JP3951921B2 - Manufacturing method of aluminum alloy processed material of 58.1IACS% or more - Google Patents
Manufacturing method of aluminum alloy processed material of 58.1IACS% or more Download PDFInfo
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【０００１】
【産業上の利用分野】
本発明は、特に電子部品冷却用ヒートシンクとして好適で、熱伝導性に優れたアルミニウム合金材に関する。
【０００２】
【従来技術】
近年、ノート型パソコン，携帯電話等の電子機器に使用されるヒートシンクには、熱伝導性に優れたアルミニウム合金を、高い寸法精度の小物製品あるいは複雑形状品の製造に適したダイカスト法で鋳造・成形したものが使用されるようになった。ところが、ヒートシンク用材料として使用されている純アルミニウムやＡｌ−Ｍｇ−Ｓｉ系アルミニウム合金は、熱伝導性に優れているものの鋳造性が悪く、ヒートシンクのように薄肉で複雑形状の部品に鋳造することはできなかった。他方、鋳造性確保のためにＳｉやＦｅを多量に含有させたアルミニウム合金は、熱伝導性が低く、ヒートシンクのように高い熱伝導性が要求される部品には適していない。
【０００３】
このため、Ｓｉに代えてＮｉを含有させ、ＮｉとＡｌの間で共晶組織を形成させ、鋳造性を改善するとともに優れた熱伝導性を確保する方法が提案されている（例えば特許文献１参照。）。しかし、生産性に優れ、熱伝導性の良いダイカスト製品は得られるものの、高価なＮｉの使用によりコスト高になっている。
また、Ａｌ−Ｍｇ−Ｓｉ系アルミニウム合金を特定の温度に加熱し、その後の冷却過程において鍛造するとともに、冷却速度を規定し、さらにその後時効硬化処理を行う方法も提案されている（例えば特許文献２参照。）。しかし、この方法では十分な熱伝導性が得られなかった。
【０００４】
【特許文献１】
特開２００１−２９４９６２号公報（第２−３頁、第２図）
【特許文献２】
特開２０００−２０４４５７号公報（第２−３頁）
【０００５】
【本発明が解決しようとする課題】
パソコン等の電子機器の高性能化や軽量化および薄肉化により、冷却性能がさらに優れた、すなわち熱伝導性がさらに優れたヒートシンクが要求されるようになった。また、製造コストの低減も図られ、寸法精度が高いものを生産性良く製造する方法が求められている。
本発明は、このような問題を解消すべく案出されたものであり、アルミニウム合金の成分組成を細かく調整して、より熱伝導性に優れ、かつ加工性に優れ、安定した品質を保てるアルミニウム合金材を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明の５８．１IACS％以上のアルミニウム合金加工材の製造方法は、その目的を達成するため、Ｓｉ：０．２５〜０．８５質量％，Ｍｇ：０．２０〜０．５０質量％，Ｆｅ：０．１０〜０．２０質量％，Ｂ：０．００３〜０．１０質量％を含み、残部がＡｌ及び不可避的不純物からなり、Ｃｕ：０．０３質量％以下，Ｍｎ：０．００５質量％以下，Ｃｒ：０．０３質量％以下，Ｔｉ：０．００５質量％以下，Ｖ：０．００５質量％以下，Ｚｒ：０．００５質量％以下に規制され、Ａｌ，Ｓｉ，Ｍｇ，Ｆｅ，Ｂ，Ｃｕ，Ｍｎ，Ｃｒ，Ｔｉ，Ｖ及びＺｒ以外のその他の元素の合計が０．０３質量％以下であるアルミニウム合金の鋳塊を、５５０〜５９５℃で１〜６時間保持して均熱処理し、２００℃／時間以上の冷却速度で２００℃以下まで冷却した後、再度加熱し、押出加工または圧延加工等の熱間加工直後の熱間加工材の温度が５００〜６００℃となるように熱間加工し、得られた熱間加工材を５０℃／分以上の冷却速度で２００℃以下まで冷却した後、１００℃／時間以下の昇温速度で３００〜４００℃まで加熱し、その温度範囲で０．５〜４時間保持した後、５０℃／時間以下の速度で１００℃以下まで冷却することにより、熱伝導性に優れたアルミニウム合金熱間加工材が得られる。
上記方法で製造された熱間加工材をさらに冷間鍛造しても良い。
【０００７】
【作用】
アルミニウムは純度が低くなるほど熱伝導性が低くなる。アルミニウム合金の熱伝導性は、母相中に固溶されている他の元素の量に影響されている。本発明は、他の元素のアルミニウム母相中への固溶量を極力少なくすることにより、熱伝導性を良くしたものである。
