CN101490491B - 用以加热半导体处理腔室的设备和方法 - Google Patents

用以加热半导体处理腔室的设备和方法 Download PDF

Info

Publication number
CN101490491B
CN101490491B CN2007800262040A CN200780026204A CN101490491B CN 101490491 B CN101490491 B CN 101490491B CN 2007800262040 A CN2007800262040 A CN 2007800262040A CN 200780026204 A CN200780026204 A CN 200780026204A CN 101490491 B CN101490491 B CN 101490491B
Authority
CN
China
Prior art keywords
heater
furnace
chamber
processing chamber
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800262040A
Other languages
English (en)
Chinese (zh)
Other versions
CN101490491A (zh
Inventor
J·约德伏斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101490491A publication Critical patent/CN101490491A/zh
Application granted granted Critical
Publication of CN101490491B publication Critical patent/CN101490491B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Furnace Details (AREA)
CN2007800262040A 2006-07-12 2007-06-12 用以加热半导体处理腔室的设备和方法 Expired - Fee Related CN101490491B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/485,547 US7429717B2 (en) 2006-07-12 2006-07-12 Multizone heater for furnace
US11/485,547 2006-07-12
PCT/US2007/070964 WO2008008585A2 (en) 2006-07-12 2007-06-12 Multizone heater for furnace

Publications (2)

Publication Number Publication Date
CN101490491A CN101490491A (zh) 2009-07-22
CN101490491B true CN101490491B (zh) 2012-04-25

Family

ID=38923985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800262040A Expired - Fee Related CN101490491B (zh) 2006-07-12 2007-06-12 用以加热半导体处理腔室的设备和方法

Country Status (7)

Country Link
US (1) US7429717B2 (https=)
EP (1) EP2054690A2 (https=)
JP (1) JP4912463B2 (https=)
KR (1) KR101046043B1 (https=)
CN (1) CN101490491B (https=)
TW (1) TW200818324A (https=)
WO (1) WO2008008585A2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012047945A2 (en) 2010-10-05 2012-04-12 Silcotek Corp. Wear resistant coating, article, and method
KR101828528B1 (ko) * 2010-06-28 2018-02-12 한화테크윈 주식회사 그래핀의 제조 장치 및 제조 방법
JP5685844B2 (ja) * 2010-07-16 2015-03-18 株式会社村田製作所 熱処理炉
US20140117005A1 (en) * 2010-10-27 2014-05-01 Tangteck Equipment Inc. Diffusion furnace
CN103806094B (zh) * 2012-11-08 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 外延生长设备
EP3108042B1 (en) * 2014-02-21 2022-08-10 Momentive Performance Materials Quartz, Inc. Multi-zone variable power density heater apparatus
WO2016006500A1 (ja) * 2014-07-07 2016-01-14 株式会社Ihi 熱処理装置
US9915001B2 (en) 2014-09-03 2018-03-13 Silcotek Corp. Chemical vapor deposition process and coated article
US10876206B2 (en) 2015-09-01 2020-12-29 Silcotek Corp. Thermal chemical vapor deposition coating
US11161324B2 (en) 2017-09-13 2021-11-02 Silcotek Corp. Corrosion-resistant coated article and thermal chemical vapor deposition coating process
CN109951906B (zh) * 2017-12-20 2024-05-10 长鑫存储技术有限公司 半导体炉管机台加热器
TWI743446B (zh) 2018-02-20 2021-10-21 美商應用材料股份有限公司 用於原子層沉積(ald)溫度均勻性的熱解氮化硼(pbn)加熱器
US11024523B2 (en) * 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
WO2020252306A1 (en) 2019-06-14 2020-12-17 Silcotek Corp. Nano-wire growth
CN110592557B (zh) * 2019-10-21 2020-06-26 山东国晶新材料有限公司 一种内cvd沉积立体式复合陶瓷加热器
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article
CN115572172B (zh) * 2022-09-09 2023-06-30 攀钢集团攀枝花钢铁研究院有限公司 废旧石墨电极的利用方法及电炉

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780251B2 (en) * 2001-07-19 2004-08-24 Hitachi Kokusai Electric, Inc. Substrate processing apparatus and method for fabricating semiconductor device
CN1563837A (zh) * 2004-04-14 2005-01-12 浙江大学 流水线安全型热风送热系统
CN2714581Y (zh) * 2004-01-13 2005-08-03 南开大学 高真空薄膜沉积室用的外热式高温电加热炉

