JPWO2024247688A1 - - Google Patents
Info
- Publication number
- JPWO2024247688A1 JPWO2024247688A1 JP2025523425A JP2025523425A JPWO2024247688A1 JP WO2024247688 A1 JPWO2024247688 A1 JP WO2024247688A1 JP 2025523425 A JP2025523425 A JP 2025523425A JP 2025523425 A JP2025523425 A JP 2025523425A JP WO2024247688 A1 JPWO2024247688 A1 JP WO2024247688A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023091932 | 2023-06-02 | ||
| PCT/JP2024/017605 WO2024247688A1 (ja) | 2023-06-02 | 2024-05-13 | 半導体装置および車両 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024247688A1 true JPWO2024247688A1 (https=) | 2024-12-05 |
| JPWO2024247688A5 JPWO2024247688A5 (https=) | 2026-03-02 |
Family
ID=93657503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025523425A Pending JPWO2024247688A1 (https=) | 2023-06-02 | 2024-05-13 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20260082923A1 (https=) |
| JP (1) | JPWO2024247688A1 (https=) |
| WO (1) | WO2024247688A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7834431B2 (en) * | 2008-04-08 | 2010-11-16 | Freescale Semiconductor, Inc. | Leadframe for packaged electronic device with enhanced mold locking capability |
| WO2011049128A1 (ja) * | 2009-10-20 | 2011-04-28 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6815217B2 (ja) * | 2017-02-09 | 2021-01-20 | エイブリック株式会社 | 半導体装置 |
| JP7210868B2 (ja) * | 2018-09-05 | 2023-01-24 | ローム株式会社 | 半導体装置 |
| US11398417B2 (en) * | 2018-10-30 | 2022-07-26 | Stmicroelectronics, Inc. | Semiconductor package having die pad with cooling fins |
| DE112021002829T5 (de) * | 2020-07-16 | 2023-03-02 | Rohm Co., Ltd. | Halbleiterbauteil und Verfahren zum Herstellen eines Halbleiterbauteils |
-
2024
- 2024-05-13 JP JP2025523425A patent/JPWO2024247688A1/ja active Pending
- 2024-05-13 WO PCT/JP2024/017605 patent/WO2024247688A1/ja not_active Ceased
-
2025
- 2025-11-25 US US19/400,369 patent/US20260082923A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260082923A1 (en) | 2026-03-19 |
| WO2024247688A1 (ja) | 2024-12-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251125 |