TWI752013B - 具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 - Google Patents
具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 Download PDFInfo
- Publication number
- TWI752013B TWI752013B TW106109378A TW106109378A TWI752013B TW I752013 B TWI752013 B TW I752013B TW 106109378 A TW106109378 A TW 106109378A TW 106109378 A TW106109378 A TW 106109378A TW I752013 B TWI752013 B TW I752013B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- polishing
- metal
- composition
- polishing composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 244
- 239000000203 mixture Substances 0.000 title claims abstract description 146
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 97
- 239000002184 metal Substances 0.000 title claims abstract description 97
- 239000000758 substrate Substances 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002253 acid Substances 0.000 claims abstract description 98
- 239000006061 abrasive grain Substances 0.000 claims abstract description 46
- 239000007800 oxidant agent Substances 0.000 claims abstract description 35
- 238000010494 dissociation reaction Methods 0.000 claims abstract description 26
- 230000005593 dissociations Effects 0.000 claims abstract description 26
- 239000002612 dispersion medium Substances 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 22
- 229910052721 tungsten Inorganic materials 0.000 claims description 22
- 239000010937 tungsten Substances 0.000 claims description 22
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 14
- 150000007524 organic acids Chemical class 0.000 claims description 14
- 239000008119 colloidal silica Substances 0.000 claims description 13
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 5
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 claims description 4
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 55
- -1 amine compounds Chemical class 0.000 description 39
- 238000005530 etching Methods 0.000 description 25
- 230000003746 surface roughness Effects 0.000 description 25
- 238000000227 grinding Methods 0.000 description 24
- 239000003795 chemical substances by application Substances 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- 238000004090 dissolution Methods 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 10
- 239000011163 secondary particle Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 7
- 150000007513 acids Chemical class 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 150000005215 alkyl ethers Chemical class 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 150000001875 compounds Chemical group 0.000 description 7
- 238000010828 elution Methods 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 7
- 150000004706 metal oxides Chemical class 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 150000002391 heterocyclic compounds Chemical group 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000011164 primary particle Substances 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000002738 chelating agent Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- PZOUSPYUWWUPPK-UHFFFAOYSA-N 4-methyl-1h-indole Chemical compound CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 235000011054 acetic acid Nutrition 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003429 antifungal agent Substances 0.000 description 4
- 229940121375 antifungal agent Drugs 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 150000007522 mineralic acids Chemical class 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- HJKYXKSLRZKNSI-UHFFFAOYSA-I pentapotassium;hydrogen sulfate;oxido sulfate;sulfuric acid Chemical compound [K+].[K+].[K+].[K+].[K+].OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-] HJKYXKSLRZKNSI-UHFFFAOYSA-I 0.000 description 4
- 150000002978 peroxides Chemical group 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000003755 preservative agent Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 3
- 239000012425 OXONE® Substances 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229940024606 amino acid Drugs 0.000 description 3
- 235000001014 amino acid Nutrition 0.000 description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 3
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 description 3
- 239000001230 potassium iodate Substances 0.000 description 3
- 235000006666 potassium iodate Nutrition 0.000 description 3
- 229940093930 potassium iodate Drugs 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 2
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- ZUHDIDYOAZNPBV-UHFFFAOYSA-N 2-[2-hydroxyethyl-[(4-methylbenzotriazol-1-yl)methyl]amino]ethanol Chemical compound CC1=CC=CC2=C1N=NN2CN(CCO)CCO ZUHDIDYOAZNPBV-UHFFFAOYSA-N 0.000 description 2
- HHYPDQBCLQZKLI-UHFFFAOYSA-N 2-[2-hydroxyethyl-[(5-methylbenzotriazol-1-yl)methyl]amino]ethanol Chemical compound CC1=CC=C2N(CN(CCO)CCO)N=NC2=C1 HHYPDQBCLQZKLI-UHFFFAOYSA-N 0.000 description 2
- BHNHHSOHWZKFOX-UHFFFAOYSA-N 2-methyl-1H-indole Chemical compound C1=CC=C2NC(C)=CC2=C1 BHNHHSOHWZKFOX-UHFFFAOYSA-N 0.000 description 2
- DBXBTMSZEOQQDU-UHFFFAOYSA-N 3-hydroxyisobutyric acid Chemical compound OCC(C)C(O)=O DBXBTMSZEOQQDU-UHFFFAOYSA-N 0.000 description 2
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 2
- MVPKIPGHRNIOPT-UHFFFAOYSA-N 5,6-dimethyl-2h-benzotriazole Chemical compound C1=C(C)C(C)=CC2=NNN=C21 MVPKIPGHRNIOPT-UHFFFAOYSA-N 0.000 description 2
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 description 2
- PWSZRRFDVPMZGM-UHFFFAOYSA-N 5-phenyl-1h-pyrazol-3-amine Chemical compound N1N=C(N)C=C1C1=CC=CC=C1 PWSZRRFDVPMZGM-UHFFFAOYSA-N 0.000 description 2
- ONYNOPPOVKYGRS-UHFFFAOYSA-N 6-methylindole Natural products CC1=CC=C2C=CNC2=C1 ONYNOPPOVKYGRS-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- IVYPNXXAYMYVSP-UHFFFAOYSA-N Indole-3-carbinol Natural products C1=CC=C2C(CO)=CNC2=C1 IVYPNXXAYMYVSP-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 description 2
- FFDGPVCHZBVARC-UHFFFAOYSA-N N,N-dimethylglycine Chemical compound CN(C)CC(O)=O FFDGPVCHZBVARC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 108010077895 Sarcosine Proteins 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 150000004996 alkyl benzenes Chemical class 0.000 description 2
- 150000008051 alkyl sulfates Chemical class 0.000 description 2
- QWCKQJZIFLGMSD-UHFFFAOYSA-N alpha-aminobutyric acid Chemical compound CCC(N)C(O)=O QWCKQJZIFLGMSD-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical compound NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- XVOYSCVBGLVSOL-UHFFFAOYSA-N cysteic acid Chemical compound OC(=O)C(N)CS(O)(=O)=O XVOYSCVBGLVSOL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002473 indoazoles Chemical class 0.000 description 2
