201235485 六、發明說明： 【發明所屬之技術領域】 本^係關於適用於以樹脂射出模具材料為代表之锻造 成形品等的高強度銅合金鍛造材。 ^ 【先前技術】 習知技術中，作為導電性、熱傳導性優異的合金，係使用 7ΓΓ11 ' ^(CU"Sn ' Be^ ' au〇y)(cU|Si系）之類的銅合金。特別要求熱傳導以及強产 與硬度的樹脂射出模具材料與飛行器構件等，係使用如 銅卡遜合金。但是，上述Be鋼會有在炫解或加工時所生 成粉塵具有毒性的顧慮，正尋求替代材料。又，對卡遜合金 要求更進-步的高熱傳導性、高財、高硬度。 再者’-般Cu合金在锻造時或熱處理時容易發生 除要求熱加工性之外，亦要求延性的提升。 又 近年，作為利用銅合金的箔帶而增加強度、且提升彎曲加 工性的策略’已提案在Cu_Ni_S i系銅合金中添加Mg、％、 Τι、Zr、A卜Μη等的銅合金(參照專利文獻卜5)。Mg、％ 係固溶於基質中而提升強度。Ti、Zr、A卜Μη係因為與硫 間之親和性強，故會與硫形成化合物，而減輕屬於熱加工龜 裂原因之硫化物對晶界的偏析情形。 專利文獻2、3、5所示之鋼合金箔帶，係添加sn、Μη、 Zr等，進一步在固溶化處理與時效處理的前後，藉由重複 101105033 3 201235485 施行熱軋、冷軋、熱拉伸、冷拉伸，而具有超過習知銅合金 箔帶的彎曲加工性與強度。 [先行技術文獻] [專利文獻] 專利文獻1:日本專利特開2006-9108號公報 專利文獻2 :曰本專利特開2008-196042號公報 專利文獻3:日本專利特開2008-223136號公報 專利文獻4 :日本專利特開2008-266787號公報 專利文獻5 :日本專利特開2010-106363號公報 【發明内容】 (發明所欲解決之問題） 但是，在製造Cu合金成形品時，因為主要係利用熱鍛來 施行加工成形，因而會有無法採用在箔帶製造時所施行的軋 延與拉伸加工之情況，即便依照專利文獻2、3、5所示成分 進行鍛造成形品的製造，仍無法獲得高強度。 為了獲得高強度，雖增加Ni與Si的添加量係屬有效，但 隨Ni與Si量的增加，熱傳導率與熱加工性亦會降低。又， 亦會導致在凝固中所生成的結晶物、與在熱處理中所生成的 析出物增加，造成熱處理後的延性降低。 本發明係以上述實情為背景而完成，目的在於提供一種可 使用於以樹脂射出模具材料為代表的鍛造成形品等，並且能 獲得南硬度、局強度、南延性、南熱傳導率特性的局強度銅 101105033 4 201235485 合金鍛造材。 (解決問題之手段） 本發明為了解決上述課題，係使Cu-Ni-Si系銅合金中適 置含有會抑制i對結晶晶界的析出、且具有提南延性效 果的Zr，進一步適量含有具增加微細析出物密度之效果， 且能與Ni、Si及Zr形成化合物的P，藉此可獲得具有高硬 度、高強度、高熱傳導性特性的材料。 即，本發明第1發明的高強度銅合金鍛造材係依質量％計 含有 Ni : 3〜7.2%、Si : 0.7〜1.8%、Zr : 0.02〜0.35%及 P : 0.002〜0.05%。 第2發明的高強度銅合金鍛造材係依質量％計含有Ni : 3〜7.2%、Si : 0.7〜1.8%、Zr : 0.02〜0.35%及 P : 0.002〜0.05%， 並進一步含有合計1.5%以下之Cr、Μη及Zn中之1種或2 種以上。 第3發明係上述第1發明或第2發明相關的高強度銅合金 鍛造材，其中，0.2%耐力係65OMPa以上，延伸係5%以上， 導電率係30%IACS以上。 (發明效果） 根據本發明，可獲得加工時與熱處理時材料不易發生龜 裂，並具有高硬度、高強度、高熱傳導率特性的高強度銅合 金鍛造材。 【實施方式】 101105033 5 201235485 以下針對本發明各成分的組成限定理由進行說明。另外， 下述成分的含有量均係依「質量％」表示。又，「質量°/〇」 與「重量％」係同義。 [Ni ： 3-7.2%] [Si : 0.7〜1.8%]201235485 VI. Description of the Invention: [Technical Field of the Invention] This is a high-strength copper alloy forging material suitable for a forged molded product represented by a resin injection mold material. [Prior Art] In the conventional art, a copper alloy such as 7ΓΓ11' ^(CU"Sn' Be^' au〇y) (cU|Si type) is used as an alloy excellent in electrical conductivity and thermal conductivity. For example, a copper-carson alloy is used for the resin injection molding material and the aircraft member which are required for heat conduction and strong production and hardness. However, the above-mentioned Be steel has a concern that dust generated during the process of distracting or processing is toxic, and alternative materials are being sought. In addition, the Carson alloy requires more advanced thermal conductivity, high wealth, and high hardness. Furthermore, the conventional Cu alloy is liable to occur during forging or heat treatment, and in addition to requiring hot workability, ductility is also required. In recent years, as a strategy for increasing the strength and improving the bending workability by using a foil strip of a copper alloy, it has been proposed to add a copper alloy such as Mg, %, Τι, Zr, or Ab Μ to a Cu_Ni_S i-based copper alloy (see Patent Literature b). Mg and % are solid-solubilized in the matrix to increase strength. Since Ti, Zr, and A Μ Μ are strong in affinity with sulfur, they