成分組成的には、Ｂを添加し、Ａｌ以外の元素、特に熱伝導を低下させるＴｉ，Ｖ，Ｚｒ，ＣｒをＢと晶出物を形成させてアルミニウム母相中に固溶される他の元素の固溶量を低減させ、熱伝導度の低下を抑制することができる。しかも、このＢ系晶出物は安定しており、その後の熱処理や加工によっても母相に再固溶し難い。
また、熱処理的には、Ａｌ−Ｍｇ−Ｓｉ系アルミニウム合金の熱間加工材を３００〜４００℃の温度範囲で焼鈍を行うことにより、母相中に固溶されているＭｇとＳｉをＭｇ2Ｓｉとして析出させ、母相中の固溶量を低減させて熱伝導度の低下を抑制するものである。
【０００８】
【実施の態様】
以下、本発明が対象とするアルミニウム合金の成分・組成，製造条件等を説明する。
Ｓｉ：０．２５〜０．８５質量％
Ｓｉは強度を向上させる合金成分であり、０．２５質量％以上のＳｉの含有で顕著になる。しかし、０．８５質量％を超える過剰量のＳｉが含まれると、熱伝導性の低下が著しくなる。
Ｍｇ：０．２０〜０．５０質量％
Ｍｇは強度を向上させる合金成分であり、０．２０質量％以上の含有量でＭｇの効果が顕著になる。しかし、０．５０質量％を超える過剰量のＭｇが含まれると、熱伝導性の低下が著しくなる。
【０００９】
Ｆｅ：０．１０〜０．２０質量％
Ｆｅは鋳造組織を均一とし、母相の強度を向上させる作用を有している。０．１０質量％以上の含有量でＦｅの効果が顕著になる。しかし、０．２０質量％を超える過剰量のＦｅが含まれると、熱伝導性の低下が著しくなる。しかも粗大な金属間化合物を形成し、伸びが低下し、押出性や鍛造性等の成形性も低下する。
Ｂ：０．００３〜０．０１質量％
Ｂは、Ａｌ以外の元素と晶出物を形成する。そのため、他の元素のＡｌ母相中での固溶量が減少し、熱伝導率の低下が抑制される。０．００３質量％以上の含有量でＢの効果が顕著になる。しかし、０．０１質量％を超える過剰量のＢが含まれると、粗大な金属間化合物を形成し、伸びが低下し、押出性や鍛造性等の成形性も低下する。
【００１０】
Ｃｕ，Ｍｎ，Ｃｒ，Ｔｉ，Ｖ，Ｚｒ
Ｃｕ，Ｍｎ，Ｃｒ，Ｔｉ，Ｖ，Ｚｒはアルミニウム合金中に含有されると熱伝導性を低下させる元素であるが、Ｃｕは０．０３質量％以下，Ｍｎは０．００５質量％以下，Ｃｒは０．０３質量％以下，Ｔｉは０．００５質量％以下，Ｖは０．００５質量％以下，Ｚｒは０．００５質量％以下であれば、熱伝導性はあまり低下しないので、これ以下の含有であれば許容される。上記数値を超えて含有すると急激に熱伝導性が低下する。
その他の元素
Ａｌ，Ｓｉ、Ｍｇ，Ｆｅ，Ｂ，Ｃｕ，Ｍｎ，Ｃｒ，Ｔｉ，Ｖ及びＺｒ以外のその他の元素もその合計が０．０３質量％以下であれば、熱伝導性はほとんど低下しないので許容される。
【００１１】
均質化処理：５５０〜５９５℃で１〜６時間保持し、２００℃／時間以上の冷却速度で２００℃以下まで冷却
均質化処理することにより、Ｍｇの偏析がなくなり、Ｆｅ系化合物が微細に分断され、加工性が向上する。また主要元素であるＭｇ，Ｓｉ，Ｆｅの存在形態を安定化させる。
なお、鋳造時に晶出させたＢ系化合物はこの温度域では変化しない。
【００１２】
熱間加工：熱間加工直後の熱間加工材の温度が５００〜６００℃となるように熱間加工し、得られた熱間加工材を５０℃／分以上の冷却速度で２００℃以下まで冷却
均質化処理されたビレット中ではＭｇ2Ｓｉが生成されている。熱間加工ではＭｇ2Ｓｉを再固溶させるために、加工直後の形材温度が５００〜６００℃の範囲になるように温度制御される。加工直後の形材温度が５００℃に満たないと、Ｍｇ2Ｓｉが十分に固溶できない。逆に６００℃を超える形材温度では、加工後の再結晶粒組織が粗大化しやすく，機械的強度が低下する傾向が示される。加工後の形材は、２００℃までを冷却速度５０℃／分以上で冷却される。冷却速度をこのように制御するとき、加工材中に粗大なＭｇ2Ｓｉが析出することが防止され、安定した組織を得ることができる。
なお、熱間加工を押出加工とし、室温にて引張り矯正する場合には、与える歪み量は０．６％以下にすることが好ましい。０．６％を超えて歪みを与えるとその後の焼鈍時にＭｇ2Ｓｉの析出状態に変動を生じさせ、熱伝導性を低下させることになる。
【００１３】
焼鈍：１００℃／時間以下の昇温速度で３００〜４００℃まで加熱し、その温度範囲で０．５〜４時間保持した後、５０℃／時間以下の速度で１００℃以下まで冷却
母相中に固溶しているＳｉとＭｇがＭｇ2Ｓｉとして析出するので、母相中の固溶量が減少し、熱伝導性が向上する。この効果は３００℃以上の加熱で顕著になる。しかし、４００℃を超える温度で焼鈍すると一部微細なＭｇ2Ｓｉが再固溶する。また冷却過程の冷却速度のバラツキにより析出に変動を生じ、Ｍｇ2Ｓｉの析出が均一とならないため熱伝導性が低下したり、バラツキが大きくなる。
冷間鍛造：
