TW201143984A - Organic particulate loaded polishing pads and method of making and using the same - Google Patents

Organic particulate loaded polishing pads and method of making and using the same Download PDF

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Publication number
TW201143984A
TW201143984A TW099146709A TW99146709A TW201143984A TW 201143984 A TW201143984 A TW 201143984A TW 099146709 A TW099146709 A TW 099146709A TW 99146709 A TW99146709 A TW 99146709A TW 201143984 A TW201143984 A TW 201143984A
Authority
TW
Taiwan
Prior art keywords
polishing
elements
polishing pad
pad
layer
Prior art date
Application number
TW099146709A
Other languages
English (en)
Chinese (zh)
Inventor
William Dale Joseph
Brian David Goers
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201143984A publication Critical patent/TW201143984A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW099146709A 2009-12-30 2010-12-29 Organic particulate loaded polishing pads and method of making and using the same TW201143984A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29118209P 2009-12-30 2009-12-30

Publications (1)

Publication Number Publication Date
TW201143984A true TW201143984A (en) 2011-12-16

Family

ID=44227136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099146709A TW201143984A (en) 2009-12-30 2010-12-29 Organic particulate loaded polishing pads and method of making and using the same

Country Status (7)

Country Link
US (1) US20130102231A1 (https=)
JP (1) JP5671554B2 (https=)
KR (1) KR20120112662A (https=)
CN (1) CN102686361A (https=)
SG (1) SG181889A1 (https=)
TW (1) TW201143984A (https=)
WO (1) WO2011082156A2 (https=)

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US10252396B2 (en) * 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
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JP6888476B2 (ja) * 2016-08-23 2021-06-16 信越化学工業株式会社 基板の製造方法
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Publication number Priority date Publication date Assignee Title
TWI743156B (zh) * 2016-08-04 2021-10-21 美商羅門哈斯電子材料Ｃｍｐ控股公司 低缺陷多孔拋光墊

Also Published As

Publication number Publication date
CN102686361A (zh) 2012-09-19
WO2011082156A2 (en) 2011-07-07
SG181889A1 (en) 2012-07-30
US20130102231A1 (en) 2013-04-25
JP2013516328A (ja) 2013-05-13
KR20120112662A (ko) 2012-10-11
WO2011082156A3 (en) 2011-11-17
JP5671554B2 (ja) 2015-02-18

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