CN103384727A - High-strength copper alloy forging - Google Patents

High-strength copper alloy forging Download PDF

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Publication number
CN103384727A
CN103384727A CN2012800094224A CN201280009422A CN103384727A CN 103384727 A CN103384727 A CN 103384727A CN 2012800094224 A CN2012800094224 A CN 2012800094224A CN 201280009422 A CN201280009422 A CN 201280009422A CN 103384727 A CN103384727 A CN 103384727A
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copper alloy
strength copper
high strength
alloy forging
strength
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CN103384727B (en
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宫部芳春
水泽护
田中慎二
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Japan Steel Works M&E Inc
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Japan Steel Works Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
    • B21J1/003—Selecting material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Forging (AREA)
  • Conductive Materials (AREA)

Abstract

The present invention pertains to a high-strength copper alloy forging which has excellent characteristics including high hardness, high strength and high thermal conductivity. This high-strength copper alloy forging contains, by mass, 3 to 7.2% of Ni, 0.7 to 1.8% of Si, 0.02 to 0.35% of Zr and 0.002 to 0.05% of P, and further contains, if necessary, one or more of Cr, Mn and Zn in a total amount of 1.5% or less. By virtue of the actions of proper amounts of Zr and P, the high-strength copper alloy forging is less susceptible to cracking during working or heat treatment, and exhibits, after working and heat treatment, excellent characteristics including high hardness, high strength and high thermal conductivity, thus being suitable for use in injection molds for resins, aircraft components, and so on.