- 150000002475 indoles Chemical class 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- FGKJLKRYENPLQH-UHFFFAOYSA-N isocaproic acid Chemical compound CC(C)CCC(O)=O FGKJLKRYENPLQH-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- QMPFMODFBNEYJH-UHFFFAOYSA-N methyl 1h-1,2,4-triazole-5-carboxylate Chemical compound COC(=O)C1=NC=NN1 QMPFMODFBNEYJH-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003216 pyrazines Chemical class 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- ZFRKQXVRDFCRJG-UHFFFAOYSA-N skatole Chemical compound C1=CC=C2C(C)=CNC2=C1 ZFRKQXVRDFCRJG-UHFFFAOYSA-N 0.000 description 2
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 2
- 229940005605 valeric acid Drugs 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 description 1
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- OBENDWOJIFFDLZ-UHFFFAOYSA-N (3,5-dimethylpyrazol-1-yl)methanol Chemical compound CC=1C=C(C)N(CO)N=1 OBENDWOJIFFDLZ-UHFFFAOYSA-N 0.000 description 1
- LVRFTAZAXQPQHI-RXMQYKEDSA-N (R)-2-hydroxy-4-methylpentanoic acid Chemical compound CC(C)C[C@@H](O)C(O)=O LVRFTAZAXQPQHI-RXMQYKEDSA-N 0.000 description 1
- AFENDNXGAFYKQO-VKHMYHEASA-N (S)-2-hydroxybutyric acid Chemical compound CC[C@H](O)C(O)=O AFENDNXGAFYKQO-VKHMYHEASA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- AGNGYMCLFWQVGX-AGFFZDDWSA-N (e)-1-[(2s)-2-amino-2-carboxyethoxy]-2-diazonioethenolate Chemical compound OC(=O)[C@@H](N)CO\C([O-])=C\[N+]#N AGNGYMCLFWQVGX-AGFFZDDWSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- UKAUYVFTDYCKQA-UHFFFAOYSA-N -2-Amino-4-hydroxybutanoic acid Natural products OC(=O)C(N)CCO UKAUYVFTDYCKQA-UHFFFAOYSA-N 0.000 description 1
- FMCUPJKTGNBGEC-UHFFFAOYSA-N 1,2,4-triazol-4-amine Chemical compound NN1C=NN=C1 FMCUPJKTGNBGEC-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- BJMUOUXGBFNLSN-UHFFFAOYSA-N 1,2-dimethylindole Chemical compound C1=CC=C2N(C)C(C)=CC2=C1 BJMUOUXGBFNLSN-UHFFFAOYSA-N 0.000 description 1
- JUDMNPJWHXETRI-UHFFFAOYSA-N 1,2-dimethylpyrazole Chemical compound CN1[CH][CH][CH]N1C JUDMNPJWHXETRI-UHFFFAOYSA-N 0.000 description 1
- SILNNFMWIMZVEQ-UHFFFAOYSA-N 1,3-dihydrobenzimidazol-2-one Chemical compound C1=CC=C2NC(O)=NC2=C1 SILNNFMWIMZVEQ-UHFFFAOYSA-N 0.000 description 1
- NAPPMSNSLWACIV-UHFFFAOYSA-N 1,3-dimethylindole Chemical compound C1=CC=C2C(C)=CN(C)C2=C1 NAPPMSNSLWACIV-UHFFFAOYSA-N 0.000 description 1
- XZHWEHOSQYNGOL-UHFFFAOYSA-N 1-(1h-benzimidazol-2-yl)ethanol Chemical compound C1=CC=C2NC(C(O)C)=NC2=C1 XZHWEHOSQYNGOL-UHFFFAOYSA-N 0.000 description 1
- ASOKPJOREAFHNY-UHFFFAOYSA-N 1-Hydroxybenzotriazole Chemical compound C1=CC=C2N(O)N=NC2=C1 ASOKPJOREAFHNY-UHFFFAOYSA-N 0.000 description 1
- LUTLAXLNPLZCOF-UHFFFAOYSA-N 1-Methylhistidine Natural products OC(=O)C(N)(C)CC1=NC=CN1 LUTLAXLNPLZCOF-UHFFFAOYSA-N 0.000 description 1
- MWZDIEIXRBWPLG-UHFFFAOYSA-N 1-methyl-1,2,4-triazole Chemical compound CN1C=NC=N1 MWZDIEIXRBWPLG-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- BLRHMMGNCXNXJL-UHFFFAOYSA-N 1-methylindole Chemical compound C1=CC=C2N(C)C=CC2=C1 BLRHMMGNCXNXJL-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- NUYZVDBIVNOTSC-UHFFFAOYSA-N 1H-indazol-6-ol Chemical compound OC1=CC=C2C=NNC2=C1 NUYZVDBIVNOTSC-UHFFFAOYSA-N 0.000 description 1
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 1
- ZCBIFHNDZBSCEP-UHFFFAOYSA-N 1H-indol-5-amine Chemical compound NC1=CC=C2NC=CC2=C1 ZCBIFHNDZBSCEP-UHFFFAOYSA-N 0.000 description 1
- WTFWZOSMUGZKNZ-UHFFFAOYSA-N 1H-indol-7-amine Chemical compound NC1=CC=CC2=C1NC=C2 WTFWZOSMUGZKNZ-UHFFFAOYSA-N 0.000 description 1
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 description 1
- LJVQHXICFCZRJN-UHFFFAOYSA-N 1h-1,2,4-triazole-5-carboxylic acid Chemical compound OC(=O)C1=NC=NN1 LJVQHXICFCZRJN-UHFFFAOYSA-N 0.000 description 1
- XBTOSRUBOXQWBO-UHFFFAOYSA-N 1h-indazol-5-amine Chemical compound NC1=CC=C2NN=CC2=C1 XBTOSRUBOXQWBO-UHFFFAOYSA-N 0.000 description 1
- ZHDXWEPRYNHNDC-UHFFFAOYSA-N 1h-indazol-5-ol Chemical compound OC1=CC=C2NN=CC2=C1 ZHDXWEPRYNHNDC-UHFFFAOYSA-N 0.000 description 1
- UAYYSAPJTRVEQA-UHFFFAOYSA-N 1h-indol-5-ylmethanamine Chemical compound NCC1=CC=C2NC=CC2=C1 UAYYSAPJTRVEQA-UHFFFAOYSA-N 0.000 description 1
- MIMYTSWNVBMNRH-UHFFFAOYSA-N 1h-indol-6-amine Chemical compound NC1=CC=C2C=CNC2=C1 MIMYTSWNVBMNRH-UHFFFAOYSA-N 0.000 description 1
- XAWPKHNOFIWWNZ-UHFFFAOYSA-N 1h-indol-6-ol Chemical compound OC1=CC=C2C=CNC2=C1 XAWPKHNOFIWWNZ-UHFFFAOYSA-N 0.000 description 1
- ORVPXPKEZLTMNW-UHFFFAOYSA-N 1h-indol-7-ol Chemical compound OC1=CC=CC2=C1NC=C2 ORVPXPKEZLTMNW-UHFFFAOYSA-N 0.000 description 1
- ROGHUJUFCRFUSO-UHFFFAOYSA-N 1h-indole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=C1C=CN2 ROGHUJUFCRFUSO-UHFFFAOYSA-N 0.000 description 1
- GHTDODSYDCPOCW-UHFFFAOYSA-N 1h-indole-6-carboxylic acid Chemical compound OC(=O)C1=CC=C2C=CNC2=C1 GHTDODSYDCPOCW-UHFFFAOYSA-N 0.000 description 1
- IPDOBVFESNNYEE-UHFFFAOYSA-N 1h-indole-7-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=C1NC=C2 IPDOBVFESNNYEE-UHFFFAOYSA-N 0.000 description 1
- JVVRJMXHNUAPHW-UHFFFAOYSA-N 1h-pyrazol-5-amine Chemical compound NC=1C=CNN=1 JVVRJMXHNUAPHW-UHFFFAOYSA-N 0.000 description 1
- KOPFEFZSAMLEHK-UHFFFAOYSA-N 1h-pyrazole-5-carboxylic acid Chemical compound OC(=O)C=1C=CNN=1 KOPFEFZSAMLEHK-UHFFFAOYSA-N 0.000 description 1
- HZNVUJQVZSTENZ-UHFFFAOYSA-N 2,3-dichloro-5,6-dicyano-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(C#N)=C(C#N)C1=O HZNVUJQVZSTENZ-UHFFFAOYSA-N 0.000 description 1
- NEFAZJJIHDDXKM-UHFFFAOYSA-N 2,3-dimethyl-1h-indol-5-amine Chemical compound C1=C(N)C=C2C(C)=C(C)NC2=C1 NEFAZJJIHDDXKM-UHFFFAOYSA-N 0.000 description 1
- PYFVEIDRTLBMHG-UHFFFAOYSA-N 2,3-dimethyl-1h-indole Chemical compound C1=CC=C2C(C)=C(C)NC2=C1 PYFVEIDRTLBMHG-UHFFFAOYSA-N 0.000 description 1
- ZFLFWZRPMDXJCW-UHFFFAOYSA-N 2,5-dimethyl-1h-indole Chemical compound CC1=CC=C2NC(C)=CC2=C1 ZFLFWZRPMDXJCW-UHFFFAOYSA-N 0.000 description 1
- MVHOAOSHABGEFL-UHFFFAOYSA-N 2,6-dimethyl-1h-benzimidazole Chemical compound C1=C(C)C=C2NC(C)=NC2=C1 MVHOAOSHABGEFL-UHFFFAOYSA-N 0.000 description 1
- JNXJYDMXAJDPRV-UHFFFAOYSA-N 2-(benzotriazol-1-yl)butanedioic acid Chemical compound C1=CC=C2N(C(C(O)=O)CC(=O)O)N=NC2=C1 JNXJYDMXAJDPRV-UHFFFAOYSA-N 0.000 description 1
- OXQGTIUCKGYOAA-UHFFFAOYSA-N 2-Ethylbutanoic acid Chemical compound CCC(CC)C(O)=O OXQGTIUCKGYOAA-UHFFFAOYSA-N 0.000 description 1
- XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 description 1
- GRUVVLWKPGIYEG-UHFFFAOYSA-N 2-[2-[carboxymethyl-[(2-hydroxyphenyl)methyl]amino]ethyl-[(2-hydroxyphenyl)methyl]amino]acetic acid Chemical compound C=1C=CC=C(O)C=1CN(CC(=O)O)CCN(CC(O)=O)CC1=CC=CC=C1O GRUVVLWKPGIYEG-UHFFFAOYSA-N 0.000 description 1
- WKZLYSXRFUGBPI-UHFFFAOYSA-N 2-[benzotriazol-1-ylmethyl(2-hydroxyethyl)amino]ethanol Chemical compound C1=CC=C2N(CN(CCO)CCO)N=NC2=C1 WKZLYSXRFUGBPI-UHFFFAOYSA-N 0.000 description 1
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 1
- AYPSHJCKSDNETA-UHFFFAOYSA-N 2-chloro-1h-benzimidazole Chemical compound C1=CC=C2NC(Cl)=NC2=C1 AYPSHJCKSDNETA-UHFFFAOYSA-N 0.000 description 1
- QKPVEISEHYYHRH-UHFFFAOYSA-N 2-methoxyacetonitrile Chemical compound COCC#N QKPVEISEHYYHRH-UHFFFAOYSA-N 0.000 description 1
- LDZYRENCLPUXAX-UHFFFAOYSA-N 2-methyl-1h-benzimidazole Chemical compound C1=CC=C2NC(C)=NC2=C1 LDZYRENCLPUXAX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- JQULCCZIXYRBSE-UHFFFAOYSA-N 2-methyl-1h-indol-5-amine Chemical compound NC1=CC=C2NC(C)=CC2=C1 JQULCCZIXYRBSE-UHFFFAOYSA-N 0.000 description 1
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 description 1
- WLAMNBDJUVNPJU-UHFFFAOYSA-N 2-methylbutyric acid Chemical compound CCC(C)C(O)=O WLAMNBDJUVNPJU-UHFFFAOYSA-N 0.000 description 1
- CVKMFSAVYPAZTQ-UHFFFAOYSA-N 2-methylhexanoic acid Chemical compound CCCCC(C)C(O)=O CVKMFSAVYPAZTQ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- DWYHDSLIWMUSOO-UHFFFAOYSA-N 2-phenyl-1h-benzimidazole Chemical compound C1=CC=CC=C1C1=NC2=CC=CC=C2N1 DWYHDSLIWMUSOO-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- HRGUSFBJBOKSML-UHFFFAOYSA-N 3',5'-di-O-methyltricetin Chemical compound COC1=C(O)C(OC)=CC(C=2OC3=CC(O)=CC(O)=C3C(=O)C=2)=C1 HRGUSFBJBOKSML-UHFFFAOYSA-N 0.000 description 1
- MLMQPDHYNJCQAO-UHFFFAOYSA-N 3,3-dimethylbutyric acid Chemical compound CC(C)(C)CC(O)=O MLMQPDHYNJCQAO-UHFFFAOYSA-N 0.000 description 1
- TXQKCKQJBGFUBF-UHFFFAOYSA-N 3,4,5-tribromo-1h-pyrazole Chemical compound BrC1=NNC(Br)=C1Br TXQKCKQJBGFUBF-UHFFFAOYSA-N 0.000 description 1
- HTAVZCVYBKYBBM-UHFFFAOYSA-N 3,5-diheptyl-1,2,4-triazol-4-amine Chemical compound CCCCCCCC1=NN=C(CCCCCCC)N1N HTAVZCVYBKYBBM-UHFFFAOYSA-N 0.000 description 1
- MIIKMZAVLKMOFM-UHFFFAOYSA-N 3,5-dimethyl-1,2,4-triazol-4-amine Chemical compound CC1=NN=C(C)N1N MIIKMZAVLKMOFM-UHFFFAOYSA-N 0.000 description 1
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 description 1
- QQHNFZBYCQMAOD-UHFFFAOYSA-N 3,5-dipropyl-1,2,4-triazol-4-amine Chemical compound CCCC1=NN=C(CCC)N1N QQHNFZBYCQMAOD-UHFFFAOYSA-N 0.000 description 1
- BRMWTNUJHUMWMS-UHFFFAOYSA-N 3-Methylhistidine Natural products CN1C=NC(CC(N)C(O)=O)=C1 BRMWTNUJHUMWMS-UHFFFAOYSA-N 0.000 description 1
- UWRBFYBQPCJRRL-UHFFFAOYSA-N 3-[bis(carboxymethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CC(O)=O)CC(O)=O UWRBFYBQPCJRRL-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- GUUULVAMQJLDSY-UHFFFAOYSA-N 4,5-dihydro-1,2-thiazole Chemical compound C1CC=NS1 GUUULVAMQJLDSY-UHFFFAOYSA-N 0.000 description 1
- UTPBOGJKHATGJY-UHFFFAOYSA-N 4-(2-azaniumylethyl)-2,6-diiodophenolate Chemical compound NCCC1=CC(I)=C(O)C(I)=C1 UTPBOGJKHATGJY-UHFFFAOYSA-N 0.000 description 1
- LUNUNJFSHKSXGQ-UHFFFAOYSA-N 4-Aminoindole Chemical compound NC1=CC=CC2=C1C=CN2 LUNUNJFSHKSXGQ-UHFFFAOYSA-N 0.000 description 1
- SVLZRCRXNHITBY-UHFFFAOYSA-N 4-chloro-1h-indole Chemical compound ClC1=CC=CC2=C1C=CN2 SVLZRCRXNHITBY-UHFFFAOYSA-N 0.000 description 1
- YMXQUFUYCADCFL-UHFFFAOYSA-N 4-chloro-1h-pyrazolo[3,4-d]pyrimidine Chemical compound ClC1=NC=NC2=C1C=NN2 YMXQUFUYCADCFL-UHFFFAOYSA-N 0.000 description 1
- NLMQHXUGJIAKTH-UHFFFAOYSA-N 4-hydroxyindole Chemical compound OC1=CC=CC2=C1C=CN2 NLMQHXUGJIAKTH-UHFFFAOYSA-N 0.000 description 1
- LUNOXNMCFPFPMO-UHFFFAOYSA-N 4-methoxy-1h-indole Chemical compound COC1=CC=CC2=C1C=CN2 LUNOXNMCFPFPMO-UHFFFAOYSA-N 0.000 description 1
- LAVZKLJDKGRZJG-UHFFFAOYSA-N 4-nitro-1h-indole Chemical compound [O-][N+](=O)C1=CC=CC2=C1C=CN2 LAVZKLJDKGRZJG-UHFFFAOYSA-N 0.000 description 1
- 125000002471 4H-quinolizinyl group Chemical class C=1(C=CCN2C=CC=CC12)* 0.000 description 1
- LJUQGASMPRMWIW-UHFFFAOYSA-N 5,6-dimethylbenzimidazole Chemical compound C1=C(C)C(C)=CC2=C1NC=N2 LJUQGASMPRMWIW-UHFFFAOYSA-N 0.000 description 1
- FYTLHYRDGXRYEY-UHFFFAOYSA-N 5-Methyl-3-pyrazolamine Chemical compound CC=1C=C(N)NN=1 FYTLHYRDGXRYEY-UHFFFAOYSA-N 0.000 description 1
- WZUUZPAYWFIBDF-UHFFFAOYSA-N 5-amino-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound NC1=NNC(S)=N1 WZUUZPAYWFIBDF-UHFFFAOYSA-N 0.000 description 1
- QGLMSZQOJZAPSZ-UHFFFAOYSA-N 5-benzyl-1h-1,2,4-triazol-3-amine Chemical compound NC1=NNC(CC=2C=CC=CC=2)=N1 QGLMSZQOJZAPSZ-UHFFFAOYSA-N 0.000 description 1
- XXAMCWVPBITOGA-UHFFFAOYSA-N 5-bromo-3-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NNC(Br)=N1 XXAMCWVPBITOGA-UHFFFAOYSA-N 0.000 description 1
- MYTGFBZJLDLWQG-UHFFFAOYSA-N 5-chloro-1h-indole Chemical compound ClC1=CC=C2NC=CC2=C1 MYTGFBZJLDLWQG-UHFFFAOYSA-N 0.000 description 1
- WUVWAXJXPRYUME-UHFFFAOYSA-N 5-chloro-2-methyl-1h-indole Chemical compound ClC1=CC=C2NC(C)=CC2=C1 WUVWAXJXPRYUME-UHFFFAOYSA-N 0.000 description 1
- PZBQVZFITSVHAW-UHFFFAOYSA-N 5-chloro-2h-benzotriazole Chemical compound C1=C(Cl)C=CC2=NNN=C21 PZBQVZFITSVHAW-UHFFFAOYSA-N 0.000 description 1
- LMIQERWZRIFWNZ-UHFFFAOYSA-N 5-hydroxyindole Chemical compound OC1=CC=C2NC=CC2=C1 LMIQERWZRIFWNZ-UHFFFAOYSA-N 0.000 description 1
- DWAQDRSOVMLGRQ-UHFFFAOYSA-N 5-methoxyindole Chemical compound COC1=CC=C2NC=CC2=C1 DWAQDRSOVMLGRQ-UHFFFAOYSA-N 0.000 description 1
- UHOFPBXQUTZOKZ-UHFFFAOYSA-N 5-methyl-1,2,4-triazole-3,4-diamine Chemical compound CC1=NN=C(N)N1N UHOFPBXQUTZOKZ-UHFFFAOYSA-N 0.000 description 1
- RWXZXCZBMQPOBF-UHFFFAOYSA-N 5-methyl-1H-benzimidazole Chemical compound CC1=CC=C2N=CNC2=C1 RWXZXCZBMQPOBF-UHFFFAOYSA-N 0.000 description 1
- FJRZOOICEHBAED-UHFFFAOYSA-N 5-methyl-1h-1,2,4-triazol-3-amine Chemical compound CC1=NNC(N)=N1 FJRZOOICEHBAED-UHFFFAOYSA-N 0.000 description 1
- QRTAIBBOZNHRMI-UHFFFAOYSA-N 5-methyl-1h-indazole-3-carboxylic acid Chemical compound CC1=CC=C2NN=C(C(O)=O)C2=C1 QRTAIBBOZNHRMI-UHFFFAOYSA-N 0.000 description 1
- XKVUYEYANWFIJX-UHFFFAOYSA-N 5-methyl-1h-pyrazole Chemical compound CC1=CC=NN1 XKVUYEYANWFIJX-UHFFFAOYSA-N 0.000 description 1
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 description 1
- YPKBCLZFIYBSHK-UHFFFAOYSA-N 5-methylindole Chemical compound CC1=CC=C2NC=CC2=C1 YPKBCLZFIYBSHK-UHFFFAOYSA-N 0.000 description 1