冷間で鍛造することにより、目的とする形状とすることができる。また加工硬化により、強度が向上する。
【００１４】
【実施例】
実施例１：
表１に示す組成のアルミニウム合金鋳塊を、５６０℃で２時間保持し、均質化処理した後、２５０℃／時間の冷却速度で常温まで冷却した。冷却後５００℃まで再加熱し、押出比１０で厚さ４ｍｍ，幅６０ｍｍの平板状に押出加工した。押出直後の材料は５４０℃であった。１００℃／分の冷却速度で室温まで冷却した。その後、１８０℃，３５０℃，４１０℃の３種類の温度に加熱して２時間保持する焼鈍を施した後、常温まで炉冷（３０℃／時間）した。
得られた押出材の電気伝導度と機械的強度（ビッカース硬度）を測定した。なお、熱伝導度は合金が同じであれば電気伝導度と比例関係にあることがわかっている。本実施例では熱伝導度に代えて電気伝導度を測定することとし、簡易的にＣｕを１００として測定・表示する方法で行った。ＩＡＣＳ％（国際・焼鈍銅・標準）で表示した。電気伝導度は押出材の表面５箇所で測定し、その平均値とした。硬度は、ビッカース硬度計（５ｋｇ荷重）にて、５箇所測定し、その平均値とした。
その結果を表２に示す。
【００１５】
表２に示す結果から、Ｂを添加した合金１，２を使用した試験番号１〜４では、Ｂ含有量の少ない合金３（この合金中のＢは不純物として含まれている量であって、積極的に添加したものではない。）や不純物含有量の多い合金４を使用した試験番号５〜７より、焼鈍条件が同じであれば熱伝導度が高くなっていることがわかる。
また、焼鈍温度が３５０℃である試験番号１，２，５，６は、同じ合金でも焼鈍温度が１８０℃や４１０℃である試験番号３，４，７と比較して熱伝導度が高くなっていることがわかる。
【００１８】
Ｂを積極的に添加した合金１，２を使用した試験番号１，２，３と比較して、Ｂ含有量が少ない合金３を使用した試験番号５，７で熱伝導度が低くなっている理由は、不純物元素をＢ系化合物として晶出させることができなったためである。なお、試験番号７では、焼鈍温度が低いためにＳｉとＭｇがＭｇ2Ｓｉとして十分に析出できなかったために、熱伝導度がより低くなっている。不純物元素含有量が多い合金４を使用した試験番号６では、Ｂ系化合物として不純物を十分に晶出しきれず、不純物元素の固溶量が多くなっているためである。
【００１９】
また、同じ合金番号１の焼鈍温度３５０℃の試験番号１と比較して焼鈍温度１８０℃，４１０℃の試験番号３，４は、熱伝導性が悪くなっている。焼鈍温度が１８０℃の試験番号３では、温度が低いために母相中に固溶しているＳｉとＭｇがＭｇ2Ｓｉとして十分に析出できず、サブミクロンサイズのＭｇ−Ｓｉ系化合物として析出し、結晶格子を歪めているためである。また、焼鈍温度が４２０℃と高い試験番号４では、一旦析出したＭｇ2Ｓｉが再び固溶したためである。
【００２０】
実施例２：
実施例１の試験番号１，２のものを、押出後室温に冷却された段階でヒートシンク形状に冷間鍛造する工程を付加したものについて、実施例１と同じ方法で電気伝導度と機械的強度を測定した。
その結果を表３に示す。
この結果からもわかるように、冷間鍛造を行っても熱伝導度は低下せず、加工硬化により機械的強度が向上している。
【００２１】
【発明の効果】
以上に説明したように、本発明では、Ａｌ−Ｍｇ−Ｓｉ系アルミニウム合金において、アルミニウム母相中に固溶する不純物元素をＢの添加によりＢ系化合物として晶出させ、しかもアルミニウム母相中に固溶しているＳｉおよびＭｇをＭｇ2Ｓｉとして析出させて、アルミニウム母相中の他元素の固溶量を極力低減して、熱伝導性を高めることができたものである。
Ｂの添加で形成されたＢ系化合物は、熱処理や冷間鍛造によっても変化することなく、母相の不純物元素固溶量を低減できるので、本発明を適用した合金には冷間鍛造が適用できる。このため、複雑形状を有し、高い形状精度が要求されるヒートシンクを始めとした各種部品も、その熱伝導性を低下させることなく製造することができる。[0001]
[Industrial application fields]
The present invention relates to an aluminum alloy material that is particularly suitable as a heat sink for cooling electronic components and is excellent in thermal conductivity.
[0002]
[Prior art]
