CN102686361A - 填充有机颗粒的抛光垫及其制造和使用方法 - Google Patents

填充有机颗粒的抛光垫及其制造和使用方法 Download PDF

Info

Publication number
CN102686361A
CN102686361A CN201080060309XA CN201080060309A CN102686361A CN 102686361 A CN102686361 A CN 102686361A CN 201080060309X A CN201080060309X A CN 201080060309XA CN 201080060309 A CN201080060309 A CN 201080060309A CN 102686361 A CN102686361 A CN 102686361A
Authority
CN
China
Prior art keywords
polishing
elements
polishing pad
major side
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080060309XA
Other languages
English (en)
Chinese (zh)
Inventor
威廉·D·约瑟夫
布赖恩·D·格斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102686361A publication Critical patent/CN102686361A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201080060309XA 2009-12-30 2010-12-28 填充有机颗粒的抛光垫及其制造和使用方法 Pending CN102686361A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29118209P 2009-12-30 2009-12-30
US61/291,182 2009-12-30
PCT/US2010/062205 WO2011082156A2 (en) 2009-12-30 2010-12-28 Organic particulate loaded polishing pads and method of making and using the same

Publications (1)

Publication Number Publication Date
CN102686361A true CN102686361A (zh) 2012-09-19

Family

ID=44227136

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080060309XA Pending CN102686361A (zh) 2009-12-30 2010-12-28 填充有机颗粒的抛光垫及其制造和使用方法

Country Status (7)

