CN106129035B - 具有模制锁定的露出焊盘式集成电路封装件 - Google Patents

具有模制锁定的露出焊盘式集成电路封装件 Download PDF

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CN106129035B
CN106129035B CN201510371780.5A CN201510371780A CN106129035B CN 106129035 B CN106129035 B CN 106129035B CN 201510371780 A CN201510371780 A CN 201510371780A CN 106129035 B CN106129035 B CN 106129035B
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die pad
trench
integrated circuit
encapsulant
circuit package
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CN106129035A (zh
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高伟
龚志伟
田彦庭
姚晋钟
叶德洪
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NXP USA Inc
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Abstract

本公开涉及具有模制锁定的露出焊盘式集成电路封装件。集成电路封装件具有带有沟槽和沟槽中开口的露出的管芯焊盘，该开口填充有包封剂以形成接近管芯焊盘的边缘的包封剂环。在组装期间，包封剂通过开口并填充沟槽以形成包封剂环。该环有助于阻止由热循环引起的管芯焊盘与包封剂分开。空气出口可包括在管芯焊盘表面中以在沟槽和开口填充有包装剂时允许空气脱离沟槽和开口。在管芯焊盘的芯片侧上可包括从开口到管芯焊盘边缘的沟槽以增强包封剂到管芯焊盘的粘附。

