KR20120112662A - 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 - Google Patents

유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 Download PDF

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Publication number
KR20120112662A
KR20120112662A KR1020127019846A KR20127019846A KR20120112662A KR 20120112662 A KR20120112662 A KR 20120112662A KR 1020127019846 A KR1020127019846 A KR 1020127019846A KR 20127019846 A KR20127019846 A KR 20127019846A KR 20120112662 A KR20120112662 A KR 20120112662A
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KR
South Korea
Prior art keywords
polishing
polishing pad
elements
pad
major face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127019846A
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English (en)
Korean (ko)
Inventor
윌리암 디 조셉
브라이언 디 고어스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20120112662A publication Critical patent/KR20120112662A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127019846A 2009-12-30 2010-12-28 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법 Ceased KR20120112662A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29118209P 2009-12-30 2009-12-30
US61/291,182 2009-12-30

Publications (1)

Publication Number Publication Date
KR20120112662A true KR20120112662A (ko) 2012-10-11

Family

ID=44227136

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019846A Ceased KR20120112662A (ko) 2009-12-30 2010-12-28 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법

Country Status (7)

Country Link
US (1) US20130102231A1 (enrdf_load_stackoverflow)
JP (1) JP5671554B2 (enrdf_load_stackoverflow)
KR (1) KR20120112662A (enrdf_load_stackoverflow)
CN (1) CN102686361A (enrdf_load_stackoverflow)
SG (1) SG181889A1 (enrdf_load_stackoverflow)
TW (1) TW201143984A (enrdf_load_stackoverflow)
WO (1) WO2011082156A2 (enrdf_load_stackoverflow)

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KR20230134719A (ko) * 2022-03-15 2023-09-22 한국생산기술연구원 수직 방향 홈을 갖는 돌출 패턴을 포함하는 연마 패드, 그 제조 방법 및 연마 장치