- KUEFXPHXHHANKS-UHFFFAOYSA-N 5-nitro-1h-1,2,4-triazole Chemical compound [O-][N+](=O)C1=NC=NN1 KUEFXPHXHHANKS-UHFFFAOYSA-N 0.000 description 1
- WSGURAYTCUVDQL-UHFFFAOYSA-N 5-nitro-1h-indazole Chemical compound [O-][N+](=O)C1=CC=C2NN=CC2=C1 WSGURAYTCUVDQL-UHFFFAOYSA-N 0.000 description 1
- OZFPSOBLQZPIAV-UHFFFAOYSA-N 5-nitro-1h-indole Chemical compound [O-][N+](=O)C1=CC=C2NC=CC2=C1 OZFPSOBLQZPIAV-UHFFFAOYSA-N 0.000 description 1
- AOCDQWRMYHJTMY-UHFFFAOYSA-N 5-nitro-2h-benzotriazole Chemical compound C1=C([N+](=O)[O-])C=CC2=NNN=C21 AOCDQWRMYHJTMY-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- ZMAXXOYJWZZQBK-UHFFFAOYSA-N 5334-40-7 Chemical compound OC(=O)C1=NNC=C1[N+]([O-])=O ZMAXXOYJWZZQBK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- YTYIMDRWPTUAHP-UHFFFAOYSA-N 6-Chloroindole Chemical compound ClC1=CC=C2C=CNC2=C1 YTYIMDRWPTUAHP-UHFFFAOYSA-N 0.000 description 1
- QJRWYBIKLXNYLF-UHFFFAOYSA-N 6-methoxy-1h-indole Chemical compound COC1=CC=C2C=CNC2=C1 QJRWYBIKLXNYLF-UHFFFAOYSA-N 0.000 description 1
- KVVBXGWVNVZOTF-UHFFFAOYSA-N 6-methyl-2,7-dihydro-1h-pyrazolo[3,4-b]pyridine-3,4-dione Chemical compound N1C(C)=CC(=O)C2=C1NNC2=O KVVBXGWVNVZOTF-UHFFFAOYSA-N 0.000 description 1
- ICQJGRLWSLEFFW-UHFFFAOYSA-N 6-methyl-2h-pyrazolo[3,4-b]pyridin-3-amine Chemical compound N1=C(C)C=CC2=C(N)NN=C21 ICQJGRLWSLEFFW-UHFFFAOYSA-N 0.000 description 1
- XPAZGLFMMUODDK-UHFFFAOYSA-N 6-nitro-1h-benzimidazole Chemical compound [O-][N+](=O)C1=CC=C2N=CNC2=C1 XPAZGLFMMUODDK-UHFFFAOYSA-N 0.000 description 1
- ORZRMRUXSPNQQL-UHFFFAOYSA-N 6-nitro-1h-indazole Chemical compound [O-][N+](=O)C1=CC=C2C=NNC2=C1 ORZRMRUXSPNQQL-UHFFFAOYSA-N 0.000 description 1
- PSWCIARYGITEOY-UHFFFAOYSA-N 6-nitro-1h-indole Chemical compound [O-][N+](=O)C1=CC=C2C=CNC2=C1 PSWCIARYGITEOY-UHFFFAOYSA-N 0.000 description 1
- UUNKRAWCQSWCJE-UHFFFAOYSA-N 6-propan-2-yl-1h-indole Chemical compound CC(C)C1=CC=C2C=CNC2=C1 UUNKRAWCQSWCJE-UHFFFAOYSA-N 0.000 description 1
- WMYQAKANKREQLM-UHFFFAOYSA-N 7-chloro-1h-indole Chemical compound ClC1=CC=CC2=C1NC=C2 WMYQAKANKREQLM-UHFFFAOYSA-N 0.000 description 1
- LHCPRYRLDOSKHK-UHFFFAOYSA-N 7-deaza-8-aza-adenine Chemical compound NC1=NC=NC2=C1C=NN2 LHCPRYRLDOSKHK-UHFFFAOYSA-N 0.000 description 1
- PIIZLMYXLGYWTN-UHFFFAOYSA-N 7-ethyl-1h-indole Chemical compound CCC1=CC=CC2=C1NC=C2 PIIZLMYXLGYWTN-UHFFFAOYSA-N 0.000 description 1
- FSOPPXYMWZOKRM-UHFFFAOYSA-N 7-methoxy-1h-indole Chemical compound COC1=CC=CC2=C1NC=C2 FSOPPXYMWZOKRM-UHFFFAOYSA-N 0.000 description 1
- KGWPHCDTOLQQEP-UHFFFAOYSA-N 7-methylindole Chemical compound CC1=CC=CC2=C1NC=C2 KGWPHCDTOLQQEP-UHFFFAOYSA-N 0.000 description 1
- LZJGQIVWUKFTRD-UHFFFAOYSA-N 7-nitro-1h-indole Chemical compound [O-][N+](=O)C1=CC=CC2=C1NC=C2 LZJGQIVWUKFTRD-UHFFFAOYSA-N 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- DCXYFEDJOCDNAF-UHFFFAOYSA-N Asparagine Natural products OC(=O)C(N)CC(N)=O DCXYFEDJOCDNAF-UHFFFAOYSA-N 0.000 description 1
- 206010003497 Asphyxia Diseases 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XXAXVMUWHZHZMJ-UHFFFAOYSA-N Chymopapain Chemical compound OC1=CC(S(O)(=O)=O)=CC(S(O)(=O)=O)=C1O XXAXVMUWHZHZMJ-UHFFFAOYSA-N 0.000 description 1
- 206010011224 Cough Diseases 0.000 description 1
- YPWSLBHSMIKTPR-UHFFFAOYSA-N Cystathionine Natural products OC(=O)C(N)CCSSCC(N)C(O)=O YPWSLBHSMIKTPR-UHFFFAOYSA-N 0.000 description 1
- ILRYLPWNYFXEMH-UHFFFAOYSA-N D-cystathionine Natural products OC(=O)C(N)CCSCC(N)C(O)=O ILRYLPWNYFXEMH-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- PMMYEEVYMWASQN-DMTCNVIQSA-N Hydroxyproline Chemical compound O[C@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-DMTCNVIQSA-N 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 description 1
- AHLPHDHHMVZTML-BYPYZUCNSA-N L-Ornithine Chemical compound NCCC[C@H](N)C(O)=O AHLPHDHHMVZTML-BYPYZUCNSA-N 0.000 description 1
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- DCXYFEDJOCDNAF-REOHCLBHSA-N L-asparagine Chemical compound OC(=O)[C@@H](N)CC(N)=O DCXYFEDJOCDNAF-REOHCLBHSA-N 0.000 description 1
- FSBIGDSBMBYOPN-VKHMYHEASA-N L-canavanine Chemical compound OC(=O)[C@@H](N)CCONC(N)=N FSBIGDSBMBYOPN-VKHMYHEASA-N 0.000 description 1
- RHGKLRLOHDJJDR-BYPYZUCNSA-N L-citrulline Chemical compound NC(=O)NCCC[C@H]([NH3+])C([O-])=O RHGKLRLOHDJJDR-BYPYZUCNSA-N 0.000 description 1
- ILRYLPWNYFXEMH-WHFBIAKZSA-N L-cystathionine Chemical compound [O-]C(=O)[C@@H]([NH3+])CCSC[C@H]([NH3+])C([O-])=O ILRYLPWNYFXEMH-WHFBIAKZSA-N 0.000 description 1
- LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
- GGLZPLKKBSSKCX-YFKPBYRVSA-N L-ethionine Chemical compound CCSCC[C@H](N)C(O)=O GGLZPLKKBSSKCX-YFKPBYRVSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- UKAUYVFTDYCKQA-VKHMYHEASA-N L-homoserine Chemical compound OC(=O)[C@@H](N)CCO UKAUYVFTDYCKQA-VKHMYHEASA-N 0.000 description 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 description 1
- DWPCPZJAHOETAG-IMJSIDKUSA-N L-lanthionine Chemical compound OC(=O)[C@@H](N)CSC[C@H](N)C(O)=O DWPCPZJAHOETAG-IMJSIDKUSA-N 0.000 description 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- SNDPXSYFESPGGJ-UHFFFAOYSA-N L-norVal-OH Natural products CCCC(N)C(O)=O SNDPXSYFESPGGJ-UHFFFAOYSA-N 0.000 description 1
- LRQKBLKVPFOOQJ-YFKPBYRVSA-N L-norleucine Chemical compound CCCC[C@H]([NH3+])C([O-])=O LRQKBLKVPFOOQJ-YFKPBYRVSA-N 0.000 description 1
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- JDHILDINMRGULE-LURJTMIESA-N N(pros)-methyl-L-histidine Chemical compound CN1C=NC=C1C[C@H](N)C(O)=O JDHILDINMRGULE-LURJTMIESA-N 0.000 description 1
- BRMWTNUJHUMWMS-LURJTMIESA-N N(tele)-methyl-L-histidine Chemical compound CN1C=NC(C[C@H](N)C(O)=O)=C1 BRMWTNUJHUMWMS-LURJTMIESA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- UQFQONCQIQEYPJ-UHFFFAOYSA-N N-methylpyrazole Chemical compound CN1C=CC=N1 UQFQONCQIQEYPJ-UHFFFAOYSA-N 0.000 description 1
- RHGKLRLOHDJJDR-UHFFFAOYSA-N Ndelta-carbamoyl-DL-ornithine Natural products OC(=O)C(N)CCCNC(N)=O RHGKLRLOHDJJDR-UHFFFAOYSA-N 0.000 description 1
- FSBIGDSBMBYOPN-UHFFFAOYSA-N O-guanidino-DL-homoserine Natural products OC(=O)C(N)CCON=C(N)N FSBIGDSBMBYOPN-UHFFFAOYSA-N 0.000 description 1
- AHLPHDHHMVZTML-UHFFFAOYSA-N Orn-delta-NH2 Natural products NCCCC(N)C(O)=O AHLPHDHHMVZTML-UHFFFAOYSA-N 0.000 description 1
- UTJLXEIPEHZYQJ-UHFFFAOYSA-N Ornithine Natural products OC(=O)C(C)CCCN UTJLXEIPEHZYQJ-UHFFFAOYSA-N 0.000 description 1
- IDDMFNIRSJVBHE-UHFFFAOYSA-N Piscigenin Natural products COC1=C(O)C(OC)=CC(C=2C(C3=C(O)C=C(O)C=C3OC=2)=O)=C1 IDDMFNIRSJVBHE-UHFFFAOYSA-N 0.000 description 1