In recent years, for heat sinks used in electronic devices such as notebook computers and mobile phones, aluminum alloys with excellent thermal conductivity have been cast and cast by die-casting methods suitable for the manufacture of small dimensional precision products or complex shaped products. Molded ones are used. However, pure aluminum and Al-Mg-Si based aluminum alloys used as heat sink materials are excellent in thermal conductivity, but have poor castability, and cast into thin and complex parts like heat sinks. I couldn't. On the other hand, an aluminum alloy containing a large amount of Si or Fe in order to ensure castability has low thermal conductivity and is not suitable for a component that requires high thermal conductivity such as a heat sink.
[0003]
For this reason, a method has been proposed in which Ni is contained instead of Si, a eutectic structure is formed between Ni and Al, castability is improved, and excellent thermal conductivity is ensured (for example, Patent Document 1). reference.). However, although a die-cast product having excellent productivity and good thermal conductivity can be obtained, the use of expensive Ni increases the cost.
In addition, a method has also been proposed in which an Al—Mg—Si-based aluminum alloy is heated to a specific temperature, forged in a subsequent cooling process, a cooling rate is specified, and an age hardening treatment is performed thereafter (for example, Patent Documents). 2). However, this method did not provide sufficient thermal conductivity.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-294962 (page 2-3, FIG. 2)
[Patent Document 2]
JP 2000-204457 A (page 2-3)
[0005]
[Problems to be solved by the present invention]
With the improvement in performance, weight and thickness of electronic devices such as personal computers, there has been a demand for heat sinks with even better cooling performance, that is, better thermal conductivity. In addition, the manufacturing cost can be reduced, and a method for manufacturing a product with high dimensional accuracy with high productivity is required.
