TW200818324A - Multizone heater for furnace - Google Patents

Multizone heater for furnace Download PDF

Info

Publication number
TW200818324A
TW200818324A TW096123605A TW96123605A TW200818324A TW 200818324 A TW200818324 A TW 200818324A TW 096123605 A TW096123605 A TW 096123605A TW 96123605 A TW96123605 A TW 96123605A TW 200818324 A TW200818324 A TW 200818324A
Authority
TW
Taiwan
Prior art keywords
heater
furnace
heating
housing
chamber
Prior art date
Application number
TW096123605A
Other languages
English (en)
Chinese (zh)
Inventor
Joseph Yudovsky
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200818324A publication Critical patent/TW200818324A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Furnace Details (AREA)
TW096123605A 2006-07-12 2007-06-28 Multizone heater for furnace TW200818324A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/485,547 US7429717B2 (en) 2006-07-12 2006-07-12 Multizone heater for furnace

Publications (1)

Publication Number Publication Date
TW200818324A true TW200818324A (en) 2008-04-16

Family

ID=38923985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123605A TW200818324A (en) 2006-07-12 2007-06-28 Multizone heater for furnace

Country Status (7)

Country Link
US (1) US7429717B2 (https=)
EP (1) EP2054690A2 (https=)
JP (1) JP4912463B2 (https=)
KR (1) KR101046043B1 (https=)
CN (1) CN101490491B (https=)
TW (1) TW200818324A (https=)
WO (1) WO2008008585A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI821379B (zh) * 2018-09-11 2023-11-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基材處理設備及方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012047945A2 (en) 2010-10-05 2012-04-12 Silcotek Corp. Wear resistant coating, article, and method
KR101828528B1 (ko) * 2010-06-28 2018-02-12 한화테크윈 주식회사 그래핀의 제조 장치 및 제조 방법
JP5685844B2 (ja) * 2010-07-16 2015-03-18 株式会社村田製作所 熱処理炉
US20140117005A1 (en) * 2010-10-27 2014-05-01 Tangteck Equipment Inc. Diffusion furnace
CN103806094B (zh) * 2012-11-08 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 外延生长设备
EP3108042B1 (en) * 2014-02-21 2022-08-10 Momentive Performance Materials Quartz, Inc. Multi-zone variable power density heater apparatus
WO2016006500A1 (ja) * 2014-07-07 2016-01-14 株式会社Ihi 熱処理装置
US9915001B2 (en) 2014-09-03 2018-03-13 Silcotek Corp. Chemical vapor deposition process and coated article
US10876206B2 (en) 2015-09-01 2020-12-29 Silcotek Corp. Thermal chemical vapor deposition coating
US11161324B2 (en) 2017-09-13 2021-11-02 Silcotek Corp. Corrosion-resistant coated article and thermal chemical vapor deposition coating process
CN109951906B (zh) * 2017-12-20 2024-05-10 长鑫存储技术有限公司 半导体炉管机台加热器
TWI743446B (zh) 2018-02-20 2021-10-21 美商應用材料股份有限公司 用於原子層沉積(ald)溫度均勻性的熱解氮化硼(pbn)加熱器
WO2020252306A1 (en) 2019-06-14 2020-12-17 Silcotek Corp. Nano-wire growth
CN110592557B (zh) * 2019-10-21 2020-06-26 山东国晶新材料有限公司 一种内cvd沉积立体式复合陶瓷加热器
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article
CN115572172B (zh) * 2022-09-09 2023-06-30 攀钢集团攀枝花钢铁研究院有限公司 废旧石墨电极的利用方法及电炉

