TW201241206A - Film-forming apparatus - Google Patents

Film-forming apparatus Download PDF

Info

Publication number
TW201241206A
TW201241206A TW100147759A TW100147759A TW201241206A TW 201241206 A TW201241206 A TW 201241206A TW 100147759 A TW100147759 A TW 100147759A TW 100147759 A TW100147759 A TW 100147759A TW 201241206 A TW201241206 A TW 201241206A
Authority
TW
Taiwan
Prior art keywords
base portion
film forming
lower side
mask
moving base
Prior art date
Application number
TW100147759A
Other languages
English (en)
Chinese (zh)
Inventor
Miyuki Tajima
Keiji Uchida
Masanao Fujitsuka
Teiji Takahashi
Original Assignee
Tokki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokki Kk filed Critical Tokki Kk
Publication of TW201241206A publication Critical patent/TW201241206A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW100147759A 2010-12-28 2011-12-21 Film-forming apparatus TW201241206A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010293492A JP2012140671A (ja) 2010-12-28 2010-12-28 成膜装置

Publications (1)

Publication Number Publication Date
TW201241206A true TW201241206A (en) 2012-10-16

Family

ID=46382864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100147759A TW201241206A (en) 2010-12-28 2011-12-21 Film-forming apparatus

Country Status (4)

Country Link
JP (1) JP2012140671A (ja)
CN (1) CN103339281A (ja)
TW (1) TW201241206A (ja)
WO (1) WO2012090753A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477627B (zh) * 2012-11-09 2015-03-21 Sumitomo Heavy Industries Film forming device
TWI688141B (zh) * 2017-02-24 2020-03-11 美商應用材料股份有限公司 用於一基板載體及一遮罩載體之定位配置、用於一基板載體及一遮罩載體之傳送系統、應用其之真空處理系統、及用於其之方法

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JP2013171811A (ja) * 2012-02-23 2013-09-02 Hitachi High-Technologies Corp 成膜装置
JP2014025098A (ja) * 2012-07-25 2014-02-06 Canon Tokki Corp 蒸着装置
JP6095405B2 (ja) * 2013-02-19 2017-03-15 株式会社アルバック アラインメント方法
CN103290364B (zh) * 2013-05-23 2015-11-18 深圳市生波尔机电设备有限公司 连续式真空蒸发镀膜装置
CN105280842B (zh) * 2014-07-25 2017-07-25 上海和辉光电有限公司 用于在oled制程中量测子像素偏移量的方法
KR20160118151A (ko) * 2015-04-01 2016-10-11 (주)브이앤아이솔루션 얼라이너 구조 및 얼라인 방법
CN104862664B (zh) * 2015-05-19 2017-12-01 南通大学 一种图形化的氧化铝超薄薄膜的制备方法
JP2017129848A (ja) * 2016-01-18 2017-07-27 Hoya株式会社 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法
CN108701775A (zh) * 2017-02-03 2018-10-23 应用材料公司 用于具有并排的基板的连续蒸发的设备和方法
WO2018153481A1 (en) * 2017-02-24 2018-08-30 Applied Materials, Inc. Apparatus for vacuum processing
WO2018166636A1 (en) * 2017-03-17 2018-09-20 Applied Materials, Inc. Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber
JP6461235B2 (ja) * 2017-05-22 2019-01-30 キヤノントッキ株式会社 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
WO2019020167A1 (en) * 2017-07-24 2019-01-31 Applied Materials, Inc. APPARATUS AND SYSTEM FOR PROCESSING A SUBSTRATE IN A VACUUM CHAMBER, AND METHOD FOR TRANSPORTING A CARRIER IN A VACUUM CHAMBER
KR102107973B1 (ko) * 2017-07-24 2020-05-07 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버 내의 기판을 프로세싱하기 위한 장치 및 시스템, 및 마스크 캐리어에 대해 기판 캐리어를 정렬하는 방법
KR101952521B1 (ko) * 2017-10-31 2019-02-26 캐논 톡키 가부시키가이샤 성막장치, 성막방법, 및 전자 디바이스 제조방법
CN110557953B (zh) * 2018-04-03 2021-10-29 应用材料公司 用于在真空腔室中的载体对准的设备和真空系统以及对准载体的方法
WO2019192677A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Carrier for supporting a substrate or a mask
KR102215483B1 (ko) * 2018-04-03 2021-02-10 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버에서 캐리어를 핸들링하기 위한 장치, 진공 증착 시스템, 및 진공 챔버에서 캐리어를 핸들링하는 방법
KR102304434B1 (ko) * 2018-04-03 2021-09-17 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버 내에서의 캐리어 정렬을 위한 장치 및 진공 시스템, 및 캐리어를 정렬하는 방법
WO2020030252A1 (en) * 2018-08-07 2020-02-13 Applied Materials, Inc. Material deposition apparatus, vacuum deposition system and method of processing a large area substrate
JP7379072B2 (ja) 2019-01-11 2023-11-14 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
KR102179271B1 (ko) * 2019-01-11 2020-11-16 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
JP7170016B2 (ja) * 2020-10-06 2022-11-11 キヤノントッキ株式会社 成膜装置
JP7379396B2 (ja) 2021-01-08 2023-11-14 キヤノントッキ株式会社 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法

