TW200910539A - Heat radiation package and semiconductor device - Google Patents

Heat radiation package and semiconductor device Download PDF

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Publication number
TW200910539A
TW200910539A TW097126935A TW97126935A TW200910539A TW 200910539 A TW200910539 A TW 200910539A TW 097126935 A TW097126935 A TW 097126935A TW 97126935 A TW97126935 A TW 97126935A TW 200910539 A TW200910539 A TW 200910539A
Authority
TW
Taiwan
Prior art keywords
substrate
heat
heat radiation
buried wiring
wiring portion
Prior art date
Application number
TW097126935A
Other languages
English (en)
Chinese (zh)
Inventor
Akinori Shiraishi
Kei Murayama
Yuichi Taguchi
Masahiro Sunohara
Mitsutoshi Higashi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200910539A publication Critical patent/TW200910539A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW097126935A 2007-08-10 2008-07-16 Heat radiation package and semiconductor device TW200910539A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007208883A JP5188120B2 (ja) 2007-08-10 2007-08-10 半導体装置

Publications (1)

Publication Number Publication Date
TW200910539A true TW200910539A (en) 2009-03-01

Family

ID=40010695

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097126935A TW200910539A (en) 2007-08-10 2008-07-16 Heat radiation package and semiconductor device

Country Status (4)

Country Link
US (1) US8368206B2 (enExample)
EP (1) EP2023699B1 (enExample)
JP (1) JP5188120B2 (enExample)
TW (1) TW200910539A (enExample)

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US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
KR20100094246A (ko) 2009-02-18 2010-08-26 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR100969146B1 (ko) 2009-02-18 2010-07-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101064098B1 (ko) 2009-02-23 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP5305987B2 (ja) * 2009-03-02 2013-10-02 キヤノン株式会社 放熱ユニット及び露光装置
TWM366757U (en) * 2009-04-27 2009-10-11 Forward Electronics Co Ltd AC LED packaging structure
JP5759191B2 (ja) * 2010-01-29 2015-08-05 日東電工株式会社 パワーモジュール
CN201829527U (zh) * 2010-05-31 2011-05-11 景德镇正宇奈米科技有限公司 具蜂巢状辐射散热装置的发光二极管结构
CN203260631U (zh) * 2010-07-01 2013-10-30 西铁城控股株式会社 Led光源装置
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
CN103078040B (zh) 2011-08-22 2016-12-21 Lg伊诺特有限公司 发光器件封装件和光装置
KR101976531B1 (ko) * 2011-12-22 2019-08-28 엘지이노텍 주식회사 발광 모듈
KR101852390B1 (ko) * 2011-11-18 2018-04-26 엘지이노텍 주식회사 광원 모듈
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
US9089075B2 (en) * 2012-03-27 2015-07-21 Gerald Ho Kim Silicon-based cooling package for cooling and thermally decoupling devices in close proximity
KR101946912B1 (ko) * 2012-05-14 2019-02-12 엘지이노텍 주식회사 광원모듈 및 이를 구비한 조명 시스템
EP2919286A4 (en) 2012-11-06 2016-05-11 Ngk Insulators Ltd SUBSTRATE FOR LIGHT-EMITTING DIODES
JP6125528B2 (ja) 2012-11-06 2017-05-10 日本碍子株式会社 発光ダイオード用基板および発光ダイオード用基板の製造方法
DE102015205354A1 (de) * 2015-03-24 2016-09-29 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102015111307A1 (de) * 2015-07-13 2017-01-19 Epcos Ag Bauelement mit verbesserter Wärmeableitung
JP2018120999A (ja) * 2017-01-27 2018-08-02 日本特殊陶業株式会社 配線基板
CN112753109B (zh) * 2018-10-03 2024-04-05 西铁城电子株式会社 嵌体基板和使用该嵌体基板的发光装置
JP7307874B2 (ja) * 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール
JP7497578B2 (ja) * 2020-02-26 2024-06-11 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置及び情報処理装置
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Also Published As

Publication number Publication date
EP2023699A3 (en) 2010-11-24
US8368206B2 (en) 2013-02-05
US20090039379A1 (en) 2009-02-12
EP2023699B1 (en) 2015-07-08
EP2023699A2 (en) 2009-02-11
JP2009044027A (ja) 2009-02-26
JP5188120B2 (ja) 2013-04-24

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