Description

The high strength copper alloy forged material
Technical field
The present invention relates to a kind of high strength copper alloy forged material that is applicable to forging and molding product etc., described forging and molding product comprise the resin injection formed material.
Background technology
As the alloy of electroconductibility and excellent thermal conductivity, use so far copper alloy such as brass (Cu-Zn yl), bronze (Cu-Sn yl), Be copper and Corson alloy (Cu-Ni-Si yl).Especially, Be copper, Corson alloy etc. have been used to resin injection formed material, aircraft components of desired strength, hardness and heat conduction etc.Yet above-mentioned Be copper has in its fusing or adds the poisonous worry of dust that produce man-hour, therefore needs its surrogate.In addition, for the Corson alloy, thermal conductivity that need to be higher, higher intensity and the hardness of Geng Gao.
In addition, usually, in the Cu alloy, easily crack when forging or thermal treatment, therefore except hot workability, also need to improve ductility.
Means as the intensity that improves the copper alloy foil and its bendability of raising propose an Albatra metal-recently, wherein are added with (referring to patent documentations 1～5) such as Mg, Sn, Ti, Zr, Al, Mn in Cu-Ni-Si base copper alloy.Mg and Sn are solid-solubilized in matrix and improve intensity.So Ti, Zr, Al, Mn be because form compound with sulphur by force to the affinity of sulphur, thereby reduce as the segregation at the grain boundary place of the sulfide of the reason that causes Hot Working Crack.
Copper alloy foil shown in patent documentation 2,3 and 5 is rolled with cold rolling or thermal stretch and cold stretching and is had bendability and the intensity that surpasses conventional copper alloy foil by add the re-heats of laying equal stress on such as Si, Mn, Zr before and after solution treatment and burin-in process.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2006-9108 communique
Patent documentation 2: TOHKEMY 2008-196042 communique
Patent documentation 3: TOHKEMY 2008-223136 communique
Patent documentation 4: TOHKEMY 2008-266787 communique
Patent documentation 5: TOHKEMY 2010-106363 communique
Summary of the invention
Technical problem
Yet, when making Cu Alloy Forming product, mainly shape by heat forged.Therefore, in the situation that the rolling or stretching of carrying out in can not using the foil manufacturing, even when using the composition shown in patent documentation 2,3 and 5 to make the forging and molding product, can not obtain high strength.
In order to obtain high strength, the addition that increases Ni and Si is effective.Yet along with the amount of Ni or Si increases, thermal conductivity or hot workability are deteriorated.In addition, the precipitate that forms of the crystalline material that forms of solidificating period or during Heat Treatment increases and reduces ductility after thermal treatment.
Carried out the present invention under the background of said circumstances, and its purpose is to provide a kind of high strength copper alloy forged material, described material can be used for forging and molding product that comprise by the resin injection formed material etc., and the performance of high rigidity, high strength, high ductibility and high heat conductance can be provided.
The means of dealing with problems
In order to address the above problem, in the present invention, contain appropriate Zr in Cu-Ni-Si base alloy, described Zr has inhibition Ni 2Si is in the effect of separating out to improve ductility at grain boundary place.In addition, also contain therein appropriate P, described P has the effect that increases thin precipitate density and forms compound with Ni, Si and Zr, and this makes the material of the performance that can obtain to have high rigidity, high strength and high thermal conductivity.
According to a first aspect of the invention, provide a kind of high strength copper alloy forged material, it is in quality %, contains 3～7.2% Ni, 0.7～1.8% Si, 0.02～0.35% Zr and 0.002～0.05% P.
According to a second aspect of the invention, a kind of high strength copper alloy forged material is provided, it is in quality %, contain 3～7.2% Ni, 0.7～1.8% Si, 0.02～0.35% Zr and 0.002～0.05% P, also contain the Cr, the Mn that add up to below 1.5% and one or more in Zn.
According to a third aspect of the invention we, first or second aspect in, described high strength copper alloy forged material has the electric conductivity more than 650MPa above 0.2% yield strength, the elongation 5% or more and 30%IACS.
The invention effect
According to the present invention, be difficult for cracking in material in processing and during Heat Treatment, and can obtain to have the high strength copper alloy forged material of the performance of high rigidity, high strength and high heat conductance.
Embodiment
The below describes the reason of the base composition of each composition in the present invention.Incidentally, the content of following ingredients is all in quality %.In addition, " quality % " and " % by weight " has identical implication.
Ni：3～7.2％
Si：0.7～1.8％
Ni and Si form mainly by thin Ni by carrying out burin-in process 2The precipitation particles of the intermetallic compound that Si consists of, and significantly increase the intensity of alloy.In addition, follow Ni in burin-in process 2Si separates out, and electroconductibility improves, and thermal conductivity improves.Yet, when Ni concentration lower than 3% and Si concentration lower than 0.7% the time, the intensity that can not obtain to expect.In addition, surpass 7.2% and Si concentration when surpassing 1.8%, Ni when forging when Ni concentration 2Si, Ni 5Si 2Deng mass crystallization or separate out, thereby cause forging or easily cracking during thermal treatment.In addition, when Ni concentration surpassed 7.2%, electric conductivity also reduced, and thermal conductivity reduces.Consider the balance of productivity and performance, the lower limit of Ni concentration is preferably 3.5%, and its upper limit is preferably 6.6%.The lower limit of Si concentration is preferably 0.8%, and its upper limit is preferably 1.7%.Incidentally, the Ni/Si ratio is preferably 3.8～4.6.In the situation that deviate from this ratio, excessive Ni or Si are solid-solubilized in the Cu matrix and reduce thermal conductivity.
Zr：0.02～0.35％
So Zr forms compound with sulphur by force because of the affinity to sulphur, and reduces as the segregation of the sulfide that causes the reason of processing crackle (Hot Working Crack) at the grain boundary place, thereby improves processibility (hot workability).On the other hand, as the result of the inventor's further investigation, the diffusion of finding to suppress by containing Zr Ni or Si reduces the Ni that separates out at the grain boundary place 2Si, thus ductility after burin-in process improved.In order to obtain this effect, contain Zr with the amount more than 0.02%.Yet when containing sometimes with the amount over 0.35%, for example, productivity or performance are because of crystalline material such as Zr oxide compound and Ni 2The increase of SiZr and aggegation and deteriorated.Therefore, be limited to 0.35% on it.Consider the balance of productivity and performance, its lower limit is preferably 0.05%, and its upper limit is preferably 0.3%.
