CN103384727B - High strength copper alloy forged material - Google Patents
High strength copper alloy forged material Download PDFInfo
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- CN103384727B CN103384727B CN201280009422.4A CN201280009422A CN103384727B CN 103384727 B CN103384727 B CN 103384727B CN 201280009422 A CN201280009422 A CN 201280009422A CN 103384727 B CN103384727 B CN 103384727B
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- Prior art keywords
- copper alloy
- high strength
- forged material
- strength copper
- alloy forged
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/003—Selecting material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Forging (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to the high strength copper alloy forged material of a kind of performance with high rigidity, high intensity and high heat conductance.Described high strength copper alloy forged material, in terms of quality %, containing 3～the P of the Zr of the Si of the Ni of 7.2%, 0.7～1.8%, 0.02～0.35% and 0.002～0.05%, always according to needing containing one or more in Cr, Mn and Zn of adding up to less than 1.5%, the most appropriate Zr and P makes to be not likely to produce crackle in the material during processing or heat treatment.After processing and heat treatment, the forged material of the present invention has the performance of high rigidity, high intensity and high heat conductance, and is applicable to resin injecting forming material, aircraft components etc..
Description
Technical field
The present invention relates to a kind of high strength copper alloy forged material being applicable to forging and molding product etc., described forging and molding product
Including resin injecting forming material.
Background technology
As electric conductivity and the alloy of excellent thermal conductivity, use copper alloy such as pyrite (Cu-Zn yl), bronze (Cu-Sn so far
Base), Be copper and Corson alloy (Cu-Ni-Si yl).Especially, Be copper, Corson alloy etc. have been used for desired strength, hard
Degree and the resin injecting forming material of heat conduction, aircraft components etc..But, above-mentioned Be copper has in its fusing or adds generation in man-hour
The poisonous worry of dust, it is therefore desirable to its substitute.It addition, for Corson alloy, need higher heat conductivity, higher
Intensity and higher hardness.
Additionally, generally, in Cu alloy, easily crack when forging or heat treatment, therefore except hot-workability it
Outward, it is similarly desirable to increase ductility.
As improving the intensity of copper alloy foil and improving the means of its bendability, it is recently proposed an Albatra metal,
In Cu-Ni-Si base copper alloy, wherein it is added with Mg, Sn, Ti, Zr, Al, Mn etc. (seeing patent documentation 1～5).Mg and Sn is solid
Molten improve intensity in the base.Ti, Zr, Al, Mn are because strong so forming compound with sulfur to the affinity of sulfur, thus reduce
As causing the segregation at grain boundary of the sulfide of reason of Hot Working Crack.
Copper alloy foil shown in patent documentation 2,3 and 5 by before and after solution treatment and burin-in process add Si,
The re-heat of laying equal stress on such as Mn, Zr is rolled and is exceeded the bending machining of conventional copper alloy foil with cold rolling or hot-stretch and cold stretch and having
Property and intensity.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2006-9108 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2008-196042 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2008-223136 publication
Patent documentation 4: Japanese Unexamined Patent Publication 2008-266787 publication
Patent documentation 5: Japanese Unexamined Patent Publication 2010-106363 publication
Summary of the invention
Technical problem
But, when manufacturing Cu Alloy Forming product, mainly it is processed shaping by warm and hot forging.Therefore, can not use
In the case of the rolling carried out in foil manufacture or stretching, even if when using the forging of the composition manufacture shown in patent documentation 2,3 and 5
When making formed products, high intensity can not be obtained.
In order to obtain high intensity, the addition increasing Ni and Si is effective.But, along with the amount of Ni or Si increases, heat
Conductance or hot-workability deterioration.Additionally, during Ning Gu formed crystalline material or heat treatment during formed precipitate increase and
Reduce the ductility after heat treatment.
Under the background of said circumstances, carry out the present invention, and its object is to provide a kind of high strength copper alloy forging material
Material, described material can be used for including the forging and molding product etc. of resin injecting forming material, and can provide high rigidity, high intensity, height
Ductility and the performance of high heat conductance.
