WO2011082156A3 - Organic particulate loaded polishing pads and method of making and using the same - Google Patents

Organic particulate loaded polishing pads and method of making and using the same Download PDF

Info

Publication number
WO2011082156A3
WO2011082156A3 PCT/US2010/062205 US2010062205W WO2011082156A3 WO 2011082156 A3 WO2011082156 A3 WO 2011082156A3 US 2010062205 W US2010062205 W US 2010062205W WO 2011082156 A3 WO2011082156 A3 WO 2011082156A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
making
polishing pads
same
pads
Prior art date
Application number
PCT/US2010/062205
Other languages
French (fr)
Other versions
WO2011082156A2 (en
Inventor
William D. Joseph
Brian D. Goers
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Priority to CN201080060309XA priority Critical patent/CN102686361A/en
Priority to SG2012046538A priority patent/SG181889A1/en
Priority to JP2012547232A priority patent/JP5671554B2/en
Priority to US13/517,367 priority patent/US20130102231A1/en
Publication of WO2011082156A2 publication Critical patent/WO2011082156A2/en
Publication of WO2011082156A3 publication Critical patent/WO2011082156A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.
PCT/US2010/062205 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same WO2011082156A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201080060309XA CN102686361A (en) 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same
SG2012046538A SG181889A1 (en) 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same
JP2012547232A JP5671554B2 (en) 2009-12-30 2010-12-28 Organic fine particle loaded polishing pad, and method for producing and using the same
US13/517,367 US20130102231A1 (en) 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29118209P 2009-12-30 2009-12-30
US61/291,182 2009-12-30

Publications (2)

Publication Number Publication Date
WO2011082156A2 WO2011082156A2 (en) 2011-07-07
WO2011082156A3 true WO2011082156A3 (en) 2011-11-17

Family

ID=44227136

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/062205 WO2011082156A2 (en) 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same

Country Status (7)

Country Link
US (1) US20130102231A1 (en)
JP (1) JP5671554B2 (en)
KR (1) KR20120112662A (en)
CN (1) CN102686361A (en)
SG (1) SG181889A1 (en)
TW (1) TW201143984A (en)
WO (1) WO2011082156A2 (en)

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Also Published As

Publication number Publication date
JP5671554B2 (en) 2015-02-18
TW201143984A (en) 2011-12-16
JP2013516328A (en) 2013-05-13
US20130102231A1 (en) 2013-04-25
KR20120112662A (en) 2012-10-11
SG181889A1 (en) 2012-07-30
WO2011082156A2 (en) 2011-07-07
CN102686361A (en) 2012-09-19

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