The present invention has been devised in order to solve such problems. The aluminum alloy is capable of finely adjusting the component composition of an aluminum alloy to achieve better thermal conductivity, better workability, and stable quality. An object is to provide an alloy material.
[0006]
[Means for Solving the Problems]
In order to achieve the object, the manufacturing method of the aluminum alloy processed material of 58.1IACS% or more of the present invention, Si: 0.25-0.85 mass%, Mg: 0.20-0.50 mass%, Fe : 0.10 to 0.20% by mass, B: 0.003 to 0.10% by mass, the balance consisting of Al and inevitable impurities, Cu: 0.03% by mass or less, Mn: 0.005% by mass %, Cr: 0.03 mass% or less, Ti: 0.005 mass% or less, V: 0.005 mass% or less, Zr: 0.005 mass% or less, Al, Si, Mg, Fe, An ingot of aluminum alloy in which the total of other elements other than B, Cu, Mn, Cr, Ti, V, and Zr is 0.03% by mass or less is maintained at 550 to 595 ° C. for 1 to 6 hours, and is soaked. And cooled down to 200 ° C. or less at a cooling rate of 200 ° C./hour or more. Then, it is heated again and hot-worked so that the temperature of the hot-worked material immediately after hot working such as extrusion or rolling is 500 to 600 ° C, and the obtained hot-worked material is 50 ° C / After cooling to 200 ° C. or less at a cooling rate of not less than minutes, heated to 300 to 400 ° C. at a temperature rising rate of 100 ° C./hour or less, held at that temperature range for 0.5 to 4 hours, and then 50 ° C./hour By cooling to 100 ° C. or lower at the following speed, an aluminum alloy hot-worked material excellent in thermal conductivity can be obtained.
The hot-worked material manufactured by the above method may be further cold forged.
[0007]
[Action]
The lower the purity of aluminum, the lower the thermal conductivity. The thermal conductivity of the aluminum alloy is affected by the amount of other elements dissolved in the matrix. The present invention improves thermal conductivity by minimizing the amount of other elements dissolved in the aluminum matrix.
In terms of component composition, B is added, and elements other than Al, particularly Ti, V, Zr, and Cr, which lower thermal conductivity, form a crystallized product with B and are dissolved in the aluminum matrix. It is possible to reduce the solid solution amount of the element and suppress a decrease in thermal conductivity. In addition, this B-based crystallized product is stable and hardly re-dissolves in the parent phase even by subsequent heat treatment or processing.
Also, in terms of heat treatment, the hot-worked material of Al—Mg—Si-based aluminum alloy is annealed in the temperature range of 300 to 400 ° C., so that Mg and Si dissolved in the matrix phase are converted into Mg 2. It precipitates as Si and reduces the amount of solid solution in the matrix phase to suppress the decrease in thermal conductivity.
[0008]
Embodiment
Hereinafter, the components and composition of the aluminum alloy targeted by the present invention, production conditions, and the like will be described.
Si: 0.25 to 0.85 mass%
Si is an alloy component that improves the strength, and becomes remarkable when Si is contained in an amount of 0.25% by mass or more. However, when an excessive amount of Si exceeding 0.85% by mass is included, the thermal conductivity is significantly lowered.
Mg: 0.20 to 0.50 mass%
Mg is an alloy component that improves the strength, and the effect of Mg becomes remarkable when the content is 0.20% by mass or more. However, when an excessive amount of Mg exceeding 0.50% by mass is contained, the thermal conductivity is significantly lowered.
[0009]
Fe: 0.10 to 0.20 mass%
Fe has the effect of making the cast structure uniform and improving the strength of the matrix. When the content is 0.10% by mass or more, the effect of Fe becomes remarkable. However, when an excessive amount of Fe exceeding 0.20% by mass is included, the thermal conductivity is significantly lowered. In addition, a coarse intermetallic compound is formed, elongation is lowered, and moldability such as extrudability and forgeability is also lowered.