The means of solution problem
In order to solve the problems referred to above, in the present invention, have containing appropriate Zr, described Zr in Cu-Ni-Si base alloy
Suppression Ni2Si separating out with the effect of raising ductility at grain boundary.It addition, contain appropriate P the most wherein, described P
Having and increase the effect of thin precipitate density and also form compound with Ni, Si and Zr, this allows to acquisition and has high hard
The material of the performance of degree, high intensity and high-termal conductivity.
According to the first aspect of the invention, it is provided that a kind of high strength copper alloy forged material, it is in terms of quality %, containing 3
～the P of the Zr of the Si of the Ni of 7.2%, 0.7～1.8%, 0.02～0.35% and 0.002～0.05%.
According to the second aspect of the invention, it is provided that a kind of high strength copper alloy forged material, it is in terms of quality %, containing 3
～the P of the Zr of the Si of the Ni of 7.2%, 0.7～1.8%, 0.02～0.35% and 0.002～0.05%, possibly together with adding up to
One or more in Cr, Mn and Zn of less than 1.5%.
According to the third aspect of the invention we, in first or second aspect, described high strength copper alloy forged material has
0.2% yield strength of more than 650MPa, the percentage elongation of more than 5% and the conductivity of more than 30%IACS.
Invention effect
According to the present invention, during processing and heat treatment, it is not likely to produce crackle in the material, and can obtain there is height
The high strength copper alloy forged material of the performance of hardness, high intensity and high heat conductance.
Detailed description of the invention
Composition each in the present invention forms reason below that limit illustrate.Incidentally, the content of following ingredients
All in terms of quality %.Additionally, " quality % " and " weight % " has identical implication.
Ni:3～7.2%
Si:0.7～1.8%
Ni and Si is formed main by thin Ni by carrying out burin-in process2The precipitation particles of the intermetallic compound that Si is constituted,
And dramatically increase the intensity of alloy.Additionally, with Ni in burin-in process2The precipitation of Si, electric conductivity improves, and thermal conductivity carries
High.But, when Ni concentration is less than 0.7% less than 3% and Si concentration, it is impossible to obtain desired intensity.Additionally, when Ni concentration surpasses
When crossing 7.2% and Si concentration more than 1.8%, the Ni when forging2Si、Ni5Si2Deng mass crystallization or precipitation, thus cause in forging
Or easily crack during heat treatment.It addition, when Ni concentration is more than 7.2%, conductivity also reduces, and thermal conductivity reduces.Examine
Considering to productivity ratio and the balance of performance, the lower limit of Ni concentration is preferably 3.5%, and its upper limit is preferably 6.6%.Under Si concentration
Limit is preferably 0.8%, and its upper limit is preferably 1.7%.Incidentally, Ni/Si ratio is preferably 3.8～4.6.This deviating from
In the case of ratio, Ni or Si of excess is solid-solubilized in and reduces thermal conductivity in Cu matrix.
Zr:0.02～0.35%
Zr is because strong so forming compound with sulfur to the affinity of sulfur, and reduces as causing processing crackle (hot-working
Crackle) the segregation at grain boundary of the sulfide of reason, thus improve processability (hot-workability).On the other hand, as
The result of the further investigation of the present inventor, finds to be reduced separated out at grain boundary by the diffusion containing Zr suppression Ni or Si
Ni2Si, thus improve the ductility after burin-in process.In order to obtain this effect, contain Zr with the amount of more than 0.02%.So
And, when containing sometimes with the amount more than 0.35%, such as, productivity ratio or performance are because of crystalline material such as Zr oxide and Ni2SiZr's
Increase and coagulation and deteriorate.Therefore, its upper limit is 0.35%.In view of productivity ratio and the balance of performance, its lower limit is preferably
0.05%, and its upper limit is preferably 0.3%.
P:0.002～0.05%
P improves intensity by increasing the density of thin precipitate, and is formed at Ni with Ni, Si and Zr further2Si、
Ni2SiZr etc. contain the compound of the P of trace, thus improves hardness.In order to obtain these effects, with more than 0.002%
Amount is containing P.But, when containing sometimes with the amount more than 0.05%, thermal conductivity is greatly reduced.Therefore, its upper limit is 0.05%.Due to
Same reason, its lower limit is preferably 0.01%, and its upper limit is preferably 0.04%.
Cr, Mn and Zn: amount to less than 1.5%
According to expectation containing at least one in Cr, Mn and Zn.
