TW200945531A - Leadframe for packaged electronic device with enhanced mold locking capability - Google Patents

Leadframe for packaged electronic device with enhanced mold locking capability Download PDF

Info

Publication number
TW200945531A
TW200945531A TW098105829A TW98105829A TW200945531A TW 200945531 A TW200945531 A TW 200945531A TW 098105829 A TW098105829 A TW 098105829A TW 98105829 A TW98105829 A TW 98105829A TW 200945531 A TW200945531 A TW 200945531A
Authority
TW
Taiwan
Prior art keywords
die pad
grooves
lead frame
extends
sidewall
Prior art date
Application number
TW098105829A
Other languages
English (en)
Chinese (zh)
Inventor
Stephen R Hooper
James D Macdonald
Russell S Shumway
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200945531A publication Critical patent/TW200945531A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW098105829A 2008-04-08 2009-02-24 Leadframe for packaged electronic device with enhanced mold locking capability TW200945531A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/099,446 US7834431B2 (en) 2008-04-08 2008-04-08 Leadframe for packaged electronic device with enhanced mold locking capability

Publications (1)

Publication Number Publication Date
TW200945531A true TW200945531A (en) 2009-11-01

Family

ID=41132492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098105829A TW200945531A (en) 2008-04-08 2009-02-24 Leadframe for packaged electronic device with enhanced mold locking capability

Country Status (4)

Country Link
US (1) US7834431B2 (https=)
JP (1) JP5300158B2 (https=)
TW (1) TW200945531A (https=)
WO (1) WO2009126367A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8120152B2 (en) 2008-03-14 2012-02-21 Advanced Semiconductor Engineering, Inc. Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof
CN102522375B (zh) * 2008-07-30 2015-04-08 三洋电机株式会社 半导体装置、半导体装置的制造方法及引线框
US8124447B2 (en) 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101882609A (zh) * 2009-05-08 2010-11-10 飞思卡尔半导体公司 用于半导体封装体的引线框
US8742555B2 (en) 2011-08-30 2014-06-03 Jian Wen Lead frame having a flag with in-plane and out-of-plane mold locking features
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
US9013028B2 (en) * 2013-01-04 2015-04-21 Texas Instruments Incorporated Integrated circuit package and method of making
US9515009B2 (en) 2015-01-08 2016-12-06 Texas Instruments Incorporated Packaged semiconductor device having leadframe features preventing delamination
CN106129035B (zh) 2015-05-05 2021-01-29 恩智浦美国有限公司 具有模制锁定的露出焊盘式集成电路封装件
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
JP6430422B2 (ja) 2016-02-29 2018-11-28 株式会社東芝 半導体装置
US10998255B2 (en) 2018-07-12 2021-05-04 Nxp Usa, Inc. Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US11901309B2 (en) 2019-11-12 2024-02-13 Semiconductor Components Industries, Llc Semiconductor device package assemblies with direct leadframe attachment
TWI784474B (zh) * 2021-04-12 2022-11-21 順德工業股份有限公司 導線架料片及其導線架
JP2022190980A (ja) * 2021-06-15 2022-12-27 富士電機株式会社 半導体装置
US20230031682A1 (en) * 2021-07-28 2023-02-02 Stmicroelectronics S.R.L. Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor device
IT202100021638A1 (it) 2021-08-10 2023-02-10 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore, dispositivo a semiconduttore e assortimento di dispositivi a semiconduttore corrispondenti
CN115360192A (zh) * 2022-09-15 2022-11-18 华天科技（西安）有限公司 一种通信射频产品引线框架的结构及其制备方法
JPWO2024247688A1 (https=) * 2023-06-02 2024-12-05

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126820A (en) * 1985-02-01 1992-06-30 Advanced Micro Devices, Inc. Thermal expansion compensated metal lead frame for integrated circuit package
JPH0685132A (ja) * 1992-09-07 1994-03-25 Mitsubishi Electric Corp 半導体装置
JPH08172145A (ja) * 1994-12-16 1996-07-02 Texas Instr Japan Ltd 半導体装置及び放熱性部品
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
JP2000269401A (ja) * 1999-03-16 2000-09-29 Toshiba Microelectronics Corp 半導体装置
KR100335480B1 (ko) * 1999-08-24 2002-05-04 김덕중 칩 패드가 방열 통로로 사용되는 리드프레임 및 이를 포함하는반도체 패키지
US6847103B1 (en) * 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
JP3706533B2 (ja) * 2000-09-20 2005-10-12 三洋電機株式会社 半導体装置および半導体モジュール
US6661083B2 (en) * 2001-02-27 2003-12-09 Chippac, Inc Plastic semiconductor package
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
US7217599B2 (en) * 2003-06-12 2007-05-15 St Assembly Test Services Ltd. Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
US6984878B2 (en) * 2004-05-24 2006-01-10 Advanced Semiconductor Engineering, Inc. Leadless leadframe with an improved die pad for mold locking
US20080079127A1 (en) * 2006-10-03 2008-04-03 Texas Instruments Incorporated Pin Array No Lead Package and Assembly Method Thereof

Also Published As

Publication number Publication date
JP5300158B2 (ja) 2013-09-25
WO2009126367A1 (en) 2009-10-15
US20090250795A1 (en) 2009-10-08
US7834431B2 (en) 2010-11-16
JP2011517113A (ja) 2011-05-26

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