KR20120112662A - 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 - Google Patents

유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 Download PDF

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Publication number
KR20120112662A
KR20120112662A KR1020127019846A KR20127019846A KR20120112662A KR 20120112662 A KR20120112662 A KR 20120112662A KR 1020127019846 A KR1020127019846 A KR 1020127019846A KR 20127019846 A KR20127019846 A KR 20127019846A KR 20120112662 A KR20120112662 A KR 20120112662A
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KR
South Korea
Prior art keywords
polishing
polishing pad
elements
pad
major face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127019846A
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English (en)
Korean (ko)
Inventor
윌리암 디 조셉
브라이언 디 고어스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20120112662A publication Critical patent/KR20120112662A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127019846A 2009-12-30 2010-12-28 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 Ceased KR20120112662A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29118209P 2009-12-30 2009-12-30
US61/291,182 2009-12-30

Publications (1)

Publication Number Publication Date
KR20120112662A true KR20120112662A (ko) 2012-10-11

Family

ID=44227136

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019846A Ceased KR20120112662A (ko) 2009-12-30 2010-12-28 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법

Country Status (7)

Country Link
US (1) US20130102231A1 (https=)
JP (1) JP5671554B2 (https=)
KR (1) KR20120112662A (https=)
CN (1) CN102686361A (https=)
SG (1) SG181889A1 (https=)
TW (1) TW201143984A (https=)
WO (1) WO2011082156A2 (https=)

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KR20230092626A (ko) * 2021-12-17 2023-06-26 케이피엑스케미칼 주식회사 균일하게 분포된 액상 포어를 포함하는 연마 패드 및 이의 제조방법
KR20230134719A (ko) * 2022-03-15 2023-09-22 한국생산기술연구원 수직 방향 홈을 갖는 돌출 패턴을 포함하는 연마 패드, 그 제조 방법 및 연마 장치

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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
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JP6888476B2 (ja) * 2016-08-23 2021-06-16 信越化学工業株式会社 基板の製造方法
KR20200014364A (ko) * 2017-06-01 2020-02-10 도쿄엘렉트론가부시키가이샤 게터링층 형성 장치, 게터링층 형성 방법 및 컴퓨터 기억 매체
CN107344336B (zh) * 2017-07-24 2023-04-11 东莞金太阳研磨股份有限公司 一种复合基材抛光磨具及其制备方法
CN107433525B (zh) * 2017-07-24 2023-05-02 东莞金太阳研磨股份有限公司 用于抛光磨具的双层高分子复合基材及其制备方法
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US11411925B2 (en) 2019-12-31 2022-08-09 Oracle International Corporation Methods, systems, and computer readable media for implementing indirect general packet radio service (GPRS) tunneling protocol (GTP) firewall filtering using diameter agent and signal transfer point (STP)
CN111168503B (zh) * 2020-01-17 2021-02-19 三峡大学 一种刚度可调的打磨装置及使用方法
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
CN111531479A (zh) * 2020-06-16 2020-08-14 湖南劳动人事职业学院 一种角度可控多孔贴片砂轮及其制造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230092626A (ko) * 2021-12-17 2023-06-26 케이피엑스케미칼 주식회사 균일하게 분포된 액상 포어를 포함하는 연마 패드 및 이의 제조방법
KR20230134719A (ko) * 2022-03-15 2023-09-22 한국생산기술연구원 수직 방향 홈을 갖는 돌출 패턴을 포함하는 연마 패드, 그 제조 방법 및 연마 장치

Also Published As

Publication number Publication date
TW201143984A (en) 2011-12-16
CN102686361A (zh) 2012-09-19
WO2011082156A2 (en) 2011-07-07
SG181889A1 (en) 2012-07-30
US20130102231A1 (en) 2013-04-25
JP2013516328A (ja) 2013-05-13
WO2011082156A3 (en) 2011-11-17
JP5671554B2 (ja) 2015-02-18

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