Cr Yu Si forms intermetallic compound, and has the effect improving intensity with making crystal grain miniaturization.Mn because
Strong so forming compound with sulfur to the affinity of sulfur, and reduce the sulfur as the reason causing processing crackle (Hot Working Crack)
Compound segregation at grain boundary, thus improve processability (hot-workability).Zn improves intensity by solution strengthening.This
Outward, when cheap pyrite chip can be used when dissolving, it is possible to decrease manufacturing cost.But, when the total amount excess of Cr, Mn and Zn
Time, thermal conductivity reduces.The total amount that it is therefore preferable that Cr, Mn and Zn is less than 1.5%.
It is highly preferred that the total amount of Cr, Mn and Zn is less than 1%.Additionally, when containing at least one in Cr, Mn and Zn,
Its total content is preferably more than 0.1%.
The high strength copper alloy forged material of the present invention has above-mentioned metal composition, and surplus is by Cu and the most miscellaneous
Matter is constituted.
The high strength copper alloy forged material of the present invention can be by common method manufacture.
The copper alloy that the present invention uses can make ingot bar by common method.Such as, can be at vacuum atmosphere, indifferent gas
The lower fusing material such as atmosphere, air atmosphere is to obtain ingot bar.Atmosphere is preferably vacuum atmosphere or inert atmosphere.But, such as, also may be used
Copper alloy is made ingot bar in air coreless induction furnace.Additionally, electroslag refining furnace etc. can be used to carry out secondary fusion.Can also lead to
Cross continuous casing and obtain sheet material.
As required copper alloy is processed.The content processed in the present invention is not particularly limited, even and if when making
During by any processing method, it is also possible to obtain the performance of the present invention.Incidentally, it is contemplated that productivity ratio, processing preferably heat adds
Work, and more preferably 600 DEG C of hot-working carried out above.But, even if can also be obtained by the processing under room temperature
The performance similar with hot-working.It addition, processing can be hot-working and cold worked compositions.Additionally, as processing, preferably forge
Make, more preferably warm and hot forging.It is more preferable that implement warm and hot forging more than 600 DEG C.As forging method, known formula can be used
Method such as extruding, hammering or rolling.
After the process or during processing, processed Cu alloy material can also be carried out solution treatment.Solution treatment
Condition include such as at 800～1000 DEG C keep 1～10 hour, then within the scope of the temperature more than 500 DEG C with 5 DEG C/
Cooldown rate more than second cools down, with by abundant for Ni and Si solid solution.
After solution treatment or after the process, processed Cu alloy material can be carried out burin-in process.Aging
The condition processed includes such as keeping 1～30 hour at 400～500 DEG C.
Gained high strength copper alloy material has 0.2% yield strength of such as more than 650MPa, the percentage elongation of more than 5%
And the performance of the conductivity of more than 30%IACS.
Incidentally, the high strength copper alloy forged material of the present invention has the excellent properties as forged material.But,
In the composition of the present invention, even if not carrying out the performance such as extension that the above-mentioned processing such as founding materials of forging can also provide good
Property.
Embodiment
Below embodiments of the invention are illustrated.
Raw material mixing is grouped into (including other inevitable impurity) with the one-tenth of acquisition table 1, and melts at vacuum induction
Change in stove and melt to prepare the alloy of 100mm (diameter) × 200mm (length).Use hammer that these alloys are entered at 900 DEG C
Row warm and hot forging has the sheet material of 25mm thickness to be formed.After keeping 4 hours at 970 DEG C, carried out at solid solution by water cooling
Reason.Then, at 400～500 DEG C, carry out being applicable to the burin-in process of the material of each composition persistently 1-30 hour, thus obtain
Specimen material.
About the specimen material of preparation, carry out the evaluation being illustrated below.
(tension test)
Based on JIS Z2201 (2010) and JIS Z2241 (2010), each sample material is carried out room temperature tension test to comment
Valency 0.2% yield strength (Y.S.), hot strength (T.S.), percentage elongation and the contraction percentage of area.Measurement result is shown in Table 2.
(Vickers hardness)
For each sample material, under 5kg load, measure Vickers hardness based on JIS Z2244 (2010).By measurement result
It is shown in Table 2.
