過氫碘酸、硫酸、硝酸、亞硝酸、檸檬酸、二氯異氰尿酸及此等之鹽，作為氧化劑。當中就研磨速度之觀點來看，較佳為過硫酸鹽及過氧化氫，就水溶液中的穩定性及對環境負荷之觀點來看，特佳為過氧化氫。
研磨用組成物可含有錯合劑。錯合劑係具有將相變合
金的表面化學蝕刻之作用，而具有提升研磨用組成物研磨相變合金之速度之功用。然而，當使用用以對含有金屬的表面進行研磨所使用之先前典型的研磨用組成物來研磨相變合金時，會引起相變合金的過度研磨，其結果為，相變合金容易被過度研磨。此可考量為相變合金的特性與銅般之一般半導體裝置中所使用之金屬材料的特性不同之故。
研磨用組成物中之錯合劑的含量之上限，較佳為10質量%，尤佳為1質量%。隨著錯合劑的含量減少，不易引起錯合劑對相變合金所造成的過剩蝕刻，而抑制相變合金的過剩研磨。
研磨用組成物中之錯合劑的含量之下限，較佳為0.01質量%，尤佳為0.1質量%。隨著錯合劑的含量增多，可增加錯合劑對相變合金所進行之蝕刻效果，故有助於提升研磨用組成物研磨相變合金之速度。
能夠使用之錯合劑，例如可列舉出無機酸、有機酸、及胺基酸。無機酸的具體例，例如可列舉出硫酸、硝酸、硼酸、碳酸、次磷酸、亞磷酸及磷酸。有機酸的具體例，例如可列舉出甲酸、乙酸、丙酸、丁酸、戊酸、2-甲基丁酸、正己酸、3,3-二甲基丁酸、2-乙基丁酸、4-甲基戊酸、正庚酸、2-甲基己酸、正辛酸、2-乙基庚酸、苯甲酸、二醇酸、柳酸、甘油酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、馬來酸、鄰苯二甲酸、蘋果酸、酒石酸、檸檬酸及乳酸。亦可使用甲烷磺酸、乙烷磺酸及羥乙基磺酸等之有機硫酸。此外，亦可使用無機酸或有機
酸的鹼金屬鹽等之鹽，來取代無機酸或有機酸、或是與無機酸或有機酸組合使用。胺基酸的具體例，例如可列舉出甘胺酸、α-丙胺酸、β-丙胺酸、N-甲基甘胺酸、N,N-二甲基甘胺酸、2-胺基丁酸、正纈胺酸、纈胺酸、白胺酸、正白胺酸、異白胺酸、苯基丙胺酸、脯胺酸、肌胺酸、鳥胺酸、離胺酸、牛磺酸、絲胺酸、蘇胺酸、類絲胺酸、酪胺酸、二羥乙甘胺酸、三(羥甲基)甲甘胺酸、3,5-二碘-酪胺酸、β-(3,4-二羥苯基)-甘胺酸、甲狀腺素、4-羥基-脯胺酸、半胱胺酸、甲硫胺酸、乙硫胺酸、羊毛硫胺酸、胱硫醚、胱胺酸、半胱胺酸、天門冬胺酸、麩胺酸、S-(羧甲基)-半胱胺酸、4-胺基丁酸、天門冬胺、麩胺、重氮絲氨酸、精胺酸、刀豆氨酸、瓜氨酸、δ-羥基-離胺酸、肌酸、組胺酸、1-甲基-組胺酸、3-甲基-組胺酸、色胺酸。當中就研磨速度的提升之觀點來看，錯合劑較佳為甘胺酸、丙胺酸、蘋果酸、酒石酸、檸檬酸、二醇酸、羥乙基磺酸或是此等之鹽。
研磨用組成物可含有金屬防蝕劑。當將金屬防蝕劑添加於研磨用組成物時，乃具有在使用研磨用組成物進行研磨後之相變合金上更不易產生凹陷等表面缺陷之效果。此外，金屬防蝕劑，當研磨用組成物中含有氧化劑及/或錯合劑時，可緩和氧化劑對相變合金表面所造成的氧化，並且發揮與因氧化劑對相變合金表面金屬所造成的氧化所產
生之金屬離子反應，而生成不溶性的錯合物之功用。其結果可抑制錯合劑對相變合金所進行之蝕刻，而抑制相變合金的過度研磨。
能夠使用之金屬防蝕劑的種類並無特別限定，較佳為雜環型化合物。雜環型化合物中之雜環的員數並無特別限定。此外，雜環型化合物可為單環化合物，或是具有縮合環之多環化合物。
作為金屬防蝕劑之雜環型化合物的具體例，例如可列舉出吡咯化合物、吡唑化合物、咪唑化合物、三唑化合物、四唑化合物、吡啶化合物、吡嗪化合物、噠嗪化合物、4-氮茚化合物、吲嗪化合物、吲哚化合物、異吲哚化合物、吲唑化合物、嘌呤化合物、喹嗪化合物、喹啉化合物、異喹啉化合物、萘啶化合物、酞嗪化合物、喹喔啉化合物、喹唑啉化合物、噌啉化合物、布替利嗪化合物、噻唑化合物、異噻唑化合物、噁唑化合物、異噁唑化合物及呋呫化合物等之含氮雜環化合物。吡唑化合物的具體例，例如可列舉出1H-吡唑、4-硝基-3-吡唑羧酸及3,5-吡唑羧酸。咪唑化合物的具體例，例如可列舉出咪唑、1-甲基咪唑、2-甲基咪唑、4-甲基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-異丙基咪唑、苯並咪唑、5,6-二甲基苯並咪唑、2-胺基苯並咪唑、2-氯苯並咪唑及2-甲基苯並咪唑。三唑的具體例，例如可列舉出1,2,3-三唑、1,2,4-三唑、1-甲基-1,2,4-三唑、甲基-1H-1,2,4-三唑-3-羧酸酯、1,2,4-三唑-3-羧酸、1,2,4-三唑-3-羧酸甲酯、3-胺基-1H-
