TWI387423B - 印刷電路板及其製造方法 - Google Patents

印刷電路板及其製造方法 Download PDF

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TWI387423B
TWI387423B TW098145375A TW98145375A TWI387423B TW I387423 B TWI387423 B TW I387423B TW 098145375 A TW098145375 A TW 098145375A TW 98145375 A TW98145375 A TW 98145375A TW I387423 B TWI387423 B TW I387423B
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layer
insulating layer
via hole
primer resin
resin layer
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TW201116184A (en
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Jae-Seok Lee
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Samsung Electro Mech
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

印刷電路板及其製造方法
本發明係有關一種印刷電路板及其製造方法。
隨著近來對於具有一電鍍元件(electro-device)之高密度多功能組件板的趨勢，增加了在基板上形成高密度電路圖案的需求。
根據相關的技術，電路圖案係形成於絕緣層之表面上。然而，由於該結構並不適用於高密度電路圖案，因此引入了一種將電路圖案埋入絕緣層內的技術。根據該技術，準備一載體，以及一電路圖案形成於該載體上。然後，電路圖案轉移至一絕緣樹脂上。
在此處，由於一金屬阻障層經插入載體及電路圖案之間，使得製造程序的簡化受到了限制，此限制係由於在轉移電路圖案至絕緣樹脂時，需同時蝕刻金屬阻障層。除此之外，在絕緣樹脂內處理一孔洞以形成作為層間連結的介層孔之前，一部分的金屬阻障層需被開啟。在此情形下，層間精度會由於開啟一部分的金屬阻障層的製程而劣化。
本發明之一態樣提供了一種製造印刷電路板的方法，此方法可包括：準備一載體，其包括一形成於其上之底漆樹脂層；形成一電路圖案於底漆樹脂層上；堆疊載體於絕緣層上使得電路圖案埋入絕緣層內；移除載體；在絕緣層內形成一介層孔，其中該底漆樹脂層堆疊於該絕緣層上；及在介層孔內形成一導電介層孔。此導電介層孔之形成，藉由在介層孔內和底漆樹脂層上形成一電鍍層，然後再去除電鍍層形成於底漆樹脂層上之部分。
該載體可由金屬所構成，而該介層孔可為一盲介層孔(BVH)。
該介層孔之形成可藉由自底漆樹脂層方向執行雷射處理。
本發明之另一態樣提供一印刷電路板。該印刷電路板可包括：一絕緣層，包括埋入絕緣層兩側內之電路圖案、一介層孔以電氣連接絕緣層的兩側、堆疊於絕緣層的一側上之底漆樹脂層、及覆蓋於底漆樹脂層上之一焊料光阻層。
該介層孔可為盲介層孔(BVH)。
由於本發明容許各種的改變及眾多的實施例，特定實施例將說明於圖示內及詳述於發明內容中。然而，此舉並非意圖使本發明受限於特定的實施方式，當所有的改變、等效物、及取代實施例並不違背本發明之精神及技術領域將被涵蓋於本發明之內。在本發明的敘述中，相關技術之部分細節描述若被認為會非必要地混淆了發明的本質則被省略。
根據本發明之某實施例的一印刷電路板及其製造方法，將參照伴隨的圖示敘述於下。若組成相同或相似則不論圖式的號碼而給予相同的元件符號，及省略冗長的敘述。
第1圖係根據本發明之一實施例以流程圖說明一印刷電路板製造方法，而第2圖到第14圖為根據本發明之一實施例用於說明一印刷電路板之製造方法的製程。第2圖到第14圖繪示一支撐構件10、一載體20、一底漆樹脂層30、一金屬箔40、一電鍍光阻42、電路圖案44，62、一絕緣層50、一介層孔52、電鍍金屬(Plated Metal) 56、一導電介層孔58、及一內部基板60。
首先，準備一載體20包括一底漆樹脂層30(步驟110)，和形成一電路圖案44於底漆樹脂層30上(步驟120)。此步驟如第2圖所示，其結構按照次序地包括：載體20、底漆樹脂層30、和金屬箔40在支撐構件10的兩側。在此處，支撐構件10的組成，舉例來說，可為一熱塑性材料，即其黏著力可在加熱支撐構件10時降低。堆疊於支撐構件10兩側之載體20也將隨之從支撐構件10上分離。金屬箔40可由銅或其他導電金屬所製成。
接著如第3圖所示，在金屬箔40上之形成一圖案化的電鍍光阻42，及藉由電鍍製程所形成之電路圖案44。在此處，由於在底漆光阻層30上形成的金屬箔40可作為種晶層，因此可進行電鍍製程製造電路圖案44。接著去除電鍍光阻42，以使在金屬箔40上形成一有著凸起形狀(Protruding Shape)的電路圖案44。
接著如第5圖所示，堆疊於支撐構件10上之載體20自支撐構件10分離。在此之前，可先在電路圖案44上進行表面處理，以確保在電路圖案44及絕緣層50之間有著足夠的黏著力。當利用閃光蝕刻(flash etching)等方式進行表面處理，可在電路圖案44上形成粗糙度，進而增加了電路圖案44和絕緣層50之間的黏著力。在此製程中，在底漆樹脂層30上之金屬箔40暴露的部分可被去除。
接著如第6圖和第7圖所示，堆疊載體20於絕緣層50上，以及將電路圖案44埋入絕緣層50內(步驟130)。因為底漆樹脂層30和電路圖案44形成於載體20之表面上，當載體20堆疊於絕緣層50上時，電路圖案44可埋入絕緣層50之內。在此處，絕緣層50可能處於B-階段，即半硬化階段。在此情形下，電路圖案44可容易地埋入絕緣層50之內。接著，當絕緣層50硬化時，可於電路圖案44和絕緣層50之間獲得固態接合強度(Solid bonding strength)。
在此同時，如第6圖所示，一內部基板60堆疊於絕緣層50的下表面。一電路圖案62形成於內部基板60的表面上，且以互相堆疊的方式埋入絕緣層50內。
當需要一雙層基板時，從支撐構件10分離出的兩個載體20則分別壓合於絕緣層50的上側及下側，如第15圖所示。在此情形下，電路圖案44則可於同一製程下同時埋入絕緣層50的兩側。
接著如第8圖所示，載體20被移除(步驟140)。當載體20為金屬所製成，則可利用蝕刻劑藉由濕式蝕刻製程將載體20去除。在此種情況下，由於埋入絕緣層50的電路圖案44的上表面被底漆樹脂層30所覆蓋，電路圖案44不會受到用來去除載體20的蝕刻劑所破壞。
接著如第9圖所示，介層孔52經處理(步驟150)。以一種雷射處理介層孔52。在本實施例中，由於電路圖44被底漆樹脂層30所覆蓋，因此可直接處理介層孔52而不需處理窗口(window)。再者，當形成於內部基板60上之電路圖案62覆蓋了介層孔52的較低之一面，則該介層孔52為一盲介層孔(BVH)，其介層孔52的深度容易被控制。
接著，在介層孔52內形成一介層孔58以用於層間連結(步驟160)，簡述如下。
首先，如第10圖所示，一種晶層54形成於底漆樹脂層30上和介層孔52之內壁上。在此處係利用無電電鍍製程。
接著，以電鍍製程將電鍍金屬56填滿於介層孔52內，如第11圖所示。填滿於介層孔52內之電鍍金屬56可作為導電介層孔58用於層間連結。該電鍍金屬56可為銅(Cu)或其他適合傳遞電信號之金屬。
接著如第12圖所示，去除形成於底漆樹脂層30之上的電鍍金屬56。在此處係以蝕刻劑藉由濕式蝕刻法進行。在此情形下，在絕緣層50表面形成之底漆樹脂層30可作為蝕刻停止阻障層(etch-stop barrier)。
接著如第13圖所示，在保有底漆光阻層30時，以防焊油墨塗佈的方式形成一焊料光阻層70。且隨後，如第14圖中所示，形成一開口區域72使得電路圖案44的一部分可充當為連接其他裝置的襯墊。可使用雷射製程方法來形成開口區域72。
一印刷電路板以上所提出之製程所製造則繪示於第14圖。參照第14圖，根據本實施例之一印刷電路板包括：一絕緣層50、埋入於絕緣層50兩側之電路圖案、以電氣連接絕緣層50的兩面之一導電介層孔58、堆疊於絕緣層 50一側上之一底漆樹脂層30、和覆蓋於底漆光阻層30上之一焊料光阻層。
藉由參照上述特定實施例描述了本發明之精神，然應注意的是，實施例僅用於說明的意圖而不應視為對本發明範疇之限制。可鑒於本揭示發展出其他進一步的實施例，且不會背離本發明之範疇及精神。
因此，其他未提及之實施例則其由如下申請專利範圍決定的範圍。
S110‧‧‧步驟
S120‧‧‧步驟
S130‧‧‧步驟
S140‧‧‧步驟
S150‧‧‧步驟
S160‧‧‧步驟
10‧‧‧支撐構件
20‧‧‧載體
30‧‧‧底漆樹脂層
40‧‧‧金屬箔
42‧‧‧電鍍光阻
44、62‧‧‧電路圖案
50‧‧‧絕緣層
52‧‧‧介層孔
54‧‧‧種晶層
56‧‧‧電鍍金屬(Plated Metal)
58‧‧‧導電介層孔
60‧‧‧內部基板
70‧‧‧焊料光阻層
72‧‧‧開口區域
第1圖係一根據本發明一實施例之流程圖，其說明一印刷電路板之製造方法。
第2圖到第14圖係根據本發明一實施例說明一印刷電路板的製造方法之製程。
第15圖係說明一製程其兩載體分別壓合於絕緣層之上側及下側。
S110．．．步驟
S120．．．步驟
S130．．．步驟
S140．．．步驟
S150．．．步驟
S160．．．步驟

