TW201143984A - Organic particulate loaded polishing pads and method of making and using the same - Google Patents
Organic particulate loaded polishing pads and method of making and using the same Download PDFInfo
- Publication number
- TW201143984A TW201143984A TW099146709A TW99146709A TW201143984A TW 201143984 A TW201143984 A TW 201143984A TW 099146709 A TW099146709 A TW 099146709A TW 99146709 A TW99146709 A TW 99146709A TW 201143984 A TW201143984 A TW 201143984A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- elements
- polishing pad
- pad
- layer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 777
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000203 mixture Substances 0.000 claims abstract description 111
- 238000009826 distribution Methods 0.000 claims abstract description 69
- 229920000642 polymer Polymers 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 64
- 238000007517 polishing process Methods 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 240
- 239000000945 filler Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 46
- -1 polyethylene Polymers 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 238000001746 injection moulding Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 239000006260 foam Substances 0.000 claims description 18
- 239000011148 porous material Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 13
- 229920001169 thermoplastic Polymers 0.000 claims description 13
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 13
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000011146 organic particle Substances 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 10
- 238000001125 extrusion Methods 0.000 claims description 10
- 229920000573 polyethylene Polymers 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 238000001723 curing Methods 0.000 claims description 9
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 9
- 239000005060 rubber Substances 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 8
- 238000000748 compression moulding Methods 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 7
- 229920000768 polyamine Polymers 0.000 claims description 7
- 239000004416 thermosoftening plastic Substances 0.000 claims description 7
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 6
- 229920002125 Sokalan® Polymers 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000004584 polyacrylic acid Substances 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 238000005187 foaming Methods 0.000 claims description 4
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 238000010107 reaction injection moulding Methods 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 244000043261 Hevea brasiliensis Species 0.000 claims description 3
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000004005 microsphere Substances 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 229920003052 natural elastomer Polymers 0.000 claims description 3
- 229920001194 natural rubber Polymers 0.000 claims description 3
- 229920002959 polymer blend Polymers 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 239000000052 vinegar Substances 0.000 claims description 3
- 235000021419 vinegar Nutrition 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 229920003169 water-soluble polymer Polymers 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 229920001083 polybutene Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 238000013007 heat curing Methods 0.000 claims 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 claims 1
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229920002857 polybutadiene Polymers 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 26
- 239000002002 slurry Substances 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- 239000012530 fluid Substances 0.000 description 17
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- 230000008569 process Effects 0.000 description 14
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- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000005266 casting Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- RYECOJGRJDOGPP-UHFFFAOYSA-N Ethylurea Chemical compound CCNC(N)=O RYECOJGRJDOGPP-UHFFFAOYSA-N 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 210000003298 dental enamel Anatomy 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 2
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 230000008021 deposition Effects 0.000 description 2
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- 230000002708 enhancing effect Effects 0.000 description 2
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- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001739 rebound effect Effects 0.000 description 2
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- 241000283690 Bos taurus Species 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 244000301850 Cupressus sempervirens Species 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229920001944 Plastisol Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
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- 239000011231 conductive filler Substances 0.000 description 1
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- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
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- 150000004702 methyl esters Chemical class 0.000 description 1
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- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000004999 plastisol Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000012704 polymeric precursor Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29118209P | 2009-12-30 | 2009-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201143984A true TW201143984A (en) | 2011-12-16 |
Family
ID=44227136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099146709A TW201143984A (en) | 2009-12-30 | 2010-12-29 | Organic particulate loaded polishing pads and method of making and using the same |
Country Status (7)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743156B (zh) * | 2016-08-04 | 2021-10-21 | 美商羅門哈斯電子材料Ｃｍｐ控股公司 | 低缺陷多孔拋光墊 |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110033277A (ko) * | 2008-07-18 | 2011-03-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 플로팅 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법과 이용 방법 |
| JP6196773B2 (ja) * | 2012-12-28 | 2017-09-13 | ニッタ・ハース株式会社 | 研磨パッド |
| CN103223643B (zh) * | 2013-05-03 | 2015-10-28 | 鲁启华 | 一种超薄刀片 |
| EP2859997B1 (en) | 2013-10-08 | 2015-09-30 | Valentini, Guido | Method for manufacturing a polishing pad and polishing pad |
| CN106132630B (zh) * | 2014-04-03 | 2019-11-26 | 3M创新有限公司 | 抛光垫和系统以及制造和使用此类抛光垫和系统的方法 |
| EP3043960B1 (en) * | 2014-05-01 | 2018-06-06 | 3M Innovative Properties Company | Flexible abrasive article and method of using the same |
| JP6574244B2 (ja) * | 2014-05-07 | 2019-09-11 | キャボット マイクロエレクトロニクス コーポレイション | Ｃｍｐ用の多層研磨パッド |
| JP6426403B2 (ja) * | 2014-08-27 | 2018-11-21 | 株式会社フジミインコーポレーテッド | 研磨方法 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| SG10202002601QA (en) | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| KR101600393B1 (ko) * | 2015-05-20 | 2016-03-07 | 에프엔에스테크 주식회사 | 연마 패드 및 이의 제조 방법 |
| EP3362224B1 (en) * | 2015-10-16 | 2024-08-14 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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2010
- 2010-12-28 WO PCT/US2010/062205 patent/WO2011082156A2/en active Application Filing
- 2010-12-28 KR KR1020127019846A patent/KR20120112662A/ko not_active Ceased
- 2010-12-28 JP JP2012547232A patent/JP5671554B2/ja not_active Expired - Fee Related
- 2010-12-28 SG SG2012046538A patent/SG181889A1/en unknown
- 2010-12-28 US US13/517,367 patent/US20130102231A1/en not_active Abandoned
- 2010-12-28 CN CN201080060309XA patent/CN102686361A/zh active Pending
- 2010-12-29 TW TW099146709A patent/TW201143984A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743156B (zh) * | 2016-08-04 | 2021-10-21 | 美商羅門哈斯電子材料Ｃｍｐ控股公司 | 低缺陷多孔拋光墊 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5671554B2 (ja) | 2015-02-18 |
| WO2011082156A3 (en) | 2011-11-17 |
| WO2011082156A2 (en) | 2011-07-07 |
| SG181889A1 (en) | 2012-07-30 |
| KR20120112662A (ko) | 2012-10-11 |
| US20130102231A1 (en) | 2013-04-25 |
| JP2013516328A (ja) | 2013-05-13 |
| CN102686361A (zh) | 2012-09-19 |
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