TW200730274A - Method for producing flake silver powder and flake silver powder produced thereby - Google Patents
Method for producing flake silver powder and flake silver powder produced therebyInfo
- Publication number
- TW200730274A TW200730274A TW095134783A TW95134783A TW200730274A TW 200730274 A TW200730274 A TW 200730274A TW 095134783 A TW095134783 A TW 095134783A TW 95134783 A TW95134783 A TW 95134783A TW 200730274 A TW200730274 A TW 200730274A
- Authority
- TW
- Taiwan
- Prior art keywords
- silver powder
- flake silver
- slurry
- stage
- flake
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272690A JP5148821B2 (ja) | 2005-09-20 | 2005-09-20 | フレーク銀粉の製造方法及び、その製造方法で製造されたフレーク銀粉 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200730274A true TW200730274A (en) | 2007-08-16 |
Family
ID=37888853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134783A TW200730274A (en) | 2005-09-20 | 2006-09-20 | Method for producing flake silver powder and flake silver powder produced thereby |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5148821B2 (fr) |
KR (1) | KR101327973B1 (fr) |
TW (1) | TW200730274A (fr) |
WO (1) | WO2007034810A1 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5563732B2 (ja) * | 2007-01-19 | 2014-07-30 | 日本光研工業株式会社 | 平滑薄片状粉体、高光輝性顔料及びそれらの製造方法 |
KR20100024295A (ko) | 2008-08-25 | 2010-03-05 | 주식회사 잉크테크 | 금속박편의 제조방법 |
JP5236400B2 (ja) * | 2008-09-04 | 2013-07-17 | 太陽ホールディングス株式会社 | 導電ペーストおよびそれを用いた電極 |
JP2011052300A (ja) * | 2009-09-04 | 2011-03-17 | Dowa Electronics Materials Co Ltd | フレーク状銀粉及びその製造方法、並びに導電性ペースト |
JP2011134630A (ja) * | 2009-12-25 | 2011-07-07 | Jsr Corp | 導電性ペースト |
WO2012176831A1 (fr) * | 2011-06-21 | 2012-12-27 | 住友金属鉱山株式会社 | Poussière d'argent et procédé de fabrication correspondant |
CN102974833B (zh) * | 2012-11-20 | 2015-03-18 | 宁波广博纳米新材料股份有限公司 | 片状银粉的制备方法 |
JP5890387B2 (ja) * | 2013-12-26 | 2016-03-22 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銀粉および導電性ペースト |
JP6368288B2 (ja) * | 2015-08-07 | 2018-08-01 | 福田金属箔粉工業株式会社 | フレーク状銀粒子の集合体及び該銀粒子の集合体を含有するペースト |
KR20170038465A (ko) | 2015-09-30 | 2017-04-07 | 엘에스니꼬동제련 주식회사 | 응집형 은 분말을 이용한 플레이크형 은 분말의 제조방법 |
CN105345013B (zh) * | 2015-11-10 | 2017-07-07 | 南京瑞盈环保科技有限公司 | 一种片状率高粒径分布窄的片状银粉的制备方法 |
JP6920029B2 (ja) | 2016-04-04 | 2021-08-18 | 日亜化学工業株式会社 | 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法 |
JP6760614B2 (ja) * | 2016-07-29 | 2020-09-23 | 国立研究開発法人産業技術総合研究所 | 微細粒子の分散固定方法 |
WO2018066724A1 (fr) * | 2016-10-04 | 2018-04-12 | 엘에스니꼬동제련 주식회사 | Procédé de préparation de poudre d'argent |
WO2018066723A1 (fr) * | 2016-10-04 | 2018-04-12 | 엘에스니꼬동제련 주식회사 | Procédé de préparation de poudre d'argent de type à flocons à l'aide de poudre d'argent agglomérée |
WO2018066722A1 (fr) * | 2016-10-04 | 2018-04-12 | 엘에스니꼬동제련 주식회사 | Procédé de fabrication de poudre d'argent de type paillettes à l'aide de poudre d'argent agglomérée |
CN106862576A (zh) * | 2017-03-30 | 2017-06-20 | 中国振华集团云科电子有限公司 | 一种片状银粉的制作工艺 |
CN110828068A (zh) * | 2019-11-28 | 2020-02-21 | 衡阳思迈科科技有限公司 | 一种环保耐低温的导电银浆的制备方法 |
JP7184847B2 (ja) * | 2020-06-29 | 2022-12-06 | 日亜化学工業株式会社 | 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法 |
CN111922348A (zh) * | 2020-08-11 | 2020-11-13 | 河南金渠银通金属材料有限公司 | 一种高频陶瓷多层片式电感器用银粉的制备方法及其制品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4273583A (en) * | 1979-06-29 | 1981-06-16 | E. I. Du Pont De Nemours And Company | Flake silver powders with chemisorbed monolayer of dispersant |
JP4263799B2 (ja) * | 1999-02-09 | 2009-05-13 | Dowaエレクトロニクス株式会社 | 鱗片状銀粉の製造方法 |
JP3874634B2 (ja) * | 2001-08-10 | 2007-01-31 | 福田金属箔粉工業株式会社 | 導体ペースト用のフレーク状銀粉及びそれを用いた導体ペースト |
JP4109520B2 (ja) * | 2002-09-12 | 2008-07-02 | 三井金属鉱業株式会社 | 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト |
JP4144856B2 (ja) * | 2002-11-29 | 2008-09-03 | 三井金属鉱業株式会社 | 極薄板状銀粒子からなる銀粉の製造方法 |
JP4489389B2 (ja) * | 2003-07-29 | 2010-06-23 | 三井金属鉱業株式会社 | 微粒銀粉の製造方法 |
JP4320447B2 (ja) * | 2004-02-03 | 2009-08-26 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
JP2005240094A (ja) * | 2004-02-26 | 2005-09-08 | Sumitomo Metal Mining Co Ltd | 希土類元素−鉄系磁石粉、その製造方法、および得られるボンド磁石用樹脂組成物とボンド磁石 |
JP4047312B2 (ja) * | 2004-08-27 | 2008-02-13 | 三井金属鉱業株式会社 | 球状の銀粉、フレーク状の銀粉、球状の銀粉とフレーク状の銀粉との混合粉、及び、これら銀粉の製造方法、当該銀粉を含有する銀インク及び銀ペースト |
-
2005
- 2005-09-20 JP JP2005272690A patent/JP5148821B2/ja active Active
-
2006
- 2006-09-20 WO PCT/JP2006/318590 patent/WO2007034810A1/fr active Application Filing
- 2006-09-20 TW TW095134783A patent/TW200730274A/zh unknown
- 2006-09-20 KR KR1020087006401A patent/KR101327973B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007084860A (ja) | 2007-04-05 |
JP5148821B2 (ja) | 2013-02-20 |
KR20080046195A (ko) | 2008-05-26 |
KR101327973B1 (ko) | 2013-11-13 |
WO2007034810A1 (fr) | 2007-03-29 |
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