1,2,4-三唑、3-胺基-5-苄基-4H-1,2,4-三唑、3-胺基-5-甲基-4H-1,2,4-三唑、3-硝基-1,2,4-三唑、3-溴-5-硝基-1,2,4-三唑、4-(1,2,4-三唑-1-基)酚、4-胺基-1,2,4-三唑、4-胺基-3,5-二丙基-4H-1,2,4-三唑、4-胺基-3,5-二甲基-4H-1,2,4-三唑、4-胺基-3,5-二庚基-4H-1,2,4-三唑、5-甲基-1,2,4-三唑-3,4-二胺、1-羥基苯並三唑、1-胺基苯並三唑、1-羧基苯並三唑、5-氯-1H-苯並三唑、5-硝基-1H-苯並三唑、5-羧基-1H-苯並三唑、5,6-二甲基-1H-苯並三唑、1-(1",2'-二羧乙基)苯並三唑。四唑化合物的具體例，例如可列舉出1H-四唑、5-甲基四唑、5-胺基四唑、及5-苯基四唑。吲哚化合物的具體例，例如可列舉出1H-吲哚、1-甲基-1H-吲哚、2-甲基-1H-吲哚、3-甲基-1H-吲哚、4-甲基-1H-吲哚、5-甲基-1H-吲哚、6-甲基-1H-吲哚、及7-甲基-1H-吲哚。吲唑化合物的具體例，例如可列舉出1H-吲唑及5-胺基-1H-吲唑。此等雜環化合物，由於對相變合金之化學或物理吸附力高，所以可將更堅固的保護膜形成於相變合金表面。因此，可抑制在使用研磨用組成物進行研磨後之相變合金的過剩蝕刻，而抑制相變合金的過剩研磨。
研磨用組成物中之金屬防蝕劑的含量之上限，較佳為10質量%，尤佳為5質量%，更佳為1質量%。隨著金屬防蝕劑的含量減少，乃具有提升研磨用組成物研磨相變合金之速度之效果。
研磨用組成物中之金屬防蝕劑的含量之下限，較佳為
0.001質量%，尤佳為0.01質量%，更佳為0.1質量%。隨著金屬防蝕劑的含量增多，可抑制在使用研磨用組成物進行研磨後之相變合金的過剩蝕刻，而抑制相變合金的過剩研磨。
使用本實施形態之研磨用組成物來研磨具有相變合金之研磨對象物的表面時，可使用研磨墊片。研磨墊片，可使用一般的不織布、發泡聚胺甲酸酯、多孔質氟樹脂等，並無特別限制。此外，可在研磨墊片上施以槽加工以使研磨用組成物容易停留在研磨墊片上。
研磨墊片之硬度的下限，以蕭氏硬度D計較佳為50，尤佳為60。墊片的蕭氏硬度D愈高，墊片的機械作用愈大，可提升相變合金的研磨速度。此外，具有即使在研磨用組成物中未含研磨料，亦可得到相變合金的高研磨速度之優點。
研磨墊片之硬度的上限，以蕭氏硬度D計較佳為99，尤佳為95。墊片的蕭氏硬度D愈低，在被研磨之相變合金的表面上愈不易形成損傷。蕭氏硬度D，就定義上不會有100以上之值。墊片的蕭氏硬度D，可藉由蕭氏硬度D測定儀來測定。
蕭氏硬度D為50以上之研磨墊片，可由發泡體所形成，或是由布、不織布等之非發泡體所形成。研磨墊片的材料，可使用聚胺甲酸酯、丙烯酸、聚酯、丙烯酸-酯共聚物、聚四氟乙烯、聚丙烯、聚乙烯、聚4-甲基戊烯、纖維素、纖維素酯、尼龍及醯胺等之聚醯胺、聚醯亞胺、
聚醯亞胺醯胺、聚矽氧烷共聚物、環氧乙烷化合物、酚樹脂、聚苯乙烯、聚碳酸酯、環氧樹脂等之樹脂。
根據本實施形態，可得到下列作用及效果。
．為用以對含有金屬的表面進行研磨時所使用之先前典型的研磨用組成物之情形時，係藉由同樣於研磨用組成物中所含有之錯合劑的作用，將藉由該研磨用組成物中所含有之氧化劑的作用使研磨對象的金屬氧化所產生之金屬氧化物予以溶解而進行金屬的研磨。相對於此，使用本實施形態之研磨用組成物來研磨相變合金時，該研磨用組成物中所含有之銨離子錯合形成於相變合金的表面並鍵結，而在相變合金的表面上形成不溶性的脆性膜。因此，根據本實施形態之研磨用組成物，可藉由高研磨速度來研磨相變合金。
．當將有機酸經固定之膠體二氧化矽添加於研磨用組成物中時，可得到涵蓋長期間之優異的分散穩定性。該理由在於：有機酸經固定之膠體二氧化矽，與有機酸未經固定之通常的膠體二氧化矽相比，研磨用組成物中之動電勢的絕對值有較大的傾向之故。隨著研磨用組成物中之動電勢的絕對值增大，二氧化矽粒子彼此間的靜電排斥力增強，所以不易引起由於凡得瓦力的引力所起因之膠體二氧化矽的凝聚。例如在酸性的pH區域中，有機酸經固定之膠體二氧化矽的動電勢，一般顯示出-15mV以下的負值，相對於此，通常的膠體二氧化矽的動電勢係顯示出接近於零之值。
前述實施形態可變更如下。
．前述實施形態之研磨用組成物，可因應必要，進一步含有界面活性劑或水溶性高分子、防腐劑般之一般所知的添加劑。
．前述實施形態之研磨用組成物，可為單液型或是以雙液型為首之多液型。
．前述實施形態之研磨用組成物，可藉由以水來稀釋研磨用組成物的原液而調製出。
接著說明本發明之實施例及比較例。
將研磨料、銨離子源或取代其之添加劑、及氧化劑適當地混合於水，藉此調製出具有第1表及第2表所記載的組成之實施例1~23及比較例1~26之研磨用組成物。
於第1表及第2表之“研磨料”欄中，係顯示各研磨用組成物中之研磨料的含量。同欄中記載為“-”者係顯示不含研磨料。實施例1~23及比較例1~26中所使用之研磨料，均為平均一次粒徑30nm且平均二次粒徑60nm的膠體二氧化矽。
於第1表及第2表之“銨離子源或取代其之添加劑”欄中的“種類”欄中，係顯示實施例中所使用之銨離子源的種類以及比較例中所使用之取代銨離子源之添加劑的種類。比較例中所使用之添加劑，係選自對含有金屬的表面進行研磨時所使用之先前典型的研磨用組成物中所使用之錯合劑及防蝕劑，均為無法發揮銨離子源的功用之化合物。此外，於“含量(質量%)”欄中，係顯示各研磨用組成
物中之銨離子源或取代其之添加劑的含量。同欄中記載為“-”者係顯示不含銨離子源或取代其之添加劑。