P：0.002～0.05％
P improves intensity by the density that increases thin precipitate, and further is formed on Ni with Ni, Si and Zr 2Si, Ni 2The compound that contains the P of trace in SiZr etc., thus hardness improved.In order to obtain these effects, contain P with the amount more than 0.002%.Yet when containing sometimes with the amount over 0.05%, thermal conductivity descends greatly.Therefore, be limited to 0.05% on it.Due to same reason, its lower limit is preferably 0.01%, and its upper limit is preferably 0.04%.
Cr, Mn and Zn: amount to below 1.5%
Contain at least a in Cr, Mn and Zn according to expectation.
Cr and Si form intermetallic compound, and have the effect that improves intensity and make the crystal grain miniaturization.So Mn forms compound with sulphur by force because of the affinity to sulphur, and reduces as the segregation of the sulfide that causes the reason of processing crackle (Hot Working Crack) at the grain boundary place, thereby improves processibility (hot workability).Zn improves intensity by solution strengthening.In addition, in the time of can using cheap brass chip when in dissolving, can reduce manufacturing cost.Yet when the total amount of Cr, Mn and Zn was excessive, thermal conductivity reduced.The total amount that it is therefore preferable that Cr, Mn and Zn is below 1.5%.
More preferably, the total amount of Cr, Mn and Zn is below 1%.In addition, during at least a in containing Cr, Mn and Zn, its total content is preferably more than 0.1%.
High strength copper alloy forged material of the present invention has above-mentioned metal and forms, and surplus is made of Cu and inevitable impurity.
High strength copper alloy forged material of the present invention can be by common method manufacturing.
The copper alloy that the present invention uses can be made ingot bar by common method.For example, can be at the lower molten material such as vacuum atmosphere, inert atmosphere, air atmosphere to obtain ingot bar.Atmosphere is preferably vacuum atmosphere or inert atmosphere.Yet, for example, can also in the atmosphere high frequency furnace, copper alloy be made ingot bar.In addition, can use electroslag remelting furnace etc. to carry out secondary fusion.Can also obtain sheet material by continuous casing.
As required copper alloy is processed.The content of processing is not particularly limited in the present invention, even and when using any working method, also can obtain performance of the present invention.Incidentally, consider productivity, processing is preferably hot-work, and more preferably in the hot-work of carrying out more than 600 ℃.Yet, even also can obtain and the similar performance of hot-work by the processing under room temperature.In addition, processing can be hot-work and cold worked composition.In addition, as processing, the preferred forging, more preferably heat forged.More preferably, implementing heat forged more than 600 ℃.As forging method, can use currently known methods such as extruding, hammering or rolling.
During can also or processing after processing, processed Cu alloy material is carried out solution treatment.The condition of solution treatment for example comprises and keeping under 800～1000 ℃ 1～10 hour, then carry out with the rate of cooling more than 5 ℃/second in the temperature range more than 500 ℃ cooling, with Ni and the abundant solid solution of Si.
After solution treatment or after processing, can carry out burin-in process to processed Cu alloy material.The condition of burin-in process for example comprises and keeping under 400～500 ℃ 1～30 hour.
Gained high strength copper alloy material has such as 0.2% yield strength more than 650MPa, elongation more than 5% and the performance of the electric conductivity more than 30%IACS.
Incidentally, high strength copper alloy forged material of the present invention has the excellent properties as forged material.Yet, in composition of the present invention, can not provide good performance such as ductility even do not carry out above-mentioned processing as the cast material that forges yet.
Embodiment
The below describes embodiments of the invention.
The one-tenth that raw material is mixed to obtain table 1 is grouped into (comprising other inevitable impurity), and in the vacuum induction melting stove fusing with the alloy of preparation 100mm (diameter) * 200mm (length).Use hammer to carry out heat forged to these alloys under 900 ℃ and have the sheet material of 25mm thickness with formation.After keeping 4 hours, carry out solution treatment by water cooling under 970 ℃.Then, the burin-in process that is applicable to the material of each composition under 400～500 ℃ also continues 1-30 hour, thereby obtains specimen material.
Specimen material about preparation carries out the evaluation that illustrates below.
(tension test)
Based on JIS Z2201 (2010) and JIS Z2241 (2010), each specimen material is carried out the normal temperature tension test to estimate 0.2% yield strength (Y.S.), tensile strength (T.S.), elongation and relative reduction in area.Measurement result is shown in Table 2.
(Vickers' hardness)
For each specimen material, measure Vickers' hardness based on JIS Z2244 (2010) under the 5kg load.Measurement result is shown in Table 2.
(thermal conductivity)
For each specimen material, measure electric conductivity.As shown in Wei Deman-flange Zi Dinglv (Wiedemann-Franz law), thermal conductivity and electric conductivity have the approximate ratio relation, thereby can estimate thermal conductivity by electric conductivity.Measurement result is shown in Table 2.
Table 2
Figure BPA0000175360810000091
As shown in table 2, the specimen material of embodiments of the invention has the above electric conductivity of 650MPa above 0.2% yield strength, the elongation more than 5% and 30%IACS, and has the hardness quite above with the specimen material of comparative example.
As mentioned above, according to the present invention, show, by contain appropriate Zr and P in the Ni-Si-Cu alloy, obtained raising intensity, ductility and hardness and kept simultaneously high conductivity, the i.e. excellent properties of high heat conductance.
With reference to specific implementations of the present invention, the present invention is had been described in detail.Yet, it will be apparent for a person skilled in the art that and can carry out in the case of without departing from the spirit and scope of the present invention variations and modifications.The Japanese patent application 2011-030660 that the application submitted to based on February 16th, 2011 is incorporated herein its content by reference.
Industrial applicability
According to high strength copper alloy forged material of the present invention, appropriate Zr and P make when processing or thermal treatment and are difficult for cracking in material.After processing and thermal treatment, forged material of the present invention can have the performance of high rigidity, high strength and high heat conductance, and applicable to resin injection formed material, aircraft components etc.