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110033277A (ko) * 2008-07-18 2011-03-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 플로팅 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법과 이용 방법
JP6196773B2 (ja) * 2012-12-28 2017-09-13 ニッタ・ハース株式会社 研磨パッド
CN103223643B (zh) * 2013-05-03 2015-10-28 鲁启华 一种超薄刀片
EP2859997B1 (en) 2013-10-08 2015-09-30 Valentini, Guido Method for manufacturing a polishing pad and polishing pad
CN106132630B (zh) * 2014-04-03 2019-11-26 3M创新有限公司 抛光垫和系统以及制造和使用此类抛光垫和系统的方法
EP3043960B1 (en) * 2014-05-01 2018-06-06 3M Innovative Properties Company Flexible abrasive article and method of using the same
JP6574244B2 (ja) * 2014-05-07 2019-09-11 キャボット マイクロエレクトロニクス コーポレイション Ｃｍｐ用の多層研磨パッド
JP6426403B2 (ja) * 2014-08-27 2018-11-21 株式会社フジミインコーポレーテッド 研磨方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
EP3362224B1 (en) * 2015-10-16 2024-08-14 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
CN106272034A (zh) * 2016-08-10 2017-01-04 盐城工学院 一种用于加工软脆性晶体材料的研磨垫及其制备方法
MY186275A (en) * 2016-08-23 2021-07-02 Shinetsu Chemical Co Method for producing substrate
JP6887016B2 (ja) * 2017-06-01 2021-06-16 東京エレクトロン株式会社 ゲッタリング層形成装置、ゲッタリング層形成方法及びコンピュータ記憶媒体
CN107344336B (zh) * 2017-07-24 2023-04-11 东莞金太阳研磨股份有限公司 一种复合基材抛光磨具及其制备方法
CN107433525B (zh) * 2017-07-24 2023-05-02 东莞金太阳研磨股份有限公司 用于抛光磨具的双层高分子复合基材及其制备方法
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
JP7420728B2 (ja) * 2018-09-28 2024-01-23 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11411925B2 (en) 2019-12-31 2022-08-09 Oracle International Corporation Methods, systems, and computer readable media for implementing indirect general packet radio service (GPRS) tunneling protocol (GTP) firewall filtering using diameter agent and signal transfer point (STP)
CN111168503B (zh) * 2020-01-17 2021-02-19 三峡大学 一种刚度可调的打磨装置及使用方法
WO2021216112A1 (en) * 2020-04-21 2021-10-28 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
CN111531479A (zh) * 2020-06-16 2020-08-14 湖南劳动人事职业学院 一种角度可控多孔贴片砂轮及其制造方法
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11553342B2 (en) 2020-07-14 2023-01-10 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming security attacks using security edge protection proxy (SEPP)
US11751056B2 (en) 2020-08-31 2023-09-05 Oracle International Corporation Methods, systems, and computer readable media for 5G user equipment (UE) historical mobility tracking and security screening using mobility patterns
US11832172B2 (en) 2020-09-25 2023-11-28 Oracle International Corporation Methods, systems, and computer readable media for mitigating spoofing attacks on security edge protection proxy (SEPP) inter-public land mobile network (inter-PLMN) forwarding interface
US11825310B2 (en) 2020-09-25 2023-11-21 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming spoofing attacks
US11622255B2 (en) 2020-10-21 2023-04-04 Oracle International Corporation Methods, systems, and computer readable media for validating a session management function (SMF) registration request
US11528251B2 (en) 2020-11-06 2022-12-13 Oracle International Corporation Methods, systems, and computer readable media for ingress message rate limiting
US11770694B2 (en) 2020-11-16 2023-09-26 Oracle International Corporation Methods, systems, and computer readable media for validating location update messages
US11818570B2 (en) 2020-12-15 2023-11-14 Oracle International Corporation Methods, systems, and computer readable media for message validation in fifth generation (5G) communications networks
US11812271B2 (en) 2020-12-17 2023-11-07 Oracle International Corporation Methods, systems, and computer readable media for mitigating 5G roaming attacks for internet of things (IoT) devices based on expected user equipment (UE) behavior patterns
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11700510B2 (en) 2021-02-12 2023-07-11 Oracle International Corporation Methods, systems, and computer readable media for short message delivery status report validation
US11516671B2 (en) 2021-02-25 2022-11-29 Oracle International Corporation Methods, systems, and computer readable media for mitigating location tracking and denial of service (DoS) attacks that utilize access and mobility management function (AMF) location service
US11689912B2 (en) 2021-05-12 2023-06-27 Oracle International Corporation Methods, systems, and computer readable media for conducting a velocity check for outbound subscribers roaming to neighboring countries
US20230114941A1 (en) * 2021-09-29 2023-04-13 Entegris, Inc. Double-sided pad conditioner
CN113977453B (zh) * 2021-11-08 2023-01-13 万华化学集团电子材料有限公司 提高抛光平坦度的化学机械抛光垫及其应用
CN117655911B (zh) * 2024-01-04 2025-04-15 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578098A (en) * 1990-10-09 1996-11-26 Minnesota Mining And Manufacturing Company Coated abrasive containing erodible agglomerates
US6099954A (en) * 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
JP2000301450A (ja) * 1999-04-19 2000-10-31 Rohm Co Ltd Ｃｍｐ研磨パッドおよびそれを用いたｃｍｐ処理装置
JP3615134B2 (ja) * 2000-08-24 2005-01-26 三共理化学株式会社 研磨材
US6645624B2 (en) * 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
JP3762943B2 (ja) * 2001-04-17 2006-04-05 株式会社ユニバーサルエアー サスペンション
JP2003136397A (ja) * 2001-11-01 2003-05-14 Roki Techno Co Ltd 研磨パッド
US7160173B2 (en) * 2002-04-03 2007-01-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
WO2006057714A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
CN101137463A (zh) * 2005-05-16 2008-03-05 宋健民 超硬切割装置及其制造方法
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
JP2008290197A (ja) * 2007-05-25 2008-12-04 Nihon Micro Coating Co Ltd 研磨パッド及び方法
US8066555B2 (en) * 2007-09-03 2011-11-29 Semiquest Inc. Polishing pad
KR101281076B1 (ko) * 2008-05-15 2013-07-09 세미퀘스트, 인코포레이티드 종결점 윈도우를 구비하는 연마 패드와, 이 연마 패드를 이용하는 시스템 및 방법
US8821214B2 (en) * 2008-06-26 2014-09-02 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230092626A (ko) * 2021-12-17 2023-06-26 케이피엑스케미칼 주식회사 균일하게 분포된 액상 포어를 포함하는 연마 패드 및 이의 제조방법
KR20230134719A (ko) * 2022-03-15 2023-09-22 한국생산기술연구원 수직 방향 홈을 갖는 돌출 패턴을 포함하는 연마 패드, 그 제조 방법 및 연마 장치

Also Published As

Publication number Publication date
JP5671554B2 (ja) 2015-02-18
WO2011082156A3 (en) 2011-11-17
WO2011082156A2 (en) 2011-07-07
SG181889A1 (en) 2012-07-30
TW201143984A (en) 2011-12-16
US20130102231A1 (en) 2013-04-25
JP2013516328A (ja) 2013-05-13
CN102686361A (zh) 2012-09-19

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