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414927A (en) 1993-03-30 1995-05-16 Union Oil Co Furnace elements made from graphite sheets
JPH08186081A (ja) * 1994-12-29 1996-07-16 F T L:Kk 半導体装置の製造方法及び半導体装置の製造装置
JPH0940481A (ja) * 1995-07-25 1997-02-10 Shin Etsu Chem Co Ltd セラミックヒーター
US5947718A (en) 1997-03-07 1999-09-07 Semitool, Inc. Semiconductor processing furnace
US6352593B1 (en) * 1997-08-11 2002-03-05 Torrex Equipment Corp. Mini-batch process chamber
JP3515900B2 (ja) * 1998-05-06 2004-04-05 京セラ株式会社 セラミックヒータ
IL125690A0 (en) 1998-08-06 1999-04-11 Reiser Raphael Joshua Furnace for processing semiconductor wafers
US6307184B1 (en) * 1999-07-12 2001-10-23 Fsi International, Inc. Thermal processing chamber for heating and cooling wafer-like objects
US6496648B1 (en) * 1999-08-19 2002-12-17 Prodeo Technologies, Inc. Apparatus and method for rapid thermal processing
JP2001223257A (ja) * 2000-02-10 2001-08-17 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP3833439B2 (ja) 2000-05-02 2006-10-11 株式会社ノリタケカンパニーリミテド 大型基板用多段加熱炉、及び両面加熱式遠赤外線パネルヒーター、並びに該加熱炉内の給排気方法
JP2004055880A (ja) * 2002-07-22 2004-02-19 Hitachi Kokusai Electric Inc 基板処理装置
WO2004049414A1 (ja) 2002-11-25 2004-06-10 Koyo Thermo Systems Co., Ltd. 半導体処理装置用電気ヒータ
US20060127067A1 (en) * 2004-12-13 2006-06-15 General Electric Company Fast heating and cooling wafer handling assembly and method of manufacturing thereof
JP6052722B2 (ja) * 2012-06-29 2016-12-27 パナソニックＩｐマネジメント株式会社 エアーマッサージ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780251B2 (en) * 2001-07-19 2004-08-24 Hitachi Kokusai Electric, Inc. Substrate processing apparatus and method for fabricating semiconductor device
CN2714581Y (zh) * 2004-01-13 2005-08-03 南开大学 高真空薄膜沉积室用的外热式高温电加热炉
CN1563837A (zh) * 2004-04-14 2005-01-12 浙江大学 流水线安全型热风送热系统

Also Published As

Publication number Publication date
WO2008008585A3 (en) 2008-07-24
JP2009543996A (ja) 2009-12-10
TW200818324A (en) 2008-04-16
EP2054690A2 (en) 2009-05-06
KR101046043B1 (ko) 2011-07-01
US7429717B2 (en) 2008-09-30
US20080017628A1 (en) 2008-01-24
WO2008008585A2 (en) 2008-01-17
KR20090037899A (ko) 2009-04-16
CN101490491A (zh) 2009-07-22
JP4912463B2 (ja) 2012-04-11

Similar Documents

Publication Publication Date Title
CN101490491B (zh) 用以加热半导体处理腔室的设备和方法
KR102911421B1 (ko) 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
US12002661B2 (en) Susceptor having cooling device
CN107881490B (zh) 化学气相沉积装置及其用途
US7312422B2 (en) Semiconductor batch heating assembly
KR102189785B1 (ko) 고온 가스 분배 어셈블리
KR101170006B1 (ko) 플라즈마 처리 장치, 플라즈마 처리 방법 및 유전체창의 온도 조절 기구
KR101017217B1 (ko) 유리-세라믹 패널 및 박막 리본 히터를 갖춘 기판 가열 장치
US6887803B2 (en) Gas-assisted rapid thermal processing
KR102296914B1 (ko) 가열식 세라믹 페이스플레이트
KR20210095059A (ko) 불균일한 열 출력의 필라멘트 램프를 갖는 반도체 처리 챔버
TW201944855A (zh) 用於hdp cvd的帶有嵌入式加熱元件和嵌入式rf線圈的進階陶瓷蓋及感應耦合電漿處理腔室
JP2005510869A (ja) 加熱真空支持装置
JP4467730B2 (ja) 基板加熱装置
US7381926B2 (en) Removable heater
KR20050083837A (ko) 강제 대류가 지원된 급속 열로
JPH08333681A (ja) 活性ガスを用いた平らなサンプルの表面化学処理装置
WO2001082342A1 (en) Gas assisted rapid thermal annealing
CN219696393U (zh) 一种隔离装置及等离子刻蚀设备
US20190024229A1 (en) Processing arrangement and method for conditioning a processing arrangement
KR100679679B1 (ko) 적외선 가열기구 및 기지 가열기 형식의 진공 챔버
JPH0397222A (ja) 枚葉式ｃｖｄ装置
JP2005093911A (ja) 基板処理装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: California, USA

Applicant after: APPLIED MATERIALS, Inc.

Address before: California, USA

Applicant before: APPLIED MATERIALS, Inc.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120425