Country Link
US (1) US20130102231A1 (https=)
JP (1) JP5671554B2 (https=)
KR (1) KR20120112662A (https=)
CN (1) CN102686361A (https=)
SG (1) SG181889A1 (https=)
TW (1) TW201143984A (https=)
WO (1) WO2011082156A2 (https=)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103223643A (zh) * 2013-05-03 2013-07-31 鲁启华 一种超薄刀片
CN104511852A (zh) * 2013-10-08 2015-04-15 吉多·瓦伦蒂尼 制造抛光垫的方法以及抛光垫
CN107344336A (zh) * 2017-07-24 2017-11-14 东莞金太阳研磨股份有限公司 一种复合基材抛光磨具及其制备方法
CN107433525A (zh) * 2017-07-24 2017-12-05 东莞金太阳研磨股份有限公司 用于抛光磨具的双层高分子复合基材及其制备方法
CN108136568A (zh) * 2015-10-16 2018-06-08 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
CN110692124A (zh) * 2017-06-01 2020-01-14 东京毅力科创株式会社 吸杂层形成装置、吸杂层形成方法以及计算机存储介质
US10537974B2 (en) 2014-10-17 2020-01-21 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN111168503A (zh) * 2020-01-17 2020-05-19 三峡大学 一种刚度可调的打磨装置及使用方法
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10953515B2 (en) 2014-10-17 2021-03-23 Applied Materials, Inc. Apparatus and method of forming a polishing pads by use of an additive manufacturing process
CN113977453A (zh) * 2021-11-08 2022-01-28 万华化学集团电子材料有限公司 提高抛光平坦度的化学机械抛光垫及其应用
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN117655911A (zh) * 2024-01-04 2024-03-08 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2323808B1 (en) * 2008-07-18 2015-09-30 3M Innovative Properties Company Polishing pad with floating elements and method of making and using the same
JP6196773B2 (ja) * 2012-12-28 2017-09-13 ニッタ・ハース株式会社 研磨パッド
US10252396B2 (en) * 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
WO2015167910A1 (en) * 2014-05-01 2015-11-05 3M Innovative Properties Company Flexible abrasive article and method of using the same
WO2015171419A1 (en) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Multi-layer polishing pad for cmp
JP6426403B2 (ja) * 2014-08-27 2018-11-21 株式会社フジミインコーポレーテッド 研磨方法
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
CN106272034A (zh) * 2016-08-10 2017-01-04 盐城工学院 一种用于加工软脆性晶体材料的研磨垫及其制备方法
JP6888476B2 (ja) * 2016-08-23 2021-06-16 信越化学工業株式会社 基板の製造方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
EP3858546A4 (en) * 2018-09-28 2021-12-01 Fujimi Incorporated POLISHING PAD AND POLISHING PROCESS USING IT
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11411925B2 (en) 2019-12-31 2022-08-09 Oracle International Corporation Methods, systems, and computer readable media for implementing indirect general packet radio service (GPRS) tunneling protocol (GTP) firewall filtering using diameter agent and signal transfer point (STP)
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
CN111531479A (zh) * 2020-06-16 2020-08-14 湖南劳动人事职业学院 一种角度可控多孔贴片砂轮及其制造方法
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11553342B2 (en) 2020-07-14 2023-01-10 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming security attacks using security edge protection proxy (SEPP)
US11751056B2 (en) 2020-08-31 2023-09-05 Oracle International Corporation Methods, systems, and computer readable media for 5G user equipment (UE) historical mobility tracking and security screening using mobility patterns
US11832172B2 (en) 2020-09-25 2023-11-28 Oracle International Corporation Methods, systems, and computer readable media for mitigating spoofing attacks on security edge protection proxy (SEPP) inter-public land mobile network (inter-PLMN) forwarding interface
US11825310B2 (en) 2020-09-25 2023-11-21 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming spoofing attacks
US11622255B2 (en) 2020-10-21 2023-04-04 Oracle International Corporation Methods, systems, and computer readable media for validating a session management function (SMF) registration request
US11528251B2 (en) 2020-11-06 2022-12-13 Oracle International Corporation Methods, systems, and computer readable media for ingress message rate limiting
US11770694B2 (en) 2020-11-16 2023-09-26 Oracle International Corporation Methods, systems, and computer readable media for validating location update messages
US11818570B2 (en) 2020-12-15 2023-11-14 Oracle International Corporation Methods, systems, and computer readable media for message validation in fifth generation (5G) communications networks
US11812271B2 (en) 2020-12-17 2023-11-07 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming attacks for internet of things (IoT) devices based on expected user equipment (UE) behavior patterns
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11700510B2 (en) 2021-02-12 2023-07-11 Oracle International Corporation Methods, systems, and computer readable media for short message delivery status report validation
US11516671B2 (en) 2021-02-25 2022-11-29 Oracle International Corporation Methods, systems, and computer readable media for mitigating location tracking and denial of service (DoS) attacks that utilize access and mobility management function (AMF) location service
US11689912B2 (en) 2021-05-12 2023-06-27 Oracle International Corporation Methods, systems, and computer readable media for conducting a velocity check for outbound subscribers roaming to neighboring countries
KR20240061651A (ko) * 2021-09-29 2024-05-08 엔테그리스, 아이엔씨. 양면 패드 컨디셔너
KR102679468B1 (ko) * 2021-12-17 2024-06-28 케이피엑스케미칼 주식회사 균일하게 분포된 액상 포어를 포함하는 연마 패드 및 이의 제조방법
KR102832719B1 (ko) * 2022-03-15 2025-07-10 한국생산기술연구원 수직 방향 홈을 갖는 돌출 패턴을 포함하는 연마 패드, 그 제조 방법 및 연마 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
WO2003085595A1 (en) * 2002-04-03 2003-10-16 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
CN1489508A (zh) * 2001-02-15 2004-04-14 3M 用于修饰半导体晶片的固定磨具
CN1494986A (zh) * 2002-09-17 2004-05-12 韩国珀利尔有限公司 一体型研磨垫及其制造方法
WO2006057714A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
CN101137463A (zh) * 2005-05-16 2008-03-05 宋健民 超硬切割装置及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099954A (en) * 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
JP2000301450A (ja) * 1999-04-19 2000-10-31 Rohm Co Ltd Ｃｍｐ研磨パッドおよびそれを用いたｃｍｐ処理装置
JP3615134B2 (ja) * 2000-08-24 2005-01-26 三共理化学株式会社 研磨材
US6645624B2 (en) * 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
JP3762943B2 (ja) * 2001-04-17 2006-04-05 株式会社ユニバーサルエアー サスペンション
JP2003136397A (ja) * 2001-11-01 2003-05-14 Roki Techno Co Ltd 研磨パッド
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
JP2008290197A (ja) * 2007-05-25 2008-12-04 Nihon Micro Coating Co Ltd 研磨パッド及び方法
KR20100082770A (ko) * 2007-09-03 2010-07-19 세미퀘스트, 인코포레이티드 폴리싱 패드
CN102089122A (zh) * 2008-05-15 2011-06-08 3M创新有限公司 具有终点窗口的抛光垫以及使用其的系统和方法
JP5596030B2 (ja) * 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
CN1489508A (zh) * 2001-02-15 2004-04-14 3M 用于修饰半导体晶片的固定磨具
WO2003085595A1 (en) * 2002-04-03 2003-10-16 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
CN1494986A (zh) * 2002-09-17 2004-05-12 韩国珀利尔有限公司 一体型研磨垫及其制造方法
WO2006057714A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
CN101137463A (zh) * 2005-05-16 2008-03-05 宋健民 超硬切割装置及其制造方法
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103223643B (zh) * 2013-05-03 2015-10-28 鲁启华 一种超薄刀片
CN103223643A (zh) * 2013-05-03 2013-07-31 鲁启华 一种超薄刀片
US10786884B2 (en) 2013-10-08 2020-09-29 Guido Valentini Method for manufacturing a polishing pad
CN104511852A (zh) * 2013-10-08 2015-04-15 吉多·瓦伦蒂尼 制造抛光垫的方法以及抛光垫
US11383352B2 (en) 2013-10-08 2022-07-12 Guido Valentini Polishing pad
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10537974B2 (en) 2014-10-17 2020-01-21 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10953515B2 (en) 2014-10-17 2021-03-23 Applied Materials, Inc. Apparatus and method of forming a polishing pads by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
CN108136568A (zh) * 2015-10-16 2018-06-08 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN110692124A (zh) * 2017-06-01 2020-01-14 东京毅力科创株式会社 吸杂层形成装置、吸杂层形成方法以及计算机存储介质
CN107344336A (zh) * 2017-07-24 2017-11-14 东莞金太阳研磨股份有限公司 一种复合基材抛光磨具及其制备方法
CN107433525A (zh) * 2017-07-24 2017-12-05 东莞金太阳研磨股份有限公司 用于抛光磨具的双层高分子复合基材及其制备方法
CN111168503A (zh) * 2020-01-17 2020-05-19 三峡大学 一种刚度可调的打磨装置及使用方法
CN113977453B (zh) * 2021-11-08 2023-01-13 万华化学集团电子材料有限公司 提高抛光平坦度的化学机械抛光垫及其应用
CN113977453A (zh) * 2021-11-08 2022-01-28 万华化学集团电子材料有限公司 提高抛光平坦度的化学机械抛光垫及其应用
CN117655911A (zh) * 2024-01-04 2024-03-08 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法
CN117655911B (zh) * 2024-01-04 2025-04-15 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法