B: 0.003 to 0.01% by mass
B forms a crystallized product with elements other than Al. Therefore, the amount of solid solution of other elements in the Al matrix decreases, and a decrease in thermal conductivity is suppressed. The effect of B becomes remarkable at a content of 0.003 mass% or more. However, when an excessive amount of B exceeding 0.01% by mass is contained, a coarse intermetallic compound is formed, elongation is lowered, and moldability such as extrudability and forgeability is also lowered.
[0010]
Cu, Mn, Cr, Ti, V, Zr
Cu, Mn, Cr, Ti, V, and Zr are elements that reduce thermal conductivity when contained in an aluminum alloy, but Cu is 0.03% by mass or less, Mn is 0.005% by mass or less, Cr If 0.03 mass% or less, Ti is 0.005 mass% or less, V is 0.005 mass% or less, and Zr is 0.005 mass% or less, the thermal conductivity will not decrease so much. If contained, it is acceptable. When it contains exceeding the said numerical value, thermal conductivity will fall rapidly.
Other elements other than Al, Si, Mg, Fe, B, Cu, Mn, Cr, Ti, V, and Zr, if the total is 0.03% by mass or less, the thermal conductivity is hardly lowered. So acceptable.
[0011]
Homogenization treatment: Hold at 550-595 [deg.] C. for 1-6 hours and cool to 200 [deg.] C. or less at a cooling rate of 200 [deg.] C./hour or more . Is finely divided to improve workability. It also stabilizes the existence forms of the main elements Mg, Si, and Fe.
The B-based compound crystallized during casting does not change in this temperature range.
[0012]
Hot working: Hot working is performed so that the temperature of the hot-worked material immediately after hot working is 500 to 600 ° C., and the obtained hot-worked material is reduced to 200 ° C. or less at a cooling rate of 50 ° C./min or more. cooling <br/> the homogenized billet of Mg 2 Si is produced. In hot working, in order to re-dissolve Mg 2 Si, temperature control is performed so that the shape material temperature immediately after working is in the range of 500 to 600 ° C. If the shape material temperature immediately after processing is less than 500 ° C., Mg 2 Si cannot be sufficiently dissolved. On the contrary, when the material temperature exceeds 600 ° C., the recrystallized grain structure after processing tends to be coarsened, and the mechanical strength tends to decrease. The processed shape is cooled to 200 ° C. at a cooling rate of 50 ° C./min or more. When the cooling rate is controlled in this way, coarse Mg 2 Si is prevented from precipitating in the processed material, and a stable structure can be obtained.
In addition, when hot processing is extrusion processing and tensile correction is performed at room temperature, the amount of strain applied is preferably 0.6% or less. If the strain exceeds 0.6%, the Mg 2 Si precipitation state varies during subsequent annealing, and the thermal conductivity is lowered.
[0013]
Annealing: Heating to 300 to 400 ° C. at a temperature rising rate of 100 ° C./hour or less, holding in that temperature range for 0.5 to 4 hours, then cooling to 100 ° C. or less at a rate of 50 ° C./hour or less <br / > Since Si and Mg dissolved in the matrix phase are precipitated as Mg 2 Si, the amount of the solid solution in the matrix phase is reduced and the thermal conductivity is improved. This effect becomes significant when heating at 300 ° C. or higher. However, when annealing is performed at a temperature exceeding 400 ° C., some fine Mg 2 Si is dissolved again. In addition, the precipitation varies due to variations in the cooling rate during the cooling process, and the Mg 2 Si precipitation is not uniform, resulting in a decrease in thermal conductivity or an increase in variation.
Cold forging:
The target shape can be obtained by cold forging. In addition, strength is improved by work hardening.
[0014]
【Example】
Example 1:
The aluminum alloy ingot having the composition shown in Table 1 was held at 560 ° C. for 2 hours, homogenized, and then cooled to room temperature at a cooling rate of 250 ° C./hour. After cooling, it was reheated to 500 ° C. and extruded into a flat plate having a thickness of 4 mm and a width of 60 mm at an extrusion ratio of 10. The material immediately after extrusion was 540 ° C. It cooled to room temperature with the cooling rate of 100 degree-C / min. Then, after heating to three types of temperatures of 180 ° C., 350 ° C., and 410 ° C. and annealing for 2 hours, the furnace was cooled to room temperature (30 ° C./hour).