Description

具有模制锁定的露出焊盘式集成电路封装件
技术领域
本发明一般涉及集成电路封装件，以及更具体的，涉及具有形成在管芯焊盘中的模制锁定特征的引线框。
背景技术
通常，以允许电路在较大系统中使用并保护管芯不受环境损坏的方式封装一个或多个集成电路(IC)或“管芯”(die)。通常，引线框用于提供管芯的IO焊盘(pad)与例如印刷电路板(PCB)的外部系统的IO焊盘之间的电互连。因此，引线框包括金属引线(用于将信号耦接进出集成电路封装件)和可能的其它元件(诸如电源条和管芯桨板(paddle)(也被称为管芯焊盘和管芯标记板(flag)))。组装前，引线框可具有支撑结构(例如，金属框和连接条(tie bar))，该支撑结构保持引线和管芯焊盘在适当的位置。在组装过程期间，可去除支撑结构。如这里所使用的，术语“引线框”可用于表示组装前或后的元件的集合，不管是否存在支撑结构。
将管芯上的接合焊盘电连接至引线框的金属引线的接合线在IC封装件内。管芯、管芯焊盘、接合线和引线的一部分被嵌入在非导电的、坚固的和非渗透性的包封剂中，以保护管芯、接合线和互连免受诸如水的环境污染。引线在封装件的外面具有露出部分以允许在例如PCB等上的外部电路和封装的芯片之间的电互连。典型的包封剂是诸如环氧树脂的塑料，而引线框典型地由铜或铜合金制成。接合线通常由金、铝、铜或铜合金制成。
功率集成电路(诸如，电压调节器或功率放大器)具有场效应晶体管(MOSFET)或双极晶体管，其操作来可变地将电流耦接到负载。由于传导电流，晶体管产生热量，加热整个芯片，由此如果芯片的温度变得过高则集成电路可能被损坏。冷却芯片的一种技术是配置包封剂使得管芯焊盘的一侧被露出而另一侧(具有附接到其的芯片的侧)被嵌入包封剂中。这允许管芯焊盘附接到热沉，该热沉从芯片提取热量并将热量传到封装件外。
随着封装的芯片随着时间加热和冷却(热循环)，诸如当芯片被焊接到PCB以及在芯片的正常运行期间，由于模制化合物(塑料)的热膨胀系数(CTE)不同于管芯焊盘(金属)的热膨胀系数，因此包封剂和管芯焊盘可能彼此分开。如果诸如水分的污染沿着这些间隔进入封装件，则可能使封装的器件失效。因此，具有抵抗模制化合物与管芯焊盘分开的封装件设计将是有利的。
附图说明
本发明的实施例通过实例示出并且不受附图限制，其中相似的标记指代相似的元件。出于清楚简要的目的示出附图中的元件，并且其并非按比例绘制。例如，为了清楚起见，层的厚度和区域尺寸可被放大。
图1是根据本发明的多种实施例的示例性集成电路封装件的立体图；
图2是图1所示的集成电路封装件的底部的平面图；
图3是图2所示的管芯焊盘的平面图；
图4和图5是图2所示的封装件的截面侧视图；以及
图6和图7是图2所示的管芯焊盘的可选实施例的平面图。
具体实施方式
这里公开了本发明的详细示例性实施例。然而，这里公开的具体的结构和功能细节仅是代表性的，用于描述本发明的实例实施例的目的。本发明的实施例可以以多种替换形式实施，并不应解释为仅限于这里所阐述的实施例。此外，这里使用的术语仅是用于描述特定实施例，而并不意图限制发明的示例实施例。
本发明的一个实施例是一种产品，其包括：具有第一和第二表面的管芯焊盘，形成在第一表面中的沟槽，以及形成在沟槽中的多个开口。该沟槽接近管芯焊盘的至少一个边缘，并具有与管芯焊盘的所述至少一个边缘基本平行的纵轴。
现在参考图1，示出了用于功率应用(诸如电压调节器、功率放大器或电机控制器等)的八引脚小轮廓集成电路(SOIC)或芯片封装件100的立体图，其中将高电流或电压施加到负载。
封装件100包括诸如硅、砷化镓等半导体材料的集成电路(未示出)，在其中形成晶体管、二极管和有源或无源的其它器件或组件。用于互连集成电路中的组件和外部电路(未示出)的一个或多个金属导体或引线102被耦接到集成电路。在典型的集成电路封装件中，金属引线是由金属(诸如铜)或金属合金形成的常规引线框(未示出)的一部分。引线框用于将其金属部件保持在固定关系直到包封之后。之后对引线框进行切单(singulate)以去除不必要的框元件(例如坝条、连接条等)并将封装件与相邻的同时形成的封装件分离，如所示地留下引线102。应该注意，这里示出的实施例不局限于SOIC封装件，而是可在其它封装类型中实现，诸如(不局限于)四方扁平无引线(QFN)封装、功率四方扁平无引线(PQFN)、四方扁平封装(QFP)、或其它模制封装件，其中露出的焊盘可用于消散由集成电路产生的热量。
在该实施例中，常规集成电路(未示出)被包封在塑料的模制块(在下文中被称为封装件主体104)内，鸥翼状引线102从其突出。由诸如环氧树脂的塑料包封剂形成的封装件主体104保护集成电路免受环境污染，并关于集成电路固定引线102的位置。
在图2中，示出了封装件100的底视图。在封装件100的底部上，露出的金属管芯焊盘206显示为设置在引线102的行之间。这种封装通常被称为露出焊盘式封装，尤其是对于这里示出的实施例称为EP-SOIC。封装件主体104延伸超过管芯焊盘206的边缘，并形成环绕管芯焊盘206的表面208，该表面208基本与管芯焊盘206的露出的表面共面。
如下面将更详细描述的，通过例如常规的导热和导电的环氧树脂、聚酰亚胺或焊料的粘附层(未示出)，将封装件100内的集成电路附接到露出的金属管芯焊盘206。通过导热粘附层将由集成电路产生的热量耦连到露出的金属管芯焊盘206。在封装件100的典型使用中，将引线102和金属管芯焊盘206焊接到基本平面的印刷电路板(未示出)上的导体。与金属管芯焊盘206焊接的导体典型地宽于或厚于焊接到引线102的导体，以对于流出封装件100的热量提供低热阻。因为封装件附接到基本平面的电路板，所以引线102的底部应该与露出的焊盘206大致共面或比露出的焊盘206略高。
