CN106272034A - A kind of grinding pad for processing soft brittle crystal material and preparation method thereof - Google Patents
A kind of grinding pad for processing soft brittle crystal material and preparation method thereof Download PDFInfo
- Publication number
- CN106272034A CN106272034A CN201610649721.4A CN201610649721A CN106272034A CN 106272034 A CN106272034 A CN 106272034A CN 201610649721 A CN201610649721 A CN 201610649721A CN 106272034 A CN106272034 A CN 106272034A
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding pad
- crystal material
- processing soft
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of grinding pad for processing soft brittle crystal material and preparation method thereof.This grinding pad includes grinding pad fabricbase, adhesive layer, grinding layer the most successively, and described grinding layer is mixed with grinding aid by abrasive material.First select grinding pad fabricbase；According to mass fraction meter, weigh adhesive 20% 50%, additionally weighing abrasive material 1% 10%, rheology modifier 1% 10%, surfactant 1% 10%, surplus is deionized water, and using standby as grinding aid after rheology modifier, surfactant and deionized water mix homogeneously；Then adhesive dilution is sprayed at grinding pad cloth primary surface and forms adhesive layer；After again abrasive material being dispersed in grinding aid, it is sprayed on adhesive layer formation grinding layer and obtains grinding pad semi-finished product；Finally semi-finished product are dried.It is simple that the present invention has preparation process, and cost of manufacture is low, uses the surface quality of grinding pad target product of the present invention to promote notable, and sub-surface damage degree is low.
Description
Technical field
The present invention relates to attrition process field, be specifically related to a kind of grinding pad for processing soft brittle crystal material and
Preparation method.
Background technology
The preparation of Semiconductor substrate needs through long crystalline substance, cuts, grinds and the mechanical processing process such as polishing, process of lapping master
If removing the cut of cutting generation and laying the foundation for chemically mechanical polishing, the quality of Grinding Quality will directly influence the later stage
The success or not of substrate polishing.
Preparing soft brittle crystal substrate uses conventional processing technique the most inappropriate, the most sapphire grinding side
Case, i.e. carries out roughly grinding use diamond and copper dish subsequently first by boron carbide and cast iron plate and carries out the two step schemes refined, this
Scheme is processed soft brittle crystal result and be there is following problem, and (1) soft crisp hardness of crystals is low more than sapphire, uses sapphire
In grinding scheme, roughing process causes the material removing rate of crystal too fast so that crystal face is easily generated cut, collapses the defects such as limit, enters
And promote the fraction defective of crystal；(2) use cost of the consumptive material such as diamond grinding fluid and copper dish during such scheme smooth grinding
Too high so that the processing cost of crystal remains high, and product will eventually be caused to lose the market competitiveness.Above-mentioned grinding pad (or
Abrasive disk) it is metal cast iron plate and copper dish, part patent of invention mentions the nothing including polyurethane resin the most on the market
Spin fabricbase or the grinding pad of chemical fibre base, but processing object is mainly hard brittle crystal material, such as sapphire, carborundum, dioxy
The semi-conducting materials such as SiClx glass and silicon chip, are not the grinding and polishing processing being suitable for soft brittle crystal, working (machining) efficiency and processing
Quality is unsatisfactory.
At present, the processing of soft brittle crystal material has the skin processing scheme using tradition classic for different materials, as
Use the mills such as Colophonium dish to coordinate diamond abrasive grain to grind as grinding pad, or use other common skin processing sides
Formula, as used polishing cloth to coordinate various lapping liquid to grind, but in above-mentioned processing method or preparation process is relative
Loaded down with trivial details, otherwise production cost is higher.
Summary of the invention
For the deficiencies in the prior art, it is an object of the invention to provide a kind of for processing grinding of soft brittle crystal material
Mill pad, improves the yields of soft brittle crystal material, improves the market competitiveness of target product.
Another object of the present invention is to provide the preparation of a kind of grinding pad for processing soft brittle crystal material
Method, the method input cost is low, pollution-free, can industrialization.
