TW201116184A - Printed circuit board and manufacturing method thereof - Google Patents

Printed circuit board and manufacturing method thereof Download PDF

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Publication number
TW201116184A
TW201116184A TW098145375A TW98145375A TW201116184A TW 201116184 A TW201116184 A TW 201116184A TW 098145375 A TW098145375 A TW 098145375A TW 98145375 A TW98145375 A TW 98145375A TW 201116184 A TW201116184 A TW 201116184A
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Taiwan
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layer
insulating layer
via hole
primer resin
resin layer
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TW098145375A
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English (en)
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TWI387423B (zh
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Jae-Seok Lee
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Samsung Electro Mech
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09509Blind vias, i.e. vias having one side closed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/054Continuous temporary metal layer over resist, e.g. for selective electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0571Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0574Stacked resist layers used for different processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/421Blind plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

201116184 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種印刷電路板及其製造方法。 【先前技術】 隨著近來對於具有一電鍵元件(electro_device)之高密 度多功能組件板的趨勢’增加了在基板上形成高密度電 路圖案的需求。 根據相關的技術,電路圖案係形成於絕緣層之表面上。 然而’由於該結構並不適用於高密度電路圖案,因此引 入了一種將電路圖案埋入絕緣層内的技術。根據該技 術,準備一載體,以及一電路圖案形成於該載體上。然 後’電路圖案轉移至一絕緣樹脂上。 在此處,由於一金屬阻障層經插入載體及電路圖案之 間’使得製造程序的簡化受到了限制,此限制係由於在 轉移電路圖案至絕緣樹脂時,需同時㈣金屬阻障層。 除此之外,在絕緣樹脂内處理一孔洞以形成作為層間連 結的介層孔之前’-部分的金屬阻障層需被開啟。在此 情形下,層間精度會由於開啟一邱八 思 wj驭邵分的金屬阻障層的製 程而劣化。 【發明内容】 201116184 本發明之一態樣提供了一種製造印刷電路板的方法’ 此方法可包括:準備一载體,其包括一形成於其上之底 漆樹脂層;形成一電路圖案於底漆樹脂層上;堆疊載體 於絕緣層上使得電路圖案埋入絕緣層内;移除載體;在 絕緣層内形成一介層孔,其中該底漆樹脂層堆疊於該絕 緣層上;及在介層孔内形成一導電介層孔。此導電介層 孔之形成,藉由在介層孔内和底漆樹脂層上形成一電鍍 層,然後再去除電鍍層形成於底漆樹脂層上之部分。 該載體可由金屬所構成,而該介層孔可為一盲介層孔 (BVH)。 該介層孔之形成可藉由自底漆樹脂層方向執行雷射處 理。 本發明之另-態樣提供一印刷電路板。該印刷電路板 可υ括、’’邑緣層,包括埋入絕緣層兩側内之電路圖案、 介層孔以電氣連接絕緣層的兩側、堆疊於絕緣層的一 側上之底漆樹脂層、及覆蓋於底漆樹脂層上之一焊料光 阻層。 該介層孔可為盲介層孔(3乂扣。 【實施方式】 施 由於本發明容許各種的改變及眾多的實施例特定實 例將說明於圖示内及詳述於發明内容中、然而,此舉 201116184 並非意圖使本發明受限於特定的實施方* ^ 乃氕,當所有的改 變、等效物、及取代實施例並不違背本發明之精神及技 術領域將被涵蓋於本發明之内。在本發明的敘述中,相 關技術之部分細節描述若被認為會非必要地混淆了發明 的本質則被省略。 根據本發明之某實施例的一印刷電路板及其製造方 法’將參照伴隨的圖示敘述於下。若組成相同或相似則 不論圖式的號碼而給予相同的元件符號,及省略冗長的 敘述。 第1圖係根據本發明之一實施例以流程圖說明一印刷 電路板製造方法,而第2圖到第14圖為根據本發明之一 實施例用於說明一印刷電路板之製造方法的製程。第2 圖到第14圖績示一支樓構件1〇、一載體2〇、一底漆樹 月曰層30、一金屬箔4〇、一電鍍光阻42 '電路圖案44, 62、一絕緣層 50、 一介層孔 52、電鍍金屬(Plated