form a compound with sulfur, and the segregation of the sulphide which is a cause of hot working cracking on the grain boundary is alleviated. The steel alloy foil tapes shown in Patent Documents 2, 3, and 5 are added with Sn, Μη, Zr, etc., and are further subjected to hot rolling, cold rolling, and hot drawing by repeating 101105033 3 201235485 before and after solution treatment and aging treatment. Stretching and cold stretching, and having more than the bending workability and strength of the conventional copper alloy foil tape. [PRIOR ART DOCUMENT] [Patent Document 1] Patent Document 1: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2008-96042 Patent Document No. 2008-223136 Document 4: Japanese Patent Laid-Open Publication No. 2008-266787 (Patent Document 5): JP-A-2010-106363 SUMMARY OF INVENTION (Problems to be Solved by the Invention) However, in the production of a Cu alloy molded article, Since hot forging is used for the forming, it is impossible to use the rolling and drawing processing performed at the time of the production of the foil tape, and even if the forged product is manufactured according to the components shown in Patent Documents 2, 3, and 5, Unable to get high strength. In order to obtain high strength, it is effective to increase the addition amount of Ni and Si, but as the amount of Ni and Si increases, thermal conductivity and hot workability also decrease. Further, the crystals formed during solidification and the precipitates formed during the heat treatment are increased, and the ductility after the heat treatment is lowered. The present invention has been made in view of the above-mentioned facts, and an object thereof is to provide a forged product which can be used for resin injection molding material, and which can obtain local strengths of south hardness, local strength, south ductility, and south heat conductivity characteristics. Copper 101105033 4 201235485 Alloy forgings. (Means for Solving the Problem) In order to solve the above problems, the Cu-Ni-Si-based copper alloy is provided with Zr which suppresses the precipitation of i to the crystal grain boundary, and has an effect of improving the ductility, and further contains an appropriate amount of material. The effect of increasing the density of fine precipitates and forming P of the compound with Ni, Si, and Zr can thereby obtain a material having high hardness, high strength, and high thermal conductivity. In other words, the high-strength copper alloy forged material according to the first aspect of the invention contains Ni: 3 to 7.2%, Si: 0.7 to 1.8%, Zr: 0.02 to 0.35%, and P: 0.002 to 0.05% by mass%. The high-strength copper alloy forged material according to the second aspect of the invention contains Ni: 3 to 7.2%, Si: 0.7 to 1.8%, Zr: 0.02 to 0.35%, and P: 0.002 to 0.05% by mass%, and further contains 1.5% in total. One or more of the following Cr, Μη, and Zn. According to a third aspect of the invention, there is provided a high-strength copper alloy forging material according to the first aspect or the second aspect of the invention, wherein the 