For solving prior art problem, the technical scheme that the present invention takes is:
A kind of grinding pad for processing soft brittle crystal material, includes grinding pad fabricbase, adhesive layer the most successively, grinds
Layer, described grinding layer is mixed with grinding aid by abrasive material.
As the above-mentioned grinding pad for processing soft brittle crystal material preferably, described grinding pad fabricbase is that texture is thick
Rough cloth.
As the above-mentioned grinding pad for processing soft brittle crystal material preferably, described adhesive layer is by EP5(aqueous emulsion
Type polyurethane adhesive), RPU 069(emulsion type non-ionic polyurethane adhesive) or RPU 048(water dispersant type polyaminoester gluing
Agent) at least two mix.
As the above-mentioned grinding pad for processing soft brittle crystal material preferably, described abrasive material is diamond,
Particle diameter is 1-3 micron.
As the above-mentioned grinding pad for processing soft brittle crystal material preferably, described grinding aid is by rheology modified
Agent, surfactant and deionized water mix.
As preferably, described surfactant is fatty acid amide sulfosuccinic acid monoesters, N-lauroyl sarcosine
Sodium, polyoxyethylenated alcohol sodium sulfate, AESA, fatty alcohol-polyoxyethylene ether 2-Sulfosuccinic acid list
Ester disodium, fatty acid methyl ester sodium sulfonate of ethoxylated, dioctyl sodium sulfosuccinates acid disodium, two-2-ethylhexyl sulfosuccinics
Acid sodium, sodium lauryl sulfate, lauryl potassium sulfate, dodecyl phenylsulfate, α-alkene sulfonate, lignosulfonates, complete
Fluorine butane sulfonate, straight chain fatty polyoxyethylenated alcohol, aliphatic acid polyethenoxy ether, polyethenoxy sorbitan list oleic acid
Any in ester, isomery ten carbon polyoxyethylenated alcohol, isomery 13 carbon polyoxyethylenated alcohol or methyl stearate polyoxyethylene ether
One or more mixture.
As preferably, described rheology modifier is carboxyl methyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl
In cellulose carrageenan, xanthan gum, hydroxypropyl guar gum, carbomer or acrylate copolymer any one or two or more mixed
Compound.
The preparation method of the above-mentioned grinding pad for processing soft brittle crystal material, comprises the following steps:
Step 1, selects grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs adhesive 20%-50%, additionally weighs abrasive material 1%-10%, rheology modifier 1%-
10%, surfactant 1%-10%, surplus is deionized water, and by the mixing of rheology modifier, surfactant and deionized water all
After even standby as grinding aid；
Step 3, dilutes adhesive basin and is sprayed at grinding pad cloth primary surface, and forming thickness is 0.2-1 micron adhesive layer；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
Beneficial effect
This grinding pad, mainly for the grinding of soft brittle crystal material and polishing, is especially suitable for the Mohs' hardness soft crystalline substance less than 5
Body, simultaneously can be used for grinding of the slightly higher brittle crystal of hardness.Compare the most common current abrasive disk, grinding pad, throwing
The materials such as light cloth, it is simple that the present invention has preparation process, and cost of manufacture is low, uses the present invention to process the grinding of soft and fragile crystal material
Efficiency is high, and process of lapping Green is pollution-free, and the surface quality of target product promotes notable, and sub-surface damage degree is low.
Accompanying drawing explanation
Fig. 1 is crystal face three-dimensional appearance before Lithium metaniobate grinds；
Fig. 2 is crystal face three-dimensional appearance after Lithium metaniobate grinds；
Fig. 3 is crystal face three-dimensional appearance before gallium oxide grinds；
Fig. 4 is crystal face three-dimensional appearance after gallium oxide grinds；
Fig. 5 is crystal face three-dimensional appearance before Silica abrasive；
Fig. 6 is crystal face three-dimensional appearance after Silica abrasive.