Metal) 56、 一導電介層孔58、及一内部基板 60 〇 首先,準備一載體2〇包括一底漆樹脂層3〇 (步驟 11〇),和形成一電路圖案44於底漆樹脂層3〇上(步驟 1 2〇)此步鄉如第2圖所示,其結構按照次序地包括:載 體2〇、底漆樹脂層30、和金屬箔40在支撐構件10的兩 側在此處,支樓構件1 〇的組成,舉例來說,可為一熱 塑性材料,即其黏著力可在加熱支撐構件10時降低。堆 201116184 疊於支撐構件10兩側之載體20也將隨之從支撐構件1〇 上刀離。金屬箔40可由銅或其他導電金屬所製成。 接者如第3圖所示,在金屬箔4〇上之形成一圖案化的 電锻光阻42,及藉由電錢製程所形成之電路圖案44。在 由於在底漆光阻層3〇上形成的金屬箔4〇可作為 種曰曰層,因此可進行電鍍製程製造電路圖案44。接著去 除電鍍光阻42,以使在金屬羯4〇上形成一有著凸起形狀 (Protruding Shape)的電路圖案 44。 接者如第5圖所示,堆疊於支撐構件1〇上之載體2〇 自支撐構# 1G分離。在此之前,可先在電路圖案44上 進行表面處理,以確保在電路圖帛44及絕緣I 5〇之間 有著足夠的黏著力。當利用閃光钱刻(flash 等方 式進行表面處理,可在電路圖案44上形成粗糙度,進而 增加了電路圖t 44和絕緣層50之間的黏著力。在此製 程中在底漆樹知層30上之金屬箔40暴露的部分可被 去除。 接著如第6圖和第7圖所示,堆疊载體2〇於絕緣層5〇 上,以及將電路圖案44埋入絕緣層5〇内(步驟13〇)。 因為底漆樹脂層30和電路圖案44形成於載體2〇之表面 上’當載體20堆疊於絕緣層50上時,電路圖案44可埋 入絕緣層50之内。在此處,絕緣層5〇可能處於B_階段’ 即半硬化階段。在此情形下,電路圖案44可容易地埋入 201116184 絕緣層50之内。接著,當絕緣層50硬化時,可於電路 圖案44和絕緣層50之間獲得固態接合強度(Solid bonding strength) 〇 在此同時,如第6圖所示’一内部基板62堆疊於絕緣 層50的下表面β 一電路圖案62形成於内部基板62的表 面上’且以互相堆疊的方式埋入絕緣層50内。 當需要一雙層基板時,從支撐構件10分離出的兩個載 體20則分別壓合於絕緣層50的上側及下側,如第μ圖 所示。在此情形下,電路圖案44則可於同一製程下同時 埋入絕緣層5 0的兩侧。 接著如第8圖所示,載體20被移除(步驟140;^當載 體20為金屬所製成,則可利用蝕刻劑藉由濕式蝕刻製程 將載體20去除》在此種情況下,由於埋入絕緣層的 電路圖案44的上表面被底漆樹脂層30所覆蓋,電路圖 案44不會受到用來去除載體2〇的蝕刻劑所破壞。 接著如第9圖所示’介層孔52經處理(步驟150)。以 一種雷射處理介層孔52。在本實施例中,由於電路圖44 被底漆樹脂層30所覆蓋,因此可直接處理介層孔52而 不需處理窗口(window)。再者,當形成於内部基板6〇上 之電路圖案62覆蓋了介層孔52的較低之一面,則該介 層孔52為—盲介層孔(BVH),其介層孔52的深度容易 被控制。 201116184 接著,在介層孔52〜 内形成一介層孔85以用於層間連 結(步驟160),簡述如下。 首先 如第10圖所示,一種晶層54形成於底漆樹脂 層30上和介層多丨气, 之内壁上。在此處係利用無電電鑛 製程》 」後以電鍍製程將電鍍金屬52填滿於介層孔52内, 如第11圖所千〇七亩,分丄 /、 具滿於介層孔52内之電鑛金屬52可作 為導電介層孔58用於層間連結。該電艘金屬52可為銅 (Cu)或其他適合傳遞電信號之金屬。 接著如第12圖所示,去除形成於底漆樹脂層30之上 、X金屬52。在此處係以银刻劑藉由濕式姓刻法進 行在此匱形下,在絕緣層5〇表面形成之底漆樹脂層 可作為蝕刻停止阻障層(etch_st〇p barrier)。 然後如第13圖所示,在保有底漆光阻層3〇時以防 焊油墨塗佈的方式形成一焊料光阻層7〇。 一印刷電路板以上所提出之製程所製造則繪示於第14 參”R第14圖,根據本實施例之一印刷電路板包括: 一絕緣層50、埋入於絕緣層5〇兩側之電路圖案、以電氣 連接絕緣層50的兩面之一導電介層孔58、堆疊於絕緣層 側上之一底漆樹脂層30、和覆蓋於底漆光阻層3〇 上之一焊料光阻層。 藉由參照上述特定實施例描述了本發明之精神,然應 201116184 注意的是,實施例僅用於說明的意圖而不應視為對本發 明範疇之限制。可鑒於本揭示發展出其他進一步的實施 例’且不會背離本發明之範疇及精神。 因此,其他未提及之實施例則其由如下申請專利範圍 決定的範圍。 【圖式簡單說明】 第1圖係一根據本發明一實施例之流程圖,其說明一 印刷電路板之製造方法。 第2圖到第14圖係根據本發明一實施例說明一印刷電 路板的製造方法之製轾。 第15圖係說明一製程其兩载體分別壓合於絕緣層之上 側及下側。 【主要元件符號說明】 S110步驟 S120步驟 S130步驟 S140步驟 S150步驟 S160步驟 10支撐構件 20載體 30底漆樹脂層 40金屬箔 42電鍍光阻 44、62電路圖案 10 201116184 50絕緣層 54種晶層 58導電介層孔 70焊料光阻層 52介層孔 56 電鍍金屬(Plated Metal) 60内部基板