0.2% proof stress is 65 OMPa or more, the elongation is 5% or more, and the electric conductivity is 30% IACS or more. (Effect of the Invention) According to the present invention, a high-strength copper alloy forging material having high hardness, high strength, and high thermal conductivity characteristics during processing and cracking of a material during heat treatment can be obtained. [Embodiment] 101105033 5 201235485 The reason for limiting the composition of each component of the present invention will be described below. In addition, the content of the following components is expressed by "% by mass". Also, "quality °/〇" is synonymous with "% by weight". [Ni : 3-7.2%] [Si : 0.7~1.8%]
Ni與Si係藉由施行時效處理，使Ni與Si形成以微細Ni2Si 為主的金屬間化合物之析出粒子，而使合金的強度明顯增 加。又，隨時效處理時的Ni2Si析出，會使導電性提升，俾 提升熱傳導率。但，當Ni濃度未滿3%且Si濃度未滿0.7% 時，無法獲得所需的強度。又，當Ni濃度超過7.2%且Si 濃度超過1.8%時，在鑄造時會大量結晶出或析出Ni2Si、 Ni5Si2等，導致鍛造時與熱處理時容易出現龜裂。此外，若 Ni濃度超過7.2%，則導電率亦會降低，熱傳導率亦降低。 若考慮製造性與特性的均衡，則Ni濃度較佳係下限3.5%、 上限6.6%。Si濃度較佳係下限0.8%、上限1.7%。另外， 犯/8丨比較佳係3.8〜4.6。若偏離此比例，則過剩的犯或81 會固溶於Cu基質中，導致熱傳導率降低。 [Zr : 0.02〜0.35%]Ni and Si are subjected to aging treatment to form precipitated particles of intermetallic compounds mainly composed of fine Ni2Si from Ni and Si, and the strength of the alloy is remarkably increased. Further, precipitation of Ni2Si during the aging treatment improves conductivity and increases thermal conductivity. However, when the Ni concentration is less than 3% and the Si concentration is less than 0.7%, the desired strength cannot be obtained. Further, when the Ni concentration exceeds 7.2% and the Si concentration exceeds 1.8%, Ni2Si, Ni5Si2, and the like are crystallized or precipitated in a large amount during casting, and cracks are likely to occur during forging and heat treatment. Further, if the Ni concentration exceeds 7.2%, the electrical conductivity also decreases, and the thermal conductivity also decreases. When the balance between manufacturability and characteristics is considered, the Ni concentration is preferably 3.5% lower limit and 6.6% upper limit. The Si concentration is preferably 0.8% lower limit and 1.7% upper limit. In addition, the crime / 8 丨 is better than 3.8 ~ 4.6. If this ratio is deviated, the excess or 81 will be dissolved in the Cu matrix, resulting in a decrease in thermal conductivity. [Zr: 0.02~0.35%]
Zr係因為與硫間之親和性強，所以會與硫形成化合物， 藉由減輕屬於加工龜裂（熱加工龜裂）原因之硫化物對結晶 晶界的偏析，俾改善加工性（熱加工性）。另一方面，經發明 者深入調查，結果發現，藉由含有Zr可抑制Ni與Si的擴 101105033 6 201235485 散，減少在晶界中所析出的Ni2Si，而改善經時效後的延性。 為獲得此效果係含有0.02%以上的Zr。但是，若含有超過 0.35%，則會導致Zr氧化物與Ni2SiZr等結晶物的增加，且 會因凝聚而導致製造性與特性劣化，所以上限設為0.35%。 若考慮製造性與特性的均衡，較佳係設為下限0.05%、上限 0.3%。 [P ： 0.002-0.05%] P係藉由使微細析出物的密度增加，而提升強度。又，藉 由形成在Ni、Si、Zr、以及Ni2Si或Ni2SiZr等之中含有微 量P的化合物，可增加硬度。為能獲得該等效果係含有 0.002%以上。但是，若含有超過0.05%，則熱傳導率會大幅 降低，因而上限設為0.05%。依照同樣的理由，較佳係下限 設為0.01%、上限設為0.04%。 [Cr、Μη、Zn :合計在1.5%以下]Since the Zr system has a strong affinity with sulfur, it forms a compound with sulfur, and reduces segregation of crystal grain boundaries by sulfides which are caused by processing cracks (thermal cracking), and improves workability (hot workability). ). On the other hand, as a result of intensive investigation by the inventors, it was found that Zr can suppress the diffusion of Ni and Si, and reduce the Ni2Si precipitated in the grain boundary, thereby improving the ductility after aging. In order to obtain this effect, Zr is contained in an amount of 0.02% or more. However, when the content is more than 0.35%, the crystals such as Zr oxide and Ni2SiZr are increased, and the productivity and characteristics are deteriorated due to aggregation. Therefore, the upper limit is made 0.35%. In consideration of the balance between manufacturability and characteristics, it is preferable to set the lower limit to 0.05% and the upper limit to 0.3%. [P : 0.002-0.05%] P is used to increase the strength by increasing the density of fine precipitates. Further, the hardness can be increased by forming a compound containing a small amount of P among Ni, Si, Zr, Ni2Si or Ni2SiZr. In order to obtain such effects, it contains 0.002% or more. However, if it is more than 0.05%, the thermal conductivity is largely lowered, so the upper limit is made 0.05%. For the same reason, the lower limit is preferably set to 0.01% and the upper limit is set to 0.04%. [Cr, Μη, Zn: total less than 1.5%]
Cr、Μη、Zn係視需要含有1種以上。Cr, Μ, and Zn are required to contain one or more types as needed.
Cr會與Si形成金屬間化合物，而具有提升強度、使結晶 粒微細化的效果。因為Μη與硫之親和性強，因而會與硫形 成化合物，藉由降低屬於加工龜裂（熱加工龜裂）原因之硫化 物對結晶晶界的偏析，而改善加工性（熱加工性）。Zn係藉由 固溶強化而提升強度。又，若在熔解時可使用低價的黃銅廢 料，便可削減製造成本。但是，若Cr、Μη、Zn的合計量過 剩含有，會導致熱傳導率降低，所以Cr、Μη及Zn的合計 101105033 7 201235485 量較佳係設為1.5%以下。 更佳係Cr、Μη及Zn的合計量設為1 ·0%以下。又，當含 有Cr、Μη及Zn中之1種以上的情況，合計量較佳係設為 0.1%以上。 本發明的高強度銅合金锻造材係具有上述金屬組成，其餘 則由Cu及不可避免的雜質構成。 本發明的高強度銅合金鍛造材係可依照常法進行製造。 本發明所使用的銅合金係可依照常法進行溶製，例如在真 空環境、惰性環境、或大氣環境等之中熔解材料，便可獲得 鑄塊。環境較佳係真空環境或惰性環境，但亦可利用例如大 氣高頻爐進行熔製。又，亦可使用電渣再熔爐（dectr〇slag remelting furnace)等施行二次熔解。利用連續鑄造法亦可獲 付板材。 銅合金係視需要施行加工。加工的内容在本發明中並無特 別的限定，使用任何加工方法均可獲得本發明的特性。另 外，若考慮製造性，則加工較佳為熱加工，更佳係依6〇〇ΐ 以上施行的熱加工’但即便室溫中的加工仍可獲得與熱加工 同樣的特性。又’加工亦可為熱加工與冷加工的組合。又， 力:工較佳係锻造、錢係餘，熱鍛較㈣依6〇(rc以上實 施，造方法係可採用例㈣锻、鍵鍛、軋延等已知方法。 經加工過的銅合金材，亦可在加工後或加工途中施行固溶 化處理Hh谷化處理的條件係例如依_〜丄_^保持1〜 101105033 8 201235485 小時後，為使Ni、Si充分固溶，而於5〇〇。〇以上的温度域 中依5°C/秒以上的冷卻速度進行冷卻。 經加工過的銅合金材係可在固溶化處理後或加工後施行 時效處理。時效處理的條件係可舉例如依4〇〇〜彡㈧它保持 1~30小時。 所獲得的高強度銅合金材係具有0 2%耐力在650MPa以 上、延伸在5%以上、導電率在3〇%IACS以上的特性。 另外，本發明的高強度銅合金鍛造材係具有當作鍛造材用 的優異特性，若屬於本發明的組成，即便未施行鍛造等上述 加工的鑄造材，仍可獲得良好的延性等特性。 [實施例] 以下，針對本發明實施例進行說明。 依成為表1的成分組成（包含其他不可避免的雜質）方式調 配原料，並利用真空感應熔解爐進行熔解，而製作直徑 1 OOmmx長度200mm的合金。將該合金在9〇〇。〇中利用鎚子 施行熱鍛而形成厚25mm之板材，再於97〇〇c中保持4小時 後鈀行水冷而實施固溶化處理。然後，依4〇〇〜5〇〇。〇分別施 行1〜30小蚪適於各成分素材的時欵處理，獲得試體材料。 101105033 9 201235485 [表1] 試體;M· 成分（質量％) 時效條件 (°Cx小時） 料] ^0. Cu Ni Si Zr P Cr Μη Ζη Cr、Μη、 Ζη之合計 Ni/Si 比 1 其餘 4.16 0.95 0.09 0.018 — — — — 4.38 475°C x3小時 2 其餘 5.15 1.14 0.16 0.017 — 一 — — 4.52 475°C x3小時 實 3 其餘 4.83 1.12 0.08 0.004 0.43 0.19 0.33 0.95 4.31 450°C xlO小時 4 其餘 7.20 1.80 0.22 0.034 — — 一 — 4.00 450°C xlO小時 施 5 其餘 3.70 0.92 0.27 0.048 0.02 — — 0.02 4.02 475°C x3小時 例 6 其餘 4.10 0.98 0.09 0.016 0.02 0.40 — 0.42 4.18 475°C x3小時 7 其餘 3.10 0.74 0.03 0.020 — — — — 4.19 475°C x3小時 8 其餘 5.04 1.17 0.32 0.049 — 0.20 0.50 0.70 4.31 450°C xlO小時 9 其餘 6.60 1.65 0.12 0.003 0.40 — — 0.40 4.00 