Detailed description of the invention
Embodiment 1
A kind of grinding pad for processing soft brittle crystal material, includes grinding pad fabricbase, adhesive layer the most successively, grinds
Layer, described grinding layer is mixed with grinding aid by abrasive material.Wherein adhesive layer is mixed by EP5 and RPU 069, and abrasive material is
Diamond, grain size specification is W3.
The preparation method of the above-mentioned grinding pad for processing soft brittle crystal material, comprises the following steps:
Step 1, selects Pilus Caprae seu Ovis cloth as grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs EP5 45%, RPU069 5% stand-by, then weigh abrasive material 10%, PEG-1000 5%,
Fatty acid amide sulfosuccinic acid monoesters 5%, surplus is deionized water, and rheology modifier, surfactant and deionized water is mixed
After closing uniformly standby as grinding aid；
Step 3, after being mixed by EP5 and RPU 069, dilution is sprayed at grinding pad cloth primary surface, and forming thickness is 0.2-1 micron glue
Adhesion coating；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
After using this grinding pad to grind lithium niobate substrate substrate on precision lapping machine, Keyemce three-dimensional appearance instrument is used to see
Examining crystal face pattern, before grinding, wafer topography is as it is shown in figure 1, wafer topography is as in figure 2 it is shown, result shows crystalline substance after Yan Moing
The surface roughness of sheet is down to 75nm by 622nm, and the quality on surface is significantly improved.
Embodiment 2
A kind of grinding pad for processing soft brittle crystal material, includes grinding pad fabricbase, adhesive layer the most successively, grinds
Layer, described grinding layer is mixed with grinding aid by abrasive material.Wherein adhesive layer is mixed by EP5 and RPU 048, abrasive material
For diamond, grain size specification is W3.
The preparation method of the above-mentioned grinding pad for processing soft brittle crystal material, comprises the following steps:
Step 1, selects Pilus Caprae seu Ovis cloth as grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs EP5 5% and RPU 048 45% stand-by, then weighs abrasive material 10%, PEG-600
3%, alkanolamide 3%, surplus is deionized water, and will make after rheology modifier, surfactant and deionized water mix homogeneously
Standby for grinding aid；
Step 3, after being mixed by EP5 and RPU 048, dilution is sprayed at grinding pad cloth primary surface, and forming thickness is 0.2-1 micron glue
Adhesion coating；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
Use this grinding pad after rough lapping gallium oxide substrate base on precision lapping machine, use Keyemce three-dimensional appearance instrument
Observe crystal face pattern, grind before wafer topography as it is shown on figure 3, after Yan Moing wafer topography as shown in Figure 4, result shows
The surface roughness of wafer is down to 179nm by 316nm, and the quality on surface is effectively improved.
Embodiment 3
A kind of grinding pad for processing soft brittle crystal material, includes grinding pad fabricbase, adhesive layer the most successively, grinds
Layer, described grinding layer is mixed with grinding aid by abrasive material.Wherein adhesive layer is mixed by RPU 069 and RPU048, mill
Material is diamond, and grain size specification is W3.
The preparation method of the above-mentioned grinding pad for processing soft brittle crystal material, comprises the following steps:
Step 1, selects Pilus Caprae seu Ovis cloth as grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs RPU069 45% and RPU048 5%, then weighs abrasive material 6%, PEG-400 5%, fat
Fat amide sulfosuccinic acid monoesters 5%, surplus is deionized water, and rheology modifier, surfactant and deionized water is mixed
After Jun Yun standby as grinding aid；
Step 3, after being mixed by RPU 069 and RPU 048, dilution is sprayed at grinding pad cloth primary surface, and forming thickness is that 0.2-1 is micro-
Rice glue adhesion coating；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
Use this grinding pad after rough lapping silicon dioxide liner bottom substrate on precision lapping machine, use Keyemce three-dimensional appearance
Instrument observe crystal face pattern, grind before wafer topography as it is shown in figure 5, after Yan Moing wafer topography as shown in Figure 6, result table
The surface roughness of bright wafer is down to 155nm by 346nm, and the quality on surface is significantly improved.