Claims (1)

  1. 201116184 七、申請專利範圍: 1. 一種印刷電路板之製造方法,該方法包含以下步驟: 準備一載體’其包括形成於其上之—底漆樹脂層; 形成一電路圖案於該底漆樹脂層上; 堆疊該載體於一絕緣層上使該電路圖案埋入該絕緣層 内; 移除該載體; 在該絕緣層㈣成一介層孔’該底漆肖脂層經堆疊於 該絕緣層上;及 在該介層孔内形成一導電介層孔,該導電介層孔之形 成係藉由形成一電鍍層於該介層孔内及該底漆樹脂層 上,及移除該電鍵層形成於該底漆樹脂層上之部分。 2. 如申請專利範圍第丨項所述之方法,其中該載體係 由金屬所製成。 3. 如申請專利範圍第1項所述之方法,其中形成一介 層孔之該步驟包含以下步驟:自該底漆樹脂層的方向執 行一雷射處理。 4. 如申晴專利範圍第3項所述之方法,其中該介層孔 係一盲介層孔(BVH)。 5. 一種印刷電路板,其包含: 12 201116184 一絕緣層,其包括電路圖案,其中該等電路圖案埋入 絕緣層的兩側; 一介層孔,其以電氣連接該絕緣層的兩側; 一底漆樹脂層,其堆疊於該絕緣層的一側上;及 一焊接光阻層,其覆蓋該底漆光阻層。 6.如申請專利範圍第5項所述之印刷電路板,其中該 介層孔係一盲介層孔。 m 13
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