於第1表及第2表之“銨離子”欄的“含量(mol/L)”欄中，係顯示以氨水換算所求取之各研磨用組成物中之銨離子的濃度。
於第1表及第2表之“氧化劑”欄的“種類”欄中，係顯示各研磨用組成物中所含有之氧化劑的種類。此外，於“含量(質量%)”欄中，係顯示各研磨用組成物中之氧化劑的含量。同欄中記載為“-”者係顯示不含氧化劑。
於第1表及第2表之“pH”欄中，係顯示各研磨用組成物的pH。各研磨用組成物的pH，係添加無機酸或無機鹼來調整為期望的值。
使用實施例1~23及比較例1~26的各研磨用組成物，並以第3表所示之條件來研磨含有GST合金(Ge、Sb及Te的質量比為2：2：5)之原晶圓。從依據直流四探針法所進行之薄片電阻的測定中，求取研磨前後之各晶圓的厚度，並以研磨時間除上該差來算出研磨速度。第1表及第2表之“評估”欄中的“研磨速度”欄，係顯示所算出之研磨速度之值。
如第1表及第2表所示，例如在含有研磨料及銨離子之實施例1~3之研磨用組成物中，與僅含有研磨料之比較例2、11~13之研磨用組成物，以及含有研磨料及無法成為銨離子源之添加劑之比較例3~9之研磨用組成物相比，可觀察到研磨速度高。在含有銨離子之實施例8之研磨用組成物中，與僅由水所構成之比較例1之研磨用組成物，以及僅含有無法成為銨離子源之添加劑之比較例10之研磨用組成物相比，可觀察到研磨速度高。在含有研磨料、銨離子及過氧化氫之實施例4~7、9之研磨用組成物中，與含有研磨料及過氧化氫之比較例14~16之研磨用組成物相比，可觀察到研磨速度高。在含有研磨料、銨離子及氧化劑之實施例10~23之研磨用組成物中，與含有研磨料及和實施例相同的氧化劑之比較例17~26之研磨用組成物相比，可觀察到研磨速度高。亦即，使用實施例1~23之研磨用組成物時，與使用不屬於本發明的範圍之比較例1~26之研磨用組成物時相比，可觀察到研磨速度的提升。
Claims (8)
- 一種研磨用組成物，其係使用在對具有相變合金之研磨對象物進行研磨的用途之研磨用組成物，其特徵為：含有銨離子(NH4 +)。
- 如申請專利範圍第1項之研磨用組成物，其中前述銨離子係作為氫氧化銨而添加。
- 如申請專利範圍第1項之研磨用組成物，其中前述銨離子係作為選自有機酸的銨鹽及無機酸的銨鹽之1種以上的銨鹽而添加。
- 如申請專利範圍第1項之研磨用組成物，其中進一步含有研磨料。
- 如申請專利範圍第4項之研磨用組成物，其中前述研磨料為膠體二氧化矽。
- 如申請專利範圍第1至5項中任一項之研磨用組成物，其中前述相變合金為鍺-銻-碲合金。
- 一種研磨方法，其特徵為：使用如申請專利範圍第1至5項中任一項之研磨用組成物，對具有相變合金之研磨對象物的表面進行研磨。
- 一種相變裝置的製造方法，其特徵為包含：使用如申請專利範圍第1至5項中任一項之研磨用組成物，對具有相變合金之研磨對象物的表面進行研磨之步驟。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011218723 | 2011-09-30 | ||
| JP2012026290A JP2013084876A (ja) | 2011-09-30 | 2012-02-09 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201326376A true TW201326376A (zh) | 2013-07-01 |
Family
ID=47995759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101135840A TW201326376A (zh) | 2011-09-30 | 2012-09-28 | 研磨用組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20140251950A1 (zh) |
| JP (1) | JP2013084876A (zh) |
| KR (1) | KR20140071446A (zh) |
| TW (1) | TW201326376A (zh) |
| WO (1) | WO2013047734A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI752013B (zh) * | 2016-03-25 | 2022-01-11 | 日商福吉米股份有限公司 | 具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6222907B2 (ja) * | 2012-09-06 | 2017-11-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6139975B2 (ja) * | 2013-05-15 | 2017-05-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6113619B2 (ja) * | 2013-09-30 | 2017-04-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN110316737A (zh) | 2015-01-19 | 2019-10-11 | 福吉米株式会社 | 改性胶体二氧化硅及其制造方法、以及使用其的研磨剂 |