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JP3257056B2 (ja) * 1992-09-04 2002-02-18 石川島播磨重工業株式会社 真空蒸着装置
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
JP2001270691A (ja) * 2000-03-28 2001-10-02 Shin Meiwa Ind Co Ltd 物体移送装置
JP2003347047A (ja) * 2002-05-28 2003-12-05 Sony Corp 有機膜形成装置
JP2004091913A (ja) * 2002-07-10 2004-03-25 Sony Corp 成膜装置および成膜方法
JP2004079349A (ja) * 2002-08-19 2004-03-11 Sony Corp 薄膜形成装置
JP4685404B2 (ja) * 2003-10-15 2011-05-18 三星モバイルディスプレイ株式會社 有機電界発光素子の垂直蒸着方法，その装置，及び有機電界発光素子の垂直蒸着装置に使用される蒸着源
JP2005154903A (ja) * 2003-11-26 2005-06-16 Samsung Sdi Co Ltd 蒸着膜形成方法及び蒸着膜形成装置
JP4384109B2 (ja) * 2005-01-05 2009-12-16 三星モバイルディスプレイ株式會社 蒸着システム用蒸着源の駆動軸及びこれを具備した蒸着システム
KR101190106B1 (ko) * 2005-08-25 2012-10-11 히다치 조센 가부시키가이샤 진공 증착용 얼라인먼트 장치
KR100729097B1 (ko) * 2005-12-28 2007-06-14 삼성에스디아이 주식회사 증발원 및 이를 이용한 박막 증착방법
JP2007332458A (ja) * 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
JP4705526B2 (ja) * 2006-06-27 2011-06-22 トッキ株式会社 アライメント装置及び方法
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法
JP5074368B2 (ja) * 2008-12-15 2012-11-14 株式会社日立ハイテクノロジーズ 成膜装置
TW201336140A (zh) * 2008-12-15 2013-09-01 Hitachi High Tech Corp 有機電激發光製造裝置及成膜裝置
JP5337632B2 (ja) * 2009-02-13 2013-11-06 株式会社日立ハイテクノロジーズ 成膜装置及び有機ｅｌデバイス製造装置
JP5277060B2 (ja) * 2009-04-16 2013-08-28 株式会社日立ハイテクノロジーズ 真空蒸着装置
JP5452178B2 (ja) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477627B (zh) * 2012-11-09 2015-03-21 Sumitomo Heavy Industries Film forming device
TWI688141B (zh) * 2017-02-24 2020-03-11 美商應用材料股份有限公司 用於一基板載體及一遮罩載體之定位配置、用於一基板載體及一遮罩載體之傳送系統、應用其之真空處理系統、及用於其之方法

Also Published As

Publication number Publication date
WO2012090753A1 (ja) 2012-07-05
CN103339281A (zh) 2013-10-02
JP2012140671A (ja) 2012-07-26

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