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 description 1
- 239000004473 Threonine Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- 206010047924 Wheezing Diseases 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000006177 alkyl benzyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005211 alkyl trimethyl ammonium group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- DFNYGALUNNFWKJ-UHFFFAOYSA-N aminoacetonitrile Chemical compound NCC#N DFNYGALUNNFWKJ-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000004599 antimicrobial Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 229960003121 arginine Drugs 0.000 description 1
- 229960001230 asparagine Drugs 0.000 description 1
- 235000009582 asparagine Nutrition 0.000 description 1
- 229960005261 aspartic acid Drugs 0.000 description 1
- 229950011321 azaserine Drugs 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- JCXKHYLLVKZPKE-UHFFFAOYSA-N benzotriazol-1-amine Chemical compound C1=CC=C2N(N)N=NC2=C1 JCXKHYLLVKZPKE-UHFFFAOYSA-N 0.000 description 1
- KYPIPCWVZKRJDD-UHFFFAOYSA-N benzotriazole-1-carboxylic acid Chemical compound C1=CC=C2N(C(=O)O)N=NC2=C1 KYPIPCWVZKRJDD-UHFFFAOYSA-N 0.000 description 1
- 229940000635 beta-alanine Drugs 0.000 description 1
- 239000007998 bicine buffer Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229940078916 carbamide peroxide Drugs 0.000 description 1
- GBFLZEXEOZUWRN-UHFFFAOYSA-N carbocisteine Chemical compound OC(=O)C(N)CSCC(O)=O GBFLZEXEOZUWRN-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 125000000259 cinnolinyl group Chemical class N1=NC(=CC2=CC=CC=C12)* 0.000 description 1
- 229960002173 citrulline Drugs 0.000 description 1
- 235000013477 citrulline Nutrition 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229960003624 creatine Drugs 0.000 description 1
- 239000006046 creatine Substances 0.000 description 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 1
- 235000018417 cysteine Nutrition 0.000 description 1
- 229960003067 cystine Drugs 0.000 description 1
- KCFYHBSOLOXZIF-UHFFFAOYSA-N dihydrochrysin Natural products COC1=C(O)C(OC)=CC(C2OC3=CC(O)=CC(O)=C3C(=O)C2)=C1 KCFYHBSOLOXZIF-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 108700003601 dimethylglycine Proteins 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- PMMYEEVYMWASQN-UHFFFAOYSA-N dl-hydroxyproline Natural products OC1C[NH2+]C(C([O-])=O)C1 PMMYEEVYMWASQN-UHFFFAOYSA-N 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- YSMODUONRAFBET-UHNVWZDZSA-N erythro-5-hydroxy-L-lysine Chemical compound NC[C@H](O)CC[C@H](N)C(O)=O YSMODUONRAFBET-UHNVWZDZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- PJMICNUGBHGMKQ-UHFFFAOYSA-N ethane-1,1,2-triamine Chemical compound NCC(N)N PJMICNUGBHGMKQ-UHFFFAOYSA-N 0.000 description 1
- DEFVIWRASFVYLL-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl)tetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)CCOCCOCCN(CC(O)=O)CC(O)=O DEFVIWRASFVYLL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 description 1
- 229960002743 glutamine Drugs 0.000 description 1
- ZTOMUSMDRMJOTH-UHFFFAOYSA-N glutaronitrile Chemical compound N#CCCCC#N ZTOMUSMDRMJOTH-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229960002591 hydroxyproline Drugs 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- IENZCGNHSIMFJE-UHFFFAOYSA-N indole-5-carboxylic acid Chemical compound OC(=O)C1=CC=C2NC=CC2=C1 IENZCGNHSIMFJE-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 125000003406 indolizinyl group Chemical class C=1(C=CN2C=CC=CC12)* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002497 iodine compounds Chemical class 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 description 1
- 125000000904 isoindolyl group Chemical class C=1(NC=C2C=CC=CC12)* 0.000 description 1
- 229960000310 isoleucine Drugs 0.000 description 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 description 1
- 150000002537 isoquinolines Chemical class 0.000 description 1
- 150000003854 isothiazoles Chemical class 0.000 description 1
- 150000002545 isoxazoles Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229960003646 lysine Drugs 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- DWPCPZJAHOETAG-UHFFFAOYSA-N meso-lanthionine Natural products OC(=O)C(N)CSCC(N)C(O)=O DWPCPZJAHOETAG-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
- 229940078490 n,n-dimethylglycine Drugs 0.000 description 1
- 150000005054 naphthyridines Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229960003104 ornithine Drugs 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- 229960005190 phenylalanine Drugs 0.000 description 1
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical class C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- AVTYONGGKAJVTE-UHFFFAOYSA-L potassium tartrate Chemical compound [K+].[K+].[O-]C(=O)C(O)C(O)C([O-])=O AVTYONGGKAJVTE-UHFFFAOYSA-L 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 229960002429 proline Drugs 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 125000001042 pteridinyl group Chemical class N1=C(N=CC2=NC=CN=C12)* 0.000 description 1
- 125000000561 purinyl group Chemical class N1=C(N=C2N=CNC2=C1)* 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 125000002294 quinazolinyl group Chemical class N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 150000003252 quinoxalines Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229960001153 serine Drugs 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229960003080 taurine Drugs 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 229960002898 threonine Drugs 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- BMCJATLPEJCACU-UHFFFAOYSA-N tricin Natural products COc1cc(OC)c(O)c(c1)C2=CC(=O)c3c(O)cc(O)cc3O2 BMCJATLPEJCACU-UHFFFAOYSA-N 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- BDPNSNXYBGIFIE-UHFFFAOYSA-J tungsten;tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[W] BDPNSNXYBGIFIE-UHFFFAOYSA-J 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本發明提供可達成充分平坦性之具有包含金屬之層的研磨對象物之研磨用組成物。
本發明之研磨用組成物係研磨具有包含金屬之層的研磨對象物所用之研磨用組成物，包含研磨粒、酸、氧化劑及分散介質，前述酸之酸解離常數(pKa)高於前述組成物之pH。
Description
本發明係有關具有包含金屬之層的研磨對象物之研磨用組成物。
近年來，因LSI製造製程之微細化造成之高積體化，使得以電腦為首之電子機器發揮小型化、多功能化、高速化等之高性能化。伴隨此LSI之高積體化之新的微細加工技術中，使用化學機械研磨(Chemical Mechanical Polishing；以下亦簡稱「CMP」)法。CMP法係於LSI製造步驟，尤其是多層配線形成步驟中之層間絕緣膜之平坦化、金屬柱塞形成、埋入配線(鑲嵌(damascene)配線)形成中頻繁被利用之技術。
CMP之一般方法係將研磨墊貼附於圓形之研磨壓盤(platen)上，以研磨劑浸漬研磨墊表面，且壓抵向基板之形成金屬膜之面，於自其背面施加特定壓力(研磨壓力)之狀態下旋轉研磨壓盤，藉由研磨劑與金屬膜之機械摩擦，而去除金屬膜(例如鎢)者。
半導體裝置中之金屬柱塞或配線之形成一般係於形成