450°C χ10小時 10 其餘 7.30 1.57 4.65 425°C x30小時 11 其餘 4.24 0.99 4.28 450°C xl 小時 12 其餘 8.37 0.93 — 9.00 475°C x3小時 比 13 其餘 3.77 0.95 0.16 — — — — 一 3.97 475°C x3小時 較 14 其餘 4.25 0.93 — 0.055 — — — 一 4.57 500°C xl 小時 例 15 其餘 4.85 1.18 0.36 0.023 0.49 0.50 0.58 1.57 4.11 450°C χ1〇小時 16 其餘 7.77 1.87 0.10 0.022 0.42 — 一 0.42 4.16 450°C xlO小時 17 其餘 2.20 0.55 0.01 0.002 一 — — — 4.00 450°C xl 小時 18 其餘 8.12 2.05 0.12 0.030 — — — — 3.96 450°C xlO小時 19 其餘 5.33 1.39 0.08 0.006 3.03 0.22 0.15 3.40 3.83 450°C xlO小時 針對所製作的試體材料，施行下述所示評估。 (拉伸試驗） 針對各試體根據J1SZ2201(2010)、JiSZ2241(2010)實施常 溫拉伸試驗，評估0.2%耐力（Y.S)、拉伸強度(t.s)、延伸及 縮軋率(reduction)。測定結果係如表2所示。 (維氏硬度） 針對各試體根據JISZ2244(2010)，依荷重5kg測定維氏硬 度。測定結果係如表2所示。 (熱傳導率） 10 101105033 201235485 關係’可利用導電率評估熱傳導率。測定社 疋、、·。果係如表2所示 [表2] 針對各試體測定導電 (Wiedemann-Franz law)戶斤示 率。如維德曼_夫蘭茲定律 ’熱傳導率與導電率大致呈比例Cr forms an intermetallic compound with Si, and has an effect of increasing the strength and refining the crystal grains. Since Μη has a strong affinity with sulfur, it forms a compound with sulfur, and improves the workability (hot workability) by reducing the segregation of sulfides belonging to the processing crack (hot-worked crack) to the grain boundary. Zn is enhanced in strength by solid solution strengthening. Moreover, if low-cost brass waste can be used during melting, the manufacturing cost can be reduced. However, if the total amount of Cr, Μη, and Zn is excessively contained, the thermal conductivity is lowered. Therefore, the total amount of Cr, Μη, and Zn is preferably 1.05% or less. More preferably, the total amount of Cr, Μη, and Zn is 1% or less. In addition, when one or more of Cr, Μη and Zn are contained, the total amount is preferably 0.1% or more. The high-strength copper alloy forged material of the present invention has the above-described metal composition, and the remainder is composed of Cu and unavoidable impurities. The high-strength copper alloy forged material of the present invention can be produced in accordance with a conventional method. The copper alloy used in the present invention can be dissolved by a usual method, for example, by melting a material in a vacuum environment, an inert environment, or an atmospheric environment to obtain an ingot. The environment is preferably a vacuum environment or an inert environment, but it can also be melted using, for example, an atmospheric high frequency furnace. Further, secondary melting may be performed using an electroslag remelting furnace or the like. Sheets can also be obtained by continuous casting. Copper alloys are processed as needed. The content of the processing is not particularly limited in the present invention, and the characteristics of the present invention can be obtained by any processing method. Further, in consideration of manufacturability, the processing is preferably hot working, and more preferably, the hot working is performed at a temperature of more than 6 Å, but the same characteristics as the hot working can be obtained even at a room temperature. Also, processing can be a combination of hot working and cold working. Moreover, the force: the