在发明的一个实施例中，通过包封剂210的环或“槽”将露出的金属管芯焊盘206固着到封装件主体104，该包封剂210的环或“槽”由用于形成封装件主体104的包封剂材料形成。如将联系图3解释的，在包封剂环210下面是在沟槽(未示出)中的一系列开口(未示出)。沟槽的每一部分具有纵轴，相邻并平行于露出的管芯焊盘206的相应边缘。在它硬化前，来自封装件主体104的塑料包封剂穿过开口并进入沟槽中形成包封剂环210。包封剂环210(与开口中的包封剂(未示出)一起)当硬化时，有助于阻止露出的管芯焊盘206在封装件100的热循环期间与封装件主体104分开。环210中的包封剂可基本填充沟槽(未示出)，但是期望包封剂环210的露出部分不延伸超出或高于管芯焊盘206的露出表面以保持封装件100的平面化。
在图3中，示出在施加封装件主体104的塑料包封剂材料之前的管芯焊盘206。开口310延伸穿过金属管芯焊盘206并设置在环绕管芯焊盘206的外周的沟槽312中。如下面将更详细的描述，在一个实施例中，沟槽312可以被刻蚀到在管芯焊盘206厚度的四分一到四分之三之间的深度。在替换实施例中，沟槽312被冲压到金属管芯焊盘206中。在任一实施例中，沟槽在开口310之间延伸，使得来自封装件主体104的塑料(在硬化前)通过开口310流动，并沿沟槽312展开以将金属管芯焊盘206锁定到封装件主体104。如这里所示，开口310和沟槽312邻近金属管芯焊盘206的边缘，即，相邻但设置为从金属管芯焊盘206边缘后缩。
可选的，沟槽312和开口310可设置为与所述边缘直接相邻，使得金属管芯焊盘206的边缘在沟槽312内。此外，沟槽312和开口310可以不是连续环，而是不连续环或一个或多个线性沟槽，每个沟槽具有基本平行于并接近于管芯焊盘206的边缘的纵轴。此外，沟槽312可以不沿管芯焊盘206的整体外周(即，沿金属管芯焊盘206的所有边缘)或沿边缘的整体长度设置。
每个开口310被示出为方形，但是也可具有不同形状，诸如圆形、椭圆形、矩形、三角形等。可以在一个管芯焊盘206中一起使用不同形状和尺寸的开口310，并且可以在相同沟槽312中根据需要使所述开口310彼此间隔不同距离。如这里所示的，每个开口310是方形的，其具有与其它开口310相同尺寸和沿沟槽312的纵轴测量的宽度。将一个开口310的边缘与相邻开口310的最接近边缘间隔开至少开口的宽度。开口可以通过刻蚀或冲压形成，但是通常使用与用于形成沟槽312相同的工艺形成。此外，开口310通常在沟槽312形成之前形成。
图4和5是图2的封装件100沿相应虚线的截面图，以示出封装件100的内部结构，以及在一个实施例中如何配置开口310和沟槽312。图4中的截面图对应图2中标以“图4”的虚线，以及图5中的截面图对应图2中标以“图5”的虚线。在图4中，芯片412被示出为使用上述粘附层(未示出)附接到管芯焊盘206的一个表面(“芯片侧”表面)。管芯焊盘206的相对表面露出在封装件100的底部上。线接合414将芯片412上的接合焊盘(未示出)连接到引线102。类似的，在图5中，芯片412被示出为附接到管芯焊盘206，但是没有示出至引线102的线接合。
为了更好的示出管芯焊盘206和沟槽312以及其中的开口310的结构，图3所示的管芯焊盘206是沿标为“图4”和“图5”的虚线的截面。图4的截面穿过开口310和沟槽312，而图5的截面仅穿过沟槽312。如图4所示，开口310和沟槽312被示出为填充有来自封装件主体104的塑料包封剂，以形成包封剂环210，而在图5中，未示出开口310并且仅示出沟槽312填充有包封剂以形成包封剂环210。如图4和5所示，包封剂环210的露出表面或“顶部”被示出为与管芯焊盘206的露出表面共面。应该理解，包封剂可以不填充沟槽312，从而使得包封剂环210可以不到达管芯焊盘206的露出表面。
图6示出了可向上述实施例添加的额外特征。这里，沟槽312包括至少一个延伸部612，该延伸部横贯管芯焊盘206的露出表面并从沟槽312延伸到最接近沟槽312的管芯焊盘206的边缘。沟槽延伸部612被示出为接近沟槽的一端以及沟槽612的中部，然而延伸部612的数量和沿沟槽312在哪里设置延伸612依赖于沟槽312的尺寸和形状。虽然延伸部612具有基本等于沟槽312的宽度和深度，但是其也可以浅于或窄于沟槽312。因为管芯焊盘206的露出表面典型地设置在注入模制机器(其用于注入包封剂到芯片412、管芯焊盘206上，注入包封剂到开口310中并沿沟槽312注入包封剂)的平面衬底上，因此延伸部612可用作在用包封剂填充开口310和沟槽312时空气逃离开口310和沟槽312的路径。延伸部612还可用作将管芯焊盘206固着到封装件主体104的额外手段。
图7示出了可添加到上述实施例的另一额外特征。在管芯焊盘206的与安装芯片412相同的侧上，提供设置在管芯焊盘206的表面中的一个或多个沟槽720，每个沟槽720从相应开口310延伸到最接近开口310的管芯焊盘206的边缘。如在管芯焊盘206另一侧上的沟槽312那样，沟槽720典型地被刻蚀到管芯焊盘206的表面中，并具有在管芯焊盘206厚度的四分之一到四分之三之间的深度。通过沟槽720的存在而提供的额外的表面区域可用作用于将管芯焊盘206固着到封装件主体104的额外手段。
应该理解，术语“包括”、“具有”、或“包含”限定所陈述的特征、步骤或组件的存在，但是并不排除一个或多个其它特征、步骤或组件的存在或添加。还应该注意，在一些可选实施方式中，所提到的功能/动作可以不按照附图所示的顺序发生。例如，根据所涉及的功能/动作，相继示出的两个附图实际可能基本同时执行，或者有时可以以相反顺序执行。除非有相反指示，否则术语“或”被解释为包含性的(inclusive)。
尽管这里参考特定实施例描述了本发明，但是可以进行多种修改和变化而不脱离如在下面权利要求中所阐述的本发明的范围。由此，说明书和附图被认为是说明性而不是限制性的意义，并且意图将所有这些修改包括在本发明的范围内。这里就具体实施例所描述的任何好处、有点或解决问题的方案不应被解释为任何或所有权利要求的关键的、所需的或实质性的特征或元素。