Embodiment 4
A kind of grinding pad for processing soft brittle crystal material, includes grinding pad fabricbase, adhesive layer the most successively, grinds
Layer, described grinding layer is mixed with grinding aid by abrasive material.Wherein adhesive layer is mixed by EP5,069 and 048, and abrasive material is
Diamond, grain size specification is W3.
The preparation method of the above-mentioned grinding pad for processing soft brittle crystal material, comprises the following steps:
Step 1, selects Pilus Caprae seu Ovis cloth as grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs EP5 10%, RPU 069 35% and RPU 048 5%, then weigh abrasive material 8%,
PEG-400 3%, fatty acid amide sulfosuccinic acid monoesters 3%, surplus is deionized water, and by rheology modifier, surfactant
Standby as grinding aid with after deionized water mix homogeneously；
Step 3, dilutes basin and is sprayed at grinding pad cloth primary surface after EP5, RPU069 and RPU048 being mixed, forming thickness is 0.2-
1 micron of adhesive layer；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
After using this grinding pad to grind lithium niobate substrate substrate on precision lapping machine, Keyemce three-dimensional appearance instrument is used to see
Examining crystal face pattern before and after grinding, result shows that the surface roughness of wafer is down to 65nm by 636nm, and the quality on surface obtains significantly
Improve.
Claims (8)
1. the grinding pad being used for processing soft brittle crystal material, it is characterised in that include the most successively grinding shield
Base (1), adhesive layer (2), grinding layer (3), described grinding layer (3) is mixed with grinding aid by abrasive material.
Grinding pad for processing soft brittle crystal material the most according to claim 1, it is characterised in that described grinding pad
Fabricbase (1) is the cloth that texture is coarse.
Grinding pad for processing soft brittle crystal material the most according to claim 1, it is characterised in that described adhesive layer
(2) by aqueous emulsion type polyurethane adhesive, in emulsion type non-ionic polyurethane adhesive or water dispersant type polyaminoester adhesive extremely
Few two kinds mix.
Grinding pad for processing soft brittle crystal material the most according to claim 1, it is characterised in that described abrasive material is
Diamond, particle diameter is 1-3 micron.
Grinding pad for processing soft brittle crystal material the most according to claim 1, it is characterised in that grinding aid by
Rheology modifier, surfactant and deionized water mix.
Grinding pad for processing soft brittle crystal material the most according to claim 5, it is characterised in that live in described surface
Property agent is fatty acid amide sulfosuccinic acid monoesters, N-sodium N-lauroyl sarcosinate, polyoxyethylenated alcohol sodium sulfate, fatty alcohol
Polyoxyethylene ether ammonium sulfate, fatty alcohol-polyoxyethylene ether sulfosuccinic acid monoesters disodium, fatty acid methyl ester polyoxyethylene ether sulfonic acid
Sodium, dioctyl sodium sulfosuccinates acid disodium, two-2-ethylhexylsulfosuccinate sodium, sodium lauryl sulfate, lauryl potassium sulfate,
Dodecyl phenylsulfate, α-alkene sulfonate, lignosulfonates, perflurobutane sulfonate, straight-chain fatty alcohol polyoxyethylene
Ether, aliphatic acid polyethenoxy ether, polyoxyethylene sorbitan monooleate dehydration, isomery ten carbon polyoxyethylenated alcohol, isomery 13
Any one or two or more mixture in carbon polyoxyethylenated alcohol or methyl stearate polyoxyethylene ether.
Grinding pad for processing soft brittle crystal material the most according to claim 5, it is characterised in that rheology modifier
For carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl cellulose carrageenan, xanthan gum, hydroxypropyl guar gum, carbomer
Or any one or a few in acrylate copolymer mixes.