The obtained extruded material was measured for electric conductivity and mechanical strength (Vickers hardness). It is known that the thermal conductivity is proportional to the electrical conductivity if the alloys are the same. In this example, the electrical conductivity was measured instead of the thermal conductivity, and the measurement was performed by simply measuring and displaying Cu as 100. Displayed in IACS% (international, annealed copper, standard). The electrical conductivity was measured at five locations on the surface of the extruded material, and the average value was taken. The hardness was measured at five locations with a Vickers hardness meter (5 kg load), and the average value was taken.
The results are shown in Table 2.
[0015]
From the results shown in Table 2, in Test Nos. 1 to 4 using Alloys 1 and 2 to which B was added, Alloy 3 with a low B content (B in this alloy is an amount contained as an impurity, From the test numbers 5 to 7 using the alloy 4 having a high impurity content, it can be seen that the thermal conductivity is high if the annealing conditions are the same.
Further, test numbers 1, 2, 5, and 6 having an annealing temperature of 350 ° C. have higher thermal conductivity than test numbers 3, 4, and 7 having an annealing temperature of 180 ° C. and 410 ° C. even in the same alloy. You can see that
[0018]
Compared with test numbers 1, 2 and 3 using alloys 1 and 2 to which B is positively added, thermal conductivity is lower in test numbers 5 and 7 using alloy 3 having a low B content. The reason is that the impurity element could not be crystallized as a B-based compound. In Test No. 7, since the annealing temperature was low, Si and Mg could not be sufficiently precipitated as Mg 2 Si, so the thermal conductivity was lower. This is because in Test No. 6 using the alloy 4 having a large impurity element content, the impurities cannot be sufficiently crystallized out as the B-based compound, and the amount of impurity elements in solid solution increases.
[0019]
Moreover, compared with the test number 1 with the annealing temperature of 350 degreeC of the same alloy number 1, test numbers 3 and 4 with the annealing temperature of 180 degreeC and 410 degreeC have bad thermal conductivity. In test number 3 where the annealing temperature is 180 ° C., Si and Mg dissolved in the matrix phase cannot be sufficiently precipitated as Mg 2 Si because the temperature is low, and precipitate as sub-micron sized Mg—Si compounds. This is because the crystal lattice is distorted. Further, the annealing temperature is 420 ° C. and higher Test No. 4, once precipitated Mg 2 Si is due to solid solution again.
[0020]
Example 2:
About the thing of the test numbers 1 and 2 of Example 1 which added the process of cold forging to the heat sink shape in the step cooled to room temperature after extrusion, it is the same method as Example 1, and electrical conductivity and mechanical strength Was measured.
The results are shown in Table 3.
As can be seen from these results, the thermal conductivity does not decrease even when cold forging is performed, and the mechanical strength is improved by work hardening.
[0021]
【The invention's effect】
As described above, in the present invention, in an Al—Mg—Si-based aluminum alloy, an impurity element that dissolves in an aluminum matrix phase is crystallized as a B-based compound by adding B, and in the aluminum matrix phase. It was possible to increase the thermal conductivity by precipitating Si and Mg in solid solution as Mg 2 Si to reduce the solid solution amount of other elements in the aluminum matrix as much as possible.
The B-based compound formed by the addition of B can reduce the amount of impurity element solid solution in the parent phase without being changed by heat treatment or cold forging. Therefore, cold forging is applied to the alloy to which the present invention is applied. it can. For this reason, various parts including a heat sink that has a complicated shape and requires high shape accuracy can be manufactured without lowering its thermal conductivity.
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| CN102011035A (en) * | 2010-12-04 | 2011-04-13 | 江苏南瑞淮胜电缆有限公司 | Heat-resistant all aluminum alloy conductor and manufacturing method thereof |
| JP5586502B2 (en) * | 2011-02-18 | 2014-09-10 | 三協立山株式会社 | Method for producing extruded aluminum alloy |
| JP6718275B2 (en) * | 2016-03-30 | 2020-07-08 | 昭和電工株式会社 | Method for manufacturing Al-Mg-Si alloy plate |
| JP6718276B2 (en) * | 2016-03-30 | 2020-07-08 | 昭和電工株式会社 | Method for manufacturing Al-Mg-Si alloy plate |
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