Claims (3)

1. high strength copper alloy forged material, it contains 3～7.2% Ni, 0.7～1.8% Si, 0.02～0.35% Zr and 0.002～0.05% P in quality %.
2. high strength copper alloy forged material, it contains 3～7.2% Ni, 0.7～1.8% Si, 0.02～0.35% Zr and 0.002～0.05% P in quality %, and also contains the Cr, the Mn that add up to below 1.5% and one or more in Zn.
3. according to claim 1 and 2 high strength copper alloy forged material, it has the electric conductivity more than 650MPa above 0.2% yield strength, the elongation 5% or more and 30%IACS.
CN201280009422.4A 2011-02-16 2012-02-14 High strength copper alloy forged material Active CN103384727B (en)

Applications Claiming Priority (3)

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JP2011-030660 2011-02-16
JP2011030660A JP5522692B2 (en) 2011-02-16 2011-02-16 High strength copper alloy forging
PCT/JP2012/053414 WO2012111674A1 (en) 2011-02-16 2012-02-14 High-strength copper alloy forging

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Publication number Priority date Publication date Assignee Title
JP5688744B2 (en) * 2012-10-04 2015-03-25 株式会社日本製鋼所 High strength and high toughness copper alloy forging
KR101472348B1 (en) * 2012-11-09 2014-12-15 주식회사 풍산 Copper alloy material for electrical and electronic components and process for producing same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method
CN1925065A (en) * 2005-09-02 2007-03-07 日立电线株式会社 Copper alloy material for electric element and method of making same
CN101314825A (en) * 2007-05-31 2008-12-03 古河电气工业株式会社 Copper alloy for electric and electronic equipments
CN101437969A (en) * 2006-05-26 2009-05-20 株式会社神户制钢所 Copper alloy having high strength, high electroconductivity and superior bend formability, and manufacturing method therefor
CN101842852A (en) * 2007-11-01 2010-09-22 古河电气工业株式会社 Conductor material for electronic device and electric wire for wiring using the same
CN101842506A (en) * 2007-11-01 2010-09-22 古河电气工业株式会社 Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04218631A (en) * 1990-12-17 1992-08-10 Nikko Kyodo Co Ltd Copper alloy for metal mold for plastic molding
MY143219A (en) * 2004-02-27 2011-03-31 Furukawa Electric Co Ltd Copper alloy
JP4166196B2 (en) 2004-06-28 2008-10-15 日鉱金属株式会社 Cu-Ni-Si copper alloy strip with excellent bending workability
EP2048251B1 (en) * 2006-05-26 2012-01-25 Kabushiki Kaisha Kobe Seiko Sho Copper alloy having high strength, high electric conductivity and excellent bending workability
JP4247922B2 (en) * 2006-09-12 2009-04-02 古河電気工業株式会社 Copper alloy sheet for electrical and electronic equipment and method for producing the same
US20080190523A1 (en) 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4357536B2 (en) 2007-02-16 2009-11-04 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent strength and formability
JP5170881B2 (en) * 2007-03-26 2013-03-27 古河電気工業株式会社 Copper alloy material for electrical and electronic equipment and method for producing the same
JP2008266787A (en) 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy material and its manufacturing method
JP5546196B2 (en) * 2008-10-03 2014-07-09 古河電気工業株式会社 Aging precipitation type copper alloy, copper alloy material, copper alloy part, and method for producing copper alloy material
JP4630387B1 (en) * 2010-04-07 2011-02-09 古河電気工業株式会社 Copper alloy wrought material, copper alloy parts, and method for producing copper alloy wrought material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method
CN1925065A (en) * 2005-09-02 2007-03-07 日立电线株式会社 Copper alloy material for electric element and method of making same
CN101437969A (en) * 2006-05-26 2009-05-20 株式会社神户制钢所 Copper alloy having high strength, high electroconductivity and superior bend formability, and manufacturing method therefor
CN101314825A (en) * 2007-05-31 2008-12-03 古河电气工业株式会社 Copper alloy for electric and electronic equipments
CN101842852A (en) * 2007-11-01 2010-09-22 古河电气工业株式会社 Conductor material for electronic device and electric wire for wiring using the same
CN101842506A (en) * 2007-11-01 2010-09-22 古河电气工业株式会社 Copper alloy material excellent in strength, bending workability and stress relaxation resistance, and method for producing the same

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WO2012111674A1 (en) 2012-08-23
CN103384727B (en) 2016-08-10
TW201235485A (en) 2012-09-01
US20130323114A1 (en) 2013-12-05
KR20130109238A (en) 2013-10-07
JP5522692B2 (en) 2014-06-18
JP2012167347A (en) 2012-09-06
TWI539016B (en) 2016-06-21
EP2677051A4 (en) 2014-09-03

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