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414927A (en) 1993-03-30 1995-05-16 Union Oil Co Furnace elements made from graphite sheets
JPH08186081A (ja) * 1994-12-29 1996-07-16 F T L:Kk 半導体装置の製造方法及び半導体装置の製造装置
JPH0940481A (ja) * 1995-07-25 1997-02-10 Shin Etsu Chem Co Ltd セラミックヒーター
US5947718A (en) 1997-03-07 1999-09-07 Semitool, Inc. Semiconductor processing furnace
US6352593B1 (en) * 1997-08-11 2002-03-05 Torrex Equipment Corp. Mini-batch process chamber
JP3515900B2 (ja) * 1998-05-06 2004-04-05 京セラ株式会社 セラミックヒータ
IL125690A0 (en) 1998-08-06 1999-04-11 Reiser Raphael Joshua Furnace for processing semiconductor wafers
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
US6496648B1 (en) * 1999-08-19 2002-12-17 Prodeo Technologies, Inc. Apparatus and method for rapid thermal processing
JP2001223257A (ja) * 2000-02-10 2001-08-17 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP3833439B2 (ja) 2000-05-02 2006-10-11 株式会社ノリタケカンパニーリミテド 大型基板用多段加熱炉、及び両面加熱式遠赤外線パネルヒーター、並びに該加熱炉内の給排気方法
JP2003031647A (ja) * 2001-07-19 2003-01-31 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2004055880A (ja) * 2002-07-22 2004-02-19 Hitachi Kokusai Electric Inc 基板処理装置
WO2004049414A1 (ja) 2002-11-25 2004-06-10 Koyo Thermo Systems Co., Ltd. 半導体処理装置用電気ヒータ
CN2714581Y (zh) * 2004-01-13 2005-08-03 南开大学 高真空薄膜沉积室用的外热式高温电加热炉
CN100373119C (zh) * 2004-04-14 2008-03-05 浙江大学 流水线安全型热风送热系统
US20060127067A1 (en) * 2004-12-13 2006-06-15 General Electric Company Fast heating and cooling wafer handling assembly and method of manufacturing thereof
JP6052722B2 (ja) * 2012-06-29 2016-12-27 パナソニックＩｐマネジメント株式会社 エアーマッサージ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI821379B (zh) * 2018-09-11 2023-11-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基材處理設備及方法

Also Published As

Publication number Publication date
WO2008008585A3 (en) 2008-07-24
JP2009543996A (ja) 2009-12-10
EP2054690A2 (en) 2009-05-06
KR101046043B1 (ko) 2011-07-01
US7429717B2 (en) 2008-09-30
US20080017628A1 (en) 2008-01-24
WO2008008585A2 (en) 2008-01-17
CN101490491B (zh) 2012-04-25
KR20090037899A (ko) 2009-04-16
CN101490491A (zh) 2009-07-22
JP4912463B2 (ja) 2012-04-11

Similar Documents

Publication Publication Date Title
TW200818324A (en) Multizone heater for furnace
US12002661B2 (en) Susceptor having cooling device
TWI380372B (en) Temperature measurement and control of wafer support in thermal processing chamber
NL2017558B1 (en) A chemical vapour deposition apparatus and use thereof
TWI673396B (zh) 大氣磊晶沈積腔室
JPH0652722B2 (ja) ヒータ組立体及び基板の加熱方法
TWI671851B (zh) 用於寬範圍溫度控制的加熱器基座組件
JP2011518430A (ja) 熱処理チャンバーでのウェハー支持部の温度測定および制御
JPH10241844A (ja) 加熱装置と加熱する方法
US9842753B2 (en) Absorbing lamphead face
JPH11176759A (ja) 化学気相蒸着の加熱装置
CN113195780B (zh) 具有不均匀的纵向截面的用于半导体材料的外延反应器的反应室及反应器
TW201504470A (zh) 用於交叉流動類型的熱ｃｖｄ腔室之改良的氣體活化的結構
TW200945474A (en) Substrate processing device, method for manufacturing semiconductor device and roof insulator
CN116190266A (zh) 灯头中的多分区灯控制和单独灯控制
WO2026040874A1 (zh) 晶圆加热器和化学气相沉积系统
KR20210095059A (ko) 불균일한 열 출력의 필라멘트 램프를 갖는 반도체 처리 챔버
WO2026040873A1 (zh) 晶圆加热器和化学气相沉积系统
TWI311340B (en) Heating system of batch type reaction chamber and method of using the heating system for heating batch type reaction chamber
JPH0917742A (ja) 熱処理装置
WO2008100718A2 (en) Substrate heating method and apparatus
TWI237293B (en) Forced convection assisted rapid thermal furnace
JP2002050461A (ja) 基板加熱装置
TWI432599B (zh) 用以均等化加熱溫度的化學蒸氣沉積裝置
JPH08333681A (ja) 活性ガスを用いた平らなサンプルの表面化学処理装置