| JP6757259B2 (ja) * | 2015-01-19 | 2020-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6189571B1 (ja) * | 2015-10-09 | 2017-08-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法、ならびにこれらを用いた研磨済研磨対象物の製造方法 |
| JP6908480B2 (ja) * | 2017-09-15 | 2021-07-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びその製造方法並びに研磨方法並びに基板の製造方法 |
| TW201915130A (zh) * | 2017-09-26 | 2019-04-16 | 日商福吉米股份有限公司 | 研磨用組合物、研磨用組合物的製造方法、研磨方法及半導體基板的製造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
| JP2005340554A (ja) * | 2004-05-28 | 2005-12-08 | Hitachi Ltd | 半導体記憶装置の製造方法 |
| JP4814502B2 (ja) * | 2004-09-09 | 2011-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| US7897061B2 (en) * | 2006-02-01 | 2011-03-01 | Cabot Microelectronics Corporation | Compositions and methods for CMP of phase change alloys |
| JP2008098314A (ja) * | 2006-10-10 | 2008-04-24 | Nitta Haas Inc | 研磨組成物 |
| US8518296B2 (en) * | 2007-02-14 | 2013-08-27 | Micron Technology, Inc. | Slurries and methods for polishing phase change materials |
| US20090001339A1 (en) * | 2007-06-29 | 2009-01-01 | Tae Young Lee | Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same |
| JP5529736B2 (ja) * | 2007-07-26 | 2014-06-25 | キャボット マイクロエレクトロニクス コーポレイション | 相変化材料を化学的機械的に研磨するための組成物及び方法 |
| US7678605B2 (en) * | 2007-08-30 | 2010-03-16 | Dupont Air Products Nanomaterials Llc | Method for chemical mechanical planarization of chalcogenide materials |
| US7915071B2 (en) * | 2007-08-30 | 2011-03-29 | Dupont Air Products Nanomaterials, Llc | Method for chemical mechanical planarization of chalcogenide materials |
| KR101198100B1 (ko) * | 2007-12-11 | 2012-11-09 | 삼성전자주식회사 | 상변화 물질층 패턴의 형성 방법, 상변화 메모리 장치의제조 방법 및 이에 사용되는 상변화 물질층 연마용 슬러리조성물 |
| KR101341875B1 (ko) * | 2008-04-30 | 2013-12-16 | 한양대학교 산학협력단 | 상변환 물질 연마용 슬러리 및 이를 이용한 상변환 물질의 패터닝 방법 |
| US8735293B2 (en) * | 2008-11-05 | 2014-05-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| US20100130013A1 (en) * | 2008-11-24 | 2010-05-27 | Applied Materials, Inc. | Slurry composition for gst phase change memory materials polishing |