(thermal conductivity)
For each sample material, measure conductivity.Such as Wei Deman-flange hereby law (Wiedemann-Franz law) institute
Showing, thermal conductivity and conductivity have approximate ratio relation, such that it is able to be evaluated thermal conductivity by conductivity.Mensuration is tied
Fruit is shown in Table 2.
Table 2
As shown in table 2, the specimen material of embodiments of the invention have 0.2% yield strength of more than 650MPa, 5%
Above percentage elongation and the conductivity of more than 30%IACS, and also there is quite above hard of the specimen material with comparative example
Degree.
As it has been described above, according to the present invention, show, by containing appropriate Zr and P in Ni-Si-Cu alloy, it is thus achieved that
Improve intensity, ductility and hardness and keep the excellent properties of high conductivity, i.e. high heat conductance simultaneously.
By reference to only certain exemplary embodiments of this invention, the present invention is described in detail.But, to art technology
Personnel are it is readily apparent that variations and modifications can be carried out in the case of without departing from the spirit and scope of the present invention.This
Apply for the Japanese patent application 2011-030660 submitted to based on February 16th, 2011, by with reference to its content being expressly incorporated herein
In.
Industrial applicability
High strength copper alloy forged material according to the present invention, appropriate Zr and P makes when processing or heat treatment at material
Material is not likely to produce crackle.After processing and heat treatment, the forged material of the present invention can have high rigidity, high intensity and Gao Re
The performance of conductance, and it is applicable to resin injecting forming material, aircraft components etc..
Claims (3)
1. a high strength copper alloy forged material, its in terms of quality % by forming as follows:
3～the P of the Zr of the Si of the Ni of 7.2%, 0.7～1.8%, 0.02～0.35% and 0.002～0.05%, surplus be Cu and
Inevitably impurity.
2. a high strength copper alloy forged material, its in terms of quality % by forming as follows: 4.10～the Ni of 7.2%, 0.7～
The P of the Zr and 0.002～0.05% of Si, 0.02～0.35% of 1.8%, and add up in Cr, Mn and Zn of less than 1.5%
One or more, surplus is Cu and inevitable impurity.
3. according to the high strength copper alloy forged material of claim 1 or 2, its have more than 650MPa 0.2% yield strength,
The percentage elongation of more than 5% and the conductivity of more than 30%IACS.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-030660 | 2011-02-16 | ||
| JP2011030660A JP5522692B2 (en) | 2011-02-16 | 2011-02-16 | High strength copper alloy forging |
| PCT/JP2012/053414 WO2012111674A1 (en) | 2011-02-16 | 2012-02-14 | High-strength copper alloy forging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103384727A CN103384727A (en) | 2013-11-06 |
| CN103384727B true CN103384727B (en) | 2016-08-10 |
Family
ID=46672591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280009422.4A Active CN103384727B (en) | 2011-02-16 | 2012-02-14 | High strength copper alloy forged material |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130323114A1 (en) |
| EP (1) | EP2677051A4 (en) |
| JP (1) | JP5522692B2 (en) |
| KR (1) | KR20130109238A (en) |
| CN (1) | CN103384727B (en) |
| TW (1) | TWI539016B (en) |
| WO (1) | WO2012111674A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5688744B2 (en) * | 2012-10-04 | 2015-03-25 | 株式会社日本製鋼所 | High strength and high toughness copper alloy forging |
| KR101472348B1 (en) * | 2012-11-09 | 2014-12-15 | 주식회사 풍산 | Copper alloy material for electrical and electronic components and process for producing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925065A (en) * | 2005-09-02 | 2007-03-07 | 日立电线株式会社 | Copper alloy material for electric element and method of making same |
| CN101314825A (en) * | 2007-05-31 | 2008-12-03 | 古河电气工业株式会社 | Copper alloy for electric and electronic equipments |
