TW201234413A - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
TW201234413A
TW201234413A TW101100848A TW101100848A TW201234413A TW 201234413 A TW201234413 A TW 201234413A TW 101100848 A TW101100848 A TW 101100848A TW 101100848 A TW101100848 A TW 101100848A TW 201234413 A TW201234413 A TW 201234413A
Authority
TW
Taiwan
Prior art keywords
wiring
wirings
measured
column
row
Prior art date
Application number
TW101100848A
Other languages
English (en)
Chinese (zh)
Inventor
Satoru Mayuzumi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW201234413A publication Critical patent/TW201234413A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW101100848A 2011-02-08 2012-01-09 Semiconductor device TW201234413A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011024568A JP5660313B2 (ja) 2011-02-08 2011-02-08 半導体装置

Publications (1)

Publication Number Publication Date
TW201234413A true TW201234413A (en) 2012-08-16

Family

ID=46587826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101100848A TW201234413A (en) 2011-02-08 2012-01-09 Semiconductor device

Country Status (4)

Country Link
US (1) US20120199829A1 (enExample)
JP (1) JP5660313B2 (enExample)
CN (1) CN102629602A (enExample)
TW (1) TW201234413A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972571B1 (en) 2016-12-15 2018-05-15 Taiwan Semiconductor Manufacturing Co., Ltd. Logic cell structure and method
US10756114B2 (en) 2017-12-28 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure and manufacturing method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816715B2 (en) * 2011-05-12 2014-08-26 Nanya Technology Corp. MOS test structure, method for forming MOS test structure and method for performing wafer acceptance test
KR102326562B1 (ko) * 2013-10-04 2021-11-16 에스케이하이닉스 주식회사 테스트부를 갖는 반도체 장치, 이를 포함하는 전자 장치 및 그 테스트 방법
US9378826B2 (en) * 2014-07-23 2016-06-28 Samsung Electronics Co., Ltd. Nonvolatile memory device, program method thereof, and storage device including the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3763664B2 (ja) * 1998-04-08 2006-04-05 松下電器産業株式会社 テスト回路
US7030651B2 (en) * 2003-12-04 2006-04-18 Viciciv Technology Programmable structured arrays
DE102004060369A1 (de) * 2004-12-15 2006-06-29 Infineon Technologies Ag Halbleiterscheibe mit Teststruktur
US7489151B2 (en) * 2005-10-03 2009-02-10 Pdf Solutions, Inc. Layout for DUT arrays used in semiconductor wafer testing
JP4274576B2 (ja) * 2007-01-12 2009-06-10 エルピーダメモリ株式会社 半導体装置
KR101283537B1 (ko) * 2007-09-28 2013-07-15 삼성전자주식회사 고전압 측정 회로 및 이를 구비하는 비휘발성 메모리 장치
JP5174505B2 (ja) * 2008-03-27 2013-04-03 シャープ株式会社 不具合検出機能を備えた半導体装置
JP5142145B2 (ja) * 2008-03-27 2013-02-13 ルネサスエレクトロニクス株式会社 半導体装置の製造方法、半導体ウェハ、およびテスト方法
US8343781B2 (en) * 2010-09-21 2013-01-01 International Business Machines Corporation Electrical mask inspection

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972571B1 (en) 2016-12-15 2018-05-15 Taiwan Semiconductor Manufacturing Co., Ltd. Logic cell structure and method
US10483204B2 (en) 2016-12-15 2019-11-19 Taiwan Semiconductor Manufacturing Co., Ltd. Logic cell structure with interconnection design and configuration
US11257761B2 (en) 2016-12-15 2022-02-22 Taiwan Semiconductor Manufacturing Co., Ltd. Logic cell structure and method
US10756114B2 (en) 2017-12-28 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure and manufacturing method
US10854635B2 (en) 2017-12-28 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure having different pitches
US11282859B2 (en) 2017-12-28 2022-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure and manufacturing method
US11721701B2 (en) 2017-12-28 2023-08-08 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure and manufacturing method

Also Published As

Publication number Publication date
JP5660313B2 (ja) 2015-01-28
CN102629602A (zh) 2012-08-08
JP2012164838A (ja) 2012-08-30
US20120199829A1 (en) 2012-08-09

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