CN102629602A - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN102629602A
CN102629602A CN2012100214923A CN201210021492A CN102629602A CN 102629602 A CN102629602 A CN 102629602A CN 2012100214923 A CN2012100214923 A CN 2012100214923A CN 201210021492 A CN201210021492 A CN 201210021492A CN 102629602 A CN102629602 A CN 102629602A
Authority
CN
China
Prior art keywords
wiring
wirings
measured
column
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100214923A
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English (en)
Chinese (zh)
Inventor
黛哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN102629602A publication Critical patent/CN102629602A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN2012100214923A 2011-02-08 2012-01-31 半导体器件 Pending CN102629602A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-024568 2011-02-08
JP2011024568A JP5660313B2 (ja) 2011-02-08 2011-02-08 半導体装置

Publications (1)

Publication Number Publication Date
CN102629602A true CN102629602A (zh) 2012-08-08

Family

ID=46587826

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012100214923A Pending CN102629602A (zh) 2011-02-08 2012-01-31 半导体器件

Country Status (4)

Country Link
US (1) US20120199829A1 (enExample)
JP (1) JP5660313B2 (enExample)
CN (1) CN102629602A (enExample)
TW (1) TW201234413A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104517938A (zh) * 2013-10-04 2015-04-15 爱思开海力士有限公司 具有测试单元的半导体器件、电子器件和测试方法
CN105321567A (zh) * 2014-07-23 2016-02-10 三星电子株式会社 非易失性存储器装置、编程方法及存储装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816715B2 (en) * 2011-05-12 2014-08-26 Nanya Technology Corp. MOS test structure, method for forming MOS test structure and method for performing wafer acceptance test
US9972571B1 (en) 2016-12-15 2018-05-15 Taiwan Semiconductor Manufacturing Co., Ltd. Logic cell structure and method
US10756114B2 (en) 2017-12-28 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor circuit with metal structure and manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157700A1 (en) * 2004-12-15 2006-07-20 Ramona Winter Semiconductor wafer with test structure
CN1976022A (zh) * 2005-10-03 2007-06-06 Pdf全解公司 用于半导体晶片测试的被测装置阵列的布局
US20090243645A1 (en) * 2008-03-27 2009-10-01 Renesas Technology Corp. Manufacturing method of a semiconductor device, a semiconductor wafer, and a test method
JP2009239027A (ja) * 2008-03-27 2009-10-15 Sharp Corp 不具合検出機能を備えた半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3763664B2 (ja) * 1998-04-08 2006-04-05 松下電器産業株式会社 テスト回路
US7030651B2 (en) * 2003-12-04 2006-04-18 Viciciv Technology Programmable structured arrays
JP4274576B2 (ja) * 2007-01-12 2009-06-10 エルピーダメモリ株式会社 半導体装置
KR101283537B1 (ko) * 2007-09-28 2013-07-15 삼성전자주식회사 고전압 측정 회로 및 이를 구비하는 비휘발성 메모리 장치
US8343781B2 (en) * 2010-09-21 2013-01-01 International Business Machines Corporation Electrical mask inspection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157700A1 (en) * 2004-12-15 2006-07-20 Ramona Winter Semiconductor wafer with test structure
CN1976022A (zh) * 2005-10-03 2007-06-06 Pdf全解公司 用于半导体晶片测试的被测装置阵列的布局
US20090243645A1 (en) * 2008-03-27 2009-10-01 Renesas Technology Corp. Manufacturing method of a semiconductor device, a semiconductor wafer, and a test method
JP2009239027A (ja) * 2008-03-27 2009-10-15 Sharp Corp 不具合検出機能を備えた半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104517938A (zh) * 2013-10-04 2015-04-15 爱思开海力士有限公司 具有测试单元的半导体器件、电子器件和测试方法
CN104517938B (zh) * 2013-10-04 2018-06-26 爱思开海力士有限公司 具有测试单元的半导体器件、电子器件和测试方法
CN105321567A (zh) * 2014-07-23 2016-02-10 三星电子株式会社 非易失性存储器装置、编程方法及存储装置

Also Published As

Publication number Publication date
US20120199829A1 (en) 2012-08-09
JP5660313B2 (ja) 2015-01-28
TW201234413A (en) 2012-08-16
JP2012164838A (ja) 2012-08-30

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Legal Events

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120808