TW200943710A - Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock - Google Patents

Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock

Info

Publication number
TW200943710A
TW200943710A TW097145760A TW97145760A TW200943710A TW 200943710 A TW200943710 A TW 200943710A TW 097145760 A TW097145760 A TW 097145760A TW 97145760 A TW97145760 A TW 97145760A TW 200943710 A TW200943710 A TW 200943710A
Authority
TW
Taiwan
Prior art keywords
package
substrates
cavity
recessed section
manufacturing
Prior art date
Application number
TW097145760A
Other languages
English (en)
Inventor
Kiyoshi Aratake
Yasuo Kawada
Original Assignee
Seiko Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instr Inc filed Critical Seiko Instr Inc
Publication of TW200943710A publication Critical patent/TW200943710A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
TW097145760A 2007-12-05 2008-11-26 Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock TW200943710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007314751A JP5048471B2 (ja) 2007-12-05 2007-12-05 パッケージの製造方法、パッケージ、電子デバイス、圧電振動子、発振器、電子機器及び電波時計

Publications (1)

Publication Number Publication Date
TW200943710A true TW200943710A (en) 2009-10-16

Family

ID=40717614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145760A TW200943710A (en) 2007-12-05 2008-11-26 Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock

Country Status (5)

Country Link
US (1) US8013499B2 (zh)
JP (1) JP5048471B2 (zh)
CN (1) CN101889391A (zh)
TW (1) TW200943710A (zh)
WO (1) WO2009072432A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102195589A (zh) * 2010-03-19 2011-09-21 精工电子有限公司 真空封装件、真空封装件的制造方法、压电振动器、振荡器、电子设备及电波钟

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* Cited by examiner, † Cited by third party
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JP6119108B2 (ja) * 2012-04-10 2017-04-26 セイコーエプソン株式会社 電子デバイス、電子機器、ベース基板の製造方法および電子デバイスの製造方法
CN104247260B (zh) * 2012-05-10 2017-07-07 株式会社大真空 压电器件
JP2015088579A (ja) * 2013-10-30 2015-05-07 セイコーエプソン株式会社 パッケージ、光学デバイス、光センサー、電子デバイスおよび電子機器
US20160027989A1 (en) * 2014-07-24 2016-01-28 Mide Technology Corporation Robust piezoelectric fluid moving devices and methods

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US4191905A (en) * 1977-06-17 1980-03-04 Citizen Watch Company Limited Sealed housings for a subminiature piezoelectric vibrator
JPS5478694A (en) * 1977-12-05 1979-06-22 Matsushima Kogyo Co Ltd Crystal vibrator
CH625372A5 (zh) * 1979-07-06 1981-09-15 Ebauchesfabrik Eta Ag
JPS56156014A (en) * 1980-05-06 1981-12-02 Seiko Epson Corp Piezoelectric oscillator
CH643980B (fr) * 1981-04-02 Ebauchesfabrik Eta Ag Oscillateur piezo-electrique et procede pour sa fabrication.
JPH06283951A (ja) 1993-03-26 1994-10-07 Citizen Watch Co Ltd 水晶部品の製造方法
DE69429848T2 (de) * 1993-11-01 2002-09-26 Matsushita Electric Ind Co Ltd Elektronische Anordnung und Verfahren zur Herstellung
JP3171043B2 (ja) * 1995-01-11 2001-05-28 株式会社村田製作所 弾性表面波装置
JPH09246904A (ja) * 1996-03-14 1997-09-19 Citizen Watch Co Ltd 表面実装型水晶振動子
JP3840698B2 (ja) * 1996-07-03 2006-11-01 セイコーエプソン株式会社 圧電振動子
JP4060972B2 (ja) * 1999-01-29 2008-03-12 セイコーインスツル株式会社 圧電振動子及びその製造方法
JP2000332140A (ja) * 1999-05-18 2000-11-30 Sumitomo Metal Electronics Devices Inc 枠状ガラスシールの形成方法
JP3820823B2 (ja) * 1999-12-02 2006-09-13 株式会社村田製作所 ケース基板の製造方法及び圧電共振部品
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP3386043B2 (ja) * 2000-08-09 2003-03-10 株式会社村田製作所 弾性表面波デバイス
US6703768B2 (en) * 2000-09-27 2004-03-09 Citizen Watch Co., Ltd. Piezoelectric generator and mounting structure therefor
JP2002319838A (ja) * 2001-02-19 2002-10-31 Seiko Epson Corp 圧電デバイス及びそのパッケージ
JP2003217968A (ja) * 2002-01-25 2003-07-31 Murata Mfg Co Ltd 積層電子部品の製造方法
JP4222147B2 (ja) * 2002-10-23 2009-02-12 セイコーエプソン株式会社 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器
JP4046641B2 (ja) * 2003-03-10 2008-02-13 富士通メディアデバイス株式会社 電子デバイスのパッケージ、ベース基板、電子部品及びそれの製造方法
EP1653772B1 (en) * 2003-08-06 2012-04-18 Murata Manufacturing Co., Ltd. Case with insert terminal and piezoelectric electroacoustic transducer using this case, process for manufacturing case with insert terminal
JP2005065104A (ja) * 2003-08-19 2005-03-10 Murata Mfg Co Ltd 表面実装型圧電振動子およびその製造方法
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JP4244865B2 (ja) * 2004-06-03 2009-03-25 セイコーエプソン株式会社 圧電発振器および電子機器
JP2007013636A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2007089117A (ja) * 2005-08-24 2007-04-05 Seiko Instruments Inc 圧電振動子、発振器、電子部品、電子機器、圧電振動子の製造方法及び電子部品の製造方法
JP4690146B2 (ja) * 2005-08-26 2011-06-01 セイコーインスツル株式会社 水晶振動子、発振器及び電子機器
JP4889267B2 (ja) * 2005-09-07 2012-03-07 共立エレックス株式会社 発光ダイオード用パッケージの製造方法
US7602107B2 (en) * 2005-11-30 2009-10-13 Nihon Dempa Kogyo Co., Ltd. Surface mount type crystal oscillator
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US8069549B2 (en) * 2007-03-22 2011-12-06 Seiko Epson Corporation Method for sealing a quartz crystal device
CN102171925B (zh) * 2008-08-05 2014-09-17 株式会社大真空 压电振动装置的密封构件及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102195589A (zh) * 2010-03-19 2011-09-21 精工电子有限公司 真空封装件、真空封装件的制造方法、压电振动器、振荡器、电子设备及电波钟

Also Published As

Publication number Publication date
WO2009072432A1 (ja) 2009-06-11
CN101889391A (zh) 2010-11-17
JP2009141581A (ja) 2009-06-25
US20100236038A1 (en) 2010-09-23
US8013499B2 (en) 2011-09-06
JP5048471B2 (ja) 2012-10-17

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