| CN101842506A (en) * | 2007-11-01 | 2010-09-22 | 古河电气工业株式会社 | Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same |
| CN101842852A (en) * | 2007-11-01 | 2010-09-22 | 古河电气工业株式会社 | Conductor material for electronic device and electric wire for wiring using the same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04218631A (en) * | 1990-12-17 | 1992-08-10 | Nikko Kyodo Co Ltd | Copper alloy for metal mold for plastic molding |
| WO2005083137A1 (en) * | 2004-02-27 | 2005-09-09 | The Furukawa Electric Co., Ltd. | Copper alloy |
| JP4166196B2 (en) | 2004-06-28 | 2008-10-15 | 日鉱金属株式会社 | Cu-Ni-Si copper alloy strip with excellent bending workability |
| JP4566048B2 (en) * | 2005-03-31 | 2010-10-20 | 株式会社神戸製鋼所 | High-strength copper alloy sheet excellent in bending workability and manufacturing method thereof |
| EP2048251B1 (en) * | 2006-05-26 | 2012-01-25 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| JP4006460B1 (en) * | 2006-05-26 | 2007-11-14 | 株式会社神戸製鋼所 | Copper alloy excellent in high strength, high conductivity and bending workability, and method for producing the same |
| JP4247922B2 (en) * | 2006-09-12 | 2009-04-02 | 古河電気工業株式会社 | Copper alloy sheet for electrical and electronic equipment and method for producing the same |
| US20080190523A1 (en) | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
| JP4357536B2 (en) | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent strength and formability |
| JP5170881B2 (en) * | 2007-03-26 | 2013-03-27 | 古河電気工業株式会社 | Copper alloy material for electrical and electronic equipment and method for producing the same |
| JP2008266787A (en) | 2007-03-28 | 2008-11-06 | Furukawa Electric Co Ltd:The | Copper alloy material and its manufacturing method |
| JP5546196B2 (en) * | 2008-10-03 | 2014-07-09 | 古河電気工業株式会社 | Aging precipitation type copper alloy, copper alloy material, copper alloy part, and method for producing copper alloy material |
| JP4630387B1 (en) * | 2010-04-07 | 2011-02-09 | 古河電気工業株式会社 | Copper alloy wrought material, copper alloy parts, and method for producing copper alloy wrought material |
-
2011
- 2011-02-16 JP JP2011030660A patent/JP5522692B2/en active Active
-
2012
- 2012-02-14 US US13/985,729 patent/US20130323114A1/en not_active Abandoned
- 2012-02-14 EP EP12747404.7A patent/EP2677051A4/en not_active Withdrawn
- 2012-02-14 KR KR1020137021662A patent/KR20130109238A/en not_active Application Discontinuation
- 2012-02-14 CN CN201280009422.4A patent/CN103384727B/en active Active
- 2012-02-14 WO PCT/JP2012/053414 patent/WO2012111674A1/en active Application Filing
- 2012-02-16 TW TW101105033A patent/TWI539016B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925065A (en) * | 2005-09-02 | 2007-03-07 | 日立电线株式会社 | Copper alloy material for electric element and method of making same |
| CN101314825A (en) * | 2007-05-31 | 2008-12-03 | 古河电气工业株式会社 | Copper alloy for electric and electronic equipments |
| CN101842506A (en) * | 2007-11-01 | 2010-09-22 | 古河电气工业株式会社 | Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same |
| CN101842852A (en) * | 2007-11-01 | 2010-09-22 | 古河电气工业株式会社 | Conductor material for electronic device and electric wire for wiring using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103384727A (en) | 2013-11-06 |
| TW201235485A (en) | 2012-09-01 |
| JP2012167347A (en) | 2012-09-06 |
| EP2677051A1 (en) | 2013-12-25 |
| WO2012111674A1 (en) | 2012-08-23 |
| US20130323114A1 (en) | 2013-12-05 |
| JP5522692B2 (en) | 2014-06-18 |
| TWI539016B (en) | 2016-06-21 |
| KR20130109238A (en) | 2013-10-07 |
| EP2677051A4 (en) | 2014-09-03 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20131106 Assignee: Chuetsu Metal Works Assignor: Japan Steel Works, Ltd. Contract record no.: 2017990000470 Denomination of invention: High-strength copper alloy forging Granted publication date: 20160810 License type: Exclusive License Record date: 20171129 |
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Effective date of registration: 20201123 Address after: Hokkaido Japan Patentee after: Japan steel works M & E Co., Ltd Address before: Tokyo, Japan Patentee before: THE JAPAN STEEL WORKS, Ltd. |