TW200740187A - Light-emitting unit, illumination device and image reading device - Google Patents

Light-emitting unit, illumination device and image reading device

Info

Publication number
TW200740187A
TW200740187A TW096106450A TW96106450A TW200740187A TW 200740187 A TW200740187 A TW 200740187A TW 096106450 A TW096106450 A TW 096106450A TW 96106450 A TW96106450 A TW 96106450A TW 200740187 A TW200740187 A TW 200740187A
Authority
TW
Taiwan
Prior art keywords
section
light emitting
emitting unit
heat dissipating
extending section
Prior art date
Application number
TW096106450A
Other languages
English (en)
Inventor
Tomihisa Saito
Masahide Wakisaka
Hiroyuki Nemoto
Naofumi Sumitani
Original Assignee
Nippon Sheet Glass Co Ltd
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd, Nichia Corp filed Critical Nippon Sheet Glass Co Ltd
Publication of TW200740187A publication Critical patent/TW200740187A/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0318—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light-source, a lens array and a photodetector array which are supported by a single-piece frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/54—Lamp housings; Illuminating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
    • H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
    • H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
    • H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
    • H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
    • H04N2201/03108—Components of integral heads
    • H04N2201/03112—Light source
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
    • H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
    • H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
    • H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
    • H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
    • H04N2201/03108—Components of integral heads
    • H04N2201/03141—Photodetector lens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
    • H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
    • H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
    • H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
    • H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
    • H04N2201/03108—Components of integral heads
    • H04N2201/03145—Photodetector
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
    • H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
    • H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
    • H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
    • H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
    • H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
    • H04N2201/0315—Details of integral heads not otherwise provided for
    • H04N2201/03158—Heat radiator

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)
TW096106450A 2006-02-22 2007-02-26 Light-emitting unit, illumination device and image reading device TW200740187A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006044620 2006-02-22
JP2006044639 2006-02-22

Publications (1)

Publication Number Publication Date
TW200740187A true TW200740187A (en) 2007-10-16

Family

ID=38458908

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106450A TW200740187A (en) 2006-02-22 2007-02-26 Light-emitting unit, illumination device and image reading device

Country Status (4)