Also Published As

Publication number Publication date
TW201143984A (en) 2011-12-16
WO2011082156A2 (en) 2011-07-07
SG181889A1 (en) 2012-07-30
US20130102231A1 (en) 2013-04-25
JP2013516328A (ja) 2013-05-13
KR20120112662A (ko) 2012-10-11
WO2011082156A3 (en) 2011-11-17
JP5671554B2 (ja) 2015-02-18

Similar Documents

Publication Publication Date Title
CN102686361A (zh) 填充有机颗粒的抛光垫及其制造和使用方法
TWI552832B (zh) 包含相分離聚合物摻合物之拋光墊及其製造及使用方法
TWI415711B (zh) 具有浮動元件之研磨墊，及其製造與使用方法
TWI396603B (zh) 具多孔元件之研磨墊及其製造及使用方法
CN102770239B (zh) 具有局部区域透明部的化学机械抛光垫
TWI769988B (zh) 拋光墊與系統及其製造與使用方法
KR101729610B1 (ko) 투명한 기초 레이어 위에 구멍 또는 개구를 가지고 있는 폴리싱면 레이어를 가진 폴리싱 패드
JP2018502452A (ja) Ｕｖ硬化性ｃｍｐ研磨パッド及び製造方法
CN1905991A (zh) 研磨垫
WO2016103862A1 (ja) 円形研磨パッド及び半導体デバイスの製造方法
JP2002059357A (ja) 研磨パッドおよび研磨装置ならびに研磨方法
JP2002075932A (ja) 研磨パッドおよび研磨装置ならびに研磨方法
TWI821561B (zh) 具有紋理化之平板黏著劑之化學機械研磨墊及貼附彼之方法
JP2003225855A (ja) 研磨用パッド及びそれを用いた被研磨物の研磨方法
HK1089127A (en) Polishing pad with a window
JP2015104768A (ja) 研磨パッド

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120919