work is better for forging, the money for the rest, the hot forging is more than (4) according to 6 〇 (rc above implementation, the manufacturing method can be used in the case of four (four) forging, forging, rolling and other known methods. The alloy material may be subjected to solution treatment after processing or during processing. The conditions of the Hh glutenization treatment are, for example, 1 to 101105033 8 201235485 hours after the _~丄_^, in order to fully dissolve Ni and Si, and 5 〇〇. The above temperature range is cooled at a cooling rate of 5 ° C / sec or more. The processed copper alloy material can be aged after solution treatment or after processing. The conditions of aging treatment can be exemplified It is maintained for 1 to 30 hours according to 4〇〇~彡(8). The obtained high-strength copper alloy material has a characteristic of 0 2% withstand strength of 650 MPa or more, elongation of 5% or more, and electrical conductivity of 3〇% IACS or more. Further, the high-strength copper alloy forging material of the present invention has excellent characteristics as a forged material, and according to the composition of the present invention, good properties such as ductility can be obtained even if the cast material subjected to the above-described processing such as forging is not applied. EXAMPLES Hereinafter, the embodiments of the present invention are described. According to the composition of Table 1 (including other unavoidable impurities), the raw materials were prepared and melted by a vacuum induction melting furnace to produce an alloy having a diameter of 100 mm and a length of 200 mm. The alloy was 9 〇〇. The hot forging is performed by a hammer to form a sheet having a thickness of 25 mm, and after maintaining for 7 hours in 97 ° C, the palladium is water-cooled to carry out a solution treatment. Then, according to 4 〇〇 5 〇〇 〇, respectively, 1 to 30 is performed. The small crucible is suitable for the time treatment of each component material to obtain the sample material. 101105033 9 201235485 [Table 1] Sample; M· Composition (% by mass) Aging condition (°Cx hour) Material] ^0. Cu Ni Si Zr P Cr Μη Ζη Cr, Μη, Ζη Total Ni/Si ratio 1 remaining 4.16 0.95 0.09 0.018 — — — — 4.38 475°C x3 hours 2 remaining 5.15 1.14 0.16 0.017 — one — — 4.52 475°C x3 hours real 3 rest 4.83 1.12 0.08 0.004 0.43 0.19 0.33 0.95 4.31 450°C xlO hour 4 remaining 7.20 1.80 0.22 0.034 — — one — 4.00 450°C xlO hour application 5 remaining 3.70 0.92 0.27 0.048 0.02 — — 0.02 4.02 475°C x3 hours example 6 The remaining 4.10 0.98 0.09 0.016 0.02 0.40 — 0.42 4.18 475°C x3 hours 7 remaining 3.10 0.74 0.03 0.020 — — — — 4.19 475°C x3 hours 8 remaining 5.04 1.17 0.32 0.049 — 0.20 0.50 0.70 4.31 450°C xlO hours 9 remaining 6.60 1.65 0.12 0.003 0.40 — — 0.40 4.00 450°C χ10 hours 10 rest 7.30 1.57 4.65 425°C x30 hours 11 remaining 4.24 0.99 4.28 450°C xl hours 12 remaining 8.37 0.93 — 9.00 475°C x3 hours ratio 13 remaining 3.77 0.95 0.16 — — — — A 3.97 475 ° C x 3 hours compared to 14 remaining 4.25 0.93 — 0.055 — — — A 4.57 500 ° C xl hours Example 15 The remaining 