Country Link
US (1) US20090168126A1 (zh)
JP (1) JPWO2007099796A1 (zh)
TW (1) TW200740187A (zh)
WO (1) WO2007099796A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499272B (zh) * 2012-05-10 2015-09-01 Mitsubishi Electric Corp Image sensor
US9128217B2 (en) 2012-04-25 2015-09-08 Mitsubishi Electric Corporation Illuminating apparatus, image sensor, and methods for manufacturing illuminating apparatus and image sensor
TWI783143B (zh) * 2014-05-21 2022-11-11 日商日亞化學工業股份有限公司 發光裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147847A (ja) * 2006-12-07 2008-06-26 Rohm Co Ltd 線状光源装置および画像読み取り装置
JP4569589B2 (ja) * 2007-03-12 2010-10-27 三菱電機株式会社 イメージセンサの放熱構造
JP2010028216A (ja) * 2008-07-15 2010-02-04 Toshiba Design & Manufacturing Service Corp 密着型イメージセンサー、および画像読取装置
US20100098399A1 (en) * 2008-10-17 2010-04-22 Kurt Breish High intensity, strobed led micro-strip for microfilm imaging system and methods
JP5657875B2 (ja) * 2009-10-06 2015-01-21 パナソニックＩｐマネジメント株式会社 導光体、これを備えた照明装置及び原稿読取装置、並びに導光体製造用金型及びその製造方法
JP5636664B2 (ja) * 2009-10-22 2014-12-10 富士ゼロックス株式会社 画像読取装置及び画像形成装置
JP5788738B2 (ja) * 2011-08-26 2015-10-07 富士フイルム株式会社 放射線検出器の製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598198A (en) * 1984-05-21 1986-07-01 Banner Engineering Corp. Automatic power control for modulated LED photoelectric devices
JPS628403A (ja) * 1985-07-04 1987-01-16 株式会社小糸製作所 車輛用灯具
US5162916A (en) * 1990-07-02 1992-11-10 Xerox Corporation Compact read/write scanner
US5969343A (en) * 1995-08-24 1999-10-19 Matsushita Electric Industrial Co., Ltd. Linear illumination device
JP3856250B2 (ja) * 1997-04-23 2006-12-13 シチズン電子株式会社 Ｓｍｄ型ｌｅｄ
JPH11330557A (ja) * 1998-05-08 1999-11-30 Canon Inc 光源装置及び電子機器
WO2000079469A2 (en) * 1999-06-22 2000-12-28 Peripheral Dynamics, Inc. Apparatus and methods for image scanning of variable sized documents having variable orientations
JP2002016292A (ja) * 2000-06-28 2002-01-18 Toshiba Lighting & Technology Corp Ｌｅｄ表示装置
JP2002111067A (ja) * 2000-09-26 2002-04-12 Toshiba Corp Ｌｅｄランプ及びｌｅｄランプ組立体
JP2002217644A (ja) * 2001-01-23 2002-08-02 Nippon Dempa Kogyo Co Ltd 水晶発振器
JP2002281240A (ja) * 2001-03-14 2002-09-27 Canon Inc 画像読み取り装置
JP2003324214A (ja) * 2002-04-30 2003-11-14 Omron Corp 発光モジュール
JP4646485B2 (ja) * 2002-06-25 2011-03-09 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
CN1759492B (zh) * 2003-03-10 2010-04-28 丰田合成株式会社 固体元件装置的制造方法
JP2005017545A (ja) * 2003-06-25 2005-01-20 Nippon Sheet Glass Co Ltd 照明装置及び画像読取装置
JP4129437B2 (ja) * 2004-01-28 2008-08-06 日本板硝子株式会社 ライン照明装置
JP2006049442A (ja) * 2004-08-02 2006-02-16 Sharp Corp 半導体発光装置およびその製造方法
DE102004056722B4 (de) * 2004-11-19 2006-09-28 Deutsches Zentrum für Luft- und Raumfahrt e.V. Filmscanner und ein Scanverfahren zum Unterdrücken von Helligkeitsschwankungen einer Strahlungsquelle
JP4542453B2 (ja) * 2005-03-24 2010-09-15 日亜化学工業株式会社 発光装置
JP4683274B2 (ja) * 2005-04-26 2011-05-18 ミネベア株式会社 面状照明装置
WO2006137263A1 (ja) * 2005-06-21 2006-12-28 Nippon Sheet Glass Company, Limited イメージセンサ、画像読取装置及びイメージセンサの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9128217B2 (en) 2012-04-25 2015-09-08 Mitsubishi Electric Corporation Illuminating apparatus, image sensor, and methods for manufacturing illuminating apparatus and image sensor
TWI499272B (zh) * 2012-05-10 2015-09-01 Mitsubishi Electric Corp Image sensor
US9386183B2 (en) 2012-05-10 2016-07-05 Mitsubishi Electric Corporation Image sensor
TWI783143B (zh) * 2014-05-21 2022-11-11 日商日亞化學工業股份有限公司 發光裝置

Also Published As

Publication number Publication date
US20090168126A1 (en) 2009-07-02
JPWO2007099796A1 (ja) 2009-07-16
WO2007099796A1 (ja) 2007-09-07

Similar Documents

Publication Publication Date Title
TW200740187A (en) Light-emitting unit, illumination device and image reading device
EP2354634B1 (en) Lamp strip covering structure
TW200736755A (en) Heat dissipation structure of backlight module
WO2010053528A3 (en) Light emitting diode emergency lighting module
RU2011115099A (ru) Светоизлучающее устройство
EP2196724A3 (en) Light-emitting module and illumination apparatus
ATE554335T1 (de) Led leuchteinheit
MX2010003785A (es) Dispositivo de iluminacion con diodos emisores de luz.
EP2056363A3 (en) Light emitting diode package and method for fabricating same
EP1996856A4 (en) LED LIGHTING MODULE
ATE515932T1 (de) Beleuchtungsanordnung mit verbesserter wärmeleitfähigkeit
TW200630710A (en) A light emitting diode backlight package background of the invention
NZ590716A (en) Led module
DK1969403T3 (da) Lysstruktur omfattende mindst én lysemitterende diode, dens fremstiling og dens anvendelser
TW200644293A (en) LED unit and LED illuminating lamp using such LED unit
WO2014039833A4 (en) Integrated led based illumination device
TW200802975A (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
TW200721547A (en) Light emitting diode and method for manufacturing the same
WO2009142675A3 (en) Solid state lighting component
EA201491207A1 (ru) Освещающее остекление для транспортного средства
JP2012503306A5 (zh)
DE502008001628D1 (de) Trägerelement mit Leuchtdiodeneinheiten
US20140204584A1 (en) Modular led lamp structure with replaceable modules and rapid maintenance
JP2008086230A5 (zh)
US9182110B2 (en) Lighting device with a circuit board mounting