有凹部之由氧化矽所成之絕緣體層上形成由如上述之金屬所成之導體層後，藉由研磨去除絕緣體層上之導體層之一部分直至絕緣體層露出而進行。該研磨步驟大致分為進行用以將應去除之導體層大部分去除之研磨的主研磨步驟與精加工研磨導體層及絕緣體層之拋光研磨步驟。
半導體裝置製造製程中使用之研磨用組成物一般含有酸等之研磨促進劑、氧化劑及研磨粒。相對於此，於日本特開2013-42131號公報(相當於美國專利申請公開第2013/045598號說明書)中，因氧化劑之使用會引起鎢柱塞之凹陷(過度研磨鎢之現象)，而報導不含氧化劑之CMP研磨漿料組成物。
以上述日本特開2013-42131號公報(相當於美國專利申請公開第2013/045598號說明書)之組成物，研磨後之表面變粗，而無法達成充分之平坦化。
因此，本發明係鑑於上述情況而完成者，目的在於提供可達成充分平坦性之具有包含金屬之層的研磨對象物之研磨用組成物。
本發明之其他目的係提供可均衡良好地確保低的蝕刻速度及極高的研磨速度之具有包含金屬之層的研磨對象物之研磨用組成物。
本發明人等為解決上述課題而進行積極研究。其結果，發現藉由使用具有酸解離常數(pKa)高於組成物之pH
的酸，可解決上述課題，因而完成本發明。
亦即，上述諸目的可藉由下述研磨用組成物而達成，該研磨用組成物係研磨具有包含金屬之層的研磨對象物所用之研磨用組成物，且包含研磨粒、酸、氧化劑及分散介質，前述酸之酸解離常數(pKa)高於前述組成物之pH。
本發明之研磨用組成物係用於研磨具有包含金屬之層的研磨對象物。且本發明之研磨用組成物包含研磨粒、酸、氧化劑及分散介質，此時酸之酸解離常數(pKa)高於研磨用組成物之pH。依據具有上述構成之研磨用組成物，可平滑地研磨研磨對象物的包含金屬之層。且依據本發明之研磨用組成物，可將蝕刻速度抑制為較低且以高的研磨速度研磨研磨對象物的包含金屬之層。
又，本說明書中，「酸解離常數(pKa)」亦簡稱為「酸解離常數」或「pKa」。且「具有酸解離常數(pKa)高於研磨用組成物之pH的酸」亦簡稱為「本發明之酸」。「具有包含金屬之層的研磨對象物之研磨用組成物」亦簡稱為「本發明之研磨用組成物」或「研磨用組成物」。
上述日本特開2013-42131號公報(相當於美國專利申請公開第2013/045598號說明書)之組成物含有由2價之陽離子部分及2價之陰離子部分所成之式(I)之二-四級化合物(尤其是四級胺化合物；段落[0029])。藉由該二-四級化合物之存在，的確可將蝕刻速度抑制為較低。然而，由
於該二-四級化合物之陽離子部分會吸附於研磨粒(例如Si-)表面且誘發研磨粒之凝集進而誘發沉降，故研磨粒之安定性降低。同時，由於研磨粒之2次粒徑變大，故研磨後之表面變粗(表面粗糙度Ra之值較高)。自CMP製程開始初期鎢因導電度較高或埋入性較高之理由而被應用。然而，廣為人知的是鎢由於硬度或脆性高故難以加工，於最終之精加工之面粗糙度比銅或鋁等之金屬更差。除上述以外，因近幾年之微細化(高積體化)而使鎢之結晶粒之面粗糙成為重要問題，該面粗糙要求藉由化學機械研磨(CMP)法消除。因此，上述日本特開2013-42131號公報(相當於美國專利申請公開第2013/045598號說明書)之組成物無法充分達成目前所要求之平坦化。且上述日本特開2013-42131號公報(相當於美國專利申請公開第2013/045598號說明書)之組成物中，必須使用碘酸鉀作為氧化劑，該氧化劑促進金屬氧化膜(例如氧化鎢(WO3)膜)之形成。然而，該碘酸鉀成為發生碘氣之原因。由於人吸入碘氣時會誘發咳嗽、氣喘、窒息等，故組成物之製造或使用該組成物之研磨作業時，必須充分換氣，作業者必須穿戴保護手套或防護衣等，有必要嚴密地管理作業環境。因此，近幾年來鑑於作業環境之健全化，期望儘可能不使用含碘之化合物。
相對於此，本發明之特徵為使用酸解離常數(pKa)高於研磨用組成物之pH的酸。藉由該構成時，即使不使用上述二-四級化合物，亦可平滑地(低表面粗糙度(Ra))研磨
包含金屬之層(具有包含金屬之層的研磨對象物)。且藉由使用本發明之研磨用組成物，可將蝕刻速度抑制為較低且以高的研磨速度研磨包含金屬之層(具有包含金屬之層的研磨對象物)。發揮上述效果之詳細機制尚不清楚，但認為係如下。又，以下之機制為推測，並非限制本發明之技術範圍者。亦即，如上述，由於以往以鎢為代表之金屬膜不易被蝕刻，故重點在於以快速之研磨速度研磨包含金屬之層。然而，近幾年來已開發出可使包含金屬之層薄膜化之技術，故提高研磨速度變得不那麼重要，代之反而是伴隨LSI製造製程之微細化的表面平坦化變得重要。通常，包含金屬之層的化學機械研磨(CMP)係以如下機制進行：藉由研磨用組成物中所含之氧化劑，使包含金屬之層表面氧化而形成金屬氧化膜。該金屬氧化膜藉由研磨粒而被物理性刮除從而受到研磨，經研磨之金屬表面又藉由氧化劑而氧化形成金屬氧化膜，該金屬氧化膜再藉由研磨粒被刮除之如此重複循環。然而，以往之方法，有研磨後之基板表面不具有充分平滑性之課題。本發明人等基於上述課題進行積極檢討後，推測結晶粒間之粒界腐蝕為表面粗糙降低之原因。亦即推測為，金屬氧化物(例如氧化鎢)與水接觸而成為金屬氫氧化物(例如氫氧化鎢)並溶解，但由於該化學反應所致的溶解比研磨粒之刮除者更快速，故蝕刻速度上升，而產生面粗糙。此處，亦已檢討提高研磨粒產生刮除之速度作為解決手段之一，但有必要提高研磨粒濃度，認為因成本高而實用性低。因此，本發明人等針對抑
制上述溶解之其他手段進行積極檢討，結果認為使用螯合能力低亦即對於組成物之pH具有高的pKa之酸為有效。
詳言之，pKa係酸所解離之基(例如羧基)量之指標，pKa高時意指解離之基少。因此，藉由使用pKa高的酸，由於可使酸的螯合能變低，故若使用含此等酸之組成物，則研磨時可抑制金屬(例如鎢)自基板溶解(溶出)，可減低研磨後之表面粗糙度。
因此，依據本發明之研磨用組成物，可將蝕刻速度抑制為較低且以高的研磨速度研磨包含金屬之層(研磨對象物)。且由於可抑制金屬之溶出，故以本發明之研磨用組成物研磨包含金屬之層(研磨對象物)時，可減低表面粗糙度(Ra)，可獲得具有平坦表面之層(基板)。此外，依據本發明之研磨用組成物，即使不提高研磨粒濃度，亦可將蝕刻速度抑制為較低且以高的研磨速度將包含金屬之層(研磨對象物)研磨為平滑表面。
以下說明本發明之實施形態。又，本發明並非僅限定於以下實施形態。
又，本說明書中只要未特別指明，則操作及物性等之測定係在室溫(20~25℃)/相對濕度40~50%RH之條件進行。
本發明之研磨對象物係包含金屬之層。此處，包含金屬之層只要為至少成為研磨對象之面包含金屬者即可。因
此，包含金屬之層可為由金屬構成之基板、具有包含金屬之層或由金屬構成之層的基板(例如於高分子或其他金屬基板上配置包含金屬之層或由金屬構成之層所成之基板)。較好，包含金屬之層係由金屬構成之層(例如基板)或具有由金屬構成之層的研磨對象物(例如基板)。
此處，作為金屬並未特別限制。例如舉例為鎢、銅、鋁、鈷、鉿、鎳、金、銀、鉑、鈀、銠、釕、銥、鋨等。
上述金屬亦可以合金或金屬化合物之形態含有。該等金屬可單獨使用或可組合2種以上使用。本發明之研磨用組成物可較好地使用於LSI製造製程之微細化造成之高積體化技術，尤其適用於研磨電晶體周邊之柱塞或通孔用之材料之際。且，作為填充之材料，較好為鎢、銅、鋁、鈷，更好為鎢。亦即，依據本發明之特佳形態，金屬為鎢(本發明之研磨用組成物使用於研磨包含鎢之層)。
本發明之研磨用組成物包含研磨粒、酸、氧化劑及分散介質，此時酸之酸解離常數(pKa)高於研磨用組成物之pH。以下說明本發明之研磨用組成物之構成。
本發明之研磨用組成物必須含有研磨粒。研磨用組成物中所含之研磨粒具有對研磨對象物進行機械研磨之作用，且提高研磨用組成物對研磨對象物之研磨速度。
使用之研磨粒可為無機粒子、有機粒子及有機無機複
合粒子之任一種。無機粒子之具體例列舉為例如由氧化矽、氧化鋁、氧化鈰、氧化鈦等金屬氧化物所成之粒子，以及氮化矽粒子、碳化矽粒子、氮化硼粒子。有機粒子之具體例列舉為例如聚甲基丙烯酸甲酯(PMMA)粒子。該研磨粒可單獨使用或混合2種以上使用。另外，該研磨粒可使用市售品亦可使用合成品。
該等研磨粒中以氧化矽較佳，特佳為膠體氧化矽。
研磨粒亦可經表面修飾。通常之膠體氧化矽由於在酸性條件下之Zeta電位值接近於零，故在酸性條件下氧化矽粒子彼此間不會相互電性排斥而容易引起凝聚。相對於此，即使在酸性條件下具有Zeta電位較大之負值之經表面修飾之研磨粒，在酸性條件下相互間強烈排斥而成良好分散。其結果，可提高研磨用組成物之保存安定性。如此之表面修飾研磨粒可藉由例如使鋁、鈦或鋯等金屬或該等之氧化物與研磨粒混合而摻雜於研磨粒之表面而獲得。
其中，特佳者為固定化有有機酸之膠體氧化矽。有機酸對研磨用組成物中所含之膠體氧化矽表面之固定化係藉由例如使有機酸之官能基化學鍵結於膠體氧化矽表面而進行。僅單使膠體氧化矽與有機酸共存，無法發揮有機酸朝膠體氧化矽之固定化。若使有機酸之一種的磺酸固定化於膠體氧化矽上，則可藉例如”Sulfonic acid-functionalized silica through quantitative oxidation of thiol groups",Chem.Commun.246-247(2003)中所記載之方法進行。具體而言，使3-巰丙基三甲氧基矽烷等之具有硫醇基之矽烷
偶合劑偶合於膠體氧化矽後，以過氧化氫使硫醇基氧化，藉此可獲得磺酸固定化於表面之膠體氧化矽。或者，若使羧酸固定化於膠體氧化矽，則可藉例如”Novel Silane Coupling Agents Containing a Photolabile 2-Nitrobenzyl Ester for Introduction of a Carboxy Group on the Surface of Silica Gel”,Chemistry Letters,3,228-229(2000)中所記載之方法進行。具體而言，在將含有光反應性2-硝基苄酯之矽烷偶合劑偶合於膠體氧化矽後，藉由光照射，可獲得使羧酸固定化於表面之膠體氧化矽。
研磨粒之平均締合度較好未達5.0，更好為3.0以下，又更好為2.5以下。隨著研磨粒之平均締合度減小，若為此等範圍，則可使造成表面粗糙度原因之研磨粒形狀變成良好者。研磨粒之平均締合度又較好為1.0以上，更好為1.05以上。該平均締合度可藉由將研磨粒之平均二次粒徑之值除以平均一次粒徑之值而得。隨著研磨粒之平均締合度增大，具有提高研磨用組成物對研磨對象物之研磨速度之有利效果。
研磨粒之平均一次粒徑之下限較好為10nm以上，更好為15nm以上，又更好為20nm以上。且，研磨粒之平均一次粒徑之上限較好為200nm以下，更好為150nm以下，又更好為100nm以下。若為該範圍，則研磨用組成物對研磨對象物之研磨速度獲得提高，且，可進一步抑制使用研磨用組成物研磨後之研磨對象物表面產生表面缺陷。又，研磨粒之平均一次粒徑係採用基於以BET法測
定之研磨粒之比表面積算出。
研磨粒之平均二次粒徑之下限較好為15nm以上，更好為20nm以上，又更好為30nm以上。且，研磨粒之平均二次粒徑之上限較好為300nm以下，更好為260nm以下，又更好為220nm以下。若為該範圍，則研磨用組成物對研磨對象物之研磨速度獲得提高，且，可更抑制使用研磨用組成物研磨後之研磨對象物表面產生表面缺陷。
又，此處所謂之二次粒子係指研磨粒在研磨用組成物中締合而形成之粒子，該二次粒子之平均二次粒徑可藉例如動態光散射法測定。
研磨用組成物中之研磨粒之長寬比之上限較好未達2.0，更好為1.8以下，又更好為1.5以下。若為此範圍，則可使造成表面粗糙度原因之研磨粒形狀變成良好者。
又，長寬比可藉由掃描型電子顯微鏡，採取與研磨粒粒子之圖像外切之最小長方形，將該長方形之長邊長度除以同一長方形之短邊之長度而得之值的平均，一般可使用圖像解析軟體求得。研磨用組成物中之研磨粒之長寬比下限為1.0以下。越接近該值，越可使造成表面粗糙度原因之研磨粒形狀變變成良好者。
研磨用組成物中之研磨粒之藉由雷射繞射散射法求得之粒度分佈中自微粒子側累計粒子重量達到全部粒子重量之90%時之粒子直徑(D90)與達到全部粒子重量之10%時之粒子直徑(D10)之比的D90/D10之下限較好為1.1以上，更好為1.2以上，又更好為1.3以上。且，研磨用組
成物中之研磨粒之藉由雷射繞射散射法求得之粒度分佈中自微粒子側累計粒子重量達到全部粒子重量之90%時之粒子直徑(D90)與達到全部粒子重量之10%時之粒子直徑(D10)之比的D90/D10之上限並未特別限制，但較好為2.04以下。若為此範圍，則可使造成表面粗糙度原因之研磨粒形狀變成良好者。
研磨用組成物中之研磨粒含量下限較好為0.1質量%以上，更好為0.5質量%以上，又更好為1質量%以上。
且，研磨用組成物中之研磨粒之含量上限較好為50質量%以下，更好為30質量%以下，又更好為20質量%以下。若為該範圍，則可提高研磨對象物之研磨速度，且可抑制研磨用組成物之成本，可更抑制使用研磨用組成物研磨後之研磨對象物表面產生表面缺陷。
本發明之研磨用組成物必須含有酸解離常數(pKa)高於該組成物之pH的酸。本發明之酸係作為防腐蝕劑發揮作用。因此藉由本發明之酸的存在，可抑制研磨對象物的金屬溶解(溶出)，可平滑地(低表面粗糙度(Ra))研磨包含金屬之層(研磨對象物)。且可將蝕刻速度抑制為較低且以高的研磨速度研磨包含金屬之層(研磨對象物)。
本說明書中，酸的酸解離常數(pKa)係酸性度之指標，係對酸的解離常數(Ka)之倒數取常用對數者。亦即酸解離常數(pKa)係在稀薄水溶液條件下測定酸解離常數
Ka=[H3O+][B-]/[BH]，由pKa=-logKa而求得。又上述式中，BH表示有機酸，B-表示有機酸之共軛鹼。pKa之測定方法係使用pH計測定氫離子濃度，自該物質之濃度與氫離子濃度算出。又，為多元酸之情況，為針對第一段Ka算出之值(pKa1)。
此處，研磨用組成物之pH與酸的酸解離常數之差若滿足研磨用組成物之pH<酸的pKa之關係，則未特別限制。若考慮金屬溶解(溶出)之抑制效果進一步提高，則酸的酸解離常數(pKa)與前述組成物之pH之差[=(酸的酸解離常數(pKa))-(組成物之pH)]較好為0.9以上，更好為1.0以上，又更好為1.2以上，特佳為超過1.4。滿足此等差的酸，研磨時，更有效地抑制金屬自基板之溶解(溶出)，可進一步減低研磨後之包含金屬之層(研磨對象物)之表面粗糙度。且，若使用含有此等酸之研磨用組成物，則可將研磨速度維持為較高且更減低研磨時之蝕刻速度。
此處，酸之pKa只要高於研磨用組成物之pH則未特別限制，可根據研磨對象的金屬種類適當選擇。具體而言，酸的酸解離常數(pKa)較好為2.9以上且未達5.0，更好為超過3.0且4.9以下，又更好為3.2以上且4.8以下，特佳為超過3.4且4.8以下。具有此種pKa之酸，於研磨時，可更有效地抑制金屬自基板之溶解(溶出)，可進一步減低研磨後之包含金屬之層(研磨對象物)之表面粗糙度。且，若使用含有此等酸之研磨用組成物，則可將研磨速度維持為較高且更減低研磨時之蝕刻速度。
