TW200815492A - Novel epoxy compound and process for production thereof - Google Patents

Novel epoxy compound and process for production thereof Download PDF

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Publication number
TW200815492A
TW200815492A TW096130023A TW96130023A TW200815492A TW 200815492 A TW200815492 A TW 200815492A TW 096130023 A TW096130023 A TW 096130023A TW 96130023 A TW96130023 A TW 96130023A TW 200815492 A TW200815492 A TW 200815492A
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
hydrogen atom
general formula
epoxy compound
Prior art date
Application number
TW096130023A
Other languages
English (en)
Chinese (zh)
Other versions
TWI362397B (enExample
Inventor
Nobutoshi Sasaki
Toshio Fujita
Hiroshi Uchida
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200815492A publication Critical patent/TW200815492A/zh
Application granted granted Critical
Publication of TWI362397B publication Critical patent/TWI362397B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934Powdered coating composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
TW096130023A 2006-08-15 2007-08-14 Novel epoxy compound and process for production thereof TW200815492A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006221648 2006-08-15

Publications (2)

Publication Number Publication Date
TW200815492A true TW200815492A (en) 2008-04-01
TWI362397B TWI362397B (enExample) 2012-04-21

Family

ID=39082158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096130023A TW200815492A (en) 2006-08-15 2007-08-14 Novel epoxy compound and process for production thereof

Country Status (7)

Country Link
US (1) US7880018B2 (enExample)
EP (1) EP2055708B1 (enExample)
JP (1) JP5153635B2 (enExample)
KR (1) KR101013394B1 (enExample)
CN (1) CN101501047B (enExample)
TW (1) TW200815492A (enExample)
WO (1) WO2008020637A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266248B2 (ja) * 2007-11-07 2013-08-21 昭和電工株式会社 エポキシ基含有オルガノシロキサン化合物
CN101977919B (zh) * 2008-03-24 2014-04-23 昭和电工株式会社 环氧化合物及其制造方法
JP5210122B2 (ja) * 2008-10-31 2013-06-12 昭和電工株式会社 接着剤用硬化性組成物
JP5149126B2 (ja) * 2008-11-07 2013-02-20 昭和電工株式会社 半導体封止用硬化性組成物
US8957136B2 (en) 2010-08-11 2015-02-17 Showa Denko K.K. Epoxysilicone condensate, curable composition comprising condensate, and cured product thereof
KR20150133779A (ko) * 2013-03-15 2015-11-30 다우 코닝 코포레이션 분말 형태의 고체 실리콘-함유 핫 멜트 조성물을 침착하는 단계 및 그의 봉지재를 형성하는 단계를 포함하는, 광학 조립체의 제조 방법
CN105669738A (zh) * 2016-01-19 2016-06-15 南昌大学 一种改性硅烷偶联剂的制备方法
WO2023008493A1 (ja) * 2021-07-29 2023-02-02 株式会社カネカ シラン化合物およびその製造方法、ポリオルガノシロキサン化合物、ハードコート組成物、ハードコーフィルムおよびその製造方法、ならびにディスプレイ
CN119798304B (zh) * 2024-12-31 2025-10-10 苏州高泰电子技术股份有限公司 一种耐高温硅烷偶联剂及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580430A (en) 1978-12-13 1980-06-17 Teijin Ltd Preparation of polyester
JPS58222160A (ja) * 1982-06-16 1983-12-23 Tokuyama Soda Co Ltd コ−テイング用組成物
US5206328A (en) * 1990-02-08 1993-04-27 Shin-Etsu Chemical Co., Ltd. Process for the production of an organopolysiloxane
JPH03255130A (ja) 1990-03-05 1991-11-14 Shin Etsu Chem Co Ltd エポキシ基含有オルガノポリシロキサンの製造方法
US6080872A (en) * 1997-12-16 2000-06-27 Lonza S.P.A. Cycloaliphatic epoxy compounds
AU2002253429A1 (en) * 2002-04-08 2003-10-20 Ranbaxy Laboratories Limited ALPHA, OMEGA-DICARBOXIMIDE DERIVATIVES AS USEFUL URO-SELECTIVE Alpha1Alpha ADRENOCEPTOR BLOCKERS
US7244473B2 (en) * 2003-04-22 2007-07-17 Konica Minolta Medical & Graphic, Inc. Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
FI116844B (fi) * 2004-03-22 2006-03-15 Valtion Teknillinen Reaktiiviset kalvonmuodostajat
CN100569209C (zh) * 2004-07-14 2009-12-16 3M创新有限公司 包括环氧乙烷单体的牙科组合物

Also Published As

Publication number Publication date
JP5153635B2 (ja) 2013-02-27
CN101501047B (zh) 2011-12-14
US20100197936A1 (en) 2010-08-05
EP2055708B1 (en) 2013-07-17
KR20090024827A (ko) 2009-03-09
TWI362397B (enExample) 2012-04-21
EP2055708A1 (en) 2009-05-06
EP2055708A4 (en) 2011-01-26
US7880018B2 (en) 2011-02-01
JPWO2008020637A1 (ja) 2010-01-07
WO2008020637A1 (en) 2008-02-21
CN101501047A (zh) 2009-08-05
KR101013394B1 (ko) 2011-02-14

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MM4A Annulment or lapse of patent due to non-payment of fees