| US20120003834A1 (en) * | 2010-07-01 | 2012-01-05 | Koo Ja-Ho | Method Of Polishing Chalcogenide Alloy |
| KR20120020556A (ko) * | 2010-08-30 | 2012-03-08 | 삼성전자주식회사 | 화학적 기계적 연마 공정의 슬러리 조성물 및 이를 이용하는 상변화 메모리 소자의 형성 방법 |
| CN102690604A (zh) * | 2011-03-24 | 2012-09-26 | 中国科学院上海微系统与信息技术研究所 | 化学机械抛光液 |
| US8309468B1 (en) * | 2011-04-28 | 2012-11-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys |
| US8790160B2 (en) * | 2011-04-28 | 2014-07-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing phase change alloys |
| JP2013080751A (ja) * | 2011-09-30 | 2013-05-02 | Fujimi Inc | 研磨用組成物 |
-
2012
- 2012-02-09 JP JP2012026290A patent/JP2013084876A/ja active Pending
- 2012-09-28 WO PCT/JP2012/075052 patent/WO2013047734A1/ja active Application Filing
- 2012-09-28 TW TW101135840A patent/TW201326376A/zh unknown
- 2012-09-28 KR KR1020147010937A patent/KR20140071446A/ko not_active Application Discontinuation
- 2012-09-28 US US14/346,921 patent/US20140251950A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI752013B (zh) * | 2016-03-25 | 2022-01-11 | 日商福吉米股份有限公司 | 具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013084876A (ja) | 2013-05-09 |
| WO2013047734A1 (ja) | 2013-04-04 |
| US20140251950A1 (en) | 2014-09-11 |
| KR20140071446A (ko) | 2014-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201326376A (zh) | 研磨用組成物 | |
| TW201333129A (zh) | 研磨用組成物 | |
| TWI586793B (zh) | A polishing composition, a polishing method using the same, and a method for manufacturing the same | |
| KR20140108563A (ko) | 연마용 조성물 | |
| TW201540817A (zh) | 硏磨用組成物 | |
| TW201422798A (zh) | 研磨用組成物 | |
| TW201418434A (zh) | 研磨用組成物 | |
| TWI557218B (zh) | 硏磨用組成物 | |
| TW201621024A (zh) | 組成物 | |
| JP2013080752A (ja) | 研磨用組成物 | |
| JP5945123B2 (ja) | 研磨用組成物 | |
| TWI833935B (zh) | 研磨用組合物、研磨方法及基板之製造方法 | |
| JP2017038070A (ja) | 研磨用組成物の製造方法 | |
| JP2013157580A (ja) | 研磨用組成物 | |
| WO2020196542A1 (ja) | 研磨用組成物、研磨方法および基板の製造方法 | |
| JP2013157579A (ja) | 研磨用組成物 | |
| JP2013157582A (ja) | 研磨用組成物 | |
| JP2013157583A (ja) | 研磨用組成物 |