Claims (10)

1.一种集成电路封装件，包括：
具有第一表面和第二表面的管芯焊盘，其中：
沟槽形成在所述第一表面中，
所述沟槽具有形成于其中的多个开口；
所述沟槽接近所述管芯焊盘的至少一个边缘；以及
所述沟槽具有基本与所述管芯焊盘的所述至少一个边缘平行的纵轴；
附接到所述管芯焊盘的所述第二表面的集成电路管芯；
覆盖所述管芯焊盘的所述第二表面和所述管芯的包封剂，其中所述包封剂延伸穿过所述管芯焊盘中的所述开口并至少部分填充所述沟槽；以及
环绕所述管芯焊盘并电耦接到所述管芯的多个引线，其中每个引线的一部分嵌入在所述包封剂中，并且每个引线的剩余部分从所述包封剂突出并在所述包封剂外部。
2.根据权利要求1所述的集成电路封装件，其中所述沟槽具有与所述至少一个边缘的长度基本相同的长度。
3.根据权利要求1所述的集成电路封装件，其中所述包封剂延伸超过所述管芯焊盘的边缘并形成环绕所述管芯焊盘的表面，所述表面与所述管芯焊盘的所述第一表面基本共面。
4.根据权利要求1所述的集成电路封装件，其中所述包封剂基本填充所述沟槽以形成与所述第一表面基本共面的露出表面。
5.根据权利要求1所述的集成电路封装件，其中所述管芯焊盘具有厚度，所述沟槽被刻蚀到所述管芯焊盘的所述第一表面中，并且所述沟槽具有在所述管芯焊盘的所述厚度的四分之一和四分之三之间的深度。
6.根据权利要求5所述的集成电路封装件，其中所述管芯焊盘的所述第二表面包括设置在所述开口中的至少一个和最接近所述开口的所述管芯焊盘的边缘之间的第二沟槽，其中所述第二沟槽被刻蚀到所述管芯焊盘的所述第二表面中，并具有在所述管芯焊盘的厚度的四分之一和四分之三之间的深度。
7.根据权利要求1所述的集成电路封装件，其中所述管芯焊盘的至少一个边缘在所述沟槽内。
8.根据权利要求1所述的集成电路封装件，其中所述管芯焊盘具有外周，所述沟槽以及其中的开口和设置在所述第一表面中并沿所述外周形成环。
9.根据权利要求1所述的集成电路封装件，其中所述沟槽具有至少一个延伸部，所述延伸部从所述沟槽横贯所述第一表面到最接近所述沟槽的所述管芯焊盘的至少一个边缘。
10.根据权利要求1所述的集成电路封装件，其中所述开口为具有基本相等宽度的方形，并且一个开口的边缘与相邻开口的最接近边缘间隔等于或大于所述开口的宽度的量。
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