8. preparation method based on the grinding pad for processing soft brittle crystal material described in claim 1, it is characterised in that
Comprise the following steps:
Step 1, selects grinding pad fabricbase；
Step 2, according to mass fraction meter, weighs adhesive 20%-50%, additionally weighs abrasive material 1%-10%, rheology modifier 1%-
10%, surfactant 1%-10%, surplus is deionized water, and by the mixing of rheology modifier, surfactant and deionized water all
After even standby as grinding aid；
Step 3, is sprayed at grinding pad cloth primary surface by adhesive dilution, and forming thickness is 0.2-1 micron adhesive layer；
Step 4, after abrasive material is dispersed in grinding aid, is sprayed on adhesive layer formation grinding layer, obtains grinding pad semi-finished product；
Step 5, by grinding pad semi-finished product drying finished product grinding pad at 80-120 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610649721.4A CN106272034A (en) | 2016-08-10 | 2016-08-10 | A kind of grinding pad for processing soft brittle crystal material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610649721.4A CN106272034A (en) | 2016-08-10 | 2016-08-10 | A kind of grinding pad for processing soft brittle crystal material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106272034A true CN106272034A (en) | 2017-01-04 |
Family
ID=57667616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610649721.4A Pending CN106272034A (en) | 2016-08-10 | 2016-08-10 | A kind of grinding pad for processing soft brittle crystal material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106272034A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107336151A (en) * | 2017-08-29 | 2017-11-10 | 华侨大学 | A kind of preparation method of individual layer abrasive material Gelatin finish film |
| CN111775071A (en) * | 2020-07-17 | 2020-10-16 | 大连理工大学 | Polishing wheel for processing hard and brittle materials and preparation method thereof |
| CN112959233A (en) * | 2021-03-05 | 2021-06-15 | 南京航空航天大学 | Fixed abrasive polishing pad and deliquescent KDP crystal dry-type polishing method |
| CN114952608A (en) * | 2022-06-15 | 2022-08-30 | 郑州磨料磨具磨削研究所有限公司 | Fixed abrasive grinding pad based on photo-initiated front-end polymerization reaction and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1126454A (en) * | 1993-06-30 | 1996-07-10 | 美国3M公司 | Precisely shaped particles and method of making the same |
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
| CN201338234Y (en) * | 2008-12-05 | 2009-11-04 | 淄博理研泰山涂附磨具有限公司 | Composite sand-planted coated abrasive tool |
| CN102172879A (en) * | 2011-02-23 | 2011-09-07 | 南京航空航天大学 | Method for processing soft and crisp LBO crystals based on consolidated abrasive polishing pad |
| CN102227289A (en) * | 2008-12-26 | 2011-10-26 | 东洋橡胶工业株式会社 | Polishing pad and method for producing same |
| JP2013516328A (en) * | 2009-12-30 | 2013-05-13 | スリーエム イノベイティブ プロパティズ カンパニー | Organic fine particle loaded polishing pad, and method for producing and using the same |
| CN105269450A (en) * | 2015-10-22 | 2016-01-27 | 盐城工学院 | Ultra-precision machining method for gallium oxide substrate |
| CN105273638A (en) * | 2015-10-14 | 2016-01-27 | 盐城工学院 | Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof |
-
2016
- 2016-08-10 CN CN201610649721.4A patent/CN106272034A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1126454A (en) * | 1993-06-30 | 1996-07-10 | 美国3M公司 | Precisely shaped particles and method of making the same |
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
| CN201338234Y (en) * | 2008-12-05 | 2009-11-04 | 淄博理研泰山涂附磨具有限公司 | Composite sand-planted coated abrasive tool |
| CN102227289A (en) * | 2008-12-26 | 2011-10-26 | 东洋橡胶工业株式会社 | Polishing pad and method for producing same |
| JP2013516328A (en) * | 2009-12-30 | 2013-05-13 | スリーエム イノベイティブ プロパティズ カンパニー | Organic fine particle loaded polishing pad, and method for producing and using the same |