酸只要具有高於研磨用組成物之pH的pKa之任一種酸均可使用，但基於金屬之溶解抑制能之觀點，較好為具有羧基之有機酸以及具有羧基及於末端具有羥基(亦即-CH2OH)之有機酸。具體舉例為檸檬酸、琥珀酸、丙二酸、酒石酸、乳酸、蘋果酸、乙酸、鄰苯二甲酸、乙醇酸、巴豆酸、戊酸、2-羥基丁酸、γ-羥基丁酸、2-羥基異丁酸、3-羥基異丁酸、甘油酸、苯甲酸、白羥酸(leucic acid)、丙酸、丁酸、2-甲基丁酸、正己酸、3,3-二甲基丁酸、2-乙基丁酸、4-甲基戊酸、正庚酸、2-甲基己酸、正辛酸、2-乙基己酸、水楊酸、草酸、戊二酸、己二酸、庚二酸、扁桃酸等。該等中，較好為琥珀酸、乙酸、鄰苯二甲酸、乙醇酸、巴豆酸、戊酸、γ-羥基丁酸、2-羥基異丁酸、3-羥基異丁酸、苯甲酸。此等酸於研磨時，可更有效地抑制金屬自基板之溶解(溶出)，可進一步減低研磨後之包含金屬之層(研磨對象物)之表面粗糙度。且，若使用含有此等酸之研磨用組成物，則可將研磨速度維持為較高且更減低研磨時之蝕刻速度。
上述酸可單獨使用或以2種以上之混合物形態使用。
又，以2種以上使用酸時之酸的酸解離常數(pKa)可藉由上述方法測定。
研磨用組成物中之酸含量並未特別限制，但較好為使研磨用組成物之pH成為1以上7以下，更好1.05以上5以下之量。此等pH之研磨用組成物之保管安定性優異。且研磨用組成物之處理容易。此外，可提高研磨對象物的
金屬之研磨速度。
本發明之研磨用組成物除了上述研磨粒及酸以外，必須含有氧化劑。本發明之氧化劑並未特別限制，但較好為過氧化物。亦即，依據本發明之較佳形態，氧化劑為過氧化物。作為此種過氧化物之具體例並非限制於以下，但舉例為過氧化氫、過乙酸、過碳酸鹽、過氧化脲、過硫酸鈉、過硫酸鉀、過硫酸銨、單過硫酸氫鉀及OXONE等。上述氧化劑可單獨使用或可混合2種以上使用。亦即，依據本發明之較佳形態，過氧化物為選自由過氧化氫、過乙酸、過碳酸鹽、過氧化脲、過硫酸鈉、過硫酸鉀、過硫酸銨、單過硫酸氫鉀(potassium monopersulfate)及OXONE(2KHSO5．KHSO4．K2SO4)所成之群中之至少1種。氧化劑較好為過硫酸鹽(過硫酸鈉、過硫酸鉀、過硫酸銨)及過氧化氫，特佳為過氧化氫。
研磨用組成物中之氧化劑含量(濃度)之下限較好為0.001質量%以上，更好為0.005質量%以上，又更好為0.01質量%以上。隨著氧化劑含量變多，有可提高研磨用組成物之研磨速度之優點。研磨用組成物中之氧化劑含量(濃度)之上限較好為10質量%以下，更好為5質量%以下，又更好為1質量%以下。隨著氧化劑含量減少，除了可抑制研磨用組成物之材料成本以外，亦具有可減輕研磨使用後之研磨用組成物之處理亦即廢液處理之負荷之優點。且亦具有不易引起研磨對象物表面之過度氧化，可減
低研磨後之金屬表面粗糙度之優點。
又，由於藉由氧化劑於包含金屬之層的表面形成氧化膜，故氧化劑較好於即將研磨前才添加。
本發明之研磨用組成物含有用以分散或溶解各成分之分散介質。此處，分散介質並未特別限制，但較好為水。基於抑制阻礙其他成分作用之觀點，較好為儘可能不含雜質之水，具體而言，較好為以離子交換樹脂去除雜質離子後，通過過濾器去除異物之純水及超純水、或蒸餾水。
如上述，本發明之研磨用組成物必須含有研磨粒、酸、氧化劑及分散介質，但除上述成分以外，亦可含有其他添加劑。此處，作為其他添加劑並未特別限制，可使用研磨用組成物中通常添加之添加劑。具體舉例為錯化劑、金屬防腐蝕劑、防腐劑、防黴劑、還原劑、水溶性高分子、用以溶解難溶性有機物之有機溶劑等。又，本發明之研磨用組成物實質上不含例如日本特開2013-42131號公報中記載之二-四級化合物。又，本發明之研磨用組成物實質上不含如啟動碘氣發生之碘化合物(例如碘酸鉀)。此處，所謂「實質上不含」意指成為對象之物質對於研磨用組成物以10質量%以下(下限：0質量%)之比例存在，較好以5質量%以下(下限：0質量%)之比例存在。
以下，針對上述其他添加劑中之錯合物、金屬防腐蝕劑、防腐劑及防黴劑加以說明。
研磨用組成物若需要可含有之錯化劑具有對研磨對象物表面進行化學蝕刻之作用，而可更有效提高利用研磨用組成物對於研磨對象物之研磨速度。
作為可使用之錯化劑之例，舉例為例如無機酸或其鹽、有機酸或其鹽、腈化合物、胺基酸、及螯合劑等。該等錯化劑可單獨使用亦可混合2種以上使用。又，錯化劑可使用市售品亦可使用合成品。
作為錯化劑，亦可使用前述無機酸或前述有機酸之鹽。尤其於使用弱酸與強鹼之鹽、強酸與弱鹼之鹽、或弱酸與弱鹼之鹽時，可期待pH之緩衝作用。此種鹽之例舉例為例如氯化鉀、硫酸鈉、硝酸鉀、碳酸鉀、四氟硼酸鉀、焦磷酸鉀、草酸鉀、檸檬酸三鈉、(+)-酒石酸鉀、六氟磷酸鉀等。
腈化合物之具體例舉例為例如乙腈、胺基乙腈、丙腈、丁腈、異丁腈、苯甲腈、戊二腈、甲氧基乙腈等。
胺基酸之具體例舉例為甘胺酸、α-丙胺酸、β-丙胺酸、N-甲基甘胺酸、N,N-二甲基甘胺酸、2-胺基丁酸、正纈胺酸、纈胺酸、亮胺酸、正亮胺酸、異亮胺酸、苯基丙胺酸、脯胺酸、肌胺酸、鳥胺酸、離胺酸、牛磺酸、絲胺酸、蘇胺酸、高絲胺酸、酪胺酸、N,N-二羥乙基甘胺酸(bicine)、N-參羥甲基甲基甘胺酸(tricin)、3,5-二碘酪胺酸、β-(3,4-二羥基苯基)-丙胺酸、甲狀腺素(thyroxin)、4-
羥基-脯胺酸、半胱胺酸、甲硫胺酸、乙硫胺酸、羊毛硫胺酸(lanthionine)、胱硫醚(cystathionine)、胱胺酸、磺基丙胺酸(cysteic acid)、天門冬胺酸、穀胺酸、S-(羧基甲基)-半胱胺酸、4-胺基丁酸、天冬醯胺、穀醯胺、氮雜絲胺酸(azaserine)、精胺酸、刀豆胺酸(canavanine)、瓜胺酸、δ-羥基離胺酸、肌酸、組胺酸、1-甲基組胺酸、3-甲基組胺酸及色胺酸等。
螯合劑之具體例列舉為氮基三乙酸、二伸乙基三胺五乙酸、乙二胺四乙酸、N,N,N-三亞甲基膦酸、乙二胺-N,N,N’,N’-四亞甲基磺酸、反式環己烷二胺四乙酸、1,2-二胺基丙烷四乙酸、二醇醚二胺四乙酸、乙二胺鄰羥基苯基乙酸、乙二胺二琥珀酸(SS體)、N-(2-羧酸根乙基)-L-天門冬胺酸、β-丙胺酸二乙酸、2-膦醯丁烷-1,2,4-三羧酸、1-羥基亞乙基-1,1-二膦酸、N,N’-雙(2-羥基苄基)乙二胺-N,N’-二乙酸、1,2-二羥基苯-4,6-二磺酸等。
該等中，較好為選自由無機酸或其鹽、羧酸或其鹽、及腈化合物所組成之群之至少1種，基於與研磨對象物中所含之金屬化合物之錯合物構造之安定性之觀點，更好為無機酸或其鹽。
研磨用組成物中含錯化劑時，錯化劑之含量(濃度)並未特別限制。例如錯化劑之含量(濃度)下限由於即使少量亦可發揮效果故而未特別限定，但較好為0.001g/L以上，更好為0.01g/L以上，又更好為1g/L以上。且，錯化劑之含量(濃度)上限，較好為20g/L以下，更好為15g/L
以下，又更好為10g/L以下。若為該範圍，則可提高研磨對象物之研磨速度，且提高使用研磨用組成物研磨後之研磨對象物之表面平滑性方面亦有利。
其次，研磨用組成物中若需要而含有之金屬防腐蝕劑係藉由防止金屬溶解而抑制研磨表面之面粗糙等之表面狀態惡化之作用。惟由於本發明中之酸係作為金屬防腐蝕劑之作用，故本發明之研磨用組成物即使未另外添加金屬防腐蝕劑，亦可充分抑制．防止金屬溶解。
可使用之金屬防腐蝕劑並未特別限制，較好為雜環式化合物或界面活性劑。雜環式化合物中之雜環員數並無特別限制。且，雜環式化合物可為單環化合物，亦可為具有縮合環之多環化合物。該金屬防腐蝕劑可單獨使用或混合2種以上使用。且，該金屬防腐蝕劑可使用市售品亦可使用合成品。
可作為金屬防腐蝕劑使用之雜環化合物之具體例列舉為例如吡咯化合物、吡唑化合物、咪唑化合物、三唑化合物、四唑化合物、吡啶化合物、哌啶化合物、嗒嗪化合物、吡嗪化合物、吲哚嗪(indolizine)化合物、吲哚化合物、異吲哚化合物、吲唑化合物、嘌呤化合物、喹嗪(quinolizine)化合物、喹啉化合物、異喹啉化合物、萘啶化合物、酞嗪化合物、喹喔啉化合物、喹唑啉化合物、噌啉化合物、喋啶化合物、噻唑化合物、異噻唑化合物、噁唑化合物、異噁唑化合物、呋咱化合物等含氮雜環化合物。
若進一步舉例具體例，作為吡唑化合物列舉為例如1H-吡唑、4-硝基-3-吡唑羧酸、3,5-吡唑羧酸、3-胺基-5-苯基吡唑、5-胺基-3-苯基吡唑、3,4,5-三溴吡唑、3-胺基吡唑、3,5-二甲基吡唑、3,5-二甲基-1-羥基甲基吡唑、3-甲基吡唑、1-甲基吡唑、3-胺基-5-甲基吡唑、4-胺基-吡唑并[3,4-d]嘧啶、異嘌呤醇、4-氯-1H-吡唑并[3,4-D]嘧啶、3,4-二羥基-6-甲基吡唑并(3,4-B)-吡啶、6-甲基-1H-吡唑并[3,4-b]吡啶-3-胺等。
咪唑化合物列舉為例如咪唑、1-甲基咪唑、2-甲基咪唑、4-甲基咪唑、1,2-二甲基吡唑、2-乙基-4-甲基咪唑、2-異丙基咪唑、苯并咪唑、5,6-二甲基苯并咪唑、2-胺基苯并咪唑、2-氯苯并咪唑、2-甲基苯并咪唑、2-(1-羥基乙基)苯并咪唑、2-羥基苯并咪唑、2-苯基苯并咪唑、2,5-二甲基苯并咪唑、5-甲基苯并咪唑、5-硝基苯并咪唑等。
三唑化合物之例較好為例如1,2,3-三唑(1H-BTA)、1,2,4-三唑、1-甲基-1,2,4-三唑、甲基-1H-1,2,4-三唑-3-羧酸酯、1,2,4-三唑-3-羧酸、1,2,4-三唑-3-羧酸甲酯、1H-1,2,4-三唑-3-硫醇、3,5-二胺基-1H-1,2,4-三唑、3-胺基-1,2,4-三唑-5-硫醇、3-胺基-1H-1,2,4-三唑、3-胺基-5-苄基-4H-1,2,4-三唑、3-胺基-5-甲基-4H-1,2,4-三唑、3-硝基-1,2,4-三唑、3-溴-5-硝基-1,2,4-三唑、4-(1,2,4-三唑-1-基)苯酚、4-胺基-1,2,4-三唑、4-胺基-3,5-二丙基-4H-1,2,4-三唑、4-胺基-3,5-二甲基-4H-1,2,4-三唑、4-胺基-3,5-二庚基-4H-1,2,4-三唑、5-甲基-1,2,4-三唑-3,4-二胺、1H-苯并
三唑、1-羥基苯并三唑、1-胺基苯并三唑、1-羧基苯并三唑、5-氯-1H-苯并三唑、5-硝基-1H-苯并三唑、5-羧基-1H-苯并三唑、5-甲基-1H-苯并三唑、5,6-二甲基-1H-苯并三唑、1-(1’,2’-二羧基乙基)苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]-5-甲基苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]-4-甲基苯并三唑等。
四唑化合物之例列舉為例如1H-四唑、5-甲基四唑、5-胺基四唑、及5-苯基四唑等。
吲唑化合物之例列舉為例如1H-吲唑、5-胺基-1H-吲唑、5-硝基-1H-吲唑、5-羥基-1H-吲唑、6-胺基-1H-吲唑、6-硝基-1H-吲唑、6-羥基-1H-吲唑、3-羧基-5-甲基-1H-吲唑等。
吲哚化合物列舉為例如1H-吲哚、1-甲基-1H-吲哚、2-甲基-1H-吲哚、3-甲基-1H-吲哚、4-甲基-1H-吲哚、5-甲基-1H-吲哚、6-甲基-1H-吲哚、7-甲基-1H-吲哚、4-胺基-1H-吲哚、5-胺基-1H-吲哚、6-胺基-1H-吲哚、7-胺基-1H-吲哚、4-羥基-1H-吲哚、5-羥基-1H-吲哚、6-羥基-1H-吲哚、7-羥基-1H-吲哚、4-甲氧基-1H-吲哚、5-甲氧基-1H-吲哚、6-甲氧基-1H-吲哚、7-甲氧基-1H-吲哚、4-氯-1H-吲哚、5-氯-1H-吲哚、6-氯-1H-吲哚、7-氯-1H-吲哚、4-羧基-1H-吲哚、5-羧基-1H-吲哚、6-羧基-1H-吲哚、7-羧基-1H-吲哚、4-硝基-1H-吲哚、5-硝基-1H-吲哚、6-硝基-1H-吲哚、7-硝基-1H-吲哚、4-腈-1H-吲哚、5-腈-1H-
吲哚、6-腈-1H-吲哚、7-腈-1H-吲哚、2,5-二甲基-1H-吲哚、1,2-二甲基-1H-吲哚、1,3-二甲基-1H-吲哚、2,3-二甲基-1H-吲哚、5-胺基-2,3-二甲基-1H-吲哚、7-乙基-1H-吲哚、5-(胺基甲基)吲哚、2-甲基-5-胺基-1H-吲哚、3-羥基甲基-1H-吲哚、6-異丙基-1H-吲哚、5-氯-2-甲基-1H-吲哚等。
該等中較佳之雜環化合物為三唑化合物，尤其較好為1H-苯并三唑、5-甲基-1H-苯并三唑、5,6-二甲基-1H-苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]-5-甲基苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]-4-甲基苯并三唑、1,2,3-三唑及1,2,4-三唑。該等雜環化合物由於對研磨對象物表面之化學或物理吸附力高，故而可於研磨對象物表面形成更強固之保護膜。此對於提高使用本發明之研磨用組成物研磨後之研磨對象物表面之平坦性方面有利。
且，作為金屬防腐蝕劑使用之界面活性劑舉例為陰離子性界面活性劑、陽離子性界面活性劑、兩性界面活性劑。
陰離子性界面活性劑之例舉例為例如聚氧伸乙基烷基醚乙酸、聚氧伸乙基烷基硫酸酯、烷基硫酸酯、聚氧伸乙基烷基醚硫酸、烷基醚硫酸、烷基苯磺酸、烷基磷酸酯、聚氧伸乙基烷基磷酸酯、聚氧伸乙基磺基琥珀酸、烷基磺基琥珀酸、烷基萘磺酸、烷基二苯基醚二磺酸及該等之鹽。
陽離子性界面活性劑之例舉例為例如烷基三甲基銨
鹽、烷基二甲基銨鹽、烷基苄基二甲基胺鹽、烷基胺鹽等。
兩性界面活性劑之例舉例為例如烷基甜菜鹼、氧化烷基胺等。
非離子性界面活性劑之例舉例為例如聚氧伸乙基烷基醚等之聚氧伸烷基烷基醚、山梨糖醇酐脂肪酸酯、甘油脂肪酸酯、聚氧伸乙基脂肪酸酯、聚氧伸乙基烷基胺及烷基烷醇醯胺。其中較好為聚氧伸烷基烷基醚。
該等中較佳之界面活性劑為聚氧伸乙基烷基醚乙酸、聚氧伸乙基烷基醚硫酸酯、烷基醚硫酸鹽及烷基苯磺酸鹽。該等界面活性劑由於對研磨對象物表面之化學或物理吸附力高，故而可於研磨對象物表面形成更強固之保護膜。此對於提高使用本發明之研磨用組成物研磨後之研磨對象物表面之平坦性方面有利。
研磨用組成物含有金屬防腐蝕劑時之金屬防腐蝕劑含量(濃度)並未特別限制。例如金屬防腐蝕劑含量(濃度)之下限，較好為0.001g/L以上，更好為0.005g/L以上，又更好為0.01g/L以上。且金屬防腐蝕劑含量(濃度)之上限，較好為10g/L以下，更好為5g/L以下，又更好為2g/L以下。若為該範圍，則可防止金屬之溶解，可抑制研磨表面之面粗糙等之表面狀態惡化。
再者，研磨用組成物中若需要可含有之防腐劑及防黴劑舉例有例如2-甲基-4-異噻唑啉-3-酮或5-氯-2-甲基-4-異噻唑啉-3-酮等之異噻唑啉系防腐劑，對羥基苯甲酸酯
類及苯氧基乙醇等。該等防腐劑及防黴劑可單獨使用或亦可混合2種以上使用。
本發明之研磨用組成物之製造方法並未特別限制，例如可藉由使研磨粒、酸、氧化劑以及視需要之其他添加劑於分散介質(例如水)中攪拌混合而獲得。亦即，本發明亦提供包含使前述研磨粒、前述酸、及前述氧化劑混合之研磨用組成物之製造方法。
又，如上述，由於氧化劑促進了對包含金屬之層表面的氧化膜形成，故較好將研磨粒、酸以及視需要之其他添加劑添加於分散介質(例如水)中調製預備組成物，並於正要研磨前將氧化劑添加於上述預備組成物中。
混合各成分時之溫度並無特別限制，但較好為10~40℃，亦可加熱以提高溶解速度。且，混合時間若可均一混合則亦無特別限制。
如上述，本發明之研磨用組成物可較好地用於研磨包含金屬之層(研磨對象物)。因此，本發明亦提供以本發明之研磨用組成物研磨具有包含金屬之層的研磨對象物之研磨方法。且本發明提供包含以前述研磨方法研磨具有包含金屬之層的研磨對象物之步驟的基板之製造方法。
作為研磨裝置可使用安裝有保持具有研磨對象物之基
板等之載具與可改變轉數之馬達等，且具有可貼附研磨墊(研磨布)之研磨壓盤之一般研磨裝置。
作為前述研磨墊可無特別限制的使用一般之不織布、聚胺基甲酸酯及多孔質氟樹脂等。研磨墊中較好施以可使研磨液積存之溝槽加工。