4.85 1.18 0.36 0.023 0.49 0.50 0.58 1.57 4.11 450 ° C χ 1 〇 16 The remaining 7.77 1.87 0.10 0.022 0.42 — a 0.42 4.16 450°C xlO hour 17 remaining 2.20 0.55 0.01 0.002 one — — — 4.00 450°C xl hour 18 remaining 8.12 2.05 0.12 0.030 — — — — 3.96 450°C xlO hour 19 remaining 5.33 1.39 0.08 0.006 3.03 0.22 0.15 3.40 3.83 450°C xlO hours For the test material to be produced, the following Evaluation. (Tensile test) For each of the samples, a room temperature tensile test was carried out in accordance with J1SZ2201 (2010) and JiSZ2241 (2010), and 0.2% proof stress (Y.S), tensile strength (t.s), elongation and reduction ratio were evaluated. The measurement results are shown in Table 2. (Vickers hardness) The Vickers hardness was measured for each sample according to JIS Z2244 (2010) at a load of 5 kg. The measurement results are shown in Table 2. (Thermal conductivity) 10 101105033 201235485 Relationship 'The conductivity can be used to evaluate the thermal conductivity. Measurement of society,, and. The results are shown in Table 2. [Table 2] The conductivity (Wiedemann-Franz law) was measured for each sample. For example, Widman _ Franz's law 'thermal conductivity is roughly proportional to conductivity
如表2所示，本發明實施例的試體材料係具有65〇Mpa以 上的0.2%耐力、5%以上的延伸、30%IACS以上的導電率。 又具有與比較例的试體材料同等級或其以上的硬度。 依如上述，可知本發明係藉由使Ni_si_Cu合金中含有適 量的Zr與P，可在維持高導電率（即高熱傳導率）之情況下， 獲得強度、延性及硬度高的優異性能。 以上針對本發明參照詳細内容或特定實施態樣進行說 101105033 11 201235485 明，惟在不脫逸本發明精神與範疇之前提下，可追加各種變 化與修正，此係熟習此技術者可知悉。本申請案係根據2011 年2月16日所提出申請的日本專利申請案（特願 2011-030660)為基礎，參照其内容並爰引於本案中。 (產業上之可利用性） 根據本發明的高強度銅合金鍛造材，使適量的Zr與P產 生作用，在加工時與熱處理時不易使材料發生龜裂，且經加 工及熱處理後，可具有高硬度、高強度及高熱傳導率的特 性，適用於樹脂射出模具材料、飛行器構件等。 101105033 12As shown in Table 2, the test material of the examples of the present invention had a 0.2% proof stress of 65 〇Mpa or more, an elongation of 5% or more, and a conductivity of 30% IACS or more. Further, it has the same hardness or higher than that of the sample material of the comparative example. As described above, according to the present invention, by providing an appropriate amount of Zr and P in the Ni_si_Cu alloy, it is possible to obtain excellent properties of high strength, ductility and hardness while maintaining high electrical conductivity (i.e., high thermal conductivity). The above description of the present invention is made with reference to the details or specific embodiments. It is to be understood that various changes and modifications may be added without departing from the spirit and scope of the invention. The present application is based on the Japanese Patent Application (Japanese Patent Application No. 2011-030660) filed on Feb. 16, 2011, which is incorporated herein by reference. (Industrial Applicability) According to the high-strength copper alloy forging material of the present invention, an appropriate amount of Zr and P acts, and it is difficult to cause cracking of the material during processing and heat treatment, and after processing and heat treatment, High hardness, high strength and high thermal conductivity, suitable for resin injection mold materials, aircraft components and so on. 101105033 12