| CN102172879A (en) * | 2011-02-23 | 2011-09-07 | 南京航空航天大学 | Method for processing soft and crisp LBO crystals based on consolidated abrasive polishing pad |
| CN105273638A (en) * | 2015-10-14 | 2016-01-27 | 盐城工学院 | Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof |
| CN105269450A (en) * | 2015-10-22 | 2016-01-27 | 盐城工学院 | Ultra-precision machining method for gallium oxide substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107336151A (en) * | 2017-08-29 | 2017-11-10 | 华侨大学 | A kind of preparation method of individual layer abrasive material Gelatin finish film |
| CN111775071A (en) * | 2020-07-17 | 2020-10-16 | 大连理工大学 | Polishing wheel for processing hard and brittle materials and preparation method thereof |
| CN111775071B (en) * | 2020-07-17 | 2022-03-15 | 大连理工大学 | Polishing wheel for processing hard and brittle materials and preparation method thereof |
| CN112959233A (en) * | 2021-03-05 | 2021-06-15 | 南京航空航天大学 | Fixed abrasive polishing pad and deliquescent KDP crystal dry-type polishing method |
| CN114952608A (en) * | 2022-06-15 | 2022-08-30 | 郑州磨料磨具磨削研究所有限公司 | Fixed abrasive grinding pad based on photo-initiated front-end polymerization reaction and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103013345B (en) | Oily diamond grinding liquid and preparation method thereof | |
| CN106272034A (en) | A kind of grinding pad for processing soft brittle crystal material and preparation method thereof | |
| CN104999365B (en) | Sapphire wafer abrasive polishing method | |
| CN101451046B (en) | Polishing composition for silicon wafer polishing | |
| CN102343547A (en) | Thermochemistry mechanical polishing method of sapphire substrate material and polishing solution | |
| CN109545680B (en) | Rapid preparation method of high-flatness and low-damage monocrystalline silicon carbide substrate | |
| CN102516873B (en) | Silicon wafer polishing composition and preparation method thereof | |
| JP7298915B2 (en) | Method for manufacturing single-crystal silicon carbide substrate | |
| CN104441281B (en) | A kind of cutting method of ultra thin silicon wafers | |
| CN107722935B (en) | Spherical diamond stacked abrasive and manufacturing method thereof | |
| CN102775915A (en) | Silicon wafer fine polishing combined solution capable of inhibiting particle deposition and preparation method thereof | |
| CN102127371B (en) | Preparation method and use method of polishing solution for silicon carbide | |
| CN105038607A (en) | Effective sapphire fine grinding method and fine grinding solution | |
| CN106663619A (en) | Composition for polishing silicon wafers | |
| CN108034360A (en) | A kind of CMP planarization liquid and its application in GaAs wafer polishings | |
| CN110291618A (en) | The polishing method of silicon wafer and the manufacturing method of silicon wafer | |
| Li et al. | Effect of chemical additive on fixed abrasive pad self-conditioning in CMP | |
| CN114231182A (en) | Easy-to-cleave gallium oxide wafer chemical mechanical polishing process, polishing solution and preparation method thereof | |
| CN108587567A (en) | A kind of abrasive suitable for the soft crisp wafer grinding polishing of cadmium-zinc-teiluride | |
| CN108381379A (en) | The polishing method that aluminum-nitride single crystal piece electrobrightening and chemically mechanical polishing are combined | |
| CN106244022A (en) | Lapping liquid for gallium nitride semiconductor wafer and preparation method thereof | |
| CN102533126B (en) | Abrasive composition and use thereof | |
| CN110099977A (en) | The grinding method of composition for polishing and Silicon Wafer | |
| CN110405543A (en) | A kind of ferrite substrate polishing method using acid polishing slurry and Metal Substrate polishing disk | |
| CN105950115A (en) | Environment-friendly abrasive paste suitable for gallium oxide substrate and preparation method of environment-friendly abrasive paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
|
| RJ01 | Rejection of invention patent application after publication |