關於研磨條件，例如研磨壓盤之旋轉速度較好為10~500rpm。對具有研磨對象物之基板施加之壓力(研磨壓力)較好為0.5~10psi。將研磨用組成物供給於研磨墊之方法亦無特別限制，例如可採用泵等連續供給之方法。其供給量並無限制，但較好為研磨墊之表面隨時以本發明之研磨用組成物覆蓋。
研磨結束後，在水流中洗淨基板，以旋轉乾燥機等甩掉附著於基板上之水滴予以乾燥，而獲得具有包含金屬之層的基板。
本發明之研磨用組成物可為一液型，亦可為以二液型為代表之多液型。如上述，氧化劑促進於包含金屬之層表面之氧化膜形成。因此，較好為由第一液及第二液所成之二液型，該第一液含有研磨粒、酸、分散介質(例如水)、以及視需要之其他添加劑，該第二液含有氧化劑及若需要之分散介質(例如水)。且本發明之研磨用組成物亦可藉由使用水等稀釋液將研磨用組成物之原液例如稀釋10倍以上而調製。
本發明之研磨用組成物較好使用於金屬研磨之步驟尤其是鎢研磨之步驟。再者，於鎢研磨之步驟大致分為進行
用以將包含鎢之層的大部分去除之主研磨步驟與精加工研磨包含鎢之層及絕緣體層之拋光研磨步驟時，本發明之研磨用組成物較好使用於拋光研磨步驟。
本發明將使用以下之實施例及比較例更詳細說明。惟，本發明之技術範圍並非僅限於以下實施例。又，只要未特別記載，則「%」及「份」分別意指「質量%」及「質量份」。且下述實施例中，只要未特別記載，則操作係於室溫(25℃)/相對濕度40~50%RH之條件下進行。
於純水1L中，以相對於最終之研磨用組成物成為2.0質量%之量添加研磨粒(固定磺酸之膠體氧化矽；平均一次粒徑：30nm，平均二次粒徑：60nm，長寬比：1.24，D90/D10：2.01)，添加下述表1所示之酸而調製研磨用組成物。又，酸係添加為使添加後述之氧化劑之前的研磨用組成物之pH成為2.0。且，於正要研磨鎢晶圓之前，以相對於最終之研磨用組成物成為0.45質量%之量邊攪拌邊將作為氧化劑之過氧化氫水(30質量%)添加於上述研磨用組成物。添加氧化劑後之最終研磨用組成物之pH一起表示於表1。研磨用組成物(液溫：25℃)之pH係藉由pH計(堀場製作所股份有限公司製，型號：LAQUA)確認。
除了將研磨粒變更為未修飾膠體氧化矽(平均一次粒徑：30nm，平均二次粒徑：60nm，長寬比：1.24，D90/D10：2.01)以外，與實施例12同樣調製研磨用組成物。
針對以上述獲得之研磨用組成物，依據下述方法，評價研磨速度(Removal Rate)(Å/min)、蝕刻速度(Etching Rate)(Å/min)及表面粗糙度。結果示於下表1。
使用各研磨用組成物，藉以下研磨條件研磨研磨對象物。藉由手動薄片電阻器(VR-120，日立國際電氣股份有限公司製)測定研磨前後之研磨對象物厚度(膜厚)。藉由下述(研磨速度之算出方法)，將研磨前後之研磨對象物厚度(膜厚)之差除以研磨時間，求出研磨速度(Removal Rate)(Å/min)。又，作為研磨對象物使用鎢晶圓(大小：32mm×32mm)。
[化1]
(研磨條件)
研磨裝置：單面CMP研磨機(ENGIS)
研磨墊：聚胺基甲酸酯製墊(IC1010：羅門哈斯公司製)
壓力：2.0psi
壓盤(platen)旋轉數：70rpm
壓頭(載具)旋轉數：70rpm
研磨用組成物之流量：150ml/min
研磨時間：60秒
研磨速度(研磨速率)(Å/min)藉由下述式(1)計算。
藉由下述操作進行蝕刻試驗。亦即，將使各研磨用組成物300mL以300rpm攪拌之樣品容器中，浸漬研磨對象物10分鐘而進行。浸漬後之晶圓以純水洗淨30秒，以空氣槍吹風乾燥進行乾燥。藉由手動薄片電阻器(VR-120，日立國際電氣股份有限公司製)測定蝕刻前後之研磨對象物厚度(膜厚)。藉由下述(蝕刻速度之算出方法)，將蝕刻試驗前後之研磨對象物厚度(膜厚)之差除以蝕刻試驗時間，求出蝕刻速度(Etching Rate)(Å/min)。又，作為研磨對象物使用鎢晶圓(大小：32mm×32mm)。
蝕刻速度(蝕刻速率)(Å/min)藉由下述式(2)計算。
[數2]
與上述[研磨速度(Removal Rate)之測定]同樣，使用研磨用組成物，研磨研磨對象物。使用掃描型探針顯微鏡(SPM)測定研磨後之研磨對象物之研磨面的表面粗糙度(Ra)。又作為SPM係使用日立高科技股份有限公司製之NANO-NVAI2。懸臂係使用SI-DF40P2。測定係以掃描頻率0.86Hz、X：512pt、Y：512pt進行3次，該等之平均值設為表面粗糙度(Ra)。
由上述表1之結果可知，藉由使用包含酸解離常數(pKa)高於前述組成物之pH的酸之研磨用組成物，可以蝕刻速度低且高的研磨速度研磨金屬(鎢)基板。且，以本發明之研磨用組成物研磨，顯示獲得具有表面粗糙度(Ra)更小(亦即平滑性優異)之研磨面之基板。
又，本申請案係基於2016年3月25日提出申請之日本專利申請第2016-61554號，其揭示內容全文被援用而併入本申請案中。
Claims (7)
- 一種研磨用組成物，其係研磨具有包含金屬之層的研磨對象物所用之研磨組成物，其中包含研磨粒、酸、氧化劑及分散介質，前述酸之酸解離常數(pKa)與前述組成物之pH之差[=(酸之酸解離常數(pKa))-(組成物之pH)]為0.88以上，且前述組成物之pH為1以上且2.14以下，前述研磨粒為氧化矽，前述氧化劑為過氧化氫，前述酸為選自由巴豆酸、2-羥基異丁酸及白羥酸所組成群之至少一種。
- 如請求項1之研磨用組成物，其中前述金屬為鎢。
- 如請求項1或2之研磨用組成物，其中前述酸之酸解離常數(pKa)與前述組成物之pH之差[=(酸之酸解離常數(pKa))-(組成物之pH)]為0.9以上。
- 如請求項1或2之研磨用組成物，其中前述研磨粒係固定化有機酸之膠體氧化矽。
- 一種研磨用組成物之製造方法，其包含使研磨粒、酸、氧化劑及分散介質混合，其中該研磨用組成物係研磨具有包含金屬之層的研磨對象物所使用者，前述酸之酸解離常數(pKa)與前述組成物之pH之差 [=(酸之酸解離常數(pKa))-(組成物之pH)]為0.88以上，且前述組成物之pH為1以上且2.14以下，前述研磨粒為氧化矽，前述氧化劑為過氧化氫，前述酸為選自由巴豆酸、2-羥基異丁酸及白羥酸所組成群之至少一種。
- 一種研磨方法，其包含使用如請求項1~4中任一項之研磨用組成物研磨具有含有金屬之層的研磨對象物。
- 一種基板之製造方法，其包含以如請求項6之研磨方法研磨具有含有金屬之層的研磨對象物之步驟。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016061554 | 2016-03-25 | ||
| JP2016-061554 | 2016-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201736566A TW201736566A (zh) | 2017-10-16 |
| TWI752013B true TWI752013B (zh) | 2022-01-11 |
Family
ID=59900207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106109378A TWI752013B (zh) | 2016-03-25 | 2017-03-21 | 具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20190085207A1 (zh) |
| JP (1) | JP6806765B2 (zh) |
| TW (1) | TWI752013B (zh) |
| WO (1) | WO2017163942A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022254841A1 (ja) | 2021-06-01 | 2022-12-08 | 信越半導体株式会社 | 両面研磨方法及び両面研磨シリコンウェーハ |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200413509A (en) * | 2002-06-03 | 2004-08-01 | Hitachi Chemical Co Ltd | Polishing composition and polishing method thereof |
| CN1320078C (zh) * | 2003-07-01 | 2007-06-06 | 花王株式会社 | 研磨液组合物 |
| CN101297015A (zh) * | 2005-10-24 | 2008-10-29 | 3M创新有限公司 | 用于cmp的抛光流体和方法 |
| US20080287038A1 (en) * | 2007-05-18 | 2008-11-20 | Nippon Chemical Industrial Co., Ltd. | Polishing composition for semiconductor wafer, method for production thereof and polishing method |
| TW201326376A (zh) * | 2011-09-30 | 2013-07-01 | Fujimi Inc | 研磨用組成物 |
| CN105143390A (zh) * | 2013-04-17 | 2015-12-09 | 三星Sdi株式会社 | 有机膜cmp浆料组成物及使用其的研磨方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100336179C (zh) * | 2002-04-30 | 2007-09-05 | 日立化成工业株式会社 | 研磨液及研磨方法 |
| US20050211952A1 (en) * | 2004-03-29 | 2005-09-29 | Timothy Mace | Compositions and methods for chemical mechanical planarization of tungsten and titanium |
| JP5957292B2 (ja) * | 2012-05-18 | 2016-07-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法 |
| TWI531642B (zh) * | 2013-06-14 | 2016-05-01 | Jsr Corp | Chemical mechanical grinding water dispersions and chemical mechanical grinding methods |
-
2017
- 2017-03-10 US US16/085,312 patent/US20190085207A1/en not_active Abandoned
- 2017-03-10 JP JP2018507225A patent/JP6806765B2/ja active Active
- 2017-03-10 WO PCT/JP2017/009802 patent/WO2017163942A1/ja active Application Filing
- 2017-03-21 TW TW106109378A patent/TWI752013B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200413509A (en) * | 2002-06-03 | 2004-08-01 | Hitachi Chemical Co Ltd | Polishing composition and polishing method thereof |
| CN1320078C (zh) * | 2003-07-01 | 2007-06-06 | 花王株式会社 | 研磨液组合物 |
| CN101297015A (zh) * | 2005-10-24 | 2008-10-29 | 3M创新有限公司 | 用于cmp的抛光流体和方法 |
| US20080287038A1 (en) * | 2007-05-18 | 2008-11-20 | Nippon Chemical Industrial Co., Ltd. | Polishing composition for semiconductor wafer, method for production thereof and polishing method |
| TW201326376A (zh) * | 2011-09-30 | 2013-07-01 | Fujimi Inc | 研磨用組成物 |
| CN105143390A (zh) * | 2013-04-17 | 2015-12-09 | 三星Sdi株式会社 | 有机膜cmp浆料组成物及使用其的研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190085207A1 (en) | 2019-03-21 |
| JPWO2017163942A1 (ja) | 2019-01-31 |
| TW201736566A (zh) | 2017-10-16 |
| WO2017163942A1 (ja) | 2017-09-28 |
| JP6806765B2 (ja) | 2021-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI656203B (zh) | Grinding composition | |
| US9486892B2 (en) | Polishing composition | |
| JP6113741B2 (ja) | 研磨用組成物 | |
| TWI609948B (zh) | 硏磨用組成物 | |
| US20180215952A1 (en) | Polishing composition | |
| JP2016069522A (ja) | 組成物 | |
| JP2014044982A (ja) | 研磨用組成物 | |
| JP2014072336A (ja) | 研磨用組成物 | |
| TWI729095B (zh) | 用於具有包含金屬之層的研磨對象物之研磨的研磨用組成物 | |
| TWI752013B (zh) | 具有包含金屬之層的研磨對象物之研磨用組成物、研磨用組成物之製造方法、研磨方法、及基板之製造方法 | |
| TWI629349B (zh) | Grinding composition | |
| JP2018157164A (ja) | 研磨用組成物、研磨用組成物の製造方法、研磨方法および半導体基板の製造方法 | |
| JP6901297B2 (ja) | 研磨用組成物 | |
| WO2017169743A1 (ja) | 金属を含む層を有する研磨対象物の研磨に用いられる研磨用組成物 | |
| JP2014060250A (ja) | 研磨用組成物 | |
| JP2015189965A (ja) | 研磨用組成物 |