Claims (6)

  1. 一種印刷電路板之製造方法，該方法包含以下步驟：準備一載體，其包括形成於其上之一底漆樹脂層；形成一電路圖案於該底漆樹脂層上；堆疊該載體於一絕緣層上使該電路圖案埋入該絕緣層內；移除該載體；在該絕緣層內形成一介層孔，該底漆樹脂層經堆疊於該絕緣層上；及在該介層孔內形成一導電介層孔，該導電介層孔之形成係藉由形成一電鍍層於該介層孔內及該底漆樹脂層上，及移除該電鍍層形成於該底漆樹脂層上之部分。
  2. 如申請專利範圍第1項所述之方法，其中該載體係由金屬所製成。
  3. 如申請專利範圍第1項所述之方法，其中形成一介層孔之該步驟包含以下步驟：自該底漆樹脂層的方向執行一雷射處理。
  4. 如申請專利範圍第3項所述之方法，其中該介層孔係一盲介層孔(BVH)。
  5. 一種印刷電路板，其包含：一絕緣層，其包括電路圖案，其中該等電路圖案埋入絕緣層的兩側；一介層孔，其以電氣連接該絕緣層的兩側；一底漆樹脂層，其堆疊於該絕緣層的一側上；及一焊接光阻層，其覆蓋該底漆光阻層。
  6. 如申請專利範圍第5項所述之印刷電路板，其中該介層孔係一盲介層孔。
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TWI517775B (zh) * 2014-03-06 2016-